Datasheet FOD814 Datasheet (Fairchild)

Page 1
FOD814 Series, FOD817 Series — 4-Pin High Operating Temperature Phototransistor Optocouplers
December 2011
Features
■
AC input response (FOD814 only)
■
Applicable to Pb-free IR reflow soldering Compact 4-pin package
■
■
Current transfer ratio in selected groups: FOD814: 20–300% FOD817: 50–600% FOD814A: 50–150% FOD817A: 80–160%
FOD817B: 130–260% FOD817C: 200–400% FOD817D: 300–600%
■
C-UL, UL and VDE approved High input-output isolation voltage of 5000Vrms
■
Minimum BV
■
■
Higher operating temperatures (versus H11AXXX
of 70V guaranteed
CEO
counterparts)
Applications
FOD814 Series
■
AC line monitor Unknown polarity DC sensor
■
Telephone line interface
■
FOD817 Series
Power supply regulators
■
■
Digital logic inputs Microprocessor inputs
■
Description
The FOD814 consists of two gallium arsenide infrared emitting diodes, connected in inverse parallel, driving a silicon phototransistor output in a 4-pin dual in-line package. The FOD817 Series consists of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 4-pin dual in-line package.
Functional Block Diagram
1ANODE, CATHODE
2
FOD814 FOD817
©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FOD814 Series, FOD817 Series Rev. 1.1.5
4
COLLECTOR
3CATHODE, ANODE
EMITTER
CATHODE
1
2
4
COLLECTORANODE
3 EMITTER
4
1
Page 2
Absolute Maximum Ratings
(TA = 25°C Unless otherwise specified.)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
Value Units
Symbol Parameter
TOTAL DEVICE
T
STG
T
OPR
T
SOL
T
J
θ
JC
P
TOT
EMITTER
I
F
V
R
P
D
DETECTOR
V
CEO
V
ECO
I
C
P
C
Storage Temperature -55 to +150 °C
Operating Temperature -55 to +105 -55 to +110 °C
Lead Solder Temperature 260 for 10 sec °C
Junction Temperature 125 Max. °C
Junction-to-Case Thermal Resistance 210 °C/W
Total Power Dissipation 200 mW
Continuous Forward Current ±50 50 mA
Reverse Voltage 6
Power Dissipation Derate above 100°C
Collector-Emitter Voltage 70 V
Emitter-Collector Voltage 6 V
Continuous Collector Current 50 mA
Collector Power Dissipation Derate above 90°C
FOD814 FOD817
70
1.7
150
2.9
mW
mW/°C
mW
mW/°C
FOD814 Series, FOD817 Series — 4-Pin High Operating Temperature Phototransistor Optocouplers
©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FOD814 Series, FOD817 Series Rev. 1.1.5 2
Page 3
FOD814 Series, FOD817 Series — 4-Pin High Operating Temperature Phototransistor Optocouplers
Electrical Characteristics
(TA = 25°C Unless otherwise specified.)
Individual Component Characteristics
Symbol Parameter Device Test Conditions Min. Typ.* Max. Unit
EMITTER
V
I
C
DETECTOR
I
CEO
BV
CEO
BV
ECO
DC Transfer Characteristics
Symbol
CTR Current Transfer
V
CE (sat)
Forward Voltage FOD814 IF = ±20mA 1.2 1.4 V
F
FOD817 IF = 20mA 1.2 1.4
Reverse Leakage Current FOD817 VR = 4.0V 10 µA
R
Te r minal Capacitance FOD814 V = 0, f = 1kHz 50 250 pF
t
FOD817 V = 0, f = 1kHz 30 250
Collector Dark Current FOD814 VCE = 20V, IF = 0 100 nA
FOD817 VCE = 20V, IF = 0 100
Collector-Emitter Breakdown Voltage
Emitter-Collector Breakdown Voltage
FOD814 IC = 0.1mA, IF = 0 70 V
FOD817 IC = 0.1mA, IF = 0 70
FOD814 IE = 10µA, IF = 0 6 V
FOD817 IE = 10µA, IF = 0 6
DC
Characteristic Device Test Conditions Min. Typ.* Max. Unit
(1)
(1)
20 300 %
50 600
Ratio
FOD814 IF = ±1mA, VCE = 5V
FOD814A 50 150
FOD817 IF = 5mA, VCE = 5V
FOD817A 80 160
FOD817B 130 260
FOD817C 200 400
FOD817D 300 600
Collector-Emitter Saturation Voltage
FOD814 IF = ±20mA, IC = 1mA 0.1 0.2 V
FOD817 IF = 20mA, IC = 1mA 0.1 0.2
AC Transfer Characteristics
Symbol AC Characteristic Device Test Conditions Min. Typ.* Max. Unit
f
Cut-Off Frequency FOD814 VCE = 5V, IC = 2mA, RL = 100Ω,
C
-3dB
Response Time (Rise) FOD814,
t
r
VCE = 2 V, IC = 2mA, RL = 100
(2)
Ω
FOD817
t
Response Time (Fall) FOD814,
f
FOD817
*Typical values at TA = 25°C
©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FOD814 Series, FOD817 Series Rev. 1.1.5 3
15 80 kHz
418µs
318µs
Page 4
Electrical Characteristics
(TA = 25°C Unless otherwise specified.)
(Continued)
Isolation Characteristics
Symbol Characteristic Device Test Conditions Min. Typ.* Max. Units
V
R
C
*Typical values at TA = 25°C
Notes:
1. Current Transfer Ratio (CTR) = IC/IF x 100%.
2. For test circuit setup and waveforms, refer to page 7.
3. For this test, Pins 1 and 2 are common, and Pins 3 and 4 are common.
Input-Output Isolation
ISO
ISO
ISO
(3)
Voltage
Isolation Resistance FOD814,
Isolation Capacitance FOD814,
FOD814, FOD817
FOD817
FOD817
f = 60Hz, t = 1 min, I
≤ 2µA
I-O
V
= 500VDC 5x10
I-O
V
= 0, f = 1 MHz 0.6 1.0 pf
I-O
5000 Vac(rms)
10
1x10
11
Ω
FOD814 Series, FOD817 Series — 4-Pin High Operating Temperature Phototransistor Optocouplers
©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FOD814 Series, FOD817 Series Rev. 1.1.5 4
Page 5
FOD814 Series, FOD817 Series — 4-Pin High Operating Temperature Phototransistor Optocouplers
Typical Electrical/Optical Characteristics
Fig. 1 Collector Power Dissipation
vs. Ambient Temperature
200
(mW)
C
150
100
50
0
COLLECTOR POWER DISSIPATION P
-55
-40 -20 0 20 40 60 80 100 120
AMBIENT TEMPERATURE T
Fig. 3 Collector-Emitter Saturation Voltage
6
vs. Forward Current
Ic = 0.5 mA
5
4
(sat) (V)
CE
3
1m A 3m A
5m A
7m A
2
VOLTAGE V
1
COLLECTOR-EMITTER SATURATION
0
FORWARD CURRENT IF (mA)
(FOD814)
(°C)
A
Ta = 25 °C
15.012.510.07.55.02.50
(TA = 25°C Unless otherwise specified.)
Fig. 2 Collector Power Dissipation
vs. Ambient Temperature
200
(mW)
C
150
100
50
0
COLLECTOR POWER DISSIPATION P
-55
-40 -20 0 20 40 60 80 100 120
AMBIENT TEMPERATURE TA (°C)
Fig. 4 Forward Current vs. Forward Voltage
100
(mA)
F
10
TA = 105oC
(FOD814)
o
C
75
o
50
C
1
FORWARD CURRENT I
0.1
0.5 1.0 1.5 2.0
FORWARD VOLTAGE VF (V)
25
o
0
C
-30
-55oC
(FOD817)
o
C
o
C
Fig. 5 Forward Current vs. Forward Voltage
(FOD817)
100
TA = 110oC
(mA)
F
10
1
FORWARD CURRENT I
0.1
0.5 1.0 1.5 2.0
140
120
o
75
C
o
C
50
o
25
C
o
0
C
o
-30
C
-55oC
100
80
60
40
20
CURRENT TRANSFER RATIO CTR ( %)
FORWARD VOLTAGE VF (V)
©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FOD814 Series, FOD817 Series Rev. 1.1.5 5
Fig. 6 Current Transfer Ratio
vs. Forward Current
V =CE5V Ta= 25°C
FOD817
FOD814
0
0.1 0 .2 0.5 1 2 5 10 20 50 100
FORWARD CURRENT IF (mA)
Page 6
FOD814 Series, FOD817 Series — 4-Pin High Operating Temperature Phototransistor Optocouplers
Typical Electrical/Optical Characteristics
Fig. 7 Collector Current
vs. Collector-Emitter Voltage (FOD814)
50
I = 30 mA
F
40
(mA)
C
30
20
20 m A
10mA
5mA
10
COLLECTOR CURRENT I
0
0102030405060708090100
COLLECTOR-EMITTER VOLTAGE VCE (V)
Fig. 9 Relative Current Transfer Ratio
160
140
vs. Ambient Temperature
FOD814
IF = 1 mA V
= 5V
CE
120
100
80
FOD817
IF = 5mA
60
RATIO (%)
= 5V
V
CE
40
20
RELATIVE CURRENT TRANSFER
0
-60 -40 -20 0 20 40 60 80 100 120
AMBIENT TEMPERATURE TA (°C)
Ta= 25°C
Pc(M AX.)
1mA
(Continued)
COLLECTOR-EMITTER SATURATION
(TA = 25°C Unless otherwise specified.)
Fig. 8 Collector Current vs.
Collector-Emitter Voltage (FOD817)
30
I I
= 30mA
F
(mA)
C
25
20mA
20
15
10mA
10
5m A
COLLECTOR CURRENT I
5
0
0102030405060708090
COLLECTOR-EMITTER VOLTAGE VCE (V)
Fig. 10 Collector-Emitter Saturation Voltage
vs. Ambient Temperature
0.12
IF = 20mA
I
= 1mA
C
0.10
0.08
(sat) (V)
CE
0.06
0.04
VOLTAGE V
0.02
0.00
-60 -40 -20 0 20 40 60 80 100 120
AMBIENT TEMPERATURE TA (°C)
Ta = 25°C
Pc(MAX.)
Fig. 11 LED Power Dissipation
vs. Ambient Temperature (FOD814)
100
(mW)
80
LED
(mW)
LED
60
40
20
LED POWER DISSIPATION P
0
-40 -20 0 20 40 60 80 100 120-55
LED POWER DISSIPATION P
AMBIENT TEMPERATURE TA (°C)
©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FOD814 Series, FOD817 Series Rev. 1.1.5 6
Fig. 12 LED Power Dissipation
vs. Ambient Temperature (FOD817)
100
80
60
40
20
0
-40 -20 0 20 40 60 80 100 120-55
AMBIENT TEMPERATURE TA (°C)
Page 7
FOD814 Series, FOD817 Series — 4-Pin High Operating Temperature Phototransistor Optocouplers
Typical Electrical/Optical Characteristics
Fig. 13 Response Time
100
50
20
10
5
2
1
RESPONSE TIME (µs)
0.5
0.2
0.1
vs. Load Resistance
V = 2V
CE
Ic = 2 m A Ta = 25 °C
0.1
0.2 0. 5 1 2 5 10
LOAD RESISTANCE RL (kΩ)
tr
td
ts
tf
10000
(nA)
1000
CEO
Fig. 15 Collector Dark Current
vs. Ambient Temperature
VCE = 20V
(Continued)
(dB)
V
-10
VOLTAGE GAIN A
-20
(TA = 25°C Unless otherwise specified.)
Fig. 14 Frequency Response
V
= 2V
CE
Ic = 2mA
0
R =10k
L
0.2
15 20.5
FREQUENCY f (kHz)
Ta = 25°C
1k
100
100010010
Test Circuit for Response Time
Vc c
R
Input
R
D
L
Output
100
10
1
0.1
0.01
COLLECTOR DARK CURRENT I
-60 -40 -20 0 20 40 60 80 100 120
AMBIENT TEMPERATURE TA (°C)
Input
Output
10%
90%
td
ts
tr tf
Test Circuit for Frequency Response
Vc c
R
R
D
L
Output
©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FOD814 Series, FOD817 Series Rev. 1.1.5 7
Page 8
FOD814 Series, FOD817 Series — 4-Pin High Operating Temperature Phototransistor Optocouplers
Package Dimensions
Through Hole
E N
LA P G IN
T A E S
0.130 (3.30)
0.091 (2.30)
0.150 (3.80)
0.110 (2.80)
0.110 (2.79)
0.090 (2.29)
0.4" Lead Spacing
0.200 (5.10)
0.161 (4.10)
LANE P
NG
I T
EA S
0.200 (5.10)
0.161 (4.10)
0.130 (3.30)
0.091 (2.30)
0.157 (4.00)
0.118 (3.00)
0.020 (0.51) TYP
0.024 (0.60)
0.016 (0.40)
0.157 (4.00)
0.118 (3.00)
Surface Mount
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.010 (0.26)
0.393 (9.98)
0.300 (7.62)
0.200 (5.10)
E
0.161 (4.10)
N
G PLA
ATIN
SE
0.051 (1.30)
0.043 (1.10)
0.110 (2.79)
0.090 (2.29)
Lead Coplanarity 0.004 (0.10) MAX
0.157 (4.00)
0.118 (3.00)
0.024 (0.60)
0.004 (0.10)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.049 (1.25)
0.030 (0.76)
0.412 (10.46)
0.388 (9.86)
0.010 (0.26)
Surface Mount (Footprint Dimensions)
1.5
1.3
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
9
0.291 (7.40)
0.252 (6.40)
0.150 (3.80)
0.110 (2.80)
0.024 (0.60)
0.016 (0.40)
0.110 (2.79)
0.090 (2.29)
0.110 (2.80)
0.011 (1.80)
0.42 (10.66)
0.38 (9.66)
0.010 (0.26)
2.54
Note:
All dimensions are in inches (millimeters)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FOD814 Series, FOD817 Series Rev. 1.1.5 8
Page 9
Ordering Information
Option Part Number Example Description
S FOD814S Surface Mount Lead Bend
SD FOD814SD Surface Mount; Tape and reel
300 FOD814300 VDE Approved
300W FOD814300W VDE Approved, 0.4" Lead Spacing
3S FOD8143S VDE Approved, Surface Mount
3SD FOD8143SD VDE Approved, Surface Mount, Tape & Reel
Marking Information
FOD814 Series, FOD817 Series — 4-Pin High Operating Temperature Phototransistor Optocouplers
4
XVY
3
1
ZZ
814
5
6
2
Definitions
1Fairchild logo
2Device number
3 VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4 One digit year code
5Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
Y = Manufactured in Thailand YA = Manufactured in China
©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FOD814 Series, FOD817 Series Rev. 1.1.5 9
Page 10
Carrier Tape Specifications
FOD814 Series, FOD817 Series — 4-Pin High Operating Temperature Phototransistor Optocouplers
Ø1.55±0.05
P
2
P
1
A0
P
0
Note:
All dimensions are in millimeters.
Symbol Description Dimensions in mm (inches)
WTape wide 16 ± 0.3 (.63)
P
0
F
P
2
P
1
A0 Compartment 10.45 ± 0.1 (.411)
B0 5.30 ± 0.1 (.209)
K0 4.25 ± 0.1 (.167)
Pitch of sprocket holes 4 ± 0.1 (.15)
Distance of compartment 7.5 ± 0.1 (.295)
2 ± 0.1 (.079)
Distance of compartment to compartment 12 ± 0.1 (.472)
1.75±0.1
F
W
B0
0.3±0.05
K0
©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FOD814 Series, FOD817 Series Rev. 1.1.5 10
Page 11
Lead Free Recommended IR Reflow Condition
Tp
FOD814 Series, FOD817 Series — 4-Pin High Operating Temperature Phototransistor Optocouplers
Tsmax
Ramp-down
Tsmin
Temperature (°C)
25°C
ts (Preheat)
Soldering zon
Time (sec)
Profile Feature Pb-Sn solder assembly Lead Free assembly
Preheat condition (Tsmin-Tsmax / ts)
Melt soldering zone 183°C
Peak temperature (Tp) 240 +0/-5°C 260 +0/-5°C
Ramp-down rate 6°C/sec max. 6°C/sec max.
100°C ~ 150°C
60 ~ 120 sec
60 ~ 120 sec
150°C ~ 200°C
60 ~120 sec
217°C
30 ~ 90 sec
Recommended Wave Soldering condition
Profile Feature For all solder assembly
Peak temperature (Tp) Max 260°C for 10 sec
©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FOD814 Series, FOD817 Series Rev. 1.1.5 11
Page 12
FOD814 Series, FOD817 Series — 4-Pin High Operating Temperature Phototransistor Optocouplers
©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FOD814 Series, FOD817 Series Rev. 1.1.5 12
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