Gate to Source Leakage CurrentVGS = ±20V - - ±100nA
Gate to Source Threshold VoltageVGS = VDS, ID = 250µA11.83V
Drain to Source On Resistance
= 25°C unless otherwise noted
J
V
= 32V, --1
DS
= 0V TJ = 150oC -- 250
V
GS
I
= 50A, VGS= 10V -3.55.2
D
= 50A, VGS= 5V -3.86.0
I
D
= 50A, VGS= 4.5V-4.06.5
I
D
= 50A, VGS= 5V,
I
D
T
= 175oC
J
-6.810.7
C/W
C/W
µA
mΩ
®
MOSFET
Dynamic Characteristics
C
iss
C
oss
C
rss
R
G
Q
g(TOT)
Q
g(TH)
Q
gs
Q
gs2
Q
gd
Input Capacitance
Output Capacitance -605 -pF
Reverse Transfer Capacitance -400 -pF
= 25V, VGS = 0V,
V
DS
f = 1MHz
Gate Resistancef = 1MHz-1.7 -Ω
Total Gate Charge at 5VVGS = 0 to 5V
Threshold Gate ChargeVGS = 0 to 2V -5.47nC
Gate to Source Gate Charge
Gate Charge Threshold to Plateau -10.9 -nC
Gate to Drain “Miller“ Charge -21 -nC
FDD8444L_F085 Rev A (W)www.fairchildsemi.com2
V
DD
I
= 50A
D
I
= 1.0mA
g
-5530 -pF
-4660nC
= 20V
-16.3-nC
Page 3
FDD8444L_F085 N-Channel PowerTrench
Electrical Characteristics T
= 25oC unless otherwise noted
J
SymbolParameterTest ConditionsMinTypMaxUnits
Switching Characteristics
t
on
t
d(on)
t
r
t
d(off)
t
f
t
off
Turn-On Time
Turn-On Delay Time-18.7-ns
Turn-On Rise Time-46-ns
Turn-Off D elay Time-42-ns
Turn-Off Fall Time-19.2-ns
Turn-Off Ti me--96ns
Drain-Source Diode Characteristics
V
SD
t
rr
Q
rr
Notes:
1: Package current limitation is 50A.
2: Starting TJ = 25oC, L = 0.37mH, IAS = 40A.
Source to Drain Diode Voltage
Reverse Recovery Time
Reverse Recovery Charge-2938nC
= 20V, ID = 50A
V
DD
V
= 5V, RGS = 2Ω
GS
I
= 50A-0.91.25
SD
= 25A-0.81.0
I
SD
= 50A, dIF/dt = 100A/µs
I
F
--104ns
-3444ns
V
®
MOSFET
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy of the
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
FDD8444L_F085 Rev A (W)www.fairchildsemi.com3
requirements, see AEC Q101 at: http://www.aecouncil.com/
Page 4
Typical Characteristics
FDD8444L_F085 N-Channel PowerTrench
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0.0
0255075100125150175
TC, CASE TEMPERATURE(oC)
Figure 1. Normalized Power Dissipation vs Case
Temperature
2
DUTY CYCLE - DESCENDING ORDER
1
D = 0.50
0.20
JC
θ
0.10
0.05
0.02
0.01
0.1
IMPEDANCE, Z
NORMALIZED THERMAL
SINGLE PULSE
0.01
-5
10
Figure 3.
-4
10
-3
10
t, RECTANGULAR PULSE DURATION(s)
Normalized Maximum Transient Thermal Impedance
140
120
VGS = 10V
CURRENT LIMITED
BY PACKAGE
100
80
VGS = 5V
60
40
, DRAIN CURRENT (A)
D
I
20
0
255075100125150175
TC, CASE TEMPERATURE(oC)
Figure 2.
Maximum Continuous Drain Current vs
Case Temperature
P
DM
NOTES:
DUTY FACTOR: D = t1/t
PEAK TJ = PDM x Z
-2
10
x R
θJC
-1
10
®
MOSFET
t
1
t
2
2
+ T
θJC
C
0
10
4000
VGS = 10V
1000
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
100
, PEAK CURRENT (A)
DM
I
SINGLE PULSE
10
-5
10
-4
10
-3
10
t, RECTANGULAR PULSE DURATION(s)
Figure 4. Peak Current Capability
FDD8444L_F085 Rev A (W)www.fairchildsemi.com4
TC = 25oC
FOR TEMPERATURES
o
ABOVE 25
CURRENT AS FOLLOWS:
-2
10
I = I
25
10
C DERATE PEAK
175 - T
150
-1
C
0
10
Page 5
Typical Characteristics
FDD8444L_F085 N-Channel PowerTrench
1000
100
10
LIMITED
, DRAIN CURRENT (A)
D
I
0.1
BY PACKAGE
1
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
DS(on)
SINGLE PULSE
T
= MAX RATED
J
o
T
= 25
C
C
110100
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 5.
100
80
60
40
, DRAIN CURRENT (A)
20
D
I
Forward Bias Safe Operating Area
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
= 5V
V
DD
TJ = 175oC
TJ = 25oC
TJ = -55oC
10us
100us
1ms
10ms
DC
500
If R = 0
tAV = (L)(IAS)/(1.3*RATED BV
If R
≠ 0
= (L/R)ln[(IAS*R)/(1.3*RATED BV
t
AV
100
- VDD)
DSS
- VDD) +1]
DSS
STARTING TJ = 25oC
10
STARTING TJ = 150oC
, AVALANCHE CURRENT (A)
AS
I
1
0.010.11101001000
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
tAV, TIME IN AVALANCHE (ms)
Figure 6. Unclamped Inductive Switching
Capability
200
V
GS
VGS = 5V
150
100
50
, DRAIN CURRENT (A)
D
I
PULSE DURATION = 80µs
= 10V
DUTY CYCLE = 0.5% MAX
V
= 4V
GS
VGS = 3.5V
VGS = 3V
®
MOSFET
0
0.51.01.52.02.53.03.5
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 7.
30
25
20
(mΩ)
Transfer CharacteristicsFigure 8.
I
PULSE DURATION = 80µs
= 50A
D
DUTY CYCLE = 0.5% MAX
15
10
, DRAIN TO SOURCE
5
ON-RESISTANCE
DS(on)
r
0
345678910
V
, GATE TO SOURCE VOLTAGE (V)
GS
Figure 9.
Drain to Source On-Resistance
TJ = 175oC
TJ = 25oC
Variation vs Gate to Source Voltage
FDD8444L_F085 Rev A (W)www.fairchildsemi.com5
0
012345
VDS, DRAIN TO SOURCE VOLTAGE (V)
Saturation Characteristics
1.8
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
1.6
1.4
1.2
1.0
NORMALIZED
0.8
0.6
DRAIN TO SOURCE ON-RESISTANCE
-80-4004080120160200
Figure 10.
TJ, JUNCTION TEMPERATURE(oC)
Normalized Drain to Source On
ID = 50A
V
GS
Resistance vs Junction Temperature
= 10V
Page 6
Typical Characteristics
FDD8444L_F085 N-Channel PowerTrench
1.4
1.2
1.0
0.8
0.6
NORMALIZED GATE
THRESHOLD VOLTAGE
0.4
0.2
-80-4004080120160200
Figure 11.
10000
1000
CAPACITANCE (pF)
100
0.1110
V
= V
GS
DS
I
= 250µA
D
TJ, JUNCTION TEMPERATURE(oC)
Normalized Gate Threshold Voltage vs
Junction Temperature
C
iss
C
oss
C
rss
f = 1MHz
= 0V
V
GS
VDS, DRAIN TO SOURCE VOLTAGE (V)
1.10
ID = 250uA
1.05
1.00
0.95
BREAKDOWN VOLTAGE
NORMALIZED DRAIN TO SOURCE
0.90
-80-4004080120160200
TJ, JUNCTION TEMPERATURE (oC)
Figure 12. Normalized Drain to Source
Breakdown Voltage vs Junction Temperature
®
10
ID = 50A
8
VDD = 15V
VDD = 20V
6
VDD = 25V
4
2
, GATE TO SOURCE VOLTAGE(V)
GS
0
V
60
0 20406080100
Q
, GATE CHARGE(nC)
g
MOSFET
Figure 13.
Capacitance vs Drain to Source
Voltage
FDD8444L_F085 Rev A (W)www.fairchildsemi.com6
Figure 14.
Gate Charge vs Gate to Source Voltage
Page 7
TRADEMARKS
tm
®
tm
tm
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
®
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK
EfficentMax™
EZSWITCH™ *
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Farichild’s Anti-Counterfeiting Policy is also stated on our external website,
www.fairchildsemi.com, under Sales Support
.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Farichild strongly encourages customers to purchase Farichild parts either directly from Fairchild or from Authorized Fairchild
Distributors who are listed by country on our web page cited above. Products customers buy either from fairchild directly or from Authorized Fairchild
Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Farichild’s full range of
up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and
warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Farichild is
committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet IdentificationProduct StatusDefinition
Advance InformationFormative / In Design
PreliminaryFirst Production
No Identification NeededFull Production
ObsoleteNot In Production
FDD8444L_F085 Rev A (W)
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
7
www.fairchildsemi.com
Rev. I37
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