Datasheet FDMA420NZ Datasheet (Fairchild)

Page 1
August 2009
FDMA420NZ Single N-Channel 2.5V Specified PowerTrench
FDMA420NZ
Single N-Channel 2.5V Specified PowerTrench® MOSFET
20V, 5.7A, 30m:
General Description
This Single N-Channel MOSFET has been designed using Fairchild Semiconductor’s advanced Power Trench process to optimize the R MicroFET leadframe.
(on) @VGS=2.5V on special
DS
Applications
Li-lon Battery Pack
Pin 1
Drain
D
G
D
Source
Features
R
R
Low Profile-0.8mm maximum-in the new package
Free from halogenated compounds and antimony oxides
RoHS Compliant
= 30m: @ V
DS(on)
= 40m:@ V
DS(on)
MicroFET 2x2 mm
HBM ESD protection level > 2.5k V typical (Note 3)
S
D
= 4.5 V, ID = 5.7A
GS
= 2.5 V, ID = 5.0A
GS
tm
G
®
D
MOSFET
D
D
S
D
Bottom Drain Contact
MicroFET Bottom View 2X2
Absolute Maximum Ratings T
Symbol Parameter Ratings Units
V
DSS
V
GSS
I
D
P
D
, T
T
J
STG
Drain-Source Voltage 20 V
Gate-Source Voltage r12 V
Drain Current -Continuous (Note 1a)
-Pulsed
Power dissipation (Steady State) (Note 1a) (Note 1b)
Operating and Storage Junction Temperature Range -55 to +150
= 25°C unless otherwise noted
A
5.7
24
2.4
0.9
Thermal Characteristics
R
TJA
R
TJA
Thermal Resistance, Junction-to-Ambient (Note 1a) 52
Thermal Resistance, Junction-to-Ambient (Note 1b) 145
o
Package Marking and Ordering Information
Device Marking Device Reel Size Tape Width Quantity
420 FDMA420NZ 7” 12mm 3000 units
©2009 Fairchild Semiconductor Corporation FDMA420NZ Rev B4
www.fairchildsemi.com
D
A
W
o
C
C/W
Page 2
FDMA420NZ Single N-Channel 2.5V specified PowerTrench
Electrical Characteristics T
= 25°C unless otherwise noted
J
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
B
VDSS
'B
VDSS
'T
J
I
DSS
I
GSS
On Characteristics
V
GS(th)
'V
GS(th)
'T
J
R
DS(ON)
g
FS
Drain-Source Breakdown Voltage VGS = 0V , ID = 250PA 20 V
Breakdown Voltage Temperature Coefficient
ID = 250PA, Referenced to 25°C
12 mV/°C
Zero Gate Voltage Drain Current VDS = 16V, VGS = 0V, 1 PA
Gate-Body Leakage VGS = r12V, VDS = 0V r10 PA
(Note 2)
Gate Threshold Voltage VDS = VGS, ID = 250PA 0.6 0.83 1.5 V
Gate Threshold Voltage Temperature Coefficient
Static Drain-Source On-Resistance
Forward Transconductance VDS = 5V, ID = 5.7A 28.3 S
ID = 250PA, Referenced to 25°C
V
= 4.5V, ID = 5.7A 16.8 30
GS
= 4.0V, ID = 5.7A 17.3 31
V
GS
= 3.1V, ID = 5.0A 18.9 33
V
GS
= 2.5V, ID = 5.0A 21.2 40
V
GS
= 4.5V, ID = 5 .7A ,
V
GS
=150°C
T
J
-3.1 mV/°C
24.8 44
Dynamic Characteristics
C
iss
C
oss
C
rss
R
G
Input Capacitance
Output Capacitance 163 220 pF
Reverse Transfer Capacitance 125 190 pF
V
= 10V, VGS = 0V,
DS
f = 1.0MHz
701 935 pF
Gate Resistance f = 1.0MHz 1.92 :
Switching Characteristics (Note 2)
t
d(on)
t
r
t
d(off)
t
f
Q
Q
Q
g
gs
gd
Turn-On Delay Time
Turn-On Rise Time 8.6 18 ns
Turn-Off Delay Time 21.5 43 ns
= 10V, ID = 1A
V
DD
= 4.5V, R
V
GS
GEN
= 6:
9.8 20 ns
Turn-Off Fall Time 8.6 18 ns
Total Gate Charge
Gate-Source Charge 0.9 2 nC
Gate-Drain Charge 2.4 4 nC
= 10V, ID = 5.7A,
V
DS
= 4.5V
V
GS
8.8 12 nC
m:
®
MOSFET
Drain-Source Diode Characteristics and Maximum Ratings
I
S
V
SD
t
rr
Q
rr
Notes:
1. R
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the
TJA
drain pins.
2. Pulse Test: Pulse Width < 300 Ps, Duty Cycle < 2.0%.
3. The diode connected between the gate and the source serves only as proection against ESD. No gate overvoltage rating is implied.
FDMA420NZ Rev B4
Maximum Continuous Drain-Source Diode Forward Current 2.0 A
Drain-Source Diode Forward Voltage VGS = 0V, IS = 2.0A 0.69 1.2 V
Diode Reverse Recovery Time
Diode Reverse Recovery Charge 5 nC
a. 52 °C/W when mounted
on a 1 in
= 5.7A,
I
F
di/dt = 100A/Ps
2
pad of 2 oz copper.
b. 145 °C/W when mounted on a minimum pad of 2 oz copper.
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20 ns
Page 3
FDMA420NZ Single N-Channel 2.5V specified PowerTrench
Typical Characteristics T
50
45
40
35
30
25
20
15
, DRAIN CURRENT (A)
10
D
I
5
0
01234
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1.
1.6
ID = 5.7A V
1.4
1.2
GS
= 4.5V
PULSE DURATION = 300Ps DUTY CYCLE = 2.0%MAX
VGS = 4.5V
VGS = 3.5V
V
= 3.0V
GS
VGS = 1.5V
On Region Characteristics Figure 2.
= 25°C unless otherwise noted
J
VGS = 2.5V
VGS = 2.0V
NORMALIZED
2.1
PULSE DURATION = 300PS DUTY CYCLE = 2.0%MAX
1.8
1.5
VGS = 2.0V
VGS = 2.5V
VGS = 3.5V
1.2
0.9
DRAIN TO SOURCE ON-RESISTANCE
10 20 30 40 50
ID, DRAIN CURRENT(A)
On-Resistance vs Drain Current and
Gate Voltage
60
50
(m:)
40
PULSE DURATION = 300PS DUTY CYCLE = 2.0%MAX
ID = 2.8A
VGS = 3.0V
VGS = 4.5V
1.0
NORMALIZED
0.8
0.6
DRAIN TO SOURCE ON-RESISTANCE
-80 -40 0 40 80 120 160
Figure 3.
30
25
20
15
10
, DRAIN CURRENT (A)
D
I
5
0
0.5 1.0 1.5 2.0 2.5
TJ, JUNCTION TEMPERATURE (oC)
Normalized On Resistance vs Junction
Temperature
PULSE DURATION = 300Ps DUTY CYCLE = 2.0%MAX
VDS = 5V
o
TJ = 125
C
o
TJ = 25
C
o
TJ = -55
C
VGS, GATE TO SOURCE VOLTAGE (V)
30
, DRAIN TO SOURCE
20
ON-RESISTANCE
DS(ON)
R
10
12345
Figure 4.
TJ = 25oC
, GATE TO SOURCE VOLTAGE (V)
V
GS
On-Resistance vs Gate to Source
TJ = 125oC
Votlage
100
VGS = 0V
10
1
0.1
0.01
1E-3
, REVERSE DRAIN CURRENT (A)
S
I
1E-4
0.2 0.4 0.6 0.8 1.0 1.2 1.4
VSD, BODY DIODE FORWARD VOLTAGE (V)
TJ = 125
TJ = 25
TJ = -55
o
C
o
C
o
C
®
MOSFET
Figure 5.
FDMA420NZ Rev B4
Transfer Characteristics Figure 6.
Source to Drain Diode Forward Voltage
vs Source Current
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Page 4
Typical Characteristics T
= 25°C unless otherwise noted
J
FDMA420NZ Single N-Channel 2.5V specified PowerTrench
5
4
3
VDS = 15V
VDS = 20V
VDS = 25V
2
1
, GATE TO SOURCE VOLTAGE(V)
GS
0
V
024681012
Qg, GATE CHARGE(nC)
Figure 7. Gate Charge Characteri
stics Figure 8. Capacitance vs
100
10us
10
1
OPERATION IN THIS AREA MAY BE
, DRAIN CURRENT (A)
LIMITED BY R
0.1
D
I
0.01
0.1 1 10
DS(ON)
SINGLE PULSE
=MAX RATED
T
J
o
TA=25
C
100us
1ms
10ms
100ms
1s 10s
DC
VDS, DRAIN TO SOURCE VOLTAGE (V)
2000
1000
f = 1MHz V
= 0V
CAPACITANCE (pF)
100
50
0.1 1 10
GS
C
iss
C
oss
C
rss
30
VDS, DRAIN TO SOURCE VOLTAGE (V)
Drain to Source Voltage
6
5
4
3
2
, DRAIN CURRENT (A)
D
I
1
0
50
25 50 75 100 125 150
TA, AMBIENT TEMPERATURE(oC)
VGS = 4.5V
VGS = 2.5V
®
MOSFET
Figure 9. Forward Bias
200
100
10
, PEAK TRANSIENT POWER (W)
1
(PK)
P
0.5
-4
10
FDMA420NZ Rev B4
-3
10
Safe Operating Area Figure 10. Maximum Continuous Drain Current vs
Ambient Temperature
VGS = 10V
SINGLE PULSE
10
Figure 11.
-2
t, PULSE WIDTH (s)
-1
10
0
10
Single Pulse Maximum Power Dissipation
TA = 25oC
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
II25=
1
10
10
150 TA–
---------------------
125
2
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3
10
Page 5
Typical Characteristics T
2
DUTY CYCLE-DESCENDING ORDER
1
D = 0.5
0.2
TJA
0.1
Impedance, Z
Normalized Thermal
0.01
0.1
0.05
0.02
0.01
SINGLE PULSE
-4
10
-3
10
Figure 12.
= 25°C unless otherwise noted
J
-2
10
-1
10
10
t, RECTANGULAR PULSE DURATION(s)
Transient Thermal Response Curve
FDMA420NZ Single N-Channel 2.5V specified PowerTrench
P
DM
t
1
t
NOTES: DUTY FACTOR: D = t1/t PEAK TJ = PDM x Z R
= 145oC
TJA
0
1
10
2
2
x R
+ T
TJA
TJA
A
2
10
3
10
®
MOSFET
FDMA420NZ Rev B4
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Page 6
Dimensional Outline and Pad Layout
FDMA420NZ Single N-Channel 2.5V specified PowerTrench
®
MOSFET
FDMA420NZ Rev B4
www.fairchildsemi.com6
Page 7
TRADEMARKS
®
t
m
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks.
AccuPower™ Auto-SPM™ Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK EfficentMax™ EZSWITCH™*
™*
Fairchild Fairchild Semiconductor FACT Quiet Series™ FACT FAST FastvCore™ FETBench™ FlashWriter
®
tm
®
® ®
®
*
®
FPS™ F-PFS™ FRFET Global Power Resource Green FPS™ Green FPS™ e-Series™ Gmax™ GTO™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ MotionMax™ Motion-SPM™ OPTOLOGIC OPTOPLANAR
®
m
PDP SPM™ Power-SPM™
PowerTrench
®
®
SM
®
PowerXS™ Programmable Active Droop™ QFET QS™ Quiet Series™ RapidConfigure™
Saving our world, 1mW /W /kW at a time™ SmartMax™ SMART START™ SPM STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS™ SyncFET™ Sync-Lock™
®
®
™
®
®*
The Power Franchise
TinyBoost™ TinyBuck™ TinyCalc™ TinyLogic TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ TriFault Detect™ TRUECURRENT™*
UHC Ultra FRFET™ UniFET™ VCX™ VisualMax™ XS™
®
t
®
®
®
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
FDMA420NZ Single N-Channel 2.5V specified PowerTrench
®
MOSFET
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
expected to result in a significant injury of the user.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
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PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative / In Design
Preliminary First Production
No Identification Needed Full Production
Obsolete Not In Production
FDMA420NZ Rev B4
Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
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Rev. I41
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