Datasheet FDMC8296 Datasheet (Fairchild)

Page 1
N-Channel Power Trench®MOSFET
30V, 18A, 8.0m:
Features
Max r
Max r
High performance trench technology for extr
Termination is Lead-free and RoHS Compliant
= 8.0m: at VGS = 10V, ID = 12A
DS(on)
= 13.0m: at VGS = 4.5V, ID = 10A
DS(on)
emely low r
DS(on)
September 2010
General Description
This N-Channel MOSFET is produced using Semiconductor‘s advanced Power Trench been especially tailored to minimize the on-state resistan device is well suited for Power Management and load switching applications common in Notebook Computers and Portable Battery Packs.
®
process that has
Application
DC - DC Buck Converter
ook battery power management
Noteb
Load switch in Notebook
Fairchild
ce. This
FDMC8296 N-Channel Power Trench
®
MOSFET
Top
Pin 1
Bottom
G
S
S
S
D
D
D
D
5
D
D
6
D
7
8
D
MLP 3.3x3.3
MOSFET Maximum Ratings T
Symbol Parameter Ratings
V
DS
V
GS
I
D
E
AS
P
D
, T
T
J
STG
Drain to Source Voltage 30 V
Gate to Source Voltage ±2
Drain Current -Continuous (Package limited) TC= 25°C 18
-Continuous (Silicon limited) T
-Continuous T
-Pulsed 52
e Pulse Avalanche Energy (Note 3) 72 mJ
Singl
Power Dissip
Power
Operating and Storage Junction Temperature Range -55 to +150
ation T
Dissipation T
= 25°C unless otherwise noted
A
= 25°C 44
C
= 25°C
A
= 25°C 27
C
= 25°C
A
(Note 1a) 12
(Note 1a) 2.3
Thermal Characteristics
G
4
S
3
S
2
S
1
Units
0 V
A
W
°C
R
TJC
R
TJA
Thermal Resistance
Thermal Resistance, Junction to Ambient
, Junction to Case 4.6
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDMC8296 FDMC8296 MLP 3.3X3.3 13 ’’
©2010 Fairchil FDMC8296 Rev.C1
d Semiconductor Corporation
(Note 1a) 53
12 mm 3000 units
1
°C/W
www.fairchildsemi.com
Page 2
FDMC8296 N-Channel Power Trench
Electrical Characteristics T
l Parameter Test Conditions Min Typ Max Units
Symbo
Off Characterist
BV
DSS
'BV
DSS
'T
J
I
DSS
I
GSS
On Characteristics
V
GS(th)
'V
GS(th)
'T
J
r
DS(on)
g
FS
Dynamic Characte
C
iss
C
oss
C
s
rs
R
g
ics
Drain to Source Breakdown Volt
Breakdown Voltage Temperature
ficient
Coef
Zero Gate Voltage Drain Current
Gate to Source Leakage Current VGS = ±20V, VDS= 0V ±1
Gate to Source Threshold Voltage
Gate to Source Threshold Voltage T
emperature Coefficient
Static Drain to
Forward T
Source On Resistance
ransconductance V
ristics
Input Capacitance
Output Capacit
Reverse Transfer Capacit
Gate Resistance f = 1MHz 0.9 :
ance 513 685
ance 87 135 pF
= 25°C unless otherwi
J
age I
= 250PA, VGS = 0V 30 V
D
I
= 250PA, referenced to 25°C 17 mV/°C
D
V
DS
V
GS
V
GS
= 250PA, referenced to 25
I
D
V
GS
GS
V
GS
DD
V
DS
f = 1MHz
se noted
= 24V, 1
= 0V, TJ = 125°C 250
00 nA
= VDS, ID = 250PA 1.0 1.9
3.0 V
°C -6 mV/°C
= 10V, ID = 12A 6.5 8.0
= 4.5V, ID = 10A 9.5 13.0
= 10V, ID = 12A, TJ = 125°C 9.0 12.8
= 5V, ID = 12A 44 S
= 15V, VGS = 0V,
1038 1385 pF
m:V
PA
®
MOSFET
pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g(TOT)
Q
gs
Q
gd
Turn-On Delay T
ime
Rise Time 310
Turn-Off Delay T
Fall T
ime 210
Total Gate Charge
Total Gate Charge
Gate to Drain “Miller”
ime 19 35 ns
3nC
Charge 2.5 nC
Drain-Source Diode Characteristics
V
SD
t
rr
Q
rr
NOTES:
is dete
1. R
TJA
the user's board design.
Source to Drain Diode Forward Volt
Reverse Recovery T
ime
Reverse Recovery Charge 9 18
2
rmined with the device mounted on a 1in
pad 2
a. 53 °C/W whe a 1 i n
= 15V, ID = 12A,
V
DD
= 10V, R
V
GS
V
= 0V to 10V
GS
V
= 0V to 4.5V 7.
GS
= 0V, IS= 12A (Note 2) 0.8
V
age
oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R
2
pad of
GS
= 0V, IS= 1.9A
V
GS
= 12A, di/dt = 100A/Ps
I
F
n mounted on
2 oz copper
GEN
= 6:
V
= 15V,
DD
= 12A
I
D
(Note 2) 0.73 1.2
918ns
16 23 nC
6 10.6 nC
2 1.3
25 45
is guar
anteed by design while R
TJC
b.125 °C/W when mounted on a minimum pad of 2 oz copper
is determined
TCA
ns
ns
V
ns
nC
by
2. Pulse Test: Pulse Width < 300Ps, Duty cycle < 2.0%.
of 72 mJ is based on starting T = 25 C, L = 1 mH, IAS = 12 A, VDD = 27 V, VGS = 10 V. 100% test at L = 3 mH, IAS= 5.7 A.
3. E
AS
©2010 Fairchild Semiconductor Corporation FDMC8296 Rev.C1
2
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Page 3
FDMC8296 N-Channel Power Trench
Typical Characteristics T
50
VGS = 10V
40
30
20
, DRAIN CURRENT (A)
10
D
I
0
012345
Figure 1.
1.8
ID = 12A V
1.6
1.4
1.2
1.0
NORMALIZED
0.8
DRAIN TO SOURCE ON-RESISTANCE
0.6
-50 -25 0 25 50 75 100 125 150
F i g u r e 3 . N o r m a l i z e d O n - R e s i s t a n c e
VGS = 4.5V
VGS = 4V
PULSE DURATION = 80Ps DUTY CYCLE = 0.5%MAX
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
On-Region Characteristics Figure 2.
= 10V
GS
, JUNCTION TEMPERATURE (
T
J
vs Junction Temperature
= 25°C unless otherwise noted
J
VGS = 3.5V
VGS = 3V
o
C)
6
PULSE DURATION = 80Ps
5
DUTY CYCLE = 0.5%MAX
VGS = 3V
4
VGS = 3.5V
V
V
= 4V
GS
GS
= 4.5V
NORMALIZED
3
2
1
V
=10V
DRAIN TO SOURCE ON-RESISTANCE
0
0 1020304050
, DRAIN CURRENT(A)
I
D
GS
N o r m a l i z e d O n - R e s i s t a n c e
vs Drain Current and Gate Voltage
50
40
(m:)
30
DRAIN TO
,
20
DS(on)
r
10
SOURCE ON-RESISTANCE
0
TJ= 25oC
246810
V
GS
Figure 4.
O n - R es i s t a n c e vs G a t e t o
PULSE DURATION = 80Ps DUTY CYCLE = 0.5%MAX
ID= 12A
TJ= 125oC
, GATE TO SOURCE VOLTAGE (V)
Source Voltage
®
MOSFET
50
PULSE DURATION = 80Ps DUTY CYCLE = 0.5%MAX
40
VDS= 5V
30
20
TJ= 150oC
, DRAIN CURRENT (A)
10
D
I
0
12345
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 5. Transfer Characteristics
©2010 Fairchild Semiconductor Corporation FDMC8296 Rev.C1
TJ= 25oC
TJ= -55oC
50
V
= 0V
GS
10
1
TJ= 150oC
TJ = 25oC
0.1
0.01
, REVERSE DRAIN CURRENT (A)
S
I
0.001
0.0 0.2 0.4 0.6 0.8 1.0 1.2
VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 6.
S o u r ce t o D r a i n Di o d e
TJ = -55oC
Forward Voltage vs Source Current
3
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Page 4
FDMC8296 N-Channel Power Trench
Typical Characteristics T
10
ID= 12A
8
6
4
2
, GATE TO SOURCE VOLTAGE(V)
GS
V
0
0 3 6 9 12 15 18
Figure 7.
Gate Charge Characteristics Figure 8.
30
10
, AVALANCHE CURRENT(A)
AS
I
1
0.01 0.1 1 10 100
tAV, TI ME IN AVALANCHE( ms)
Figure 9.
Switching Capability
V
= 10V
DD
Qg, GATE CHARGE(nC)
TJ= 125oC
U n c l a m p e d I n d u c t i v e
= 25°C unless otherwise noted
J
VDD = 15V
VDD = 20V
TJ= 25oC
3000
1000
C
100
CAPACITANCE (pF)
f = 1MHz V
= 0V
GS
30
0.1 1 10 30
VDS, DRAIN TO SOURCE VOLTAGE (V)
C a p a c i t a n c e v s D r a i n
to Source Voltage
50
40
V
= 10V
GS
30
V
= 4.5V
GS
20
, DRAIN CURRENT (A)
D
I
10
Limited by Package
0
25 50 75 100 125 150
T
, CASE TEMPERATURE (
C
Figure 10.
M a x i m u m C o n t i n u o u s D r a i n
R
TJC
= 4.6oC/W
o
C)
C u r r e n t v s C a s e T e m p e r a t ur e
C
iss
oss
C
rss
®
MOSFET
100
10
1
THIS AREA IS LIMITED BY r
, DRAIN CURRENT (A)
D
I
SINGLE PULSE
0.1
T
J
R
TJA
T
0.01
A
0.01 0.1 1 10 100
Figure 11.
DS(on)
= MAX RATED
= 125oC/W
= 25oC
VDS, DRAIN to SOURCE VOLTAGE (V)
Fo rw ar d B ia s Safe
Operating Area
©2010 Fairchild Semiconductor Corporation FDMC8296 Rev.C1
1ms
10ms
100ms
1s
10s
DC
200
100
VGS = 10V
SINGLE PULSE
= 125oC/W
R
TJA
= 25oC
T
A
10
), PEAK TRANSIENT POWER (W)
1
PK
P(
0.5
-3
10
Figure 12.
10-210
-1
t, PULSE WIDTH (s)
110
100 1000
S i n g l e P u l s e M a x i m u m
Power Dissipation
4
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Page 5
FDMC8296 N-Channel Power Trench
Typical Characteristics T
2
DUTY CYCLE-DESCENDING ORDER
1
D = 0.5
TJA
Z
0.1
IMPEDANCE,
NORMALIZED THERMAL
0.01
0.005
0.2
0.1
0.05
0.02
0.01
-3
10
-2
10
= 25°C unless otherwise noted
J
SINGLE PULSE
R
= 125oC/W
TJA
-1
10
t, RECTANGULAR PULSE DURATION (sec )
110
NOTES: DUTY FACTOR: D = t
PEAK TJ = PDM x Z
Figure 13. Transient Thermal Response Curve
P
DM
t
1
t
2
1/t2
x R
+ T
TJA
TJA
A
100 1000
®
MOSFET
©2010 Fairchild Semiconductor Corporation FDMC8296 Rev.C1
5
www.fairchildsemi.com
Page 6
Dimensional Outline and Pad Layout
FDMC8296 N-Channel Power Trench
®
MOSFET
©2010 Fairchild Semiconductor Corporation FDMC8296 Rev.C1
6
www.fairchildsemi.com
Page 7
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks.
AccuPower™ Auto-SPM™ Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ DEUXPEED Dual Cool™ EcoSPARK
®
®
EfficientMax™ ESBC™
®
®
Fairchild Fairchild Semiconductor FACT Quiet Series™
®
FACT
®
FAST FastvCore™ FETBench™ FlashWriter
®
*
FPS™
®
F-PFS™ FRFET Global Power ResourceSM Green FPS™ Green FPS™ e-Series™ Gmax™ GTO™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MicroPak2™ MillerDrive™ MotionMax™ Motion-SPM™ OptoHiT™ OPTOLOGIC OPTOPLANAR
PDP SPM™
®
Power-SPM™ PowerTrench
®
PowerXS™ Programmable Active Droop™
®
QFET QS™ Quiet Series™ RapidConfigure™
™
Saving our world, 1mW/W /kW at a time™ SignalWise™ SmartMax™ SMART START™
®
SPM STEALTH™ SuperFET™ SuperSOT™-3
®
®
®
SuperSOT™-6 SuperSOT™-8 SupreMOS™ SyncFET™ Sync-Lock™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
The Power Franchise
TinyBoost™ TinyBuck™ TinyCalc™ TinyLogic TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ TriFault Detect™ TRUECURRENT™* μSerDes™
UHC Ultra FRFET™ UniFET™ VCX™ VisualMax™ XS™
®
*
®
®
FDMC8296 N-Channel Power Trench
®
®
MOSFET
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE W ARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative / In Design
Preliminary First Production
No Identification Needed Full Production
Obsolete Not In Production
©2010 Fairchild Semiconductor Corporation
FDMC8296 Rev.C1
Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
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Rev. I48
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