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FDR844P
P-Channel 1.8V Specified PowerTrench
MOSFET
FDR844P
October 2001
General Description
This P-Channel 1.8V specified MOSFET uses
Fairchild’s advanced low voltage PowerTrench proces s.
It has been optimized for battery power management
applications.
Applications
• Power management
• Load switch
• Battery protection
Features
• –10 A, –20 V. R
R
R
• Fast switching speed
• High performance trench te chnology for extremely
DS(ON)
low R
• High power and current handling capability
= 11 mΩ @ VGS = –4.5 V
DS(ON)
= 14 mΩ @ VGS = –2.5 V
DS(ON)
= 20 mΩ @VGS = –1.8 V
DS(ON)
S
D
D
S
G
SuperSOT -8
TM
D
D
D
Absolute Maximum Ratings T
o
=25
C unless otherwise noted
A
45
36
27
18
Symbol Parameter Ratings Units
V
Drain-Source Voltage –20 V
DSS
V
Gate-Source Voltage
GSS
ID Drain Current – Continuous (Note 1a) –10 A
– Pulsed –50
PD
TJ, T
STG
Power Dissipation for Single Operation (Note 1a) 1.8
(Note 1b)
Operating and Storage Junction Temperature Range -55 to +150
(Note 1c)
± 8
1.0
0.9
V
W
°C
Thermal Characteristics
R
θJA
R
θJC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a) 70
(Note 1) 20
Package Marking and Ordering Information
Device Marking Device Reel Size Tape width Quantity
2001 Fairchild Semiconductor Corporation
.844P FDR844P 13’’ 12mm 2500 units
°C/W
°C/W
FDR844P Rev A1(W)
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FDR844P
Electrical Characteristics T
= 25°C unless otherwise noted
A
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
Drain–Source Breakdown Voltage
DSS
∆BVDSS
∆T
I
Zero Gate Voltage Drain Current VDS = –16V, VGS = 0 V –1
DSS
I
GSSF
I
GSSR
Breakdown Voltage Temperature
Coefficient
J
Gate–Body Leakage, Forward VGS = 8 V, VDS = 0 V 100 nA
Gate–Body Leakage, Reverse VGS = –8 V, VDS = 0 V –100 nA
= 0 V, ID = –250 µA
V
GS
= –250 µA, Referenced to 25°C
I
D
–20 V
–13
mV/°C
µA
On Characteristics (Note 2)
V
Gate Threshold Voltage
GS(th)
∆VGS(th)
∆TJ
R
DS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
I
On–S t ate Drain Current VGS = –4.5 V, VDS = –5 V –50 A
D(on)
= VGS, ID = –250 µA
V
DS
= –250 µA, Referenced to 25°C
I
D
VGS = –4.5 V, ID = –10 A
= –2.5 V, ID = –9 A
V
GS
= –1.8 V, ID = –7.5 A
V
GS
V
= –4.5 V, ID = –10 A, TJ=125°C
GS
gFS Forward Transconductance VDS = –10 V, ID = –10 A 57 S
–0.4 –0.7 –1.5 V
3
7
9.5
13
9.5
11
14
20
15
mV/°C
mΩ
Dynamic Characteristics
C
Input Capacitance 4951 pF
iss
C
Output Capacitance 884 pF
oss
C
Reverse Transfer Capacitance
rss
= –10 V, V
V
DS
f = 1.0 MHz
= 0 V,
GS
451 pF
Switching Characteristics (Note 2)
t
Turn–On Delay Time 16 29 ns
d(on)
tr Turn–On Rise Time 9 18 ns
t
Turn–Off Delay Time 196 314 ns
d(off)
tf Turn–Off Fall Time
Qg Total Gate Charge 53 74 nC
Qgs Gate–Source Charge 6 nC
Qgd Gate–Drain Charge
= –10 V, ID = –1 A,
V
DD
= –4.5 V, R
V
GS
= –10 V, ID = –10 A,
V
DS
V
= –4.5 V
GS
GEN
= 6 Ω
78 125 ns
12 nC
Drain–Source Diode Characteristics and Maximum Ratings
IS Maximum Continuous Drain–Source Diode Forward Current –1.5 A
VSD
Notes:
1. R
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
θJA
the drain pins. R
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
Drain–Source Diode Forward
Voltage
is guaranteed by design while R
θJC
a) 70°C/W when
mounted on a 1in2
pad of 2 oz copper
θCA
VGS = 0 V, IS = –1.5 A (Note 2) –0.56 –1.2 V
is determined by the user's board design.
b) 125°C/W when
mounted on a .04 in
pad of 2 oz copper
2
c) 135°C/W when mounted on a
minimum pad.
FDR844P Rev A1(W)
Page 3
)
Typical Characteristics
FDR844P
50
VGS = -4.5V
-3.0V
40
30
20
, DRAIN CURRENT (A)
D
-I
10
0
00.511.52
-2.5V
-2.0V
-V
, DRAIN TO SOURCE VOLTAGE (V)
DS
-1.5V
2.2
2
VGS = - 1.5V
1.8
1.6
1.4
, NORMALIZED
DS(ON)
1.2
R
1
DRAIN-SOURCE ON-RESISTANCE
0.8
0 1020304050
-2.0V
-2.5V
-I
, DRAIN CURRENT (A)
D
-3.0V
-3.5V
Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with
Drain Current and Gate Voltage.
1.6
ID = -10A
V
= - 4.5V
GS
1.4
1.2
, NORMALIZED
1
DS(ON)
R
0.8
DRAIN-SOURCE ON-RESISTANCE
0.6
-50 -25 0 25 50 75 100 125 150 175
T
, JUNCTION TEMPERATURE (oC)
J
0.035
0.03
0.025
0.02
0.015
, ON-RESISTANCE (OHM)
DS(ON)
0.01
R
0.005
012345
TA = 25oC
-V
GS
TA = 125oC
, GATE TO SOURCE VOLTAGE (V)
-4.5V
ID = -5A
Figure 3. On-Resistance Variation with
Temperature.
50
VDS = -5V
40
30
20
, DRAIN CURRENT (A)
D
-I
10
0
00.511.52
-V
, GATE TO SOURCE VOLTAGE (V)
GS
TA = -55oC
25oC
125oC
Figure 4. On-Resistance Variation with
Gate-to-Source Voltage.
10
VGS = 0V
1
0.1
0.01
0.001
, REVERSE DRAIN CURRENT (A
S
-I
0.0001
0 0.2 0.4 0.6 0.8
TA = 125oC
25oC
-55oC
BODY DIODE FORWARD VOLTAGE (V)
-V
SD,
Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation
with Source Current and Temperature.
FDR844P Rev A1(W)
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Typical Characteristics
FDR844P
5
ID = -10A
4
3
2
1
, GATE-SOURCE VOLTAGE (V)
GS
-V
0
0 102030405060
Q
, GATE CHARGE (nC)
g
VDS = -5V
-10V
-15V
6000
C
5000
4000
3000
2000
CAPACITANCE (pF)
1000
0
C
OSS
C
RSS
0 5 10 15 20
-V
ISS
, DRAIN TO SOURCE VOL TAG E (V)
DS
Figure 7. Gate Charge Characteristics. Figure 8. Capacitance Characteristics.
100
R
LIMIT
DS(ON)
10
1
, DRAIN CURRENT (A)
D
-I
0.01
VGS = -4.5V
SINGLE PULSE
0.1
=135oC/W
R
θ
JA
= 25oC
T
A
0.1 1 10 100
, DRAIN-SOURCE VO LTAGE (V)
-V
DS
10ms
100ms
1s
DC
1ms
10µs
100µs
50
40
30
20
POWER (W)
10
0
0.001 0.01 0.1 1 10 100
SINGLE PULSE TIME (SEC)
SINGLE PULSE
R
θ
JA
T
f = 1 MHz
V
= 0 V
GS
=135oC/W
= 25oC
A
Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum
Power Dissipation.
1
0.1
0.01
D = 0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
R
(t) = r(t) * R
JA
θ
R
= 135 °C/W
θJA
P(pk)
t
1
t
2
- TA = P * R
T
J
Duty Cycle, D = t
r(t), NORMALIZED EFFECTIVE
TRANSIENT THERMAL RESISTANCE
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1c.
Transient thermal response will change depending on the circuit board design.
FDR844P Rev A1(W)
JA
θ
(t)
θJA
/ t
1
2
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TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DenseTrench™
DOME™
EcoSPARK™
E2CMOS
EnSigna
TM
TM
FACT™
FACT Quiet Series™
STAR*POWER is used under license
FAST
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
LittleFET™
MicroFET™
MicroPak™
MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SILENT SWITCHER
SMART START™
STAR*POWER™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
TruTranslation™
UHC™
UltraFET
VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Formative or
In Design
First Production
Full Production
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. H4
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