Datasheet FFA60UP20DN Datasheet (Fairchild)

Page 1
FFA60UP20DN
Features
• Ultrafast with soft recovery = 1A), < 40ns
(@ I
F
• Reverse Voltage, 200V
• Forward Voltage (@ T
Applications
• Power switching circuits
• Output rectifiers
• Freewheeling diodes
• Switching mode power supply
= 100°C), < 1V
C
FFA60UP20DN
Ultrafast Rectifier
TO-3PN
1 2 3
1. Anode 2.Cathode 3. Anode
Absolute Maximum Ratings
Symbol Parameter Value Units
V
RRM
I
F(AV)
I
FSM
T
J, TSTG
Peak Repetitive Reverse Voltage 200 V Average Rectified Forward Current @ TC = 100°C30 A Non-repetitive Peak Surge Current
60Hz Single Half-Sine Wave
Operating Junction and Storage Temperature - 65 to +150 °C
(per diode) TC=25°C unless otherwise noted
300 A
Thermal Characteristics
Symbol Parameter Value Units
R
θJC
Electrical Characteristics
Symbol Parameter Min. Typ. Max. Units
V
FM
*
I
RM
*
t
rr
I
rr
Q
rr
t
rr
W
AVL
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%
Maximum Thermal Resistance, Junction to Case 1.4 °C/W
(per diode) TC=25 °C unless otherwise noted
Maximum Instantaneous Forward Voltage I I
Maximum Instantaneous Reverse Current
Reverse Recovery Time Reverse Recovery Current Reverse Recovery Charge
=30A, di/dt = 200A/µs)
(I
F
Maximum Reverse Recovery Time
=1A, di/dt = 100A/µs)
(I
F
Avalanche Energy (L=40mH) 2 - - mJ
= 30A
F
= 30A
F
@ rated V
TC = 25 °C
R
T
= 25 °C
C
= 100 °C
T
C
= 100 °C
T
C
-
-
-
-
-
-
-
- - 40 ns
-
-
-
-
32
2.4
38.4
1.15
1.0
10
100
-
-
-
V
µA
ns
A
nC
Rev. A, August 2004©2004 Fairchild Semiconductor Corporation
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Typical Characteristics
FFA60UP20DN
100
[A]
F
TC = 100oC
10
1
TC = 25oC
Forward Current , I
0.1
0.00.51.01.52.0
Forward Voltage , VF [V]
Figure 1. Typical Forward Voltage Drop
vs. Forward Current
500
400
200
Capacitance , Cj [pF]
Typical Capacitance at 0V = 473.9 pF
10
A]
1
µ
[
R
0.1
0.01
TC = 100oC
TC = 25oC
Reverse Current , I
0.001 0 50 100 150 200
Reverse Voltage , VR [V]
Figure 2. Typical Reverse Current
vs. Reverse Voltage
40
[ns]
rr
35
30
IF = 30A Tc = 25oC
0.1 1 10 100
Reverse Voltage , VR [V]
Figure 3. Typical Junction Capacitance
6
5
[A]
rr
4
3
2
1
Reverse Recovery Curr e nt , I
0
100 500
di/dt [A/µs]
Figure 5. Typical Reverse Recovery Current
vs. di/dt
©2004 Fairchild Semiconductor Corporation
IF = 30A TC = 25oC
Reverse Recovery Time , t
25
100 500
di/dt [A/µs]
Figure 4. Typical Reverse Recovery Time
vs. di/dt
35
[A]
30
F(AV)
25
20
15
10
5
Average Forward Current , I
0
60 80 100 120 140 160
DC
Case Temperature , TC [oC]
Figure 6. Forward Current Derating Curve
Rev. A, August 2004
Page 3
Mechanical Dimensions
FFA60UP20DN
TO-3PN
Dimensions in Millimeters
©2004 Fairchild Semiconductor Corporation Rev. A, August 2004
Page 4
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
A
CEx™ ActiveArray™ Bottomless™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™
2
E
CMOS™ EnSigna™ FACT™ FACT Quiet Series™
Across the board. Around the w or ld. ™ The Power Franchise Programmable Active Droop™
®
FAST FASTr™ FPS™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ I2C™ i-Lo™ ImpliedDisconnect™
®
ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC
®
OPTOPLANAR™ PACMAN™ POP™
Power247™ PowerSaver™ PowerTrench QFET
®
®
QS™ QT Optoelect ronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ SILENT SWITCHER SMART START™ SPM™ Stealth™
SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic TINYOPTO™ TruTranslation™ UHC™ UltraFET
®
VCX™
®
®
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design
Preliminary First Production This datasheet contains preliminary data, and
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Obsolete Not In Production This datasheet contains specifications on a product
©2004 Fairchild Semiconductor Corporation
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Semiconductor reserves the right to make changes at any time without notice in order to improve design.
that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I11
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