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FFA20U60DN
Features
• High voltage and high reliability
• High speed switching
• Low forward voltage
Applications
• General purpose
• Switching mode power supply
• Free-wheeling diode for motor application
• Power switching circuits
1 2 3
ULTRA FAST RECOVERY POWER RECTIFIER
TO-3P
FFA20U60DN
1. Anode 2.Cathode 3. Anode
Absolute Maximum Ratings (per diode) T
Symbol Parameter Value Units
V
RRM
I
F(AV)
I
FSM
T
J, TSTG
Peak Repetitive Reverse Voltage 600 V
Average Rectified Forward Current @ TC = 100°C20 A
Non-repetitive Peak Surge Current
60Hz Single Half-Sine Wave
Operating Junction and Storage Temperature - 65 to +150 °C
=25°°°°C unless otherwise noted
C
120 A
Thermal Characteristics
Symbol Parameter Value Units
R
θJC
Electrical Characteristics
Symbol Parameter Min. Typ. Max Units
V
FM
*
I
RM
*
t
rr
I
rr
Q
rr
W
AVL
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%
Maximum Thermal Resistance, Junction to Case 1.25 °C/W
(per diode) TC=25 °°°°C unless otherwise noted
Maximum Instantaneous Forward Voltage
Maximum Instantaneous Reverse Current
Maximum Reverse Rec overy T ime
Maximum Reverse Recovery Current
Maximum Reverse Recovery Charge
=20A, di/dt = 200A/µs)
(I
F
Avalanche Energy 1.0 - - mJ
= 20A
I
F
I
= 20A
F
@ rated V
= 25 °C
T
C
T
= 100 °C
C
TC = 25 °C
R
= 100 °C
T
C
-
-
-
-
-
-
-
-
-
-
-
-
-
-
2.2
2.0
10
100
90
8
360
V
µA
ns
A
nC
©2002 Fairchild Semiconductor Corporation
Rev. A, March 2002
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Typical CharacteristicsTypical Characteristics
FFA20U60DN
40
10
[A]
TC = 100oC
F
TC = 25oC
1
Forward Current , I
0.1
0.0 0.5 1.0 1.5 2.0 2.5 3.0
Forward Voltage , VF [V]
Figure 1. Typical Forward Voltage Drop
vs. Forward Current
200
150
100
Capacitance , Cj [pF]
50
1
0.1 1 10 100
Reverse Voltage , VR [V]
Typical Ca pacitance
at 0V = 178 pF
1000
100
A]
µ
[
R
Reve rs e Cu rr e n t , I
10
1
0.1
0.01
1E-3
TC = 100oC
TC = 25oC
100 200 300 400 500 600
Reverse Voltage , VR [V]
Figure 2. Typical Reverse Current
vs. Reverse Voltage
100
IF = 20A
90
[ns]
rr
80
70
60
50
Reverse Recovery Time , t
40
100 500
di/dt [A/µs]
TC = 25oC
Figure 3. Typical Junction Capacitance
Figure 4. Typical Rever se Recovery Time
vs. di/dt
16
14
[A]
rr
12
10
8
6
4
2
Reverse Recovery Current , I
0
100 500
IF = 20A
TC = 25oC
di/dt [A/µs]
Figure 5. Typical Reverse Recovery Current
30
[A]
25
F(AV)
20
15
10
5
DC
Average Forward Current , I
0
60 80 100 120 140 160
Case Temperature , TC [oC]
Figure 6. Forward Current Derating Curve
vs. di/dt
©2002 Fairchild Semiconductor Corporation Rev. A, March 2002
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Package Dimensions
ø3.20
±0.10
15.60
13.60
9.60
±0.20
±0.20
±0.20
TO-3P
±0.20
3.80
4.80
1.50
±0.20
+0.15
–0.05
FFA20U60DN
±0.20
13.90
2.00
±0.20
3.00
±0.20
1.00
±0.20
5.45TYP
[5.45
±0.30
±0.20
±0.20
±0.20
12.76
19.90
23.40
±0.20
3.50
±0.30
16.50
5.45TYP
]
[5.45
±0.30
]
±0.20
18.70
1.40
0.60
±0.20
+0.15
–0.05
©2002 Fairchild Semiconductor Corporation
Dimensions in Millimeters
Rev. A, March 2002
Page 4
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DenseTrench™
DOME™
EcoSPARK™
2
CMOS™
E
EnSigna™
FACT™
FACT Quiet Series™
STAR*POWER is used under license
®
FAST
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
2
C™
I
ISOPLANAR™
LittleFET™
MicroFET™
MicroPak™
MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench
®
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SLIENT SWITCHER
SMART START™
SMP™
STAR*POWER™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
TruTranslation™
®
UHC™
UltraFET
VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
®
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design
Preliminary First Production This datasheet contains preliminary data, and
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Obsolete Not In Production This datasheet contains specifications on a product
©2002 Fairchild Semiconductor Corporation Rev. H5
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
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