Datasheet FODM452, FODM453 Datasheet (Fairchild)

FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler

July 2010

FODM452, FODM453 5-Pin Mini Flat Package High Speed Transistor Optocoupler

Features

Compact 5-pin mini flat package

■

High speed-1 MBit/s

■

Superior CMR-15kV/µs at V Performance guaranteed over temperature (0–70°C)

■

U.L. recognized (File # E90700) VDE0884 recognized (File # 136480)

■

– Ordering option V, e.g., FODM452V 260°C reflow capability for Pb-free assembly

■

= 1500V (FODM453)

CM

Applications

Line receivers

■

Pulse transformer replacement Output interface to CMOS-LSTTL-TTL

■

Wide bandwidth analog coupling

Functional Schematic

ANODE

1

V

6

CC

V

5

O

Description

The FODM452 and FODM453 optocouplers consist of an AlGaAs LED optically coupled to a high speed photodetector transistor. The devices are housed in a compact 5-pin mini flat package for optimum mounting density. The FODM453 features a high CMR rating for optimum

common mode transient immunity.

Related Resources

■

www.fairchildsemi.com/products/opto/ www.fairchildsemi.com/pf/FO/FODM611.html

■

www.fairchildsemi.com/pf/FO/FODM8061.html www.fairchildsemi.com/pf/FO/FODM8071.html

■

Truth Table

LED Output

Off High

On Low

3 4

GNDCATHODE

°

Pin Definitions

Number Name Function Description

1 ANODE Anode

3CATHODE Cathode

4 GND Output Ground

5V

6V

O

CC

Output Voltage

Output Supply Voltage

Safety and Insulation Ratings for Mini-Flat Package (SO5 Pin)

As per IEC60747-5-2 (Pending Certification). This optocoupler is suitable for “safe electrical insulation” only within the safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.

Symbol Parameter Min. Typ. Max. Unit

Installation Classiﬁcations per DIN VDE 0110/1.89 Table 1 For rated main voltage < 150Vrms I-IV For rated main voltage < 300Vrms I-III Climatic Classiﬁcation 40/85/21 Pollution Degree (DIN VDE 0110/1.89) 2

CTI Comparative Tracking Index 175

V

T

V

PR

V

PR

IORM

IOTM

Case

R

IO

Input to Output Test Voltage, Method b, VIORM x 1.875 = V t

= 1 sec, Partial Discharge < 5 pC

m

, 100% Production Test with

PR

Input to Output Test Voltage, Method a, VIORM x 1.5 = V t

= 60 sec, Partial Discharge < 5 pC

m

, Type and Sample Test with

PR

Max Working Insulation Voltage 565 V Highest Allowable Over Voltage 4000 V External Creepage 5.0 mm External Clearance 5.0 mm Insulation thickness 0.5 mm Safety Limit Values, Maximum Values allowed in the event

of a failure, Case Temperature Insulation Resistance at T

, V

= 500V 10

S

IO

1060

848

150

peak

C

9

Ω

FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler

Absolute Maximum Ratings

(T

= 25°C unless otherwise noted)

A

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.

Symbol Parameter Value Units

T

STG

T

OPR

EMITTER

I

(avg) DC/Average Forward Input Current 25 mA

F

I

(pk) Peak Forward Input Current (50% duty cycle, 1ms P.W.) 50 mA

F

(trans) Peak Transient Input Current ( ≤ 1µs P.W., 300pps) 1.0 A

I

F

V

R

P

D

DETECTOR

I

(avg) Average Output Current 8 mA

O

I

(pk) Peak Output Current 16 mA

O

V

CC

V

O

P

D

Storage Temperature -40 to +125 °C Operating Temperature -40 to +85 °C

Reverse Input Voltage 5 V Input Power Dissipation

45 mW

(No derating required over speciﬁed operating temp range)

Supply Voltage -0.5 to 30 V Output Voltage -0.5 to 20 V Output Power Dissipation

100 mW

(No derating required over speciﬁed operating temp range)

∆

/ ∆

FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler

Electrical Characteristics

(T

= 0 to 70°C unless otherwise specified)

A

Individual Component Characteristics

Symbol Parameter Test Conditions Min. Typ.* Max. Unit

EMITTER

V

B

VR

V

F

Input Forward Voltage I

F

Input Reverse Breakdown Voltage I

T

Temperature Coefﬁcient of

A

= 16mA, T

F

= 16mA 1.8

I

F

= 10µA 5.0 V

R

I

= 16mA -1.8 mV/°C

F

= 25°C 1.60 1.7 V

A

Forward Voltage

DETECTOR

I

CCL

I

CCH

OH

Logic High Output Current I

Logic Low Supply Current I Logic high supply current I

= 0mA, V

F

= 0 mA, V

I

F

= 0mA, V

I

F

= 16mA, V

F

= 0 mA, V

F

= 25°C

T

A

= 0mA, V

I

F

= V

O

CC

= V

O

CC

= V

O

CC

= Open, V

O

= Open, V

O

= Open, V

O

= 5.5V, T

= 15V, T

=25°C .001 0.5 µA

A

=25°C .001 1

A

= 15V 50

= 15V 100 200 µA

CC

= 15V,

CC

= 15V 2

CC

0.05 1 µA

Transfer Characteristics

Symbol Parameter Test Conditions Min. Typ.* Max Unit

COUPLED

CTR Current Transfer Ratio

V

Logic LOW Output

OL

Voltage

(1)

I

= 16mA, V

F

I

= 16mA, I

F

= 16mA, I

I

F

= 4.5V T

CC

= 3mA, V

O

= 2.4mA, V

O

= 25°C V

A

=0.5V 15

V

OL

= 4.5V, T

CC

= 4.5 V 0.5

CC

=0.4V 20 50 %

OL

=2 5°C 0.4 V

A

Switching Characteristics

(V

CC

= 5V)

Symbol Parameter Test Conditions Device Min. Typ.* Max. Unit

T

Propagation Delay

PHL

Time to Logic LOW

T

Propagation Delay

PLH

Time to Logic HIGH

| Common Mode

|CM

H

Tr ansient Immunity at Logic HIGH

| Common Mode

|CM

L

Tr ansient Immunity at Logic LOW

BW Bandwidth R

R

= 1.9k Ω , I

L

= 1.9k Ω , IF = 16mA

R

L

= 16mA, T

F

A

(2)

(Fig. 9) 1.0 µs

RL = 1.9kΩ, IF = 16mA, TA = 25°C

= 1.9kΩ, IF = 16mA

R

L

= 0mA, VCM = 10V

I

F

T

A

= 0mA, VCM = 1500V

I

F

T

A

= 25°C

(3)

(Fig. 10)

(3)

(Fig. 10)

IF = 16mA, VCM = 10V

(3)

= 25°C

T

A

= 16mA, VCM = 1500V

I

F

= 25°C

T

A

= 100Ω 3 MHz

L

(Fig. 10)

(3)

(Fig. 10)

(2)

(Fig. 9) 1.0 µs

, RL = 1.9kΩ,

P-P

, RL = 1.9kΩ,

P-P

(2)

= 25°C

(2)

, RL = 1.9kΩ

, RL = 1.9kΩ,

(Fig. 9) 0.40 0.8 µs

(Fig. 9) 0.35 0.8 µs

FODM452 5 15 KV/µs

FODM453 15 40 KV/µs

FODM452 5 15 KV/µs

FODM453 15 40 KV/µs

Isolation Characteristics

Symbol Characteristics Test Conditions Min. Typ.* Max. Unit

V

ISO

C

Withstand Insulation Test Voltage RH ≤ 50%, TA = 25°C, t = 1 min. Capacitance (Input to Output) f = 1MHz

I-O

*All Typicals at T

= 25°C

A

(4)

3750 V

0.2 pF

RMS

Notes:

1. Current Transfer Ratio is deﬁned as a ratio of output collector current, I

, to the forward LED input current, IF,

O

times 100%.

2. The 1.9kΩ load represents 1 TTL unit load of 1.6mA and 5.6kΩ pull-up resistor.

3. Common mode transient immunity in logic high level is the maximum tolerable (positive) dV leading edge of the common mode pulse signal V (i.e., V

> 2.0V). Common mode transient immunity in logic low level is the maximum tolerable (negative) dVcm/dt

O

on the trailing edge of the common mode pulse signal, V state (i.e., V

< 0.8V).

O

, to assure that the output will remain in a logic high state

CM

, to assure that the output will remain in a logic low

CM

/dt on the

cm

4. Device is considered a two terminal device: Pins 1, and 3 are shorted together and Pins 4, 5, and 6 are shorted together.

FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler

Typical Performance Curves

FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler

Fig. 1 Input Forward Current vs Forward Voltage

100

TA = 25°C

10

(mA)

1

0.1

– FORWARD CURRENT

0.01

F

I

0.001

1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8

VF – FORWARD CURRENT (mA)

Fig. 3 Normalized Current Transfer Ratio

vs. Ambient Temperature

1.6

IF = 16mA

= 0.4V

V

O

1.4 = 5V

V

CC

Normalized to T

1.2

1.0

0.8

0.6

0.4

0.2

NORMALIZED CURRENT TRANSFER RATIO

0.0

-40 -20 0 20 40 60 80 100

= 25°C

A

TA – AMBIENT TEMPERATURE

Fig. 2 Normalized Current Transfer Ratio vs. Input Current

1.20

VO = 0.4V

= 5V

V

CC

1.15

= 25°C

T

A

Normalized to I

1.10

1.05

URRENT TRANSFER RATIO

1.00

0.95

NORMALIZED C

0.90

= 16mA

F

110

IF – INPUT CURRENT (mA)

Fig. 4 Logic High Output Current

vs. Ambient Temperature

VO = VCC = 5V

= 0V

I

F

10

UTPUT CURRENT (nA)

1

– LOGIC HIGH O

OH

I

0.1

-40 -20 0 20 40 60 80 100

TA – TEMPERATURE (°C)

Fig. 5 DC and Pulsed Transfer Characteristics

14

TA = 25°C

= 5V

V

12

CC

10

8

6

4

- OUTPUT CURRENT (mA) O

I

2

0

024 6810121416

IF = 40mA

35mA

30mA

25mA

20mA

15mA

10mA

5mA

VO – OUTPUT VOLTAGE (V)

Fig. 6 Propagation Delay vs. Load Resistance

10

TA = 25°C

= 5V

V

CC

s)

1

AGATION DELAY (µ

PROP

P –

t

0.1 12345678910

I

= 16mA

F

IF = 10mA

RL – LOAD RESISTANCE (kΩ)

t

PLH

t

PHL

Typical Performance Curves (Continued)

FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler

Fig. 7 Propagation Delay vs. Ambient Temperature

1400

I

= 16mA

F

= 5V

V

CC

= 1.9kΩ

R

1200

L

1000

800

600

400

– PROPAGATION DELAY (ns)

P

t

200

0

-40 -20 0 20 40

t

PLH

t

PHL

TA – AMBIENT TEMPERATURE (°C) f – FREQUENCY (MHz)

Fig. 8 Frequency Response

5

= 16mA

I

F

= 5V

V

CC

= 25°C

T

A

0

-5

-10

R

L

= 470Ω

NORMALIZED RESPONSE (dB)

60 80 100 0.01 0.1 1 10

-15

R

= 1kΩ

L

R

L

= 220Ω

RL = 100Ω

FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler

Pulse Generator tr = 5ns Z = 50

O

10% D.C. I/f < 100µs

I Monitor

F

Noise

+I

F

Ω

R

m

I

Shield

1

3

F

V

CC

6

V

O

5

4

GND

0

V

O

1.5 V

T

PHL

1.5 V

Fig. 9 Switching Time Test Circuit

T

PLH

0.1 µF

R

V

OL

L

C = 1.5 µF

5 V

+5 V

V

L

O

I

F

Noise Shield

+

1

A

B

V

FF

3

V

CM

+-

Pulse Gen

V 10 V

CM

10% 10%

0 V

t

r

V

O

Switch at A : I = 0 mA

V

O

Switch at A : I = 16 mA

90%

F

V

CC

6

V

O

5

0.1 µF

GND

4

t

f

5 V

V

OL

Fig. 10 Common Mode Immunity Test Circuit

+5 V

R

L

V

O

-

Package Dimensions

FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler

Notes:

1. No standard applies to this package.

2. All dimensions are in millimeters.

3. Dimensions are exclusive of burrs, mold flash, and tie bar extrusion.

4. Drawings filesname and revision: MKT-MFP05A.

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions, speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www

.fairchildsemi.com/packaging/

Footprint Drawing for PCB Layout

FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler

0.61

Device

‘A’

Pin 1

1.45

2.54

Dimensions in millimeters

1.27 1.27 1.27

End Stacking Configuration

Unutilized Solder Pad

Device

Pin 1

‘B

’

5.05 7.95

Tape and Reel Dimensions

FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler

K

t

0

W

1

d

Description

Tape Width

Tape Thickness

Sprocket Hole Pitch

Sprocket Hole Diameter

Sprocket Hole Location

Pocket Location

Pocket Pitch

Pocket Dimension

Pocket Hole Diameter

Cover Tape Width

Cover Tape Thickness

Max. Component Rotation or Tilt

Devices Per Reel

Reel Diameter

P

0

Symbol

W

t

P

0

D

0

E

F

P

2

P

A

0

B

0

K

0

D

1

W

1

d

P

A

0

P

Dimensions (mm)

12.00 +0.30

2

B

0

2.54 Pitch

0.30 ±0.05

4.00 ±0.10

1.50 +0.10

1.75 ±0.10

5.50 ±0.10

2.00 ±0.10

8.00 ±0.10

4.40 ±0.10

7.30 ±0.10

2.30 ±0.10

1.50 Min.

9.20

0.065 ±0.010 10° Max.

2500

330mm (13")

D

-0.10

/

-0.0

/

0

E

W

F

D

1

Ordering Information

Option

R2 FODM452R2 Tape and Reel (2500 per reel)

V FODM452V IEC60747-5-2

R2V FODM452R2V IEC60747-5-2, Tape and Reel (2500 per reel)

Marking Information

FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler

Order Entry Identiﬁer

(example) Description

1

M452

V

43

Deﬁnitions

1Fairchild logo

2Device number

IEC60747-5-2 mark (Note: Only appears on parts ordered

3

with VDE option – See order entry table)

4 One digit year code, e.g., ‘7’

5Two digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

2

MYYX

5

6

Reﬂow Proﬁle

FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler

Max. Ramp-up Rate = 3°C/S

Max. Ramp-down Rate = 6°C/S

Ts ma x

Preheat Area

Ts mi n

t

L

t

s

260 240 220 200 180 160 140 120

T

P

T

L

100

80 60

Temperature (°C)

40 20

0

120

240 360

Time 25°C to Peak

Time (seconds)

Proﬁle Freature Pb-Free Assembly Proﬁle

Temperature Min. (Tsmin) 150°C

Temperature Max. (Tsmax) 200°C

Time (t

Ramp-up Rate (t

Liquidous Temperature (T

Time (t

Peak Body Package Temperature 260°C +0°C / –5°C

Time (t

Ramp-down Rate (T

Time 25°C to Peak Temperature 8 minutes max.

) from (Tsmin to Tsmax) 60–120 seconds

S

to tP) 3°C/second max.

L

) 217°C

L

) Maintained Above (TL) 60–150 seconds

L

) within 5°C of 260°C 30 seconds

P

to TL) 6°C/second max.

P

t

P

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®

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As used herein:

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Definition of Terms

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Advance Information Formative / In Design

Preliminary First Production

No Identification Needed Full Production

Obsolete Not In Production

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Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.

Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.

Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.

Rev. I49

FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler