Trench insulated gate bipolar transistors (IGBTs) with NPT
technology show outstanding performance in conduction
and switching characteristics as well as enhanced
avalanche ruggedness. These devices are well suited for
(1) Repetitive rating : Pulse width limited by max. junction temperature
Collector-Emitter Voltage1000V
Gate-Emitter Voltage± 25V
Collector Current @ TC = 25°C60A
Collector Current@ T
= 100°C42A
C
Pulsed Collector Current 200A
Diode Continuous Forward Current@ TC = 100°C15A
Diode Maximum Forward Current200A
M a x i m u m P o w e r Di ssipation @ TC = 25°C180W
Maximum Power Dissipation @ T
= 100°C72 W
C
Storage Temperature Range-55 to +150°C
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
Fig 1. Typical Output CharacteristicsFig 2. Typical Saturation Voltage Characteristics
30A
60A
80A
Common Emitter
TC= - 40 OC
Common Emitter
VGE=15V
3
[V]
CE
2
Collector-Emitter Voltage, V
1
-50050100150
Case Temperature, TC []℃
80A
60A
30A
IC=10A
10
8
[V]
CE
6
4
2
Collector-Emitter Voltage, V
0
48121620
IC=10A
Gate-Emitter Voltage, VGE [V]
Temperature at Varient Current Level
10
8
[V]
CE
6
30A
4
2
Collector-Emitter Voltage, V
0
48121620
60A
80A
IC = 10A
Gate-Emitter Voltage, VGE [V]
Fig 5. Saturation Voltage vs. V
FGL60N100BNTD Rev.A2
Fig 4. Saturation Voltage vs. VGE Fig 3. Saturation Voltage vs. Case
Common Emitter
= 25oC
T
C
Fig 6. Saturation Voltage vs. VGE
GE
10
8
[V]
CE
6
4
2
Collector-Emitter Voltage, V
0
48121620
30A
60A
80A
IC = 10A
Gate-Emitter Voltage, VGE [V]
Common Emitter
= 125oC
T
C
www.fairchildsemi.com
Page 4
FGL60N100BNTD
10000
1000
Capacitance [pF]
100
Common Emitter
VGE = 0V, f = 1MHz
TC = 25oC
051015202530
Collector-Emitter Voltag e, VCE [V]
Fig 7. Capacitance Characteristics
1000
VCC=600V, Rg=51Ω
VGE=15V, TC=25oC
Tdoff
Tf
Tr
Switching Time [ns]
100
Tdon
102030405060
Co llec tor Curre n t, IC [A]
Cies
Coes
Cres
10000
VCC=600V, IC=60A
VGE=15V
TC=25oC
1000
100
Switching Time [ns]
10
05010015 020 0
Gate Resistance, RG [?]
Fig 8. Switching Characteristics vs.
Gate Resistance
20
Common Emitter
VCC=600V, RL=10Ω
TC=25 oC
15
[V]
GE
10
5
Gate-Emitter Voltage,V
0
050100150200250300
Gate Charge, Qg [nC]
Tdoff
Tr
Tdon
Tf
Fig 9. Switching Characteristics vs.
Fig 10. Gate Charge Characteristics
Collector Current
IC MAX. (Pulsed)
100
IC MAX. (Continuous)
[A]
C
10
1ms
DC Operation
Single Nonrepetitive Pulse
1
T
= 25oC
Collector Current , I
C
Curve must be darated
linearly with increase
in temperature
0.1
1101001000
Collector-Emitter Voltage, VCE [V]
50us
100us
10
1
C/W]
o
[
0.5
θJC
0.2
0.1
0.1
0.05
0.02
0.01
0.01
Thermal Response, Z
single pulse
1E-3
10-410
-3
10-210
Rectangular Pulse Du ration [se c]
Fig 11. SOA CharacteristicsFig 12. Transient Thermal Impedance of IGBT
FGL60N100BNTD Rev.A2
-1
0
10
1
10
www.fairchildsemi.com
Page 5
FGL60N100BNTD
100
[A]
F
10
1
TC = 100 oC
TC = 25 oC
Forward Current, I
0.1
0.00.51.01.52.02.5
Forward Voltage, VFM [V]
Fig 13. Forward Characteristics
1.2
[ns]
rr
1.0
0.8
t
rr
I
rr
di/dt=-20A/µs
TC=25oC
1.2
1.0
[ns]
rr
0.8
t
0.6
0.4
0.2
Reverse Recovery Time, t
0.0
04080120160200240
rr
I
rr
IF= 60A
TC= 25oC
120
100
80
60
40
20
0
Reverse Recovery Current I
rr
[A]
di/dt [A/µs]
Fig 14. Reverse Recovery Characteristics
vs. di/dt
12
Reverse Recovery Current I
10
8
[µA]
1000
R
100
TC = 150oC
10
1
0.6
Reverse Recovery Time, t
0.4
102030405060
6
4
Forward Current, IF [A]
Fig 15. Reverse Recovery Characteristics vs.
Forward Current
250
200
[pF]
j
150
100
Capacitance, C
50
0
0.1110100
Reverse Voltage, VR [V]
TC = 25 oC
rr
[A]
0.1
Reverse Current, I
0.01
1E-3
0300600900
TC= 25oC
Reverse Voltage, VR [V]
Fig 16. Reverse Current vs. Reverse Voltage
Fig 17. Junction capacit a nce
FGL60N100BNTD Rev.A2
www.fairchildsemi.com
Page 6
Package Dimension
(8.30)(8.30)
(9.00)
20.00
±0.20
TO-264
(1.00)
(4.00)
±0.20
6.00
FGL60N100BNTD
(2.00)
(R2.00)
ø3.30
(9.00)
(11.00)
±0.20
(R1.00)
±0.20
1.50
4.90
(7.00)
±0.20
(7.00)
(1.50)(1.50)
±0.20
2.50
3.00
1.00
5.45TYP
±0.30
[5.45
]
5.45TYP
[5.45
±0.20
+0.25
–0.10
±0.30
(0.50)
(2.00)
]
±0.10
2.50
±0.20
20.00
±0.50
20.00
0.60
+0.25
–0.10
(1.50)
2.80
±0.30
±0.20
±0.20
(0.15)
5.00
3.50
(1.50)
FGL60N100BNTD Rev.A2www.fairchildsemi.com
(2.80)
Dimensions in Millimeters
Page 7
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tm
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(a) are intended for surgical implant into the body or (b) support
or sustain life, and (c) whose failure to perform when properly
used in accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a significant
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2. A critical component in any component of a life support,
device, or system whose failure to perform can be reasonably
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or to affect its safety or effectiveness.
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet IdentificationProduct StatusDefinition
Advance InformationFormative or In DesignThis datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
PreliminaryFirst ProductionThis datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
No Identification NeededFull ProductionThis datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to
improve design.
ObsoleteNot In ProductionThis datasheet contains specifications on a product that has been dis-
continued by Fairchild Semiconductor.The datasheet is printed for reference information only.
FGL60N100BNTD Rev.A2
Rev. I29
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