• 600V-10A 3-phase IGBT inverter bridge including control ICs
for gate driving and protection
• Easy PCB layout due to built-in bootstrap diode and VS output
• Divided negative dc-link terminals for inverter current sensing
applications
• Single-grounded power supply due to built-in HVIC
• Built-in thermistor for over-temperature monitoring
• Isolation rating of 2000Vrms/min.
Applications
• AC 100V ~ 253V three-phase inverter drive for small power
ac motor drives
• Home appliances applications like air conditioner and washing machine
General Description
It is an advanced motion-smart power module (Motion-SPMTM)
that Fairchild has newly developed and designed to provide
very compact and high performance ac motor drives mainly targeting low-power inverter-driven application like air conditioner
and washing machine. It combines optimized circuit protection
and drive matched to low-loss IGBTs. System reliability is further enhanced by the integrated under-voltage lock-out protection, short-circuit protection, and temperature monitoring. The
high speed built-in HVIC provides opto-coupler-less single-supply IGBT gate driving capability that further reduce the overall
size of the inverter system design. Each phase current of
inverter can be monitored separately due to the divided negative dc terminals.
Additional Information
For further infomation, please see AN-9070 and FEB306-001 in
http://www.fairchildsemi.com
10. Do not make over torque when mounting screws. Much mounting torque may cause ceramic cracks, as well as bolts and Al heat-sink destruction.
11. Avoid one side tightening stress. Fig.10 shows the recommended torque order for mounting screws. Uneven mounting can cause the SPM ceramic substrate to be damaged.
The Pre-Screwing torque is set to 20~30% of maximum torque rating.
Figure 10. Mounting Screws Torque Order
2
FNB41060 Rev. C
10www.fairchildsemi.com
Page 11
Time Charts of SPMs Protective Function
Input Signal
FNB41060 Smart Power Module
Protection
Circuit State
Control
UV
RESET
CCR
a1
Supply Voltage
Output Current
Fault Output Signal
a1 : Control supply voltage rises: After the voltage rises UV
a2 : Normal operation: IGBT ON and carrying current.
a3 : Under voltage detection (UV
a4 : IGBT OFF in spite of control input condition.
a5 : Fault output operation starts.
a6 : Under voltage reset (UV
a7 : Normal operation: IGBT ON and carrying current.
CCR
CCD
).
).
Figure 11. Under-Voltage Protection (Low-side)
SETRESET
UV
CCD
a3
a2
, the circuits start to operate when next input is applied.
CCR
a4
a5
a6
a7
Input Signal
Protection
Circuit State
Control
Supply Voltage
UV
BSR
RESET
b1
b2
UV
SETRESET
BSD
b3
b4
Output Current
High-level (no fault output)
Fault Output Signal
b1 : Control supply voltage rises: After the voltage reaches UV
b2 : Normal operation: IGBT ON and carrying current.
b3 : Under voltage detection (UV
b4 : IGBT OFF in spite of control input condition, but there is no fault output signal.
b5 : Under voltage reset (UV
b6 : Normal operation: IGBT ON and carrying current
BSR
BSD
)
).
, the circuits start to operate when next input is applied.
BSR
Figure 12. Under-Voltage Protection (High-side)
b5
b6
FNB41060 Rev. C
11www.fairchildsemi.com
Page 12
FNB41060 Smart Power Module
Lower arms
control input
c6
c7
Protection
Circuit state
Internal IGBT
Gate-Emitter Voltage
Output Current
Sensing Voltage
SET
c3
c2
SC
c1
RESET
c4
c8
SC Reference Voltage
of the shunt
resistance
CR circuit time
constant delay
Fault Output Signal
(with the external shunt resistance and CR connection)
c1 : Normal operation: IGBT ON and carrying current.
c2 : Short circuit current detection (SC trigger).
c3 : Hard IGBT gate interrupt.
c4 : IGBT turns OFF.
c5 : Input “L” : IGBT OFF state.
c6 : Input “H”: IGBT ON state, but during the active period of fault output the IGBT doesn’t turn ON.
c7 : IGBT OFF state
c5
Figure 13. Short-Circuit Current Protection (Low-side Operation only)
Input/Output Interface Circuit
5V-Line (MCU or Control p ower)
RPF=10kΩ
IN
IN
MCU
Note:
1) RC coupling at each input (parts shown dotted) might change depending on the PWM control scheme used in the application and the wiring impedance of the application’s
printed circuit board. The SPM input signal section integrates 5kW (typ.) pull-down resistor. Therefore, when using an external filtering resistor, please pay attention to the signal voltage drop at input terminal.
2) The logic input is compatible with standard CMOS outputs.
V
FO
CO M
Figure 14. Recommended CPU I/O Interface Circuit
FNB41060 Rev. C
12www.fairchildsemi.com
SPM
,,
(UH)IN(VH)
,,
(UL)IN(VL )
IN
IN
(WH )
(WL)
Page 13
FNB41060 Smart Power Module
M
C
U
Gating UH
Gating VH
Gating WH
Fault
Gating UL
Gating VL
Gating WL
(26) V
B(U)
CBSC
BSC
(25) V
C
C
SPC15
S(U)
(20) IN
(UH)
(24) V
B(V)
BSC
(23) V
S(V)
(19) IN
(VH)
(22) V
B(W)
BSC
(21) V
S(W)
(18) IN
(WH)
(17) V
CC(H)
(15) COM
(16) V
CC(L)
(11) V
FO
(14) IN
(UL)
(13) IN
(VL)
(12) IN
(WL)
(10) C
SC
(1) V
TH
THERMISTOR
(2) R
TH
R
S
C
R
S
R
S
BS
C
BS
15V line
CPSC
PSCPS
C
SP15
C
5V line
R
PF
C
SPC05
C
CPSC
SP05
C
C
PS
PS
SC
R
F
R
TH
R
S
C
PF
C
BPF
R
S
R
S
R
S
VB(U)
VS(U)
IN(UH)
VB(V)
VS(V)
IN(VH)
VB(W)
VS(W)
IN(WH)
VCC
COM
VCC
VFO
IN(UL)
IN(VL)
IN(WL)
COM
CSC
HVIC
LVIC
OUT(UH)
VS(U)
OUT(VH)
VS(V)
OUT(WH)
VS(W)
OUT(UL)
OUT(VL)
OUT(WL)
P (3)
U (4)
V (5)
W (6)
NU(7)
NV(8)
NW(9)
M
V
C
DC
DCS
R
SU
R
SV
R
SW
Input Signal for
Short-Circuit Protection
Temp. Monitoring
U-Phase Current
V-Phase Current
W-Phase Current
Note:
1) To avoid malfunction, the wiring of each input should be as short as possible. (less than 2-3cm)
2) By virtue of integrating an application specific type HVIC inside the SPM, direct coupling to CPU terminals without any opto-coupler or transformer isolation is possible.
3) VFO output is open drain type. This signal line should be pulled up to the positive side of the MCU or control power supply with a resistor that makes IFO up to 1mA. Please refer
to Figure14.
4) C
of around 7 times larger than bootstrap capacitor CBS is recommended.
SP15
5) Input signal is High-Active type. There is a 5kW resistor inside the IC to pull down each input signal line to GND. RC coupling circuits is recommanded for the prevention
of input signal oscillation. RSCPS time constant should be selected in the range 50~150ns. (Recommended RS=100 Ω , CPS=1nF)
6) To prevent errors of the protection function, the wiring around RF and CSC should be as short as possible.
7) In the short-circuit protection circuit, please select the RFCSC time constant in the range 1.5~2ms.
8) Each capacitor should be mounted as close to the pins of the SPM as possible.
9) To prevent surge destruction, the wiring between the smoothing capacitor and the P&GND pins should be as short as possible. The use of a high frequency non-inductive
capacitor of around 0.1~0.22mF between the P&GND pins is recommended.
10) Relays are used at almost every systems of electrical equipments of home appliances. In these cases, there should be sufficient distance between the CPU and the relays.
11) The zener diode should be adopted for the protection of ICs from the surge destruction between each pair of control supply terminals. (Recommanded zener diode=24V/1W)
12) Please choose the electrolytic capacitor with good temperature characteristic in CBS. Also, choose 0.1~0.2mF R-category ceramic capacitors with good temperature and
frequency characteristics in C
BSC
.
13) For the detailed information, please refer to the AN-9070 and FEB306-001.
Figure 15. Typical Application Circuit
FNB41060 Rev. C
13www.fairchildsemi.com
Page 14
Detailed Package Outline Drawings
±0.10
17-0.50
FNB41060 Smart Power Module
(2.609)
2-R1.60
PKG.C
PKG.C
(2-0.70)
±0.50
11.10
16.891
19x1.778
±0.30
39.00
±0.300
16.891
=33.782
±0.50
±0.30
±0.50
6.00
±0.05
2.05
±0.50
23.00
13.00013.000
PKG.C
2
°
~6
±0.50
27.23
°
±0.15
10.00
PKG.C
36.70
±0.15
(R0.50)
4.50
11.10
±0.30
±0.50
0
5
1
.
0
.
0
0
+
0
5
.
0
FNB41060 Rev. C
(1.50)
9-0.60
±0.10
13x2.54
15.240
±0.30
±0.300
PKG.C
=33.020
17.780
±0.30
(1.720)
(2-0.50)
±0.50
6.00
±0.50
11.10
14www.fairchildsemi.com
Page 15
®
®
®
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
AccuPower™
Auto-SPM™
Build it Now™
CorePLUS™
CorePOWER™ CROSSVOLT™
CTL™
Current Transfer Logic™
DEUXPEED
Dual Cool™
EcoSPARK
EfficientMax™
Fairchild
Fairchild Semiconductor
FACT Quiet Series™
FACT
FAST
®
®
®
®
®
®
®
FastvCore™
FETBench™
FlashWriter
®
*
FPS™
F-PFS™
FRFET
Global Power ResourceSM
Green FPS™
Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
MicroPak™
MicroPak2™
MillerDrive™
MotionMax™
Motion-SPM™
OptoHiT™
OPTOLOGIC
OPTOPLANAR
®
®
®
PDP SPM™
Power-SPM™
PowerTrench
PowerXS™
Programmable Active Droop™
®
QFET
QS™
Quiet Series™
RapidConfigure™
™
Saving our world, 1mW/W/kW at a time™
SignalWise™
SmartMax™
SMART START™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMI CONDUCTOR RESERVES THE RIGH T TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREI N TO IM PROVE
RELIABILITY, FUNCTION, OR DESI GN. FAI RCHILD DO ES NOT ASSUME ANY LI ABILI TY ARISI NG OUT OF THE APPLI CATION OR USE O F ANY PRODUCT OR
CIRCUIT DESCRIBED HEREIN; NEI THER DOES IT CONVEY ANY LICENSE UNDER I TS PATENT RIGHTS, NOR THE RI GHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EX PAND THE TERMS OF FAIRCHI LD’S WORLDWIDE TERMS AND CONDITIONS, SPECIF ICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRI TICAL COM PONENTS IN L IFE SUPPORT DEVI CES OR SYSTEM S WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEM I CONDUCTOR CORPORATI ON.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical com ponent in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are
listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have
full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.
Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any w arranty issues that may arise. Fairchild w ill not pro vide
any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our
customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative / In Design
Preliminary First Production
No Identification Needed Full Production
Obsolete Not In Production
Datasheet contains the design specifications for product development. Specifications may change in
any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.