Datasheet FDMC7660 Datasheet (Fairchild)

Page 1
S
S
S
G
D
D
D
D
Top
Power 33
Bottom
D
D
D
D
S
S
S
G
Pin 1
N-Channel PowerTrench® MOSFET
30 V, 20 A, 2.2 mΩ Features
Max rMax rHigh performance technology for extremely low rTermination is Lead-free and RoHS Compliant
= 2.2 mΩ at VGS = 10 V, ID = 20 A
DS(on)
= 3.3 mΩ at VGS = 4.5 V, ID = 18 A
DS(on)
DS(on)
General Description
This N-Channel MOSFET is produced using Fairchild Semiconductor’s advanced Power been especially tailored to minimize the on-state resistance. device is well suited for Power Management and load switching applications common in Notebook Computers and Portable Battery Packs.
Applications
DC - DC Buck ConvertersPoint of LoadHigh Efficiency Load Switch and Low Side Switching
FDMC7660 N-Channel PowerTrench
June 2012
Trench® process that has
This
®
MOSFET
MOSFET Maximum Ratings T
Symbol Parameter Ratings Units
V
DS
V
GS
I
D
E
AS
P
D
, T
T
J
STG
Drain to Source Voltage 30 V Gate to Source Voltage (Note 4) ±20 V Drain Current -Continuous (Package limited) TC = 25°C 40
-Continuous (Silicon limited) T
-Continuous T
-Pulsed 200 Single Pulse Avalanche Energy (Note 3) 200 mJ Power Dissipation TC = 25°C 41 Power Dissipation T Operating and Storage Junction Temperature Range -55 to + 150 °C
C
Thermal Characteristics
R
θJC
R
θJA
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDMC7660 FDMC7660 Power 33 13’’ 12
©2012 Fairchild Semiconductor Corporation FDMC7660 Rev.C5
Thermal Resistance, Junction to Case 3 Thermal Resistance, Junction to Ambient (Note 1a) 53
= 25°C unless otherwise noted
= 25°C 100
C
= 25°C (Note 1a) 20
A
= 25°C (Note 1a) 2.3
A
1
mm 3000 units
www.fairchildsemi.com
A
W
°C/W
Page 2
FDMC7660 N-Channel PowerTrench
Electrical Characteristics T
= 25°C unless otherwise noted
J
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
ΔBV ΔT
I
DSS
I
GSS
DSS
DSS J
Drain to Source Breakdown Voltage I Breakdown Voltage Temperature
Coefficient Zero Gate Voltage Drain Current V Gate to Source Leakage Current V
= 250 μA, VGS = 0 V30 V
D
I
= 250 μA, referenced to 25°C 14 mV/°C
D
= 24 V, V
DS
= 20 V, V
GS
= 0 V1μA
GS
= 0 V 100nA
DS
On Characteristics
V
GS(th)
ΔV ΔT
r
DS(on)
g
FS
GS(th)
J
Gate to Source Threshold Voltage VGS = VDS, I Gate to Source Threshold Voltage
Temperature Coefficient
Static Drain to Source On Resistance
Forward Transconductance V
I
= 250 μA, referenced to 25°C -6 mV/°C
D
V
= 10 V, ID = 20 A 1.82.2
GS
= 4.5 V, ID = 18 A2.63.3
GS
= 10 V, ID = 20 A, T
V
GS
= 5 V, ID = 20 A 163 S
DS
= 250 μA 1.2 1.7 2.5 V
D
= 125°C 2.2 3.1
J
Dynamic Characteristics
C
iss
C
oss
C
rss
R
g
Input Capacitance Output Capacitance 1345 1790 pF Reverse Transfer Capacitance 110 165 pF Gate Resistance 0.9 Ω
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q Q Q Q
g g gs gd
Turn-On Delay Time Rise Time 6.8 14 ns Turn-Off Delay Time 36 58 ns Fall Time 5.7 11 ns Total Gate Charge V Total Gate Charge V Gate to Source Charge 11 nC Gate to Drain “Miller” Charge 5.6 nC
= 15 V, VGS = 0 V,
V
DS
f = 1MHz
= 15 V, ID = 20 A,
V
DD
V
= 10 V, R
GS
= 0 V to 10 V
GS
= 0 V to 4.5 V2438nC
GS
GEN
= 6 Ω
V
DD
I
= 20 A
D
= 15 V,
3630 4830 pF
14 25 ns
54 86 nC
mΩV
®
MOSFET
Drain-Source Diode Characteristics
V
= 0 V, IS = 20 A (Note 2) 0.8 1.2
V
SD
t
rr
Q
rr
Notes:
1. R
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
θJA
is guaranteed by design while R
R
θJC
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.
3. Starting T
4. As an N-channel device, the negative Vgs rating is for low duty cycle pulse ocurrence only. No continuous rating is implied.
©2012 Fairchild Semiconductor Corporation FDMC7660 Rev.C5
Source-Drain Diode Forward Voltage Reverse Recovery Time
Reverse Recovery Charge 25 35 nC
is determined by the user’s board design.
θJA
a.
53 °C/W when mounted on a
SS
SF
DF
DS
G
= 25 °C, L = 1 mH, IAS = 20 A, VDD = 27 V, VGS = 10 V
J
2
1 in
pad of 2 oz copper
GS
= 0 V, IS = 1.9 A (Note 2) 0.7 1.2
V
GS
= 20 A, di/dt = 100 A/μs
I
F
G
2
DF
DS
SF
SS
45 63 ns
b.
125 °C/W when mounted on a minimum pad of 2 oz copper
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V
Page 3
FDMC7660 N-Channel PowerTrench
0.0 0.5 1.0 1.5 2 .0
0
50
100
150
200
VGS = 4.5 V
VGS = 3.5 V
VGS = 3 V
VGS = 4 V
PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX
VGS = 10 V
I
D
, DRAIN CURRENT (A)
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
0 50 100 150 200
0.5
1.0
1.5
2.0
2.5
3.0
VGS = 3.5 V
PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
I
D
, DRAIN CURRENT (A)
V
GS
= 4 V
VGS = 4.5 V
VGS = 3 V
V
GS
= 10 V
-75 -50 -25 0 25 50 75 100 125 150
0.8
1.0
1.2
1.4
1.6
ID = 20 A V
GS
= 10 V
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
T
J
, JUNCTION TEMPERATUR E (
o
C)
246810
0
5
10
15
TJ = 125oC
ID = 20 A
TJ = 25 oC
V
GS
, GATE TO S OURCE VOLTAGE (V)
r
DS(on)
,
DRAIN TO
SOURCE ON-RESISTANCE
(mΩ)
PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX
1234
0
50
100
150
200
TJ = 150 oC
V
DS
= 5 V
PULSE DURA TION = 80 μs DUTY CYCLE = 0.5% MAX
TJ = -55 oC
TJ = 25 oC
I
D
, DRAIN CURRENT (A)
VGS, GATE TO SOURC E VO LTAGE (V)
0.2 0.4 0.6 0.8 1.0 1.2
0.1
1
10
100
TJ = -55 oC
TJ = 25 oC
TJ = 150 oC
V
GS
= 0 V
I
S
, REVERSE DRAIN CURRENT (A)
VSD, BODY DIODE FORWARD VOLTAGE (V)
200
Typical Characteristics T
Figure 1.
On Region Characteristics Figure 2.
= 25°C unless otherwise noted
J
®
MOSFET
No rm al iz ed On -R es is ta nc e
vs Drain Current and Gate Voltage
Fi gur e 3. No rma lized On R esist anc e
vs Junction Temperature
©2012 Fairchild Semiconductor Corporation FDMC7660 Rev.C5
Figure 5. Transfer Characteristics
Figure 4.
On-Resistance vs Gate to
Source Voltage
Figure 6.
Source to Drain Dio de
Forward Voltage vs Source Current
3
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Page 4
FDMC7660 N-Channel PowerTrench
0204060
0
2
4
6
8
10
ID = 20 A
V
DD
= 20 V
V
DD
= 10 V
V
GS
, GATE TO SOURCE VOLTAGE (V)
Qg, GATE CHARGE (nC)
VDD = 15 V
0.1 1 10
0.05
0.1
1
10
f = 1 MHz V
GS
= 0 V
CAPACITANCE (nF)
VDS, DRAIN TO SOURCE VOLTAGE (V)
C
rss
C
oss
C
iss
30
0.01 0.1 1 10 100 300
1
10
30
TJ = 100 oC
TJ = 25 oC
TJ = 125 oC
tAV, TIME IN AVAL ANCH E (ms)
I
AS
, AVALANCHE CURRENT (A)
25 50 75 100 125 150
0
50
100
150
Limited by Package
V
GS
= 4.5 V
R
θJC
= 3 oC/W
V
GS
= 10 V
I
D
, DRAIN CURRENT (A)
T
C
, CASE TEMPERATURE (
o
C)
0.01 0.1 1 10 100
0.01
0.1
1
10
100
300
DERIVED FROM TESTED DATA
1 ms
1 s
10 ms
DC
10 s
100 ms
I
D
, DRAIN CURRENT (A)
VDS, DRAIN to SOURCE VOLTAGE (V)
THIS AREA IS LIMITED BY r
DS(on)
SINGLE PULSE T
J
= MAX RATED
R
θJA
= 125
o
C/W
T
A
= 25
o
C
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
3
0.5
1
10
100
1000
SINGLE PULSE R
θJA
= 125
o
C/W
T
A
= 25
o
C
P(
PK
), PEAK TRANSIENT POWER (W)
t, PULSE WIDTH (sec)
Typical Characteristics T
Figure 7.
Gate Charge Characteristics Figure 8.
= 25°C unless otherwise noted
J
®
MOSFET
Ca pacit an ce vs Dr ain
to Source Voltage
Figure 9.
Un c la mp e d I nd u ct iv e
Switching Capability
©2012 Fairchild Semiconductor Corporation FDMC7660 Rev.C5
Figure 11. Forward Bias Safe
Op
erating Area
Figure 10.
Max imum Con tinu ous Drai n
Current vs Case Temperature
Figure 12.
Single Pu lse Maximum
Power Dissipation
4
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Page 5
FDMC7660 N-Channel PowerTrench
10
-3
10
-2
10
-1
10
0
10
1
100 1000
1E-3
0.01
0.1
1
SINGLE PULSE R
θJA
= 125 oC/W
DUTY CYCLE-DESCENDING ORDER
NORMALIZED THERMAL
IMPEDANCE,
Z
θJA
t, RECTANGULAR PULSE DURATION (sec)
D = 0.5
0.2
0.1
0.05
0.02
0.01
2
P
DM
t
1
t
2
NOTES: DUTY FACTOR: D = t1/t
2
PEAK TJ = PDM x Z
θJA
x R
θJA
+ T
A
Typical Characteristics T
Figure 13. Junction-to-Ambient Transient Thermal Response Curve
= 25°C unless otherwise noted
J
®
MOSFET
©2012 Fairchild Semiconductor Corporation FDMC7660 Rev.C5
5
www.fairchildsemi.com
Page 6
FDMC7660 N-Channel PowerTrench
Dimensional Outline and Pad Layout
®
MOSFET
©2012 Fairchild Semiconductor Corporation FDMC7660 Rev.C5
6
www.fairchildsemi.com
Page 7
TRADEMARKS
®
™
tm
tm
The following includes registered and unregistered trade marks and service marks, o wned by Fairchild Semicond uctor and/or its g lobal subsidiaries, and i s not intended to be an exhaustive list of all such trademarks.
2Cool™ AccuPower™ AX-CAP™*
®
BitSiC Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ DEUXPEED Dual Cool™ EcoSPARK EfficentMax™ ESBC™
Fairchild Fairchild Semiconductor FACT Quiet Series™ FACT FAST FastvCore™ FETBench™ FlashWriter FPS™
®
®
®
® ®
®
*
®
F-PFS™
®
FRFET Global Power Resource Green Bridge™ Green FPS™ Green FPS™ e-Series™ Gmax™ GTO™ IntelliMAX™ ISOPLANAR™ Marking Small Speakers Sound Louder and Better™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MicroPak2™ MillerDrive™ MotionMax™ Motion-SPM™ mWSaver™ OptoHiT™ OPTOLOGIC OPTOPLANAR
®
®
®
SM
PowerTrench PowerXS™ Programmable Active Droop™ QFET QS™ Quiet Series™ RapidConfigure™
Saving our world, 1mW/W/kW at a time™ SignalWise™ SmartMax™ SMART START™ Solutions for Your Success™ SPM STEALTH™ SuperFET SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS SyncFET™ Sync-Lock™
®
®
®
®
®
®*
The Power Franchise
TinyBoost™ TinyBuck™ TinyCalc™
®
TinyLogic TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™
®
TranSiC TriFault Detect™ TRUECURRENT μSerDes™
®
UHC Ultra FRFET™ UniFET™ VCX™ VisualMax™ VoltagePlus™ XS™
®
®
®
*
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
FDMC7660 N-Channel PowerTrench
®
MOSFET
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used here in:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or ( b) su pport or susta in life , and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.
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Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support Counterfeiting of semiconductor parts is a growing problem in the indust ry. All manufactures of semiconductor products are experiencin g counterfeiting of their
parts. Customers who inadvertently purchase coun te rfei t part s expe rien ce many probl ems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing del ays. Fairch ild is taking stro ng measure s to prot ect ourselves and our customers fro m the proliferation of counterfeit parts. Fairchild strongly encou rages cust omers to purchase Fairchil d parts eit her directly from Fa irchild or from Author ized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s qua lity standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is
.
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
committed to combat this global problem and encourage our customer s to do their part in stopping this practice by buying direct or from authorized distrib utors.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative / In Design
Preliminary First Production
No Identification Needed Full Production
Obsolete Not In Production
Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
Rev. I61
©2012 Fairchild Semiconductor Corporation 7 www.fairchildsemi.com FDMC7660 Rev.C5
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