Datasheet FDMS8692 Datasheet (Fairchild)

Page 1
FDMS8692
N-Channel PowerTrench® MOSFET
30V, 28A, 9.0m:
Features
Max r
Max r
Advanced Package and Silicon combination for
low r
MSL1 robust package design
RoHS Compliant
= 9.0m:at VGS = 10V, ID = 12A
DS(on)
= 14.0m: at VGS = 4.5V, ID = 10.5A
DS(on)
and high efficiency
DS(on)
May 2009
General Description
The FDMS8692 has been designed to minimize losses in power conversion application. Advancements in both silicon and package technologies have been combined to offer the lowest
while maintaining excellent switching performance.
r
DS(on)
Applications
Low Side for Synchronous Buck to Power Core Processor
Secondary Side Synchronous Rectifier
Low Side Switch in POL DC/DC Converter
Oring FET/ Load Switch
tm
FDMS8692 N-Channel PowerTrench
®
Top
D
Bottom
D
D
D
Pin 1
S
S
S
G
5
D
6
D
7
D
8
D
G
4
S
3
S
2
1
S
Power 56
MOSFET Maximum Ratings
Symbol Parameter Ratings Units
V
DS
V
GS
I
D
E
AS
P
D
TJ, T
STG
Drain to Source Voltage 30 V
Gate to Source Voltage ±20 V
Drain Current -Continuous (Package limited) TC= 25°C 28
-Continuous (Silicon limited) T
-Continuous TA= 25°C (Note 1a) 12
-Pulsed 120
Single Pulse Avalanche Energy (Note 3) 72 mJ
Power Dissipation TC = 25°C 41
Power Dissipation TA = 25°C (Note 1a) 2.5
Operating and Storage Junction Temperature Range -55 to +150 °C
TA= 25°C unless otherwise noted
= 25°C 48
C
Thermal Characteristics
A
W
R
TJC
R
TJA
Thermal Resistance, Junction to Case 3.0
Thermal Resistance, Junction to Ambient (Note 1a) 50
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDMS8692 FDMS8692 Power 56 13’’ 12mm 3000units
©2009 Fairchild Semiconductor Corporation FDMS8692 Rev.C4
°C/W
1
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Page 2
FDMS8692 N-Channel PowerTrench
Electrical Characteristics T
= 25°C unless otherwise noted
J
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
'BV 'T
I
DSS
I
GSS
DSS
DSS
J
Drain to Source Breakdown Voltage ID = 250PA, VGS = 0V 30 V
Breakdown Voltage Temperature Coefficient
= 250PA, referenced to 25°C 20 mV/°C
I
D
Zero Gate Voltage Drain Current VDS = 24V, VGS= 0V 1 PA
Gate to Source Leakage Current VGS = ±20V, VDS= 0V ±100 nA
On Characteristics
V
GS(th)
'V 'T
r
DS(on)
g
FS
GS(th)
J
Gate to Source Threshold Voltage VGS = VDS, ID = 250PA 1 1.8 3 V
Gate to Source Threshold Voltage Temperature Coefficient
Static Drain to Source On Resistance
= 250PA, referenced to 25°C -5.4 mV/°C
I
D
V
= 10V, ID = 12A 7.0 9.0
GS
= 4.5, ID = 10.5A 10.5 14.0
GS
= 10V, ID = 12A, TJ = 125°C 10.0 13.0
V
GS
Forward Transconductance VDD = 10V, ID = 12A 58 S
Dynamic Characteristics
C
iss
C
oss
C
rss
R
g
Input Capacitance
Output Capacitance 515 685 pF
Reverse Transfer Capacitance 85 130 pF
= 15V, VGS = 0V,
V
DS
f = 1MHz
Gate Resistance f = 1MHz 1.0 2.8
950 1265 pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
Q
Q
Q
g
g
gs
gd
Turn-On Delay Time
Rise Time 310ns
Turn-Off Delay Time 19 34 ns
VDD = 15V, ID = 12A, V
= 10V, R
GS
GEN
= 6:
918ns
Fall Time 210ns
Total Gate Charge VGS= 0V to 10V
Total Gate Charge VGS= 0V to 5V 8 11 nC
Gate to Source Charge 2.7 nC
VDD = 15V, I
= 12A
D
15 21 nC
Gate to Drain “Miller” Charge 2.1 nC
m:V
®
:
Drain-Source Diode Characteristics
V
SD
t
rr
Q
rr
NOTES:
1. R
is determined with the device mounted on a 1in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R
TJA
the user's board design.
2. Pulse Test: Pulse Width < 300Ps, Duty cycle < 2.0%.
3. Starting TJ = 25°C, L = 0.3mH, IAS = 22A, VDD = 30V, VGS = 10V.
©2009 Fairchild Semiconductor Corporation FDMS8692 Rev.C
Source to Drain Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge 14 25 nC
4
V
= 0V, IS= 2.1A (Note 2) 0.7 1.2 V
GS
= 0V, IS= 12A 0.8 1.2 V
V
GS
= 12A, di/dt = 100A/Ps
I
F
a. 50°C/W when mounted on a
2
1in
pad of 2 oz copper.
2
29 47 ns
is guaranteed by design while R
TJC
b. 125°C/W when mounted on a minimum pad of 2 oz copper.
is determined by
TCA
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Page 3
FDMS8692 N-Channel PowerTrench
Typical Characteristics T
120
100
80
60
40
, DRAIN CURRENT (A)
D
I
20
0
01234
, DRAIN TO SOURCE VOLTAGE (V)
V
DS
Figure 1.
1.8
1.6
On-Region Characteristics Figure 2.
ID = 12A V
= 10V
GS
1.4
1.2
1.0
NORMALIZED
0.8
DRAIN TO SOURCE ON-RESISTANCE
0.6
-75 -50 -25 0 25 50 75 100 125 150
T
, JUNCTION TEMPERATURE (
J
VGS = 10V
VGS = 5V
PULSE DURATION = 80Ps DUTY CYCLE = 0.5%MAX
= 25°C unless otherwise noted
J
VGS = 4.5V
VGS = 4V
VGS = 3.5V
o
C)
3.5
PULSE DURATION = 80Ps DUTY CYCLE = 0.5%MAX
3.0
VGS=3.5V
VGS = 4V
2.5
V
= 4.5V
GS
2.0
1.5
NORMALIZED
1.0
DRAIN TO SOURCE ON-RESISTANCE
0.5 020406080100120
I
, DRAIN CURRENT(A)
D
VGS = 5V
V
=10V
GS
N o r m a l i z e d O n - R e s i s t a n c e
vs Drain Current and Gate Voltage
25
ID= 12A
20
(m:)
15
, DRAIN TO
DS(on)
10
r
SOURCE ON-RESISTANCE
5
246810
V
, GATE TO SOURCE VOLTAGE (V)
GS
PULSE DURATION = 80Ps DUTY CYCLE = 0.5%MAX
TJ= 125oC
TJ= 25oC
®
F i g u r e 3 . N o r m a l i z e d O n - R e s i s t a n c e
vs Junction Temperature
120
PULSE DURATION = 80Ps DUTY CYCLE = 0.5%MAX
100
V
= 5V
DD
80
60
40
, DRAIN CURRENT (A)
D
I
20
0
123456
TJ= 150oC
TJ = 25oC
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 5. Transfer Characteristics
©2009 Fairchild Semiconductor Corporation FDMS8692 Rev.C
4
TJ = -55oC
Figure 4.
O n - R es i s t a n c e vs G a t e t o
Source Voltage
300
V
= 0V
100
GS
10
1
TJ= 150oC
TJ = 25oC
0.1
0.01
, REVERSE DRAIN CURRENT (A)
S
I
0.001
0.0 0.2 0.4 0.6 0.8 1.0 1.2
VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 6.
S o u r ce t o D r a i n Di o d e
TJ = -55oC
Forward Voltage vs Source Current
3
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Page 4
FDMS8692 N-Channel PowerTrench
Typical Characteristics T
10
ID= 12A
8
V
= 10V
DD
6
4
2
, GATE TO SOURCE VOLTAGE(V)
GS
V
0
0481216
Figure 7.
20
10
, AVALANCHE CURRENT(A)
AS
I
1
0.01 0.1 1 10 100
Figure 9.
Qg, GATE CHARGE(nC)
Gate Charge Characteristics Figure 8.
TJ= 125oC
tAV, TI ME IN AVALANCHE (ms)
U n c l a m p e d I n d u c t i v e
Switching Capability
= 25°C unless otherwise noted
J
VDD = 15V
VDD = 20V
TJ= 25oC
2000
C
iss
C
oss
C
rss
CAPACITANCE (pF)
1000
100
50
f = 1MHz
= 0V
V
GS
0.1 1 10
VDS, DRAIN TO SOURCE VOLTAGE (V)
C a p a c i t a n c e v s D r a i n
to Source Voltage
50
40
30
VGS= 10V
20
Limited by Package
, DRAIN CURRENT (A)
D
I
10
R
= 3oC/W
TJC
0
25 50 75 100 125 150
T
, CASE TEMPERATURE (
C
Figure 10.
M a x i m u m C o n t i n u o u s D r a i n
V
= 4.5V
GS
o
C)
Current vs Case Temperature
30
®
100
10
1
THIS AREA IS LIMITED BY r
, DRAIN CURRENT (A)
D
0.1
I
0.01
0.01 0.1 1 10 100
DS(on)
SINGLE PULSE T
= MAX RATED
J
= 125oC/W
R
TJA
= 25oC
T
A
VDS, DRAIN to S OURCE VOLTAGE (V)
F ig u re 1 1. F or w ar d B ia s Sa f e
Operating Area
©2009 Fairchild Semiconductor Corporation FDMS8692 Rev.C
4
1ms
10ms
100ms
1s
10s
DC
200
100
VGS = 10V
SINGLE PULSE
= 125oC/W
R
TJA
= 25oC
T
A
10
, PEAK TRANSIENT POWER (W)
)
1
PK
P(
0.5
-3
10
10-210
Figure 12.
-1
0
1
2
t, PULSE WIDTH (s)
10
10
10
3
10
S i n g l e P u l s e M a x i m u m
Power Dissipation
4
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Page 5
FDMS8692 N-Channel PowerTrench
Typical Characteristics T
2
1
TJA
0.1
IMPEDANCE, Z
0.01
NORMALIZED THERMAL
0.001
DUTY CYCLE-DESCENDING ORDER
D = 0.5
0.2
0.1
0.05
0.02
0.01
-3
10
10
SINGLE PULSE
R
TJA
-2
= 25°C unless otherwise noted
J
= 125oC/W
-1
10
t, RECTANGULAR PULSE DURATION (s)
0
10
NOTES: DUTY FACTOR: D = t1/t
PEAK TJ = PDM x Z
1
10
Figure 13. Transient Thermal Response Curve
P
DM
t
1
t
2
2
x R
+ T
TJA
TJA
A
2
10
3
10
®
©2009 Fairchild Semiconductor Corporation FDMS8692 Rev.C
4
5
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Page 6
Dimensional Outline and Pad Layout
FDMS8692 N-Channel PowerTrench
®
MOSFET
©2009 Fairchild Semiconductor Corporation
FDMS8692 RevC4
6
www.fairchildsemi.com
Page 7
t
®
m
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks.
Auto-SPM™ Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK EfficentMax™ EZSWITCH™ *
™*
Fairchild Fairchild Semiconductor FACT Quiet Series™ FACT FAST FastvCore™ FETBench™ FlashWriter FPS™
®
m
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®
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®
FRFET Global Power Resource Green FPS™ Green FPS™ e-Series™ Gmax™ GTO™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™
®
MotionMax™ Motion-SPM™ OPTOLOGIC OPTOPLANAR
®
tm
PDP SPM™ Power-SPM™
®
SM
®
PowerTrench PowerXS™ Programmable Active Droop™ QFET QS™ Quiet Series™ RapidConfigure™
Saving our world, 1mW /W /kW at a time™ SmartMax™ SMART START™ SPM STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS™ SyncFET™ Sync-Lock™
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FDMS8692 N-Channel PowerTrench
®
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS Definition of Terms
.
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Datasheet Identification Product Status Definition
Advance Information Formative / In Design
Preliminary First Production
No Identification Needed Full Production
Obsolete Not In Production
©2009 Fairchild Semiconductor Corporation FDMS8692 Rev.C4
Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
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Rev. I40
Page 8
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