Datasheet fgl60n100bntd Datasheet

Page 1
FGL60N100BNTD
NPT-Trench IGBT
FGL60N100BNTD
IGBT
General Description
Features
• High Speed Switching
• Low Saturation Voltage : V
• High Input Impedance
• Built-in Fast Recovery Diode
CE(sat)
= 2.5 V @ IC = 60A
Induction Heating ( I-H ) applications
Application
Micro- Wave Oven, I-H Cooker, I-H Jar, Induction Heater, Home Appliance
C
C
G
G
TO-264
G
C
E
Absolute Maximum Ratings T
= 25°C unless otherwise noted
C
Symbol Description FGL60N100BNTD Units
V
CES
V
GES
I
C
I
CM (1)
I
F
I
FM
P
D
T
Operating Junction Temperature -55 to +150 °C
J
T
stg
T
L
Notes :
(1) Repetitive rating : Pulse width limited by max. junction temperature
Collector-Emitter Voltage 1000 V Gate-Emitter Voltage ± 25 V Collector Current @ TC = 25°C60 A Collector Current @ T
= 100°C42 A
C
Pulsed Collector Current 200 A Diode Continuous Forward Current @ TC = 100°C15 A Diode Maximum Forward Current 200 A M a x i m u m P o w e r Di ssipation @ TC = 25°C 180 W Maximum Power Dissipation @ T
= 100°C72 W
C
Storage Temperature Range -55 to +150 °C Maximum Lead Temp. for soldering Purposes, 1/8” from case for 5 seconds
E
E
300 °C
Thermal Characteristics
Symbol Parameter Typ. Max. Units
R
(IGBT) Thermal Resistance, Junction-to-Case -- 0.69 °C/W
θJC
(DIODE) Thermal Resistance, Junction-to-Case -- 2.08 °C/W
R
θJC
R
θJA
©2008 Fairchild Semiconductor Corporation FGL60N100BNTD Rev.A2
Thermal Resistance, Junction-to-Ambient -- 25 °C/W
www.fairchildsemi.com
Page 2
FGL60N100BNTD
Electrical Characteristics of IGBT T
= 25°C unless otherwise noted
C
Symbol Parameter Test Conditions Min. Typ. Max. Units
Off Characteristics
BV I
CES
I
GES
CES
Collector Emitter Breakdown Voltage Collector Cut-Off Current
V
GE
= 1000V, VGE = 0V
V
CE
G-E Leakage Current VGE = ± 25, VCE = 0V -- -- ± 500 nA
1000 -- -- V
-- -- 1.0 mA
= 0V, IC = 1mA
On Characteristics
V
GE(th)
V
CE(sat)
G-E Threshold Voltage IC = 60mA, VCE = V
I
Collector to Emitter Saturation Voltage
= 10A, VGE = 15V -- 1.5 1.8 V
C
I
= 60A, VGE = 15V -- 2.5 2.9 V
C
GE
4.0 5.0 7.0 V
Dynamic Characteristics
C
ies
C
oes
C
res
Input Capacitance Output Capacitance -- 260 -- pF Reverse Transfer Capacitance -- 200 -- pF
=10V, VGE = 0V,
V
CE
f = 1MHz
-- 6000 -- pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q Q Q
g ge gc
Turn-On Delay Time Rise Time -- 320 -- ns Turn-Off Delay Time -- 630 -- ns Fall Time -- 130 250 ns Total Gate Charge Gate-Emitter Charge -- 45 -- nC Gate-Collector Charge -- 95 -- nC
V
= 600 V, IC = 60A,
CC
R
= 51Ω, VGE=15V,
G
Resistive Load, T
= 600 V, IC = 60A,
V
CE
V
= 15V , TC = 25°C
GE
= 25°C
C
-- 140 -- ns
-- 275 350 nC
Electrical Characteristics of DIODE T
= 25°C unless otherwise noted
C
Symbol Parameter Test Conditions Min. Typ. Max. Units
= 15A -- 1.2 1.7 V
I
V
FM
t
rr
I
R Instantaneous Reverse Current VRRM = 1000V -- 0.05 2 µA
Diode Forward Voltage Diode Reverse Recovery Time IF = 60A di/dt = 20 A/us -- 1.2 1.5 µs
F
I
= 60A -- 1.8 2.1 V
F
FGL60N100BNTD Rev.A2
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Page 3
FGL60N100BNTD
200
Common Emitter T
= 25oC
C
150
[A]
C
100
Collector Current, I
50
0
01234
Collector-Emitter Voltage, VCE [V]
20V
15V
10V
9V
8V
7V
VGE = 6V
90
Common Emitter V
= 15V
GE
80
T
= 25oC
[A]
C
C
70
TC = 125oC ------
60
50
40
Collector Current, I
30
20
10
0
01234
Collector-Emitter Voltage, VCE [V]
TC = 25oC
TC = 125oC
Fig 1. Typical Output Characteristics Fig 2. Typical Saturation Voltage Characteristics
30A 60A
80A
Common Emitter TC= - 40 OC
Common Emitter VGE=15V
3
[V]
CE
2
Collector-Emitter Voltage, V
1
-50 0 50 100 150
Case Temperature, TC []℃
80A
60A
30A
IC=10A
10
8
[V]
CE
6
4
2
Collector-Emitter Voltage, V
0
4 8 12 16 20
IC=10A
Gate-Emitter Voltage, VGE [V]
Temperature at Varient Current Level
10
8
[V]
CE
6
30A
4
2
Collector-Emitter Voltage, V
0
4 8 12 16 20
60A 80A
IC = 10A
Gate-Emitter Voltage, VGE [V]
Fig 5. Saturation Voltage vs. V
FGL60N100BNTD Rev.A2
Fig 4. Saturation Voltage vs. VGE Fig 3. Saturation Voltage vs. Case
Common Emitter
= 25oC
T
C
Fig 6. Saturation Voltage vs. VGE
GE
10
8
[V]
CE
6
4
2
Collector-Emitter Voltage, V
0
4 8 12 16 20
30A 60A
80A
IC = 10A
Gate-Emitter Voltage, VGE [V]
Common Emitter
= 125oC
T
C
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Page 4
FGL60N100BNTD
10000
1000
Capacitance [pF]
100
Common Emitter VGE = 0V, f = 1MHz
TC = 25oC
0 5 10 15 20 25 30
Collector-Emitter Voltag e, VCE [V]
Fig 7. Capacitance Characteristics
1000
VCC=600V, Rg=51Ω VGE=15V, TC=25oC
Tdoff
Tf Tr
Switching Time [ns]
100
Tdon
10 20 30 40 50 60
Co llec tor Curre n t, IC [A]
Cies
Coes
Cres
10000
VCC=600V, IC=60A VGE=15V
TC=25oC
1000
100
Switching Time [ns]
10
0 50 100 15 0 20 0
Gate Resistance, RG [?]
Fig 8. Switching Characteristics vs. Gate Resistance
20
Common Emitter VCC=600V, RL=10Ω
TC=25 oC
15
[V]
GE
10
5
Gate-Emitter Voltage,V
0
0 50 100 150 200 250 300
Gate Charge, Qg [nC]
Tdoff
Tr
Tdon
Tf
Fig 9. Switching Characteristics vs.
Fig 10. Gate Charge Characteristics
Collector Current
IC MAX. (Pulsed)
100
IC MAX. (Continuous)
[A]
C
10
1ms
DC Operation
Single Nonrepetitive Pulse
1
T
= 25oC
Collector Current , I
C
Curve must be darated linearly with increase in temperature
0.1 1 10 100 1000
Collector-Emitter Voltage, VCE [V]
50us
100us
10
1
C/W]
o
[
0.5
θJC
0.2
0.1
0.1
0.05
0.02
0.01
0.01
Thermal Response, Z
single pulse
1E-3
10-410
-3
10-210
Rectangular Pulse Du ration [se c]
Fig 11. SOA Characteristics Fig 12. Transient Thermal Impedance of IGBT
FGL60N100BNTD Rev.A2
-1
0
10
1
10
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Page 5
FGL60N100BNTD
100
[A]
F
10
1
TC = 100 oC
TC = 25 oC
Forward Current, I
0.1
0.0 0.5 1.0 1.5 2.0 2.5
Forward Voltage, VFM [V]
Fig 13. Forward Characteristics
1.2
[ns]
rr
1.0
0.8
t
rr
I
rr
di/dt=-20A/µs TC=25oC
1.2
1.0
[ns]
rr
0.8 t
0.6
0.4
0.2
Reverse Recovery Time, t
0.0
0 40 80 120 160 200 240
rr
I
rr
IF= 60A TC= 25oC
120
100
80
60
40
20
0
Reverse Recovery Current I
rr
[A]
di/dt [A/µs]
Fig 14. Reverse Recovery Characteristics vs. di/dt
12
Reverse Recovery Current I
10
8
[µA]
1000
R
100
TC = 150oC
10
1
0.6
Reverse Recovery Time, t
0.4
10 20 30 40 50 60
6
4
Forward Current, IF [A]
Fig 15. Reverse Recovery Characteristics vs. Forward Current
250
200
[pF]
j
150
100
Capacitance, C
50
0
0.1 1 10 100
Reverse Voltage, VR [V]
TC = 25 oC
rr
[A]
0.1
Reverse Current, I
0.01
1E-3
0 300 600 900
TC= 25oC
Reverse Voltage, VR [V]
Fig 16. Reverse Current vs. Reverse Voltage
Fig 17. Junction capacit a nce
FGL60N100BNTD Rev.A2
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Page 6
Package Dimension
(8.30) (8.30)
(9.00)
20.00
±0.20
TO-264
(1.00)
(4.00)
±0.20
6.00
FGL60N100BNTD
(2.00)
(R2.00)
ø3.30
(9.00)
(11.00)
±0.20
(R1.00)
±0.20
1.50
4.90
(7.00)
±0.20
(7.00)
(1.50) (1.50)
±0.20
2.50
3.00
1.00
5.45TYP
±0.30
[5.45
]
5.45TYP
[5.45
±0.20
+0.25 –0.10
±0.30
(0.50)
(2.00)
]
±0.10
2.50
±0.20
20.00
±0.50
20.00
0.60
+0.25 –0.10
(1.50)
2.80
±0.30
±0.20
±0.20
(0.15)
5.00
3.50
(1.50)
FGL60N100BNTD Rev.A2 www.fairchildsemi.com
(2.80)
Dimensions in Millimeters
Page 7
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PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In Design This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Preliminary First Production This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve design.
Obsolete Not In Production This datasheet contains specifications on a product that has been dis-
continued by Fairchild Semiconductor.The datasheet is printed for refer­ence information only.
FGL60N100BNTD Rev.A2
Rev. I29
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