Datasheet fgh40n60sf Datasheet

Page 1
tm
FGH40N60SF
600V, 40A Field Stop IGBT
FGH40N60SF 600V, 40A Field Stop IGBT
March 2009
Features
• High current capability
• Low saturation voltage: V
• High input impedance
• Fast switching
• RoHS compliant
=2.3V @ IC = 40A
CE(sat)
General Description
Using Novel Field Stop IGBT Technology, Fairchild’s new ses­ries of Field Stop IGBTs offer the optimum performance for Inverter, UPS, SMPS and PFC applications where low conduc­tion and switching losses are essential.
Applications
• Inverter, UPS, SMPS, PFC
E
C
G
COLLECTOR
(FLANGE)
Absolute Maximum Ratings
Symbol Description Ratings Units
V
CES
V
GES
I
C
I
CM (1)
P
D
Operating Junction Temperature -55 to +150
T
J
T
stg
T
L
Collector to Emitter Voltage 600 V Gate to Emitter Voltage ± 20 V Collector Current @ TC = 25oC80 A Collector Current @ T Pulsed Collector Current
Maximum Power Dissipation @ TC = 25oC290 W Maximum Power Dissipation @ T
Storage Temperature Range -55 to +150 Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
= 100oC40 A
C
@ T
= 25oC
C
= 100oC116 W
C
120 A
300
o
C
o
C
o
C
Notes:
Thermal Characteristics
Symbol Parameter Typ. Max. Units
R
(IGBT) Thermal Resistance, Junction to Case - 0.43
θJC
R
θJA
©2008 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com
FGH40N60SF Rev.A
Thermal Resistance, Junction to Ambient - 40
o
C/W
o
C/W
Page 2
Package Marking and Ordering Information
FGH40N60SF 600V, 40A Field Stop IGBT
Max Qty
per Box
Device Marking Device Package
Packaging
Type Qty per Tube
FGH40N60SF FGH40N60SFTU TO-247 Tube 30ea -
Electrical Characteristics of the IGBT T
= 25°C unless otherwise noted
C
Symbol Parameter Test Conditions Min. Typ. Max. Units
Off Characteristics
BV
CES
∆BV ∆T
J
I
CES
I
GES
On Characteristics
V
GE(th)
V
CE(sat)
Dynamic Characteristics
C
ies
C
oes
C
res
Collector to Emitter Breakdown Voltage VGE = 0V, IC = 250µA 600 - - V Temperature Coefficient of Breakdown
CES
Voltage Collector Cut-Off Current VCE = V G-E Leakage Current VGE = V
V
= 0V, IC = 250µA
GE
CES
GES
-0.6-V/
, VGE = 0V - - 250 µA
, VCE = 0V - - ±400 nA
G-E Threshold Voltage IC = 250µA, VCE = VGE 4.0 5.0 6.5 V
= 40A, VGE = 15V -2.32.9V
I
Collector to Emitter Saturation Voltage
Input Capacitance Output Capacitance - 200 - pF
C
= 40A, VGE = 15V,
I
C
T
= 125oC
C
V
= 30V, VGE = 0V,
CE
f = 1MHz
-2.5- V
-2110- pF
Reverse Transfer Capacitance - 60 - pF
o
C
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
Total Switching Loss - 1.44 - mJ
E
ts
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
Total Switching Loss - 1.62 - mJ
E
ts
Q
g
Q
ge
Q
gc
Turn-On Delay Time Rise Time - 42 - ns Turn-Off Delay Time - 115 - ns Fall Time - 27 54 ns Turn-On Switching Loss - 1.13 - mJ
= 400V, IC = 40A,
V
CC
R
= 10Ω, V
G
Inductive Load, T
GE
= 15V,
= 25oC
C
Turn-Off Switching Loss - 0.31 - mJ
Turn-On Delay Time Rise Time - 43 - ns Turn-Off Delay Time - 120 - ns Fall Time - 30 - ns Turn-On Switching Loss - 1.14 - mJ
= 400V, IC = 40A,
V
CC
R
= 10Ω, V
G
Inductive Load, T
GE
= 15V,
= 125oC
C
Turn-Off Switching Loss - 0.48 - mJ
Total Gate Charge
V
= 400V, IC = 40A,
Gate to Emitter Charge - 14 - nC Gate to Collector Charge - 58 - nC
CE
V
= 15V
GE
-25-ns
-24-ns
- 120 - nC
FGH40N60SF Rev. A
2 www.fairchildsemi.com
Page 3
Typical Performance Characteristics
FGH40N60SF 600V, 40A Field Stop IGBT
Figure 1. Typical Output Characteristics Figure 2. Typical Output Characteristics
120
TC = 25oC
100
[A]
C
80
60
40
Collector Current, I
20
0
0.0 1.5 3.0 4.5 6.0
Collector-Emitter Voltage, VCE [V]
20V
120
15V
12V
10V
TC = 125oC
100
[A]
C
80
60
40
Collector Current, I
20V
15V
12V
10V
20
VGE = 8V
0
0.0 1.5 3.0 4.5 6.0
Collector-Emitter Voltage, VCE [V]
VGE = 8V
Figure 3. Typical Saturation Voltage Figure 4. Transfer Characteristics Characteristics
80
Common Emitter VGE = 15V
TC = 25oC
60
[A]
TC = 125oC
C
120
Common Emitter VCE = 20V
TC = 25oC
[A]
TC = 125oC
C
80
40
40
20
Collector Current, I
0
01234
Collector-Emitter Voltage, VCE [V]
Collector Current, I
0
6 8 10 12 13
Gate-Emitter Voltage,VGE [V]
Figure 5. Saturation Voltage vs. Case Figure 6. Saturation Voltage vs. V Temperature at Variant Current Level
4.0
Common Emitter VGE = 15V
[V]
3.5
CE
3.0
2.5
2.0
1.5
Collector-Emitter Voltage, V
1.0 25 50 75 100 125
Collector-EmitterCase Temperature, TC [oC]
80A
40A
IC = 20A
20
[V]
CE
16
12
Common Emitter TC = -40oC
8
80A
4
Collector-Emitter Voltage, V
0
4 8 12 16 20
IC = 20A
Gate-Emitter V o ltage , VGE [V]
40A
GE
FGH40N60SF Rev. A
3 www.fairchildsemi.com
Page 4
Typical Performance Characteristics
FGH40N60SF 600V, 40A Field Stop IGBT
Figure 7. Saturation Voltage vs. V
20
[V]
CE
16
Common Emitter TC = 25oC
12
Figure 8. Saturation Voltage vs. V
GE
20
16
[V]
CE
Common Emitter TC = 125oC
12
GE
8
40A
80A
4
Collector-Emitter Voltage, V
0
4 8 12 16 20
IC = 20A
Gate-Emitter V o ltage , VGE [V]
Figure 9. Capacitance Characteristics Figure 10. Gate charge Characteristics
5000
Common Emitter VGE = 0V, f = 1MHz
4000
C
iss
TC = 25oC
3000
2000
C
oss
Capacitance [pF]
1000
C
rss
8
40A
80A
4
Collector-Emitter Voltage, V
0
4 8 12 16 20
IC = 20A
Gate-Emitter Voltage, VGE [V]
Vcc = 100V
200V
300V
15
Common Emitter TC = 25oC
12
[V]
GE
9
6
3
Gate-Emitter Voltage, V
0
0.1 1 10
Collector-Emitter Voltage, VCE [V]
30
0
0 50 100 150
Gate Ch a r g e , Qg [nC]
Figure 11. SOA Characteristics Figure 12. Turn-on Characteristics vs. Gate Resistance
400
100
[A]
c
10
1
Single Nonrepetitive
= 25oC
Pulse T
Collector Current, I
0.1
0.01 1 10 100 1000
C
Curves must be derated linearly with increase in temperature
Collector-Emitter Voltage, VCE [V]
10µs
100µs
1ms
10 ms
DC
200
100
t
r
Com mon Emitt e r
Switching Time [ns]
10
0 1020304050
t
d(on)
VCC = 400V, VGE = 15V IC = 40A
TC = 25oC TC = 125oC
Gate Resistance, RG [Ω]
FGH40N60SF Rev. A
4 www.fairchildsemi.com
Page 5
Typical Performance Characteristics
Figure 13. Turn-off Characteristics vs. Figure 14. Turn-on Characteristics vs. Gate Resistance Collector Current
5500
Com mon Emitt e r VCC = 400V, VGE = 15V
IC = 40A TC = 25oC
1000
TC = 125oC
100
Switching Time [ns]
t
d(off)
t
f
500
Common Emitter VGE = 15V, RG = 10Ω
TC = 25oC TC = 125oC
100
Switching Time [ns]
t
d(on)
t
r
FGH40N60SF 600V, 40A Field Stop IGBT
10
0 1020304050
Gate Resistance, RG [Ω]
10
20 40 60 80
Collector Current, IC [A]
Figure 15. Turn-off Characteristics vs. Figure 16. Switching Loss vs. Gate Resistance Collector Current
500
Common Emitter VGE = 15V, RG = 10Ω
TC = 25oC TC = 125oC
10
Common Emitter VCC = 400V, VGE = 15V
IC = 40A
t
d(off)
TC = 25oC TC = 125oC
100
1
Switching Loss [mJ]
0.2
0.3 0 1020304050
Switching Time [ns]
10
20 40 60 80
t
f
Collector Current, IC [A]
Gate Resistance, RG [Ω]
E
on
E
off
Figure 17. Switching Loss vs. Collector Current Figure 18. Load Current vs. Frequency
30
Common Emitter VGE = 15V, RG = 10Ω
10
TC = 25oC TC = 125oC
E
on
140
120
100
VCC = 400V load C urrent : pea k of square w a ve
1
Switching Loss [mJ]
0.1
20 30 40 50 60 70 80
FGH40N60SF Rev. A
Collector Cur ren t, IC [A]
E
off
80
60
Load Current [A]
40
Duty cycle : 50%
20
0
o
TC = 100
C
Power Dissipation = 116 W
1 10 100 1000
Frequency [kHz]
5 www.fairchildsemi.com
Page 6
Typical Performance Characteristics
Figure 19.Turn off Switching SOA Characteristics
200
100
[A]
C
FGH40N60SF 600V, 40A Field Stop IGBT
10
Collector Current, I
Safe Operating Area VGE = 15V, TC = 125oC
1
1 10 100 1000
Collector-Emitter Voltage, VCE [V]
1
0.1
0.01
Thermal Response [Zthjc]
1E-3
1E-5 1E-4 1E-3 0.01 0.1 1
Figure 20. Transient Thermal Impedance of IGBT
0.5
0.2
0.1
0.05
0.02
0.01
single pulse
Rectangular Pulse Duration [sec]
P
DM
t
1
t
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + T
2
C
FGH40N60SF Rev. A
6 www.fairchildsemi.com
Page 7
Mechanical Dimensions
TO-247AB (FKS PKG CODE 001)
FGH40N60SF 600V, 40A Field Stop IGBT
FGH40N60SF Rev. A
Dimensions in Millimeters
7 www.fairchildsemi.com
Page 8
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks.
Auto-SPM™ Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK
®
EfficentMax™ EZSWITCH™*
™*
®
®
Fairchild Fairchild Semiconductor FACT Quiet Series™
®
FACT
®
FAST
®
F-PFS™ FRFET Global Power ResourceSM Green FPS™ Green FPS™ e-Series™ Gmax™ GTO™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ MotionMax™ Motion-SPM™ OPTOLOGIC OPTOPLANAR
®
®
®
FastvCore™ FETBench™ FlashWriter FPS™
®
*
PDP SPM™ Power-SPM™
PowerTrench PowerXS™ Programmable Active Droop™ QFET QS™ Quiet Series™ RapidConfigure™
Saving our world, 1mW/W/kW at a time™ SmartMax™ SMART START™ SPM STEALTH™ SuperFET™
®
SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS™ SyncFET™ Sync-Lock™
®
™
®
®
The Power Franchise
TinyBoost™ TinyBuck™ TinyLogic
®
TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ TriFault Detect™ TRUECURRENT™* μSerDes™
®
UHC Ultra FRFET™ UniFET™ VCX™ VisualMax™
®
*
XS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
®
DISCLAIMER
FAIRCHILD SEMI CONDUCTOR RESERVES THE RIGH T TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREI N TO IM PROVE RELIABILITY, FUNCTION, OR DESI GN. FAI RCHILD DO ES NOT ASSUME ANY LI ABILI TY ARISI NG OUT OF THE APPLI CATION OR USE O F ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEI THER DOES IT CONVEY ANY LICENSE UNDER I TS PATENT RIGHTS, NOR THE RI GHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EX PAND THE TERMS OF FAIRCHI LD’S WORLDWIDE TERMS AND CONDITIONS, SPECIF ICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRI TICAL COM PONENTS IN L IFE SUPPORT DEVI CES OR SYSTEM S WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEM I CONDUCTOR CORPORATI ON.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any w arranty issues that may arise. Fairchild w ill not pro vide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative / In Design
Preliminary First Production
No Identification Needed Full Production
Obsolete Not In Production
Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
Rev. I40
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
Loading...