Datasheet FFA15U120DN Datasheet (Fairchild Semiconductor)

Page 1

FFA15U120DN

Features
• High v ol tage and high rel ia bi lity
• High speed switching
• Low forward voltage
Applications
• General purpose
• Switc hing mode power supply
• Free-wheeling diode for motor application
• Power switching circuits
1 2 3

ULTRA FAST RECOVERY POWER RECTIFIER

TO-3P
FFA15U120DN
1. Anode 2.Cathode 3. Anode
Absolute Maximum Ratings
Symbol Parameter Value Units
V
RRM
I
F(AV)
I
FSM
T
J, TSTG
Peak Repetitiv e Reverse Volt age 1200 V Average Rectified Forward Current @ TC = 100°C15 A Non-repetitive Peak Surge Current
60Hz Single Ha lf- Sine Wave
Operating Junction and Storage Temperature - 65 to +150 °C
(per diode) TC=25°°°°C unless otherwise noted
90 A
Thermal Characteristics
Symbol Parameter Value Units
R
θJC
Electrical C haract eri stics
Symbol Parameter Min. Typ. Max. Units
V
FM
*
I
RM
*
t
rr
I
rr
Q
rr
W
AVL
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%
Maxi mum Therm al Resist an ce, Junction to Ca se 1.0 °C/W
(per diode) TC=25 °°°°C unless otherwise noted
Maximum Instantaneous Forward Voltage I I
Maximum Instantaneous Reverse Current
Maximum Reverse Recovery Time Maximum Reverse Recovery Current Maximum Reverse Recovery Charge (I
=15A, di/dt = 200A/µs)
F
Avalanche Energy 1.0 - - mJ
= 15A
F
= 15A
F
@ rated V
= 25 °C
T
C
T
= 100 °C
C
TC = 25 °C
R
T
= 100 °C
C
-
-
-
-
-
-
-
-
-
-
-
-
-
-
3.5
3.2
15
1
100
9
405
V
µA
mA
ns
A
nC
©2000 Fai r ch i ld Semiconductor Inter national
Rev. F, September 2000
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Typical C h aracteristic s

FFA15U120DN
80
TC = 100oC
[A]
F
10
TC = 25oC
1
Forward Current , I
0.1 0123456
Forward Voltage , VF [V]
Figure 1. Typical Forward Voltage Drop
vs. Forward Current
300
Typical Capacitan ce
250
200
150
100
Capacit anc e , Cj [ pF]
50
0.1 1 10 100
Reverse Voltage , VR [V]
at 0V = 270 pF
1000
A]
µ
[
Reverse Current , I
R
0.001
100
10
0.1
0.01
TC = 100oC
1
0 200 400 600 800 1000 1200
TC = 25oC
Reverse Voltage , VR [V]

Figure 2. Typical Reverse Current

vs. Revers e Voltag e

140
VR = 200V
120
[ns]
rr
100
80
60
Reverse Recovery Time , t
40
100 500
TC = 25oC
TC = 100oC
di/dt [A/µs]
IF = 15A

Figure 3. Typical Junction Capacitance

Figure 4. Typical Reverse Recovery Time

vs. di/dt
20 18
[A]
rr
16 14 12 10
8 6 4 2
Reverse Recovery Current , I
0
100 500
TC = 100oC
VR = 200V IF = 15A
TC = 25oC
di/dt [A/µs]
Figure 5. Typical Reverse Recovery Current
20
[A]
F(AV)
15
10
5
DC
Averag e Forwa rd Cur rent , I
0
60 80 100 120 140 160
Case Temperature , TC [oC]
Figure 6. Forward Current Derati ng Curve
vs. di/dt
©2000 Fai r ch i ld Semiconductor Inter national Rev. F, September 2000
Page 3

Package Di men sio n s

ø3.20
±0.10
15.60
13.60
9.60
±0.20
±0.20
±0.20
TO-3P
±0.20
3.80
4.80
1.50
±0.20
+0.15 –0.05
FFA15U120DN
±0.20
13.90
2.00
±0.20
3.00
±0.20
1.00
±0.20
5.45TYP
[5.45
±0.30
±0.20
±0.20
±0.20
12.76
19.90
23.40
±0.20
3.50
±0.30
16.50
5.45TYP
]
[5.45
±0.30
]
±0.20
18.70
1.40
0.60
±0.20
+0.15
0.05
©2000 Fairchild Semiconductor International
Dimensions in Millimeters
Rev. F, September 2000
Page 4
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DOME™ E2CMOS EnSigna
TM
TM
FACT™ FACT Quiet Series™
®
FAST
FASTr™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ MICROWIRE™ OPTOLOGIC™ OPTOPLANAR™ POP™ PowerTrench
®
QFET™ QS™ QT Optoelectronics™
Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ UHC™
VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
Formative or In Design
First Production
Full Production
Not In Production
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. F1
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