Datasheet FDD5670 Datasheet (Fairchild Semiconductor)

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Page 1

FDD5670

60V N-Channel PowerTrenchTM MOSFET

FDD5670

March 1999

ADV ANCE INFORMATION

General Description

This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers.

These MOSFETs feature faster switching and lower gate charge than other MOSFETs with comparable R

specifications.

DS(ON)

Features

• 48 A, 60 V. R

DS(ON)

= 0.015 Ω @ V

= 0.018 Ω @ V

= 10 V

= 6 V.

• Low gate charge.

• Fast switching speed.

• High performance trench technology for extremely

low R

DS(ON

)

The result is a MOSFET that is easy and safer to drive (even at very high frequencies), and DC/DC power supply designs with higher overall efficiency.

TO-252

Absolute Maximum Ratings

Symbol Parameter Ratings Units

DSS

GSS

TJ, T

stg

Drain-Source Voltage 60 V Gat e-Source Voltage Maximum Drain Current -Continuous

Maximum Drain Current -Pulsed 100 Maximum Power Dissipation @ TC = 25oC

TA = 25oC Operatin g and Storage Junction Temperature Range -55 to +150

=25oC unless otherwise noted

TA = 25oC

(Note 1a) (Note 1b)

(Note 1) (Note 1a)

(Note 1)

±20

48 10

2.8

1.3

V A

°C

Thermal Characteristics

Thermal Resistance, Junction-to- Case Thermal Resistance, Junction-to- Ambient

(Note 1)

(Note 1b)

1.8 96

Package Marking and Ordering Information

Device Marking Device Reel Size Tape widt h Quantity

FDD5670 FDD5670 13’’ 16mm 2500

1999 Fairchild Semiconductor Corporation

°C/W °C/W

FDD5670 Rev. A

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FDD5670

Electrical Characteristics

TC=25oC unless otherwise noted

Symbol Parameter Test Conditions Min Typ Max Units

OFF CHARACTERISTICS

DSS

GSSF

GSSR

ON CHARACTERISTICS

GS(TH)

DS(ON)

Drain-Source Breakdown Vol t age

= 0 V, ID = 250 µA

60 V Zero Gate Voltage Drain Current VDS = 48 V, VGS = 0 V 1 Gate-Body Leakage, Forward VGS = 20 V, VDS = 0 V 100 nA Gate-Body Leakage, Reverse VGS = -20 V, VDS = 0 V -100 nA

(Note 2)

Gate Thre shold Voltage Static Drain-Source

On-Resistance

= VGS, ID = 250 µA

VGS = 10 V, ID = 10 A V

= 6 V, ID = 9 A

24V

0.015

0.018

DRAIN-SO URCE DIODE CHARACTERISTICS AND MA XIM UM RA TINGS

Notes:

1. R

θJC

θJA

Maximum Continuous Drain-Source Diode Forward Current 48 A Drain-Source Diode Forward

VGS = 0 V, IS = 2.4 A 1.2 V

Voltage

is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the drain tab.

is guaranteed by design while R

is determined by the user's board design.

θCA

a) R

= 45oC/W when mounted on

θJA

a 1 in2 pad of 2oz copper.

b) R

= 96oC/W when mounted on

θJA

a 0.076 in2 pad of 2oz copper.

Ω

Scale 1 : 1 on letter size paper

2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%

FDD5670 Rev. A

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D-PAK (TO-252) Packaging Configuration: Figure 1.0

ELECTROSTATIC

SENSITIVE DEVICES

DO NOT SHIP OR STORE NEAR STRONG ELECTROSTATIC ELECTROMAGNETIC, MAGNETIC OR RADIOACTIVE FIELDS

TNR DATE PT NUMBER PEEL STRENGTH MIN ______________gms

MAX _____________ gms

ESD Label

F63TNR Label

Antis tatic Cover Tape

Static Dissipative

Embossed Carrier Tape

Packaging Description:

TO-252 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 2500 units per 13” or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). This and some other options are further described in the Packaging Information table.

These full reels are individually barcode labeled and placed inside a standard intermediate box (illustrated in figure 1.0) made of recyclable corrugated brown paper. One box contains two reels maximum. And these boxes are placed inside a barcode labeled shipping box which comes in di ff e rent siz es depe nd in g on th e num ber of pa rts shippe d.

D-PAK (TO-252) Packaging Information

Packaging Option Packaging type

Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight pe r Reel(k g)

Note/Comments

Standard

(no flow code)

TNR

2,500

13” Dia

359x359x57

5,000

0.300

1.200

F63TNR Label sample

LOT: CBVK741B019

CBVK741B019

FSID: FDD6680

FDD6680

D/C1: Z9942 QTY1: SPEC REV: D/C2: QTY2: CPN:

QTY: 2500

3000

SPEC:

N/F: F (F63TNR)3

TO-252 (D-PAK) Tape Leader and Trailer Configuration: Figure 2.0

6680 FDD

Z9935

D-PAK (TO-252) Unit Orientation

359mm x 359mm x 57mm

Stand ard Inter m ed ia te box

6680 FDD

Z9935

ESD Label

F63TNR Label

6680 FDD

Z9935

6680 FDD

Z9935

Carrier Tape

Cover Tape

Trailer Tap e 640mm minimum or 80 empty pockets

Components

Leader Tape 1680mm minimum or 210 empty pockets

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D-PAK (TO-252) Embossed Carrier Tape Co nfigura tion: Figure 3.0

User Direction of Feed

Dimensions are in millimeter

Pkg ty pe

TO252

(24mm)

A0 B0 W D0 D1 E 1 E 2 F P1 P0 K0 T Wc Tc

6.90

10.50

16.0

1.55

1.5

1.75

14.25

+/-0.10

+/-0.3

+/-0.05

+/-0.10

min

7.50 +/-0.10

Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481

rotational and lateral movement requirements (see sketches A, B, and C).

10 deg maximum

10 deg maximum component rotation

Sketch A (Side or Front Sectional View)

Component Rotation

D-PAK (TO-252) Reel

Sketch B (Top View)

Component Rotation

Configuration: Figure 4.0

W1 Measured at Hub

Dim A

max

Dim N

8.0 +/-0.1

Typical component cavity center line

Typical component center line

Dim A

Max

Dim D

min

4.0 +/-0.1

2.65

0.30

+/-0.10

+/-0.05

0.9mm maximum

Sketch C (Top View)

Component lateral movement

13.0 +/-0.3

0.9mm maximum

B Min

Dim C

0.06 +/-0.02

Tape Size

164mm 13” Dia

Reel

Option

DETAIL AA

13” Diameter Option

See detail AA

W2 max Measured at Hub

Dimensions are in inches and millimeters

Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL)

13.00 330

0.059

1.5

512 +0.020/- 0.008 13 +0.5/-0.2

0.795

20.2

4.00 100

0.646 +0.078/-0.000

16.4 +2/0

0.882

22.4

0.626 – 0.764

15.9 – 19.4

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TRADEMARKS

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.

ACEx™ CoolFET™ CROSSVOLT™

CMOS

FACT™ FACT Quiet Series™

FAST FASTr™ GTO™ HiSeC™

ISOPLANAR™ MICROWIRE™ POP™ PowerTrench



QFET™ QS™

Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8

SyncFET™ TinyLogic™ UHC™ VCX™

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF FAIRCHILD SEMICONDUCTOR CORPORA TION. As used herein:

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or

effectiveness.

PRODUCT STA TUS DEFINITIONS Definition of Terms

Datasheet Identification Product Status Definition

Advance Information

Preliminary

No Identification Needed

Obsolete

Formative or In Design

First Production

Full Production

Not In Production

This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.

This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.

This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.

This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.

Rev. D