Datasheet FOD060L, FOD260L Datasheet (Fairchild)

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

October 2011

FOD060L, FOD260L

3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

■

Features

■

FOD060L in SO8 and FOD260L in 8-pin DIP

■

Very high speed – 10 MBit/s Superior CMR — 50 kV/µs at 1,000V peak

■

Fan-out of 8 over -40°C to +85°C Logic gate output

■

Strobable output Wired OR-open collector

■

Safety and regulatory approvals – UL1577 – DIN EN/IEC 60747-5-2

Applications

■

Ground loop elimination LSTTL to TTL, LSTTL or 5-volt CMOS

■

Line receiver, data transmission

■

Data multiplexing Switching power supplies

■

Pulse transformer replacement Computer-peripheral interface

■

Description

These optocouplers consist of an AlGaAS LED, optically coupled to a very high speed integrated photo-detector logic gate. Devices include a strobable output. This output features an open collector, thereby permitting wired OR outputs. The coupled parameters are guaranteed over the temperature range of -40°C to +85°C. A maximum input signal of 5 mA will provide a minimum output sink current of 13 mA (fan out of 8). An internal noise shield provides superior common mode rejection of typically 50 kV/µs at 1,000V common mode.

Package

8

1

8

1

8

1

8

1

Truth Table (Positive Logic)

Input Enable Output

On H L

Off H H

On L H

Off L H

On* NC* L*

Off* NC* H*

*Devices with pin 7 not connected. A 0.1 µF bypass capacitor must be connected between pins 5 and 8. (See Note 1)

N/C

V

N/C

1

+

2

F

_

3

4

8

7

6

5

V

CC

V

E

V

O

GND

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

Absolute Maximum Ratings

(No derating required up to 85°C)

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.

Symbol Parameter Value Units

T

STG

T

OPR

EMITTER

I

F

V

E

V

R

P

I

DETECTOR

V

CC

(1 minute max)

I

O

V

O

P

O

Storage Temperature -40 to +125 °C

Operating Temperature -40 to +85 °C

DC/Average Forward Input Current 50 mA

Enable Input Voltage, not to exceed V

by more than 500 mV V

CC

+ 0.5V V

CC

Reverse Input Voltage 5.0 V

Power Dissipation 45 mW

Supply Voltage 7.0 V

Output Current 50 mA

Output Voltage 7.0 V

Collector Output Power Dissipation 85 mW

Recommended Operating Conditions

Symbol Parameter Min. Max. Units

I

FL

I

FH

V

CC

V

EL

V

EH

T

A

NFan Out (TTL load) 8

R

L

*6.3 mA is a guard banded value which allows for at least 20% CTR degradation. Initial input current threshold value is 5.0 mA or less.

Input Current, Low Level 0 250 µA

Input Current, High Level *6.3 15 mA

Supply Voltage, Output 3.0 5.5 V

Enable Voltage, Low Level 0 0.8 V

Enable Voltage, High Level 2.0 V

CC

V

Operating Temperature -40 +85 °C

Output Pull-up Resistor 330 4K

Ω

∆

(T

Electrical Characteristics

= 25°C and V

T

A

= 3.3V)

CC

= -40°C to +85°C unless otherwise speciﬁed. Typical value is measured at

A

Individual Component Characteristics

Symbol Parameter Test Conditions Min. Typ. Max. Unit

EMITTER

V

Input Forward Voltage I

F

B

C

Input Reverse Breakdown Voltage I

VR

Input Capacitance V

IN

VF/ ∆ TA Input Diode Temperature Coefﬁcient I

DETECTOR

I

CCH

I

CCL

I

V

High Level Supply Current V

Low Level Supply Current V

Low Level Enable Current V

I

EL

High Level Enable Current V

EH

High Level Enable Voltage V

EH

Low Level Enable Voltage V

EL

= 10 mA 1.4 1.8 V

F

= 25°C

T

A

= 10 µA 5.0 V

R

= 0, f = 1 MHz 6.0 pF

F

= 10 mA -1.9 mV/°C

F

= 0.5 V, I

E

= 0.5 V, I

E

= 3.3 V, V

CC

= 3.3 V, V

CC

= 3.3 V, I

CC

= 3.3 V, I

CC

= 0 mA, V

F

= 0 mA, V

F

= 0.5 V -1.6 mA

E

= 2.0 V -1.6 mA

E

= 10 mA 2.0 1.27 V

F

= 10 mA (Note 2) 1.18 0.8 V

F

= 3.3 V 3.5 7 mA

CC

= 3.3 V 3.2 10 mA

CC

1.75

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

Switching Characteristics

Typical value is measured at T

(T

= -40°C to +85°C, V

A

= 25°C and V

A

= 3.3V)

CC

= 3.3 V, I

CC

= 7.5 mA unless otherwise speciﬁed.

F

Symbol AC Characteristics Test Conditions Min. Typ. Max. Unit

T

PLH

T

PHL

– T

|T

PHL

t

PSK

t

r

t

f

t

ELH

t

EHL

CM

Propagation Delay Time to Output High Level

Propagation Delay Time to Output Low Level

| Pulse Width Distortion R

PLH

Propagation Delay Skew R

Output Rise Time (10-90%)

Output Fall Time (90-10%)

Enable Propagation Delay Time to Output High Level

Enable Propagation Delay Time to Output Low Level

Common Mode

H

Tr ansient Immunity (at Output High Level)

Common Mode

L

Tr ansient Immunity (at Output Low Level)

R

= 350 Ω , C

L

R

= 350 Ω , C

L

= 350 Ω , C

L

= 350 Ω , C

L

R

= 350 Ω , C

L

R

= 350 Ω , C

L

V

= 3 V, R

EH

= 15 pF (Fig. 9) (Note 3) 65 90 ns

L

= 15 pF (Fig. 9) (Note 4) 43 75 ns

L

= 15 pF (Fig. 9) 23 25 ns

L

= 15 pF (Note 5) 31 40 ns

L

= 15 pF (Fig. 9)(Note 6) 22 ns

L

= 15 pF (Fig. 12) (Note 7) 3 ns

L

= 350 Ω , C

L

= 15 pF

L

(Fig. 10) (Note 8)

V

= 3 V, R

EH

= 350 Ω , C

L

= 15 pF

L

(Fig. 10) (Note 9)

RL = 350Ω, TA =25°C, IF = 0 mA,

(Min.) = 2.0V, |VCM| = 1,000 V

V

OH

(Fig. 11) (Note 10)

RL = 350Ω, TA =25°C, IF = 7.5 mA,

(Max.) = 0.8 V, |VCM| = 1,000 V

V

OL

(Fig. 11) (Note 11)

47 ns

27 ns

25,000 50,000 V/µs

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

Transfer Characteristics (T

= 25°C and VCC = 3.3V)

T

A

= -40°C to +85°C Unless otherwise speciﬁed. Typical value is measured at

A

Symbol DC Characteristics Test Conditions Min. Typ. Max. Unit

I

OH

V

I

FT

Isolation Characteristics (T

T

= 25°C and VCC = 3.3V)

A

High Level Output Current IF = 250 µA, VCC = 3.3 V, VO = 3.3 V,

V

= 2.0 V (Note 2)

E

Low Level Output Voltage VCC = 3.3 V, IF = 5 mA, IOL = 13 mA,

OL

V

= 2.0 V (Note 2)

E

Input Threshold Current VCC = 3.3 V, VO = 0.6 V, IOL = 13 mA,

V

= 2.0 V (Note 2)

E

= -40°C to +85°C Unless otherwise speciﬁed. Typical value is measured at

A

0.01 50 µA

0.3 0.6 V

15mA

Symbol Characteristics Test Conditions Min. Typ. Max. Unit

I

V

R

C

Input-Output

I-O

Insulation Leakage Current

Withstand Insulation Test

ISO

Voltage

FOD060L

FOD260L

Resistance (Input to Output) V

I-O

Capacitance (Input to Output) f = 1 MHz (Note 12) 0.6 pF

I-O

Relative humidity = 45%, T

= 25°C, t = 5 s,

A

V

= 3000 VDC (Note 12)

I-O

IIO ≤ 2 µA, RH < 50%, T

= 25°C, t = 1 min.(Note 12)

A

3750

5000

= 500 V (Note 12) 10

I-O

12

1.0 µA

V

RMS

Ω

Notes

1. The V

supply to each optoisolator must be bypassed by a 0.1µF capacitor or larger. This can be either a ceramic

CC

or solid tantalum capacitor with good high frequency characteristic and should be connected as close as possible to the package V

and GND pins of each device.

CC

2. Enable Input – No pull up resistor required as the device has an internal pull up resistor.

3. t

– Propagation delay is measured from the 3.75 mA level on the HIGH to LOW transition of the input current

PLH

pulse to the 1.5V level on the LOW to HIGH transition of the output voltage pulse.

4. t

– Propagation delay is measured from the 3.75 mA level on the LOW to HIGH transition of the input current

PHL

pulse to the 1.5V level on the HIGH to LOW transition of the output voltage pulse.

5. t

6. t

7. t

8. t

is the worst case difference between t

PSK

– Rise time is measured from the 90% to the 10% levels on the LOW to HIGH transition of the output pulse.

r

– Fall time is measured from the 10% to the 90% levels on the HIGH to LOW transition of the output pulse.

f

– Enable input propagation delay is measured from the 1.5V level on the HIGH to LOW transition of the input

ELH

PHL

and t

for any devices at the stated test conditions.

PLH

voltage pulse to the 1.5V level on the LOW to HIGH transition of the output voltage pulse.

9. t

– Enable input propagation delay is measured from the 1.5V level on the LOW to HIGH transition of the input

EHL

voltage pulse to the 1.5V level on the HIGH to LOW transition of the output voltage pulse.

10. CM

11. CM

– The maximum tolerable rate of rise of the common mode voltage to ensure the output will remain in the high

H

state (i.e., V

– The maximum tolerable rate of fall of the common mode voltage to ensure the output will remain in the low

L

output state (i.e., V

> 2.0 V). Measured in volts per microsecond (V/µs).

OUT

< 0.8 V). Measured in volts per microsecond (V/µs).

OUT

12. Device considered a two-terminal device: Pins 1, 2, 3 and 4 shorted together, and Pins 5, 6, 7 and 8 shorted together.

Typical Performance Curves

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

Fig. 1 Input Forward Current vs.

Forward Voltage

100

10

T

= 100°C

A

1

= -40°C

T

A

T

A

T

= 0°C

A

= 25°C

TA = 85°C

0.1

- Forward Current (mA)

F

I

0.01

0.001

0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7

VF - Forward Voltage (V)

Fig. 3 Low Level Output Voltage vs.

Ambient Temperature

0.6

VCC = 3.3V

= 2V

V

E

0.5

= 5mA

I

F

= 13mA

I

O

0.4

0.3

0.2

- Low Level Output Voltage (V)

0.1

OL

V

0.0

-40 -20 0 20 40 60 80 100

TA - Ambient Temperature (°C) TA - Ambient Temperature (°C)

Fig. 2 Input Threshold Current vs.

Ambient Temperature

2.5

VCC = 3.3V V

= 0.6V

O

2.0

1.5

FOD060L

= 350Ω, 1kΩ, 4k Ω

R

L

1.0

0.5

- Input Threshold Current (mA)

TH

I

0.0

-40 -20 0 20 40 60 80 100

FOD260L R

= 350Ω, 1kΩ, 4k Ω

L

TA - Ambient Temperature (°C)

Fig. 4 High Level Output Current

vs. Ambient Temperature

20

16

12

8

- High Level Output Current (nA) 4

VO = VCC = 3.3V

OH

I

= 2V

V

E

= 250 µA

I

F

0

-40 -20 0 20 40 60 80 100

Fig. 5 Low Level Output Current vs.

Ambient Temperature

40

VCC = 3.3V

V

= 2V

E

35

VOL = 0.6V

I

= 5mA

F

30

25

20

15

10

- Low Level Output Current (mA)

OL

5

I

0

-40 -20 0 20 40 60 80 100

T

- Ambient Temperature (°C)

A

- Propagation Delay (ns)

P

t

Fig. 6 Propagation Delay vs.

Ambient Temperature

80

VCC = 3.3V

= 7.5mA

I

F

70

R

= 350Ω

L

60

50

40

30

20

-40 -20 0 20 40 60 80 100

t

- FOD060L

PLH

- FOD260L

t

PLH

t

- FOD060L

PHL

- FOD260L

t

PHL

- Ambient Temperature (°C)

T

A

Typical Performance Curves

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

Fig. 7 Rise and Fall Times vs.

Ambient Temperature

35

VCC = 3.3V

= 7.5mA

I

F

30

RL = 350Ω

25

t

20

15

, - Rise, Fall Time (ns)

10

f

, t

r

t

5

0

-40 -20 0 20 40 60 80 100

r

tf

TA - Ambient Temperature (°C)

Fig. 8 Pulse Width Distortion vs.

Ambient Temperature

30

VCC = 3.3V

= 7.5mA

I

F

25

RL = 350Ω

20

15

10

5

PWD - Pulse Width Distortion (ns)

0

-40 -20 0 20 40 60 80 100

TA - Ambient Temperature (°C)

FOD260L

FOD060L

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

Pulse Gen.

= tr = 5 ns

t

f

Z

Input

Monitor

(I

= 50 Ω

O

)

F

47Ω

Pulse Generator tr = 5ns Z = 50Ω

O

+3.3V

V

1

2

3

4

CC

GND

8

7

6

5

0.1µF Bypass

R

C

L

Output (V

L

)

O

Fig. 9 Test Circuit and Waveforms for t

Input Monitor (V )

E

V

1

7.5 mA

2

3

4

CC

GND

8

7

0.1µF bypass

R

6

C

5

+3.3V

L

Output (V )

L

O

Input (I )

F

Output (V )

O

Output (V )

O

t

PHL

PLH

Input (V )

E

Output (V )

O

t

f

t

EHL

, t

PHL, tr

90%

10%

t

PLH

t

r

and tf.

I = 7.5 mA

F

I = 3.75 mA

F

1.5 V

t

ELH

3.0 V

1.5 V

Fig. 10 Test Circuit t

EHL

and t

ELH

.

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

V

1

I

F

A

B

V

FF

2

3

CC

8

7

6

0.1

µf

bypass

350Ω

+3.3V

Output (V )

O

V

CM

0V

Peak

3.3V

V

O

4

Pulse Gen

Switching Pos. (A), I = 0

V (Min)

O

F

V

GND

CM

5

CM

H

V (Max)

O

V

O

0.5 V

Switching Pos. (B), I = 7.5 mA

F

CM

L

Fig. 11 Test Circuit Common Mode Transient Immunity

Package Dimensions

Small Outline

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

0.164 (4.16)

0.144 (3.66)

0.202 (5.13)

0.182 (4.63)

SEATING PLANE

0.143 (3.63)

0.123 (3.13)

0.021 (0.53)

0.011 (0.28)

0.275 (6.99)

0.008 (0.20)

0.003 (0.08)

0.050 (1.27) TYP

Lead Coplanarity : 0.004 (0.10) MAX

0.024 (0.61)

0.060 (1.52)

0.155 (3.94)

0.050 (1.27)

0.010 (0.25)

0.006 (0.16)

0.244 (6.19)

0.224 (5.69)

Note:

All dimensions are in millimeters.

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions, speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www

.fairchildsemi.com/packaging/

Package Dimensions (Continued)

M

DIP

Through Hole

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

6.35–6.86

3.68–3.94

5.08 AX

0.51 MIN

0.41–0.56

9.40–9.91

2.54 BSC

Pin 1

1.14–1.78

3.05–3.90

0.4" Lead Spacing (Option T)

9.40–9.91

(0.78)

Pin 1

0.20–0.40

7.62 TYP

6.35–6.86

3.68–3.94

5.08

MAX

0.41–0.56

0.51 MIN

2.54 BSC

1.14–1.78

3.05–3.90

(0.78)

15.0° MAX

10.16 TYP

0.20–0.40

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions, speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

Package Dimensions (Continued)

SMT

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

Surface Mount – 0.3" Lead Spacing (Option S)

9.40–9.91

Pin 1

6.35–6.86

3.68–3.94

5.08

MAX

0.51 MIN

2.54 BSC

1.14–1.78

(0.41–0.56)

(0.78)

0.40 MIN

Both sides

8.00 MIN

10.30 MAX

Surface Mount – 0.4" Lead Spacing (Option TS)

9.40–9.91

1.50

ø1.00 TYP

(1.78)

(7.49)

(10.54)

(2.54)

(0.76)

Recommended Land Pattern

0.20–0.40

(1.78)

(2.54)

(1.54)

6.35–6.86

(9.96)

(13.00)

(0.76)

Recommended Land Pattern

3.68–3.94

5.08

MAX

Note:

0.51 MIN

2.54 TYP

1.14–1.78

(0.78)

7.62 TYP

0.40 MIN

Both sides

10.16

12.60 MAX

0.20–0.40

1. All dimensions are in millimeters.

2. Dimensions are exclusive of burrs, mold fash, and tie bar extrusion.

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions, speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www

.fairchildsemi.com/packaging/

Ordering Information

Part Number Package Packing Method

FOD060L Small outline 8-pin Tube (50 units per tube)

FOD060LR2 Small outline 8-pin Tape and Reel (2.500 units per reel)

FOD260L DIP 8-Pin Tube (50 units per tube)

FOD260LS SMT 8-Pin (Lead Bend) Tube (50 units per tube)

FOD260LSD SMT 8-Pin (Lead Bend) Tape and Reel (1,000 units per reel)

FOD260LV DIP 8-Pin, DIN EN/IEC 60747-5-2 option Tube (50 units per tube)

FOD260LSV SMT 8-Pin (Lead Bend), DIN EN/IEC 60747-5-2 option Tube (50 units per tube)

FOD260LSDV SMT 8-Pin (Lead Bend), DIN EN/IEC 60747-5-2 option Tape and Reel (1,000 units per reel)

FOD260LTV DIP 8-Pin, 0.4” Lead Spacing, DIN EN/IEC 60747-5-2 option Tube (50 units per tube)

FOD260LTSV SMT 8-Pin, 0.4” Lead Spacing, DIN EN/IEC 60747-5-2 option Tube (50 units per tube)

FOD260LTSR2 SMT 8-Pin, 0.4” Lead Spacing Tape and Reel (700 units per reel)

FOD260LTSR2V SMT 8-Pin, 0.4” Lead Spacing, DIN EN/IEC 60747-5-2 option Tape and Reel (700 units per reel)

Marking Information

Small Outline

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

Deﬁnitions

1

Fairchild logo

2

Device number

3

One digit year code, e.g., ‘8’

4

Tw o digit work week ranging from ‘01’ to ‘53’

5

Assembly package code

1

060L

S1YYX

3

4

2

5

Marking Information (Continued)

DIP and SMT

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

1

260L

XXV

43

Deﬁnitions

1Fairchild logo

2Device number

3 VDE mark (Note: Only appears on parts ordered with

DIN EN/IEC 60747-5-2 option – See order entry table)

4Two digit year code, e.g., ‘11’

5Two digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

BYY

5

2

6

Carrier Tape Specification

Small Outline

3.50 ± 0.20

0.30 MAX

8.3 ± 0.10

4.0 ± 0.10

8.0 ± 0.10

2.0 ± 0.05

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

Ø1.5 MIN

1.75 ± 0.10

5.5 ± 0.05

12.0 ± 0.3

5.20 ± 0.20

0.1 MAX

User Direction of Feed

Note: All dimensions are in millimeters.

6.40 ± 0.20

Ø1.5 ± 0.1/-0

Carrier Tape Speciﬁcation (Continued)

Option S

K

0

t

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

D

0

P

0

P

2

E

F

D

1

W

1

User Direction of Feed

d

A

0

B

0

P

Symbol Description Dimension in mm

WTape Width 16.0 ± 0.3

tTape Thickness 0.30 ± 0.05

P

0

D

0

E Sprocket Hole Location 1.75 ± 0.10

FPocket Location 7.5 ± 0.1

P

2

PPocket Pitch 12.0 ± 0.1

A

0

B

0

K

0

W

1

dCover Tape Thickness 0.1 max

R Min. Bending Radius 30

Sprocket Hole Pitch 4.0 ± 0.1

Sprocket Hole Diameter 1.55 ± 0.05

2.0 ± 0.1

Pocket Dimensions 10.30 ±0.20

10.30 ±0.20

4.90 ±0.20

Cover Tape Width 13.2 ± 0.2

Max. Component Rotation or Tilt 10°

W

Carrier Tape Speciﬁcation (Continued)

Option TS

K

0

t

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

D

0

P

0

P

2

E

F

D

1

W

1

User Direction of Feed

d

A

0

B

0

P

Symbol Description Dimension in mm

WTape Width 24.0 ± 0.3

tTape Thickness 0.40 ± 0.1

P

0

D

0

E Sprocket Hole Location 1.75 ± 0.10

FPocket Location 11.5 ± 0.1

P

2

PPocket Pitch 16.0 ± 0.1

A

0

B

0

K

0

W

1

dCover Tape Thickness 0.1 max

R Min. Bending Radius 30

Sprocket Hole Pitch 4.0 ± 0.1

Sprocket Hole Diameter 1.55 ± 0.05

2.0 ± 0.1

Pocket Dimensions 12.80 ± 0.1

10.35 ± 0.1

5.7 ±0.1

Cover Tape Width 21.0 ± 0.1

Max. Component Rotation or Tilt 10°

W

Reflow Profile

Small Outline

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

Temperature

(°C)

300

280

260

240

220

200

180

160

140

120

100

80

60

40

20

0

0 60 180120 270

1.822°C/Sec Ramp up rate

33 Sec

Time (s)

260°C

Time above

183°C = 90 Sec

>245°C = 42 Sec

360

Reﬂow Proﬁle (Continued)

DIP and SMT

T

80

60

40

20

P

T

L

0

260

240

220

200

180

160

140

120

100

Temperature (°C)

Max. Ramp-up Rate = 3°C/S

Max. Ramp-down Rate = 6°C/S

Ts ma x

Preheat Area

Ts mi n

120

Time 25°C to Peak

t

s

240 360

Time (seconds)

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers

t

P

t

L

Proﬁle Freature Pb-Free Assembly Proﬁle

Temperature Min. (Tsmin) 150°C

Temperature Max. (Tsmax) 200°C

Time (t

Ramp-up Rate (t

Liquidous Temperature (T

Time (t

Peak Body Package Temperature 260°C +0°C / –5°C

Time (t

Ramp-down Rate (T

Time 25°C to Peak Temperature 8 minutes max.

) from (Tsmin to Tsmax) 60–120 seconds

S

to tP) 3°C/second max.

L

) 217°C

L

) Maintained Above (TL) 60–150 seconds

L

) within 5°C of 260°C 30 seconds

P

to TL) 6°C/second max.

P

FOD060L, FOD260L — 3.3V/5V High Speed-10 MBit/s Logic Gate Optocouplers