Datasheet fnb41060 Datasheet

Page 1
FNB41060
Smart Power Module
FNB41060 Smart Power Module
January 2010
TM
Motion-SPM
• 600V-10A 3-phase IGBT inverter bridge including control ICs for gate driving and protection
• Easy PCB layout due to built-in bootstrap diode and VS out­put
• Divided negative dc-link terminals for inverter current sensing applications
• Single-grounded power supply due to built-in HVIC
• Built-in thermistor for over-temperature monitoring
• Isolation rating of 2000Vrms/min.
Applications
• AC 100V ~ 253V three-phase inverter drive for small power ac motor drives
• Home appliances applications like air conditioner and wash­ing machine
General Description
It is an advanced motion-smart power module (Motion-SPMTM) that Fairchild has newly developed and designed to provide very compact and high performance ac motor drives mainly tar­geting low-power inverter-driven application like air conditioner and washing machine. It combines optimized circuit protection and drive matched to low-loss IGBTs. System reliability is fur­ther enhanced by the integrated under-voltage lock-out protec­tion, short-circuit protection, and temperature monitoring. The high speed built-in HVIC provides opto-coupler-less single-sup­ply IGBT gate driving capability that further reduce the overall size of the inverter system design. Each phase current of inverter can be monitored separately due to the divided nega­tive dc terminals.
Additional Information
For further infomation, please see AN-9070 and FEB306-001 in http://www.fairchildsemi.com
Figure 1.
©2010 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com
FNB41060 Rev. C
Page 2
Integrated Power Functions
• 600V-10A IGBT inverter for three-phase DC/AC power conversion (Please refer to Figure 3)
Integrated Drive, Protection and System Control Functions
• For inverter high-side IGBTs: Gate drive circuit, High voltage isolated high-speed level shifting
Control circuit under-voltage (UV) protection
• For inverter low-side IGBTs: Gate drive circuit, Short circuit protection (SC)
Control supply circuit under-voltage (UV) protection
• Fault signaling: Corresponding to UV (Low-side supply) and SC faults
• Input interface: 3.3/5V CMOS compatible, Schmitt trigger input
Pin Configuration
Top View
VTH(1)
VTH(1)
RTH(2)
RTH(2)
P(3)
P(3)
U(4)
U(4)
Case Temperature (TC)
Case Temperature (TC)
Detecting Point
Detecting Point
V(5)
V(5)
W(6)
W(6)
NU(7)
NU(7)
NV(8)
NV(8)
NW(9)
NW(9)
V
(26)
V
(26)
B(U)
B(U)
V
(25)
V
(25)
S(U)
S(U)
V
(24)
V
(24)
B(V)
B(V)
V
(23)
V
(23)
S(V)
S(V)
V
(22)
V
(22)
B(W)
B(W)
V
(21)
V
(21)
S(W)
S(W)
IN
(20)
IN
(20)
(UH)
(UH)
IN
(19)
IN
(19)
(VH)
(VH)
IN
(18)
IN
(18)
(WH)
(WH)
V
(17)
V
(17)
CC(H)
CC(H)
V
(16)
V
(16)
CC(L)
CC(L)
COM(15)
COM(15)
IN
(14)
IN
(14)
(UL)
(UL)
IN
(13)
IN
(13)
(VL)
(VL)
IN
(12)
IN
(12)
(WL)
(WL)
VFO(11)
VFO(11)
CSC(10)
CSC(10)
FNB41060 Smart Power Module
FNB41060 Rev. C
Figure 2.
2 www.fairchildsemi.com
Page 3
Pin Descriptions
Pin Number Pin Name Pin Description
1 V
2 R
TH
TH
3 P Positive DC–Link Input
4 U Output for U Phase
5 V Output for V Phase
6 W Output for W Phase
7 N
8 N
9 N
10 C
11 V
12 IN
13 IN
14 IN
U
V
W
SC
FO
(WL)
(VL)
(UL)
15 COM Common Supply Ground
16 V
17 V
18 IN
19 IN
20 IN
21 V
22 V
23 V
24 V
25 V
26 V
CC(L)
CC(H)
(WH)
(VH)
(UH)
S(W)
B(W)
S(V)
B(V)
S(U)
B(U)
Thermistor Bias Voltage
Series Resistor for the Use of Thermistor (Temperature Detection)
Negative DC–Link Input for U Phase
Negative DC–Link Input for V Phase
Negative DC–Link Input for W Phase
Capacitor (Low-pass Filter) for Short-Current Detection Input
Fault Output
Signal Input for Low-side W Phase
Signal Input for Low-side V Phase
Signal Input for Low-side U Phase
Low-Side Common Bias Voltage for IC and IGBTs Driving
High-Side Common Bias Voltage for IC and IGBTs Driving
Signal Input for High-side W Phase
Signal Input for High-side V Phase
Signal Input for High-side U Phase
High-side Bias Voltage Ground for W Phase IGBT Driving
High-side Bias Voltage for W Phase IGBT Driving
High-side Bias Voltage Ground for V Phase IGBT Driving
High-side Bias Voltage for V Phase IGBT Driving
High-side Bias Voltage Ground for U Phase IGBT Driving
High-side Bias Voltage for U Phase IGBT Driving
FNB41060 Smart Power Module
FNB41060 Rev. C
3 www.fairchildsemi.com
Page 4
Internal Equivalent Circuit and Input/Output Pins
(26) V
(25) V
(24) V
(23) V
(22) V
(21) V
(20) IN
(19) IN
(18) IN
(17) V
(16) V
(15) COM
(14) IN
(13) IN
(12) IN
(11) V
(10) C
B(U)
S(U)
B(V)
S(V)
B(W)
S(W)
(UH)
(VH)
(WH)
CC(H)
CC(L)
(UL)
(VL)
(WL)
FO
SC
UVB
UVS
VVB
VVS
WVB
WVS
IN(UH)
IN(VH)
IN(WH)
VCC
COM
VCC
COM
IN(UL)
IN(VL)
IN(WL)
VFO
C(SC)
OUT(UH)
UVS
OUT(VH)
VVS
OUT(WH)
WVS
OUT(UL)
OUT(VL)
OUT(WL)
Thermister
V
TH
RTH(2)
P (3)
U(4)
V (5)
W(6)
NU(7)
NV(8)
NW(9)
FNB41060 Smart Power Module
(1)
Note:
1) Inverter high-side is composed of three IGBTs, freewheeling diodes and one control IC for each IGBT.
2) Inverter low-side is composed of three IGBTs, freewheeling diodes and one control IC for each IGBT. It has gate drive and protection functions.
3) Inverter power side is composed of four inverter dc-link input terminals and three inverter output terminals.
Figure 3.
FNB41060 Rev. C
4 www.fairchildsemi.com
Page 5
FNB41060 Smart Power Module
Absolute Maximum Ratings (T
= 25°C, Unless Otherwise Specified)
J
Inverter Part
Symbol Parameter Conditions Rating Units
V
PN
V
PN(Surge)
V
CES
I
O,25
I
O,100
I
pk
P
T
Note:
1. Sinusoidal PWM at VPN=300V, VCC=VBS=15V, TJ< 150°℃, FSW=20kHz, MI=0.9, PF=0.8
2. The maximum junction temperature rating of the power chips integrated within the SPM is 150°C.
Supply Voltage Applied between P- NU, NV, N
Supply Voltage (Surge) Applied between P- NU, NV, N
W
W
450 V
500 V
Collector-emitter Voltage 600 V
Output Phase Current TC = 25°C, TJ < 150°C (Note 1) 10 A
Output Phase Current TC = 100°C, TJ < 150°C (Note 1) 5 A
Output Peak Phase Current TC = 25°C, TJ < 150°C, Under 1ms Pulse Width 15 A
Collector Dissipation TC = 25°C per One Chip 32 W
C
Operating Junction Temperature (Note 2) -40 ~ 150 °C
J
Control Part
Symbol Parameter Conditions Rating Units
V
CC
V
BS
V
V
FO
I
FO
V
SC
Control Supply Voltage Applied between V
High-side Control Bias Voltage
Input Signal Voltage Applied between IN
IN
Applied between V V
- V
B(W)
S(W)
IN
, IN
(WL)
- COM
(VL)
CC(H)
B(U)
(UH)
, V
- COM 20 V
CC(L)
- V
, IN
S(U)
(VH)
, V
, IN
B(V)
(WH)
- V
, IN
,
S(V)
,
-0.3~VCC+0.3 V
(UL)
20 V
Fault Output Supply Voltage Applied between VFO - COM -0.3~VCC+0.3 V
Fault Output Current Sink Current at VFO Pin 1 mA
Current Sensing Input Voltage Applied between CSC - COM -0.3~VCC+0.3 V
Bootstrap Diode Part
Symbol Parameter Conditions Rating Units
V
RRM
I
F
I
FP
T
Maximum Repetitive Reverse Voltage 600 V
Forward Current TC = 25°C 0.5 A
Forward Current (Peak) TC = 25°C, Under 1ms Pulse Width 1 A
Operating Junction Temperature -40 ~ 150 °C
J
Total System
Symbol Parameter Conditions Rating Units
V
PN(PROT)
T
STG
V
ISO
Self Protection Supply Voltage Limit (Short Circuit Protection Capability)
VCC = VBS = 13.5 ~ 16.5V TJ = 150°C, Non-repetitive, less than 2ms
400 V
Storage Temperature -40 ~ 125 °C
Isolation Voltage 60Hz, Sinusoidal, AC 1 minute, Connection
2000 V
Pins to heat sink plate
Thermal Resistance
Symbol Parameter Conditions Min. Typ. Max. Units
R
th(j-c)Q
R
th(j-c)F
Note:
3. For the measurement point of case temperature(TC), please refer to Figure 2.
Junction to Case Thermal Resistance
Inverter IGBT part (per 1/6 module) - - 3.8 °C/W
Inverter FWD part (per 1/6 module) - - 4.8 °C/W
rms
FNB41060 Rev. C
5 www.fairchildsemi.com
Page 6
FNB41060 Smart Power Module
Electrical Characteristics (T
= 25°C, Unless Otherwise Specified)
J
Inverter Part
Symbol Parameter Conditions Min. Typ. Max. Units
V
CE(SAT)
V
F
HS t
t
C(ON)
t
t
C(OFF)
LS t
t
C(ON)
t
t
C(OFF)
I
CES
Note:
4. tON and t
OFF
For the detailed information, please see Figure 4.
Collector-Emitter Saturation Voltage
VCC = VBS = 15V VIN = 5V
IC = 5A, TJ = 25°C - 1.5 2.0 V
FWD Forward Voltage VIN = 0V IF = 5A, TJ = 25°C - 1.5 2.0 V
Switching Times VPN = 300V, VCC = VBS = 15V, IC = 5A
ON
TJ = 25°C VIN = 0V « 5V, Inductive Load
OFF
(Note 4)
0.45 0.75 1.25 ms
- 0.20 0.45 ms
- 0.70 1.20 ms
- 0.15 0.40 ms
t
rr
ON
OFF
VPN = 300V, VCC = VBS = 15V, IC = 5A TJ = 25°C VIN = 0V « 5V, Inductive Load (Note 4)
- 0.15 - ms
0.35 0.65 1.15 ms
- 0.15 0.40 ms
- 0.65 1.15 ms
- 0.15 0.40 ms
t
rr
Collector-Emitter
VCE = V
Leakage Current
include the propagation delay time of the internal drive IC. t
CES
C(ON)
and t
are the switching time of IGBT itself under the given gate driving condition internally.
C(OFF)
- 0.15 - ms
- - 1 mA
V
IN( ON)
10 0% I
V
CE
V
IN
t
ON
10 % I
(a) turn -on
C
90 % I
C
t
t
C( ON)
C
10 0 % I
rr
10 % V
C
I
C
V
IN
t
OFF
V
CE
IN( OFF )
I
C
10 % V
t
C( OF F)
CE
V
10 % I
CE
C
(b) turn-off
Figure 4. Switching Time Definition
FNB41060 Rev. C
6 www.fairchildsemi.com
Page 7
Switching Loss (Typical)
FNB41060 Smart Power Module
Inductive Load, VPN=300V, VCC=15V, TJ=25℃
400
350
300
[uJ]
SW
250
200
150
100
SWITCHING LOSS, E
50
0
0 1 2 3 4 5
IGBT Turn-ON, E
IGBT Turn-OFF, E
FRD Turn-OFF, E
on
off
rec
COLLECTOR CURRENT, Ic [AMPERES]
Inductive Load, VPN=300V, VCC=15V, TJ=150℃
400
350
300
[uJ]
SW
250
200
150
100
SWITCHING LOSS, E
50
0
IGBT Turn-ON, E
IGBT Turn-OFF, E
FRD Turn-OFF, E
0 1 2 3 4 5
COLLECTOR CURRENT, Ic [AMPERES]
on
off
rec
Figure 5. Switching Loss Characteristics
Control Part
Symbol Parameter Conditions Min. Typ. Max. Units
I
QCCH
I
QCCL
I
PCCH
I
PCCL
I
I
V
V
V
SC(ref)
UV
UV
UV
UV
t
V
IN(ON)
V
IN(OFF)
R
Note:
5. Short-circuit current protection is functioning only at the low-sides.
6. TTH is the temperature of thermister itselt. To know case temperature (TC), please make the experiment considering your application.
Quiescent VCC Supply Current
Operating VCC Supply Current
V
CC(H)
V
CC(L)
V
CC(H)
= 15V, IN
= 15V, IN
= 15V, f
(UH,VH,WH)
(UL,VL, WL)
= 20kHz,
PWM
= 0V V
= 0V V
duty=50%, applied to one PWM
- COM - - 0.10 mA
CC(H)
- COM - - 2.65 mA
CC(L)
V
- COM - - 0.15 mA
CC(H)
signal input for High-side
V
= 15V, f
CC(L)
duty=50%, applied to one PWM
= 20kHz,
PWM
V
- COM - - 3.65 mA
CC(L)
signal input for Low-side
Quiescent VBS Supply
QBS
Current
Operating VBS Supply
PBS
Current
VBS = 15V, IN
(UH, VH, WH)
VCC = VBS = 15V, f duty=50%, applied to one PWM
= 0V V
= 20kHz,
PWM
- V
, V
-
B(U)
S(U)
B(W)
S(U)
B(W)
- V
, V
- V
B(V)
S(W)
B(V)
S(W)
V
, V
S(V)
V
- V
B(U)
V
, V
S(V)
- - 0.30 mA
-
- - 2.00 mA
signal input for High-side
Fault Output Voltage VSC = 0V, VFO Circuit: 4.7kW to 5V Pull-up 4.5 - - V
FOH
FOL
VSC = 1V, VFO Circuit: 4.7kW to 5V Pull-up - - 0.5 V
Short Circuit Trip Level VCC = 15V (Note 5) 0.45 0.5 0.55 V
CCD
Supply Circuit
CCR
Under-Voltage Protection
BSD
BSR
Fault-out Pulse Width 30 - - ms
FOD
ON Threshold Voltage Applied between IN
OFF Threshold Voltage 0.8 - - V
Resistance of
TH
Thermister
Detection Level 10.5 - 13.0 V
Reset Level 11.0 - 13.5 V
Detection Level 10.0 - 12.5 V
Reset Level 10.5 - 13.0 V
, IN
, IN
, IN
, IN
,
(UH)
(VH)
(WH)
(UL)
IN
- COM
(WL)
(VL)
- - 2.6 V
@TTH=25°C, (Note 6) - 47 - kW
@TTH=100°C - 2.9 - kW
FNB41060 Rev. C
7 www.fairchildsemi.com
Page 8
600
550
500
450
400
R-T Curve
20
16
12
R-T Curve in 50 ~ 125℃ ℃
350
300
250
200
Resistance[kW]
150
8
4
Resistance[kW]
0
50 60 70 80 90 100 110 120
Temperature [ ]℃
100
50
0
-20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
Temperature TTH[ ]℃
Figure. 6. R-T Curve of The Built-in Thermistor
FNB41060 Smart Power Module
Bootstrap Diode Part
Symbol Parameter Conditions Min. Typ. Max. Units
V
F
t
rr
Note:
7. Built in bootstrap diode includes around 15 Ω resistance characteristic.
Forward Voltage IF = 0.1A, TC = 25°C - 2.5 - V
Reverse Recovery Time IF = 0.1A, TC = 25°C - 80 - ns
Built in Bootstrap Diode VF-IF Characteristic
1.0
0.9
0.8
0.7
0.6
0.5
[A]
F
I
0.4
0.3
0.2
0.1
0.0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
TC=25℃
VF [V]
FNB41060 Rev. C
Figure 7. Built in Bootstrap Diode Characteristic
8 www.fairchildsemi.com
Page 9
Recommended Operating Conditions
FNB41060 Smart Power Module
Symbol Parameter Conditions
V
V
V
dVCC/dt,
dVBS/dt
t
f
PWM
V
P
WIN(ON)
P
WIN(OFF)
Note:
8. SPM might not make response if input pulse width is less than the recommanded value.
Note:
9. The allowable output current value may be different from the actual application.
Supply Voltage Applied between P - NU, NV, N
PN
Control Supply Voltage Applied between V
CC
High-side Bias Voltage Applied between V
BS
, V
CC(H)
B(U)-VS(U)
CC(L)
, V
Control supply variation -1 - 1 V/ms
dead
Blanking Time for
For Each Input Signal 1.5 - - ms
Preventing Arm-short
PWM Input Signal -40°C < TJ < 150°C - - 20 kHz
Voltage for Current
SEN
Sensing
Minimun Input Pulse
Applied between NU, NV, N (Including surge voltage)
W
- COM
(Note 8) 0.5 - - ms
Width
10
]
9
rms
8
[A
Orms
7
6
5
4
3
2
1
Allowable Output Current, I
0
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140
Allowable Maximum Output Current
VDC=300V, VCC=VBS=15V
TJ < 150℃ , TC ≤ 125℃
M.I.=0.9, P.F.=0.8 Sinusoidal PWM
fSW=15kHz
Case Temperature, TC [℃]
Value
Units
Min. Typ. Max.
W
-COM 13.5 15 16.5 V
B(V)-VS(V),VB(W)-VS(W)
fSW=5kHz
- 300 400 V
13.0 15 18.5 V
-4 4 V
0.5 - -
Figure 8. Allowable Maximum Output Current
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FNB41060 FNB41060 SPM26-AA - - 12
FNB41060 Rev. C
9 www.fairchildsemi.com
Page 10
Mechanical Characteristics and Ratings
FNB41060 Smart Power Module
Parameter Conditions
Device Flatness Note Figure 9 0 - +120 mm
Mounting Torque Mounting Screw: - M3
Note Figure 10
Weight - 11 - g
Figure 9. Flatness Measurement Position
Recommended 0.7N•m 0.6 0.7 0.8 N•m
Recommended 7.1kg•cm 6.2 7.1 8.1 kg•cm
Min. Typ. Max.
Limits
Units
Pre - Screwing : 1→2
Pre - Screwing : 1→2
2
Final Screwing : 2→1
Final Screwing : 2→1
1
1
Note:
10. Do not make over torque when mounting screws. Much mounting torque may cause ceramic cracks, as well as bolts and Al heat-sink destruction.
11. Avoid one side tightening stress. Fig.10 shows the recommended torque order for mounting screws. Uneven mounting can cause the SPM ceramic substrate to be damaged.
The Pre-Screwing torque is set to 20~30% of maximum torque rating.
Figure 10. Mounting Screws Torque Order
2
FNB41060 Rev. C
10 www.fairchildsemi.com
Page 11
Time Charts of SPMs Protective Function
Input Signal
FNB41060 Smart Power Module
Protection
Circuit State
Control
UV
RESET
CCR
a1
Supply Voltage
Output Current
Fault Output Signal
a1 : Control supply voltage rises: After the voltage rises UV
a2 : Normal operation: IGBT ON and carrying current.
a3 : Under voltage detection (UV
a4 : IGBT OFF in spite of control input condition.
a5 : Fault output operation starts.
a6 : Under voltage reset (UV
a7 : Normal operation: IGBT ON and carrying current.
CCR
CCD
).
).
Figure 11. Under-Voltage Protection (Low-side)
SET RESET
UV
CCD
a3
a2
, the circuits start to operate when next input is applied.
CCR
a4
a5
a6
a7
Input Signal
Protection
Circuit State
Control
Supply Voltage
UV
BSR
RESET
b1
b2
UV
SET RESET
BSD
b3
b4
Output Current
High-level (no fault output)
Fault Output Signal
b1 : Control supply voltage rises: After the voltage reaches UV
b2 : Normal operation: IGBT ON and carrying current.
b3 : Under voltage detection (UV
b4 : IGBT OFF in spite of control input condition, but there is no fault output signal.
b5 : Under voltage reset (UV
b6 : Normal operation: IGBT ON and carrying current
BSR
BSD
)
).
, the circuits start to operate when next input is applied.
BSR
Figure 12. Under-Voltage Protection (High-side)
b5
b6
FNB41060 Rev. C
11 www.fairchildsemi.com
Page 12
FNB41060 Smart Power Module
Lower arms
control input
c6
c7
Protection
Circuit state
Internal IGBT
Gate-Emitter Voltage
Output Current
Sensing Voltage
SET
c3
c2
SC
c1
RESET
c4
c8
SC Reference Voltage
of the shunt
resistance
CR circuit time constant delay
Fault Output Signal
(with the external shunt resistance and CR connection)
c1 : Normal operation: IGBT ON and carrying current.
c2 : Short circuit current detection (SC trigger).
c3 : Hard IGBT gate interrupt.
c4 : IGBT turns OFF.
c5 : Input “L” : IGBT OFF state.
c6 : Input “H”: IGBT ON state, but during the active period of fault output the IGBT doesn’t turn ON.
c7 : IGBT OFF state
c5
Figure 13. Short-Circuit Current Protection (Low-side Operation only)
Input/Output Interface Circuit
5V-Line (MCU or Control p ower)
RPF=10kΩ
IN
IN
MCU
Note:
1) RC coupling at each input (parts shown dotted) might change depending on the PWM control scheme used in the application and the wiring impedance of the application’s printed circuit board. The SPM input signal section integrates 5kW (typ.) pull-down resistor. Therefore, when using an external filtering resistor, please pay attention to the sig­nal voltage drop at input terminal.
2) The logic input is compatible with standard CMOS outputs.
V
FO
CO M
Figure 14. Recommended CPU I/O Interface Circuit
FNB41060 Rev. C
12 www.fairchildsemi.com
SPM
, ,
(UH)IN(VH)
, ,
(UL)IN(VL )
IN
IN
(WH )
(WL)
Page 13
FNB41060 Smart Power Module
M
C U
Gating UH
Gating VH
Gating WH
Fault
Gating UL
Gating VL
Gating WL
(26) V
B(U)
CBSC
BSC
(25) V
C
C
SPC15
S(U)
(20) IN
(UH)
(24) V
B(V)
BSC
(23) V
S(V)
(19) IN
(VH)
(22) V
B(W)
BSC
(21) V
S(W)
(18) IN
(WH)
(17) V
CC(H)
(15) COM
(16) V
CC(L)
(11) V
FO
(14) IN
(UL)
(13) IN
(VL)
(12) IN
(WL)
(10) C
SC
(1) V
TH
THERMISTOR
(2) R
TH
R
S
C
R
S
R
S
BS
C
BS
15V line
CPSC
PSCPS
C
SP15
C
5V line
R
PF
C
SPC05
C
CPSC
SP05
C
C
PS
PS
SC
R
F
R
TH
R
S
C
PF
C
BPF
R
S
R
S
R
S
VB(U)
VS(U)
IN(UH)
VB(V)
VS(V)
IN(VH)
VB(W)
VS(W)
IN(WH)
VCC
COM
VCC
VFO
IN(UL)
IN(VL)
IN(WL)
COM
CSC
HVIC
LVIC
OUT(UH)
VS(U)
OUT(VH)
VS(V)
OUT(WH)
VS(W)
OUT(UL)
OUT(VL)
OUT(WL)
P (3)
U (4)
V (5)
W (6)
NU(7)
NV(8)
NW(9)
M
V
C
DC
DCS
R
SU
R
SV
R
SW
Input Signal for
Short-Circuit Protection
Temp. Monitoring
U-Phase Current V-Phase Current
W-Phase Current
Note:
1) To avoid malfunction, the wiring of each input should be as short as possible. (less than 2-3cm)
2) By virtue of integrating an application specific type HVIC inside the SPM, direct coupling to CPU terminals without any opto-coupler or transformer isolation is possible.
3) VFO output is open drain type. This signal line should be pulled up to the positive side of the MCU or control power supply with a resistor that makes IFO up to 1mA. Please refer
to Figure14.
4) C
of around 7 times larger than bootstrap capacitor CBS is recommended.
SP15
5) Input signal is High-Active type. There is a 5kW resistor inside the IC to pull down each input signal line to GND. RC coupling circuits is recommanded for the prevention
of input signal oscillation. RSCPS time constant should be selected in the range 50~150ns. (Recommended RS=100 Ω , CPS=1nF)
6) To prevent errors of the protection function, the wiring around RF and CSC should be as short as possible.
7) In the short-circuit protection circuit, please select the RFCSC time constant in the range 1.5~2ms.
8) Each capacitor should be mounted as close to the pins of the SPM as possible.
9) To prevent surge destruction, the wiring between the smoothing capacitor and the P&GND pins should be as short as possible. The use of a high frequency non-inductive
capacitor of around 0.1~0.22mF between the P&GND pins is recommended.
10) Relays are used at almost every systems of electrical equipments of home appliances. In these cases, there should be sufficient distance between the CPU and the relays.
11) The zener diode should be adopted for the protection of ICs from the surge destruction between each pair of control supply terminals. (Recommanded zener diode=24V/1W)
12) Please choose the electrolytic capacitor with good temperature characteristic in CBS. Also, choose 0.1~0.2mF R-category ceramic capacitors with good temperature and
frequency characteristics in C
BSC
.
13) For the detailed information, please refer to the AN-9070 and FEB306-001.
Figure 15. Typical Application Circuit
FNB41060 Rev. C
13 www.fairchildsemi.com
Page 14
Detailed Package Outline Drawings
±0.10
17-0.50
FNB41060 Smart Power Module
(2.609)
2-R1.60
PKG.C
PKG.C
(2-0.70)
±0.50
11.10
16.891
19x1.778
±0.30
39.00
±0.300
16.891
=33.782
±0.50
±0.30
±0.50
6.00
±0.05
2.05
±0.50
23.00
13.00013.000
PKG.C
2
°
~6
±0.50
27.23
°
±0.15
10.00
PKG.C
36.70
±0.15
(R0.50)
4.50
11.10
±0.30
±0.50
0
5
1
.
0
.
0
0
+
­0 5
. 0
FNB41060 Rev. C
(1.50)
9-0.60
±0.10
13x2.54
15.240
±0.30
±0.300
PKG.C
=33.020
17.780
±0.30
(1.720)
(2-0.50)
±0.50
6.00
±0.50
11.10
14 www.fairchildsemi.com
Page 15
®
®
®
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks.
AccuPower™ Auto-SPM™ Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ DEUXPEED Dual Cool™ EcoSPARK EfficientMax™
Fairchild Fairchild Semiconductor FACT Quiet Series™ FACT FAST
®
®
®
®
® ®
®
FastvCore™ FETBench™ FlashWriter
®
* FPS™ F-PFS™
FRFET Global Power ResourceSM Green FPS™ Green FPS™ e-Series™ Gmax™ GTO™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MicroPak2™ MillerDrive™ MotionMax™ Motion-SPM™ OptoHiT™ OPTOLOGIC OPTOPLANAR
®
®
®
PDP SPM™ Power-SPM™
PowerTrench PowerXS™ Programmable Active Droop™
®
QFET QS™ Quiet Series™ RapidConfigure™
™
Saving our world, 1mW/W/kW at a time™ SignalWise™ SmartMax™ SMART START™
®
SPM STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS™ SyncFET™ Sync-Lock™
®
*
The Power Franchise
TinyBoost™ TinyBuck™ TinyCalc™
®
TinyLogic TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ TriFault Detect™ TRUECURRENT™* μSerDes™
®
UHC Ultra FRFET™ UniFET™ VCX™ VisualMax™ XS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMI CONDUCTOR RESERVES THE RIGH T TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREI N TO IM PROVE RELIABILITY, FUNCTION, OR DESI GN. FAI RCHILD DO ES NOT ASSUME ANY LI ABILI TY ARISI NG OUT OF THE APPLI CATION OR USE O F ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEI THER DOES IT CONVEY ANY LICENSE UNDER I TS PATENT RIGHTS, NOR THE RI GHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EX PAND THE TERMS OF FAIRCHI LD’S WORLDWIDE TERMS AND CONDITIONS, SPECIF ICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRI TICAL COM PONENTS IN L IFE SUPPORT DEVI CES OR SYSTEM S WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEM I CONDUCTOR CORPORATI ON.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.
2. A critical com ponent in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any w arranty issues that may arise. Fairchild w ill not pro vide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative / In Design
Preliminary First Production
No Identification Needed Full Production
Obsolete Not In Production
Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
Rev. I47
© Fairchild Semiconductor Corporation www.fairchildsemi.com
Loading...