Datasheet FDMC3612 Datasheet (Fairchild)

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G
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D D
D
D
5
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D
D
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MLP 3.3x3.3
6
7
8
N-Channel Power Trench® MOSFET
100 V, 12 A, 110 mΩ
Features
Max rMax rLow Profile - 1 mm max in Power 33
100% UIL TestedRoHS Compliant
= 110 mΩ at VGS = 10 V, ID = 3.3 A
DS(on)
= 122 mΩ at VGS = 6 V, ID = 3.0 A
DS(on)
General Description
This N-Channel MOSFET is produced using Fairchild Semiconductor‘s advanced Power Trench been especially tailored to minimize the on-state resistance and yet maintain superior switching performance.
Applications
DC - DC ConversionPSE Switch
February 2012
®
process that has
FDMC3612 N-Channel PowerTrench
®
MOSFET
MOSFET Maximum Ratings T
Symbol Parameter Ratings Units
V
DS
V
GS
I
D
E
AS
P
D
, T
T
J
STG
Thermal Characteristics
R
θJC
R
θJA
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDMC3612 FDMC3612 Power 33 13’’ 12
©2012 Fairchild Semiconductor Corporation FDMC3612 Rev.C2
Drain to Source Voltage 100 V Gate to Source Voltage ±20 V Drain Current -Continuous (Package limited) TC = 25 °C 16
-Continuous (Silicon limited) T
-Continuous T
-Pulsed 15 Single Pulse Avalanche Energy (Note 3) 32 mJ Power Dissipation TC = 25 °C 35 Power Dissipation T Operating and Storage Junction Temperature Range -55 to + 150 °C
Thermal Resistance, Junction to Case 3.5 Thermal Resistance, Junction to Ambient (Note 1a) 53
= 25 °C unless otherwise noted
C
C A
A
1
= 25 °C 12 = 25 °C (Note 1a) 3.3
= 25 °C (Note 1a) 2.3
mm 3000 units
A
W
°C/W
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Page 2
FDMC3612 N-Channel PowerTrench
Electrical Characteristics T
= 25 °C unless otherwise noted
J
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
ΔBV ΔT
I
DSS
I
GSS
DSS
DSS J
Drain to Source Breakdown Voltage ID = 250 μA, VGS = 0 V 100 V Breakdown Voltage Temperature
Coefficient Zero Gate Voltage Drain Current VDS = 80 V, V Gate to Source Leakage Current VGS = ±20 V, V
I
= 250 μA, referenced to 25 °C 109 mV/°C
D
= 0 V 1 μA
GS
= 0 V ±100 nA
DS
On Characteristics
V
GS(th)
ΔV ΔT
r
DS(on)
g
FS
GS(th)
J
Gate to Source Threshold Voltage VGS = VDS, ID = 250 μA 2.0 2.5 4.0 V Gate to Source Threshold Voltage
Temperature Coefficient
Static Drain to Source On Resistance
I
= 250 μA, referenced to 25 °C -7 mV/°C
D
V
= 10 V, ID = 3.3 A 92 110
GS
= 6 V, ID = 3.0 A 98 122
GS
= 10 V , ID = 3.3 A, TJ = 125 °C 177 212
V
GS
Forward Transconductance VDS = 10 V, ID = 3.3 A 13 S
Dynamic Characteristics
C
iss
C
oss
C
rss
R
g
Input Capacitance Output Capacitance 40 55 pF Reverse Transfer Capacitance 23 35 pF Gate Resistance 1.3 Ω
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g(TOT)
Q
g(TOT)
Q
gs
Q
gd
Turn-On Delay Time Rise Time 2.8 10 ns Turn-Off Delay Time 19 34 ns Fall Time 210ns Total Gate Charge V Total Gate Charge V Total Gate Charge 2.3 nC Gate to Drain “Miller” Charge 3.7 nC
= 50 V, VGS = 0 V,
V
DS
f = 1 MHz
= 50 V, ID = 3.3 A,
V
DD
V
= 10 V, R
GS
= 0 V to 10 V
GS
= 0 V to 5 V 7.9 12 nC
GS
= 6 Ω
GEN
VDD = 50 V, I
D
= 3.3 A
662 880 pF
7.4 15 ns
14.4 21 nC
mΩV
®
MOSFET
Drain-Source Diode Characteristics
V
SD
t
rr
Q
rr
NOTES:
is determined with the device mounted on a 1 in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R
1. R
θJA
the user's board design.
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.
3. Starting TJ = 25 °C; N-ch: L = 1 mH, IAS = 8 A, VDD = 90 V, VGS = 10 V.
©2012 Fairchild Semiconductor Corporation FDMC3612 Rev.C2
Source to Drain Diode Forward Voltage Reverse Recovery Time
Reverse Recovery Charge 37 60 nC
a) 53 °C/W when mounted on a 1 in
V V
I
F
2
pad of 2 oz copper
= 0 V, IS = 3.3 A (Note 2) 0.88 1.2
GS
= 0 V, IS = 2 A (Note 2) 0.77 1.2
GS
= 3.3 A, di/dt = 100 A/μs
θJC
2
34 55 ns
is guaranteed by design while R
b) 125 °C/W when mounted on a minimum pad of 2 oz copper
V
is determined by
θCA
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Page 3
FDMC3612 N-Channel PowerTrench
012345
0
3
6
9
12
15
VGS = 4 V
VGS = 3.5 V
VGS = 4.5 V
PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX
VGS = 6 V
VGS = 10 V
I
D
, DRAIN CURRENT (A)
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
03691215
0.5
1.0
1.5
2.0
2.5
3.0
VGS = 6 V
PULSE DURA TION = 80 μs DUTY CYCLE = 0.5% MAX
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
I
D
, DRAIN CURRENT (A)
V
GS
= 4 V
VGS = 4.5 V
VGS = 3.5 V
V
GS
= 10 V
-75 -50 -25 0 25 50 75 100 125 150
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
ID = 3.3 A V
GS
= 10 V
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
T
J
, JUNCTION TEMPERATURE (
o
C)
246810
0
100
200
300
400
TJ = 125 oC
ID = 3.3 A
TJ = 25 oC
V
GS
, GATE TO SOURCE VOL TAG E (V)
r
DS(on)
,
DRAIN TO
SOURCE ON-RESISTANCE
(mΩ)
PULSE DURA TION = 80 μs DUTY CYCLE = 0.5% MAX
2.0 2.5 3.0 3.5 4.0 4.5 5.0
0
3
6
9
12
15
TJ = 150 oC
V
DS
= 5 V
PULSE DURA TION = 80 μs DUTY CYCLE = 0.5% MAX
TJ = -55 oC
TJ = 25 oC
I
D
, DRAIN CURRENT (A)
VGS, GATE TO SOURCE VOLTAGE (V)
0.2 0.4 0.6 0.8 1.0 1.2
0.001
0.01
0.1
1
10
20
TJ = -55 oC
TJ = 25 oC
TJ = 150 oC
V
GS
= 0 V
I
S
, REVERSE DRAIN CURRENT (A)
VSD, BODY DIODE FORWARD VOLTAGE (V)
Typical Characteristics T
Figure 1.
On Region Characteristics
= 25 °C unless otherwise noted
J
Figure 2.
Normali z e d O n - R esistance
vs Drain Current and Gate Voltage
®
MOSFET
Fig u re 3. Norma l ized O n Res i stan c e
vs Junction Temperature
©2012 Fairchild Semiconductor Corporation FDMC3612 Rev.C2
Figure 5. Transfer Characteristics
Figure 4.
On-R esistance vs Gate to
Source Voltage
Figure 6.
Source to Drain Di ode
Forward Voltage vs Source Current
3
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Page 4
FDMC3612 N-Channel PowerTrench
0246810121416
0
2
4
6
8
10
ID = 3.3 A
VDD = 75 V
V
DD
= 25 V
V
GS
, GATE TO SOURCE VOLTAGE (V)
Qg, GATE CHARGE (nC)
VDD = 50 V
0.1 1 10 100
10
100
1000
f = 1 MHz V
GS
= 0 V
CAPACITANCE (pF)
VDS, DRAIN TO SOURCE VOLTAGE (V)
C
rss
C
oss
C
iss
0.001 0.01 0.1 1 10
1
10
TJ = 100 oC
30
TJ = 25 oC
TJ = 125 oC
tAV, TIME IN AVALANCHE (ms)
I
AS
, AVALANCHE CURRENT (A)
25 50 75 100 125 150
0
3
6
9
12
V
GS
= 6 V
R
θJC
= 3.5 oC/W
V
GS
= 10 V
I
D
, DRAIN CURRENT (A)
T
C
, CASE TEMPERATURE (
o
C)
0.1 1 10 100 500
0.001
0.01
0.1
1
10
50
1 s
100 μs
10 ms
DC
10 s
100 ms
1 ms
I
D
, DRAIN CURRENT (A)
VDS, DRAIN to SOURCE VOLTAGE (V)
THIS A REA IS LIMITED BY r
DS(on)
SINGLE PULSE T
J
= MAX RATED
R
θJA
= 125
o
C/W
T
A
= 25
o
C
10-410-310-210
-1
110
100 1000
0.5
1
10
100
1000
SINGLE PULSE R
θJA
= 125
o
C/W
T
A
= 25
o
C
VGS = 10 V
P(
PK
), PEAK TRANSIENT POWER (W)
t, PULSE WIDTH (sec)
Typical Characteristics T
Figure 7.
Gate Charge Characteristics Figure 8.
= 25 °C unless otherwise noted
J
®
MOSFET
Capacitance vs Drain
to Source Voltage
Figure 9.
Unc l a m p e d I ndu c t i v e
Switching Capability
©2012 Fairchild Semiconductor Corporation FDMC3612 Rev.C2
Figure 11. Forward Bias Safe
Op
erating Area
Figure 10.
Ma xim um Continuous Drain
Current vs Case Temperature
Figure 12.
Si ngle P ulse Maxi mum
Power Dissipation
4
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Page 5
FDMC3612 N-Channel PowerTrench
10
-4
10
-3
10
-2
10
-1
110
100 1000
0.001
0.01
0.1
1
D = 0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE R
θJA
= 125 oC/W
DUTY CYCLE-DESCENDING ORDER
NORMALIZED THERMAL
IMPEDANCE,
Z
θJA
t, RECTANGULAR PU L SE DURATION (sec)
P
DM
t
1
t
2
NOTES: DUTY FACTOR: D = t1/t
2
PEAK TJ = PDM x Z
θJA
x R
θJA
+ T
A
Typical Characteristics T
Figure 13. Junction-to-Ambient Transient Thermal Response Curve
= 25 °C unless otherwise noted
J
®
MOSFET
©2012 Fairchild Semiconductor Corporation FDMC3612 Rev.C2
5
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Page 6
Dimensional Outline and Pad Layout
FDMC3612 N-Channel PowerTrench
®
MOSFET
©2012 Fairchild Semiconductor Corporation FDMC3612 Rev.C2
6
www.fairchildsemi.com
Page 7
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DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
FDMC3612 N-Channel PowerTrench
®
MOSFET
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICE S OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used here in:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.
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Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experie ncing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experie nce many problems such as loss o f bran d re putat ion, subst and ard performance, fa iled application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairch ild strongly en courage s customers to purchase Fair child parts eit her directly f rom Fa irchild or from Au thorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and e ncourage our cust omers to do their part in stopping this practice by buyin g direct or from authorize d distributors.
PRODUCT STATUS DEFINITIONS Definition of Terms
.
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Datasheet Identification Product Status Definition
Advance Information Formative / In Design
Preliminary First Production
No Identification Needed Full Production
Obsolete Not In Production
©2012 Fairchild Semiconductor Corporation FDMC3612 Rev.C2
Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
7
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Rev. I61
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