Page 1
FFAF10U20DN
Features
• Ultrafast with soft recovery
• Low forward voltage
Applications
• Power switching circuits
• Output rectifiers
• Freewheeling diodes
• Switching mode power supply
1 2 31 2 3
ULTRA FAST RECOVERY POWER RECTIFIER
TO-220F
TO-3PF
FFAF10U20DN
1. Anode 2.Cathode 3. Anode
Absolute Maximum Ratings (per diode) T
Symbol Parameter Value Units
V
RRM
I
F(AV)
I
FSM
T
J, TSTG
Peak Repetitive Reverse Voltage 200 V
Average Rectified Forward Current @ TC = 100°C10 A
Non-repetitive Peak Surge Current
60Hz Single Half-Sine Wave
Operating Junction and Storage Temperature - 65 to +150 °C
=25°°°°C unless otherwise noted
C
100 A
Thermal Characteristics
Symbol Parameter Value Units
R
θJC
Electrical Characteristics
Symbol Parameter Min. Typ. Max. Units
V
FM
*
I
RM
*
t
rr
I
rr
Q
rr
W
AVL
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%
Maximum Thermal Resistance, Junction to Case 4.0 °C/W
(per diode) TC=25 °°°°C unless otherwise noted
Maximum Instantaneous Forward Voltage
I
I
Maximum Instantaneous Reverse Current
Maximum Reverse Rec overy T ime
Maximum Reverse Recovery Current
Maximum Reverse Recovery Charge
=10A, di/dt = 200A/µs)
(I
F
Avalanche Energy 0.5 - - mJ
= 10A
F
= 10A
F
@ rated V
= 25 °C
T
C
T
= 100 °C
C
TC = 25 °C
R
= 100 °C
T
C
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.2
1.0
10
100
35
2.5
45
V
µA
ns
A
nC
©2001 Fairchild Semiconductor Corporation
Rev. A, December 2001
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Typical CharacteristicsTypical Characteristics
FFAF10U20DN
50
10
[A]
F
1
TC = 100oC
TC = 25oC
Forward Current , I
0.1
0.0 0.5 1.0 1.5 2.0
Forward Voltage , VF [V]
Figure 1. Typical Forward Voltage Drop
vs. Forward Current
400
300
200
Typical Ca pacitance
at 0V = 286 pF
1000
100
A]
µ
[
R
10
1
0.1
Reverse Current , I
0.01
0.001
0 50 100 150 200
TC = 100oC
TC = 25oC
Reverse Voltage , VR [V]
Figure 2. Typical Reverse Current
vs. Reverse Voltage
40
[ns]
rr
35
30
IF = 10A
Tc = 25oC
Capacitance , Cj [pF]
100
0.1 1 10 100
Reverse Voltage , VR [V]
Figure 3. Typical Junction Capacitance
6
IF = 10A
[A]
rr
5
4
3
2
1
TC = 25oC
Reverse Recovery Current , I
0
100 500
di/dt [A/µs]
Figure 5. Typical Reverse Recovery Current
vs. di/dt
25
Reverse Recovery Time , t
20
100 500
di/dt [A/µs]
Figure 4. Typical Rever se Recovery Time
vs. di/dt
16
[A]
14
F(AV)
12
10
8
6
4
2
Average Forward Current , I
0
60 80 100 120 140 160
DC
Case Temperature , TC [oC]
Figure 6. Forward Current Derating Curve
©2001 Fairchild Semiconductor Corporation Rev. A, December 2001
Page 3
Package Dimensions
±0.20
4.50
TO-3PF
15.50
±0.20
ø3.60
±0.20
±0.20
10.00
10°
5.50
3.00
(1.50)
FFAF10U20DN
±0.20
±0.20
±0.20
26.50
±0.20
14.80
±0.20
±0.20
14.50
16.50
2.00
2.00
4.00
0.75
5.45TYP
[5.45
±0.20
3.30
±0.20
±0.20
±0.20
+0.20
–0.10
±0.30
±0.20
2.00
]
±0.20
2.00
2.00
5.45TYP
[5.45
±0.20
2.50
±0.20
±0.30
±0.20
5.50
]
0.85
±0.20
16.50
±0.03
0.90
±0.20
1.50
2.00
3.30
+0.20
–0.10
±0.20
±0.20
±0.20
23.00
±0.20
22.00
©2001 Fairchild Semiconductor Corporation
Dimensions in Millimeters
Rev. A, December 2001
Page 4
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DenseTrench™
DOME™
EcoSPARK™
2
CMOS™
E
EnSigna™
FACT™
FACT Quiet Series™
STAR*POWER is used under license
®
FAST
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
LittleFET™
MicroFET™
MicroPak™
MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench
®
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SLIENT SWITCHER
SMART START™
STAR*POWER™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TruTranslation™
TinyLogic™
UHC™
®
UltraFET
VCX™
®
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
INTERNATIONAL.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design
Preliminary First Production This datasheet contains preliminary data, and
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Obsolete Not In Production This datasheet contains specifications on a product
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. H4©2001 Fairchild Semiconductor Corporation
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