Datasheet FDS4141 Datasheet (Fairchild)

Page 1
P-Channel PowerTrench® MOSFET
-40V, -10.8A, 13.0mΩ
Features
Max rMax rHigh performance trench technology for extremely low rRoHS Compliant
= 13.0mΩ at VGS = -10V, ID = -10.5A
DS(on)
= 19.0mΩ at VGS = -4.5V, ID = -8.4A
DS(on)
DS(on)
General Description
This P-Channel MOSFET has been produced using Fairchild Semiconductor’s proprietary PowerTrench deliver low superior performance benefit in the applications switching performance capability reducing power dissipation losses in converter/inverter applications
r
Applications
Control switch in synchronous & non-synchronous buckLoad switchInverter
and optimized BV
DS(on)
November 2007
®
technology to
capability to offer
DSS
.
and optimized
FDS4141 P-Channel PowerTrench
®
MOSFET
D
D
D
D
SO-8
Pin 1
MOSFET Maximum Ratings T
Symbol Parameter Ratings Units
V
DS
V
GS
I
D
E
AS
P
D
, T
T
J
STG
Drain to Source Voltage -40 V Gate to Source Voltage ±20 V Drain Current -Continuous -10.8
-Pulsed -36 Single Pulse Avalanche Energy (Note 3) 294 mJ Power Dissipation TA = 25°C (Note 1a) 5 Power Dissipation T Operating and Storage Junction Temperature Range -55 to +150 °C
S
A
G
S
S
= 25°C unless otherwise noted
= 25°C (Note 1b) 2.5
A
5
D
D
6
D
7
D
8
G
4
S
3
S
2
S
1
Thermal Characteristics
R
θJC
R
θJA
Thermal Resistance, Junction to Case (Note 1) 25 Thermal Resistance, Junction to Ambient (Note 1a) 50
Package Marking and Ordering Information
A
W
°C/W
Device Marking Device Package Reel Size Tape Width Quantity
FDS4141 FDS4141 SO-8 13’’ 12mm 2500units
©2007 Fairchild Semiconductor Corporation FDS4141 Rev.C
1
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Page 2
FDS4141 P-Channel PowerTrench
Electrical Characteristics T
= 25°C unless otherwise noted
J
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
DSS
∆BV
DSS
∆T
J
I
DSS
I
GSS
On Characteristics
V
GS(th)
∆V
GS(th)
∆T
J
r
DS(on)
g
FS
Drain to Source Breakdown Voltage ID = -250µA, VGS = 0V -40 V Breakdown Voltage Temperature
Coefficient
ID = -250µA, referenced to 25°C -33 mV/°C
Zero Gate Voltage Drain Current VDS = -32V, -1 µA Gate to Source Leakage Current VGS = ±20V, V
= 0V ±100 nA
DS
Gate to Source Threshold Voltage VGS = VDS, ID = -250µA -1.0 -1.6 -3.0 V Gate to Source Threshold Voltage
Temperature Coefficient
Static Drain to Source On Resistance
Forward Transconductance VDD = -5V, ID = -10.5A 37 S
ID = -250µA, referenced to 25°C 5.3 mV/°C VGS = -10V, ID = -10.5A 11.0 13.0
VGS = -10V, ID = -10.5A, TJ= 125°C 16.8 19.9
Dynamic Characteristics
C
iss
C
oss
C
rss
R
g
Input Capacitance Output Capacitance 355 475 pF Reverse Transfer Capacitance 190 285 pF
VDS = -20V, VGS = 0V, f = 1MHz
2005 2670 pF
Gate Resistance f = 1MHz 5 Ω
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q Q Q Q
g g gs gd
Turn-On Delay Time Rise Time 5 10 ns Turn-Off Delay Time 42 68 ns
VDD = -20V, ID = -10.5A, VGS = -10V, R
GEN
= 6Ω
10 20 ns
Fall Time 12 22 ns Total Gate Charge V Total Gate Charge V Gate to Source Charge 6 nC
= 0V to -10V
GS
= 0V to -5V 19 27 nC
GS
VDD = -20V,
35 49 nC
ID = -10.5A
Gate to Drain “Miller” Charge 7 nC
mΩVGS = -4.5V, ID = -8.4A 15.2 19.0
®
MOSFET
Drain-Source Diode Characteristics
V
SD
t
rr
Q
rr
NOTES:
1. R
is determined with the device mounted on a 1in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R
θJA
the user's board design.
2. Pulse Test: Pulse Width < 300µs, Duty cycle < 2.0%.
3. UIL condition: Starting T
©2007 Fairchild Semiconductor Corporation FDS4141 Rev.C
Source to Drain Diode Forward Voltage Reverse Recovery Time
Reverse Recovery Charge 14 26 nC
= 25°C, L = 3mH, I
J
a) 50°C/W when mounted on a
2
1in
pad of 2 oz copper.
= -14A, VDD = -40V, VGS = -10V.
AS
V
= 0V, IS = -10.5A (Note 2) -0.8 -1.3
GS
V
= 0V, IS = -2.1A (Note 2) -0.7 -1.2
GS
IF = -10.5A, di/dt = 100A/µs
θJC
2
26 42 ns
is guaranteed by design while R
b) 125°C/W when mounted on a minimum pad.
V
is determined by
θCA
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Page 3
FDS4141 P-Channel PowerTrench
Typical Characteristics T
36
27
18
9
, DRAIN CURRENT (A)
D
-I
0
0123
-V
Figure 1.
1.8
ID = -10.5A V
= -10V
GS
1.6
1.4
1.2
1.0
NORMALIZED
0.8
0.6
DRAIN TO SOURCE ON-RESISTANCE
-75 -50 -25 0 25 50 75 100 125 150
T
Figu r e 3. Nor m a lized O n - Resis t a nce
vs Junction Temperature
VGS = -3.5V
VGS = -4V
VGS = - 4.5V
VGS = -10V
PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX
, DRAIN TO SOURCE VOLTAGE (V)
DS
On-Region Characteristics
, JUNCTION TEMPERATURE (
J
= 25°C unless otherwise noted
J
VGS = -3V
o
C)
4.0
PULSE DURATION = 80µs
3.5
VGS = -3V
DUTY CYCLE = 0.5%MAX
3.0
2.5
2.0
NORMALIZED
1.5
1.0
DRAIN TO SOURCE ON-RESISTANCE
0.5 0 9 18 27 36
-I
, DRAIN CURRENT(A)
D
Figure 2.
Norma l i z e d O n - Resistanc e
V
= -3.5V
GS
VGS = -4V
V
= - 4.5V
GS
V
= -10V
GS
vs Drain Current and Gate Voltage
50
ID = -10.5A
40
(mΩ)
30
20
, DRAIN TO
DS(on)
r
10
SOURCE ON-RESISTANCE
0
246810
-V
, GATE TO SOURCE VOLTA GE (V)
GS
Figure 4.
On-Resistance vs Gate to
PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX
TJ = 125oC
o
T
= 25
C
J
Source Voltage
®
MOSFET
36
PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX
27
V
= -5V
DS
18
9
, DRAIN CURRENT (A)
D
-I
0
01234
-VGS, GATE TO SOURCE V OLTAGE (V)
Figure 5. Transfer Characteristics
©2007 Fairchild Semiconductor Corporation FDS4141 Rev.C
TJ = 150oC
TJ = 25oC
TJ = -55oC
100
V
= 0V
GS
10
TJ = 150oC
1
0.1
0.01
, REVERSE DRAIN CURRENT (A)
S
-I
0.001
0.0 0.2 0.4 0.6 0.8 1.0 1.2
-VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 6.
Source to Drain Diode
TJ = 25oC
TJ = -55oC
Forward Voltage vs Source Current
3
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Page 4
FDS4141 P-Channel PowerTrench
Typical Characteristics T
10
ID = -10.5A
8
6
4
V
2
, GATE TO SOURCE VOLTAGE(V)
GS
-V
0
0 5 10 15 20 25 30 35 40
Figure 7.
20
10
VDD = -20V
= -15V
DD
Qg, GATE CHARGE(nC)
Gate Charge Characteristics
= 25°C unless otherwise noted
J
VDD = -25V
TJ = 25oC
5000
1000
CAPACITANCE (pF)
f = 1MHz V
= 0V
GS
100
60
0.1 1 10
-VDS, DRAIN TO SOURCE VOL TA G E (V)
Figure 8.
Capacitance vs Drain
to Source Voltage
12
9
6
V
= -4.5V
GS
C
iss
C
oss
C
rss
40
®
MOSFET
V
= -10V
GS
TJ = 125oC
, AVALANCHE CURRENT(A)
AS
-I
1
0.01 0.1 1 10 100
Figure 9.
tAV, TIME IN AVALA NCHE(ms)
Uncl a m p e d I n duct i v e
Switching Capability
100
10
1
, DRAIN CURRENT (A)
D
-I
0.01
THIS AREA IS LIMITED BY r
0.1
DS(on)
SINGLE PULSE
= MAX RATED
T
J
o
= 125
θJA
A
= 25
C/W
o
C
R T
0.01 0.1 1 10 100
-VDS, DRAIN to SOURCE VOLTAGE (V)
Figure 11. Forward Bias Safe
Operating Area
1ms
10ms
100ms
1s 10s
DC
500
200
, DRAIN CURRENT (A)
D
3
-I
R
= 50oC/W
θJA
0
25 50 75 100 125 150
T
, AMBIENT TEMPERATURE (
A
Figure 10.
Ma xim um Continuou s Dr ain
Current vs Ambient Temperature
2000
1000
VGS = -10V
100
SINGLE PULSE R
= 125
θJA
= 25
T
A
10
), PEAK TRANSIENT POWER (W)
1
PK
P(
0.5 10-410-310-210
t, PULSE WIDTH (sec)
Figure 12.
Sing le Pulse Maxim um
-1
110
Power Dissipation
o
C)
o
C/W
o
C
100 1000
©2007 Fairchild Semiconductor Corporation FDS4141 Rev.C
4
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Page 5
FDS4141 P-Channel PowerTrench
Typical Characteristics T
2
NORMALIZED THERMAL
θJA
Z
IMPEDANCE,
0.001
0.0001
1
0.1
0.01
10
DUTY CYCLE-DESCENDING ORDER
D = 0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE R
θJA
-4
-3
10
= 25°C unless otherwise noted
J
NOTES:
= 125oC/W
-2
10
t, RECTANGULAR PULSE DURATION (sec)
-1
10
110
DUTY FACTOR: D = t PEAK TJ = PDM x Z
Figure 13. Transient Thermal Response Curve
P
DM
t
1
t
2
1/t2
x R
+ T
θJA
θJA
A
100 1000
®
MOSFET
©2007 Fairchild Semiconductor Corporation FDS4141 Rev.C
5
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Page 6
Preliminary Datasheet
®
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FDS4141 P-Channel PowerTrench
®
MOSFET
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
provided in the labeling, can be reasonably expected to result in a significant injury to the user.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In Design
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
This datasheet contains preliminary data; supplementary data will be pub-
Preliminary First Production
lished at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
No Identification Needed Full Production
This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
This datasheet contains specifications on a product that has been discontin-
Obsolete Not In Production
ued by Fairchild Semiconductor. The datasheet is printed for reference infor­mation only.
Rev. I31
©2007 Fairchild Semiconductor Corporation FDS4141 Rev.C
6
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