Datasheet FDA70N20 Datasheet (Fairchild)

Page 1
FDA70N20
200V N-Channel MOSFET
FDA70N20 200V N-Channel MOSFET
TM
UniFET
Features
• Low gate charge ( typical 66 nC)
•Low C
•Fast switching
• 100% avalanche tested
• Improved dv/dt capability
( typical 89 pF)
rss
= 0.035Ω @VGS = 10 V
DS(on)
GSD
TO-3PN
FDA Series
Description
These N-Channel enhancement mode power field effect transis­tors are produced using Fairchild’s proprietary, planar stripe, DMOS technology.
This advanced technology has been especially tailored to mini­mize on-state resistance, provide superior switching perfor­mance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high effi­cient switched mode power supplies and active power factor correction.
D
{
{
z
z
z
{
{
G
z z
z
{
{
S
Absolute Maximum Ratings
Symbol Parameter FDA70N20 Unit
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt
P
D
T
J, TSTG
T
L
Drain-Source Voltage 200 V
Drain Current - Continuous (TC = 25°C)
- Continuous (T
Drain Current - Pulsed
Gate-Source voltage ±30 V
Single Pulsed Avalanche Energy
Avalanche Current (Note 1) 70 A
Repetitive Avalanche Energy (Note 1) 41.7 mJ
Power Dissipation (TC = 25°C)
- Derate above 25°C
Operating and Storage Temperature Range -55 to +150 °C
Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds
= 100°C)
C
(Note 1)
(Note 2)
(Note 3) 4.5 V/ns
70 45
280 A
1742 mJ
417
3.3
300 °C
A A
W
W/°C
Thermal Characteristics
Symbol Parameter Min. Max. Unit
R
θJC
R
θCS
R
θJA
©2005 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com
FDA70N20 Rev. A
Thermal Resistance, Junction-to-Case -- 0.3 °C/W
Thermal Resistance, Case-to-Sink 0.24 -- °C/W
Thermal Resistance, Junction-to-Ambient -- 40 °C/W
Page 2
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDA70N20 FDA70N20 TO-3PN - - 30
FDA70N20 200V N-Channel MOSFET
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter Conditions Min. Typ. Max Units
Off Characteristics
BV
DSS
∆BV / ∆T
I
DSS
I
GSSF
I
GSSR
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Dynamic Characteristics
C
iss
C
oss
C
rss
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Drain-Source Breakdown Voltage VGS = 0V, ID = 250µA 200 -- -- V
Breakdown Voltage Temperature
DSS
Coefficient
J
Zero Gate Voltage Drain Current VDS = 200V, VGS = 0V
I
= 250µA, Referenced to 25°C--0.2--V/°C
D
= 160V, TC = 125°C
V
DS
--
--
--
--
1
10
µA µA
Gate-Body Leakage Current, Forward VGS = 30V, VDS = 0V -- -- 100 nA
Gate-Body Leakage Current, Reverse VGS = -30V, VDS = 0V -- -- -100 nA
Gate Threshold Voltage VDS = VGS, ID = 250µA3.0--5.0V
Static Drain-Source On-Resistance
Forward Transconductance VDS = 40V, ID = 35A
Input Capacitance VDS = 25V, VGS = 0V,
Output Capacitance -- 750 980 pF
= 10V, ID = 35A -- 0.029 0.035 Ω
V
GS
(Note 4)
-- 47 -- S
-- 3050 3970 pF
f = 1.0MHz
Reverse Transfer Capacitance -- 89 130 pF
Turn-O n Delay Time VDD = 100V, ID = 70A
= 25Ω
R
Turn-On Rise Time -- 235 480 ns
G
-- 71 150 ns
Turn-Off Delay Time -- 65 140 ns
Turn-Off Fall Time -- 39 88 ns
Total Gate Charge VDS = 160V, ID = 70A
V
= 10V
Gate-Source Charge -- 19 -- nC
GS
Gate-Drain Charge -- 26 -- nC
(Note 4, 5)
-- 66 86 nC
(Note 4, 5)
Maximum Continuous Drain-Source Diode Forward Current -- -- 70 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 280 A
Drain-Source Diode Forward Voltage VGS = 0V, IS = 70A -- -- 1.4 V
Reverse Recovery Time VGS = 0V, IS = 70A
/dt =100A/µs (Note 4)
dI
Reverse Recovery Charge -- 4.1 -- µC
F
-- 175 -- ns
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 0.533mH, IAS = 70A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3. ISD ≤ 70A, di/dt ≤ 200A/µs, VDD ≤ BV
4. Pulse Test: Pulse width ≤ 300µs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
, Starting TJ = 25°C
DSS
FDA70N20 Rev. A
2 www.fairchildsemi.com
Page 3
Typical Performance Characteristics
FDA70N20 200V N-Channel MOSFET
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics
, Drain Current [A] I
2
10
1
10
D
0
10
10
V Top : 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V Bottom : 6.0 V
-1
GS
0
10
VDS, Drain-Source Voltage [V]
2
10
150oC
Notes :※
1. 250µ s Pulse Test
2. T
= 25℃
C
1
10
1
10
, Drain Current [A]
D
I
0
10
24681012
25oC
VGS, Gate-Source Voltage [V]
-55oC
Notes :※
1. VDS = 40V
2. 250µ s Pulse Test
Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage
Drain Current and Gate Voltage Variation vs. Source Current
and Temperatue
0.06
0.05
VGS = 10V
0.04
VGS = 20V
[Ω ],Drain-Source On-Resistance
0.03
DS(ON)
R
0 25 50 75 100 125 150 175 200
Note : T※J = 25℃
ID, Drain Current [A]
2
10
1
10
, Reverse Drain Current [A]
DR
I
0
10
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1. 6 1.8
150℃
VSD, Source-Drain voltage [V]
25℃
Notes :※
1. VGS = 0V
2. 250µ s Pulse Test
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
8000
6000
4000
Capacitances [pF]
2000
0
-1
10
FDA70N20 Rev. A
C
oss
C
iss
C
rss
0
10
VDS, Drain-Source Voltage [V]
C
= Cgs + Cgd (Cds = shorted)
iss
= Cds + C
C
oss
gd
C
= C
rss
gd
Note ;※
1. VGS = 0 V
2. f = 1 MHz
1
10
12
10
8
6
4
, Gate-Source Voltage [V]
2
GS
V
0
0 10203040506070
VDS = 40V
VDS = 100V
VDS = 160V
Note : I※D = 70A
QG, Total Gate Charge [nC]
3 www.fairchildsemi.com
Page 4
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation
vs. Temperature vs. Temperature
1.2
1.1
3.0
2.5
2.0
FDA70N20 200V N-Channel MOSFET
1.0
, (Normalized)
DSS
BV
0.9
Drain-Source Breakdown Voltage
0.8
-100 -50 0 50 100 150 200
Notes :※
1. VGS = 0 V
2. I
TJ, Junction Temperature [oC]
= 250 µ A
D
1.5
, (Normalized)
1.0
DS(ON)
R
0.5
Drain-Source On-Resistance
0.0
-100 -50 0 50 100 150 200
TJ, Junction Temperature [oC]
? Notes :
1. V
GS
2. I
= 35 A
D
= 10 V
Figure 9. Safe Operating Area Figure 10. Maximum Drain Current vs. Case Temperature
, Drain Current [A]
D
I
3
10
2
10
1
10
Operation in This Area is Limited by R
0
10
-1
10
-2
10
0
10
1 ms
10 ms
100 ms
DC
DS(on)
? Notes :
1. T
C
2. T
J
3. Single Puls e
1
10
VDS, Drain-Source Voltage [V]
100 µs
= 25 oC
= 150 oC
10
80
10 µs
2
70
60
50
40
30
, Drain Current [A]
D
I
20
10
0
25 50 75 100 125 150
TC, Case Temperature [ ]℃
Figure 11. Transient Thermal Response Curve
D=0.5
-1
10
0.2
0.1
(t), Thermal Response
Z
FDA70N20 Rev. A
0.05
0.02
θ JC
-2
10
0.01
-5
10
-4
10
single pulse
t1, Square Wave Pulse Duration [sec]
P
DM
t
1
t
2
No tes :※
1. Z
(t) = 0.3 /W Max.℃
θ JC
2. D uty Fa ctor , D =t1/t
3. TJM - TC = PDM * Z
-3
10
-2
10
-1
10
2
(t)
θ JC
0
10
1
10
4 www.fairchildsemi.com
Page 5
12V
12V
200nF
200nF
3mA
3mA
50KΩ
50KΩ
V
V
Gate Charge Test Circuit & Waveform
V
V
GS
GS
GS
300nF
300nF
Same Type
Same Type
as DUT
as DUT
DUT
DUT
V
V
DS
DS
GS
10V
10V
Resistive Switching Test Circuit & Waveforms
FDA70N20 200V N-Channel MOSFET
Q
Q
g
g
Q
Q
gs
gs
Q
Q
gd
gd
Charge
Charge
10V
10V
10V
10V
R
R
L
DUT
DUT
L
V
V
DD
DD
V
V
DS
DS
V
V
GS
GS
R
R
G
G
V
V
DS
DS
90%
90%
10%
10%
V
V
GS
GS
t
t
t
d(on)tr
d(on)tr
t
t
on
on
t
d(off )
d(off )
t
t
f
f
t
t
off
off
Unclamped Inductive Switching Test Circuit & Waveforms
BV
BV
DSS
L
LL
V
V
DS
DS
BV
BV
DSS
V
V
DSS
I
I
AS
AS
DD
DD
I
IDI
D
D
R
R
G
G
DUT
DUT
t
t
p
p
V
V
DD
DD
1
1
1
1
----
----
----
----
E
E
=LI
E
=LI
=LI
AS
AS
AS
2
2
2
2
2
2
2
AS
AS
AS
I
I
(t)
(t)
D
D
t
t
p
p
DSS
--------------------
-------------------­BV
BV
DSS-VDD
DSS-VDD
Time
Time
V
(t)
V
(t)
DS
DS
FDA70N20 Rev. A
5 www.fairchildsemi.com
Page 6
Peak Diode Recovery dv/dt Test Circuit & Waveforms
+
DUT
DUT
I
I
SD
SD
Driver
Driver
R
R
G
G
V
V
GS
GS
+
V
V
DS
DS
_
_
L
LL
Same Type
Same Type
as DUT
as DUT
• dv/dt controlled by R
• dv/dt controlled by R
•ISDcontrolled by pulse period
•ISDcontrolled by pulse period
G
G
FDA70N20 200V N-Channel MOSFET
V
V
DD
DD
V
V
GS
GS
( Driver )
( Driver )
I
I
SD
SD
( DUT )
( DUT )
V
V
DS
DS
( DUT )
( DUT )
Gate Pulse Width
Gate Pulse Width
Gate Pulse Width
--------------------------
--------------------------
--------------------------
D =
D =
D =
Gate Pulse Period
Gate Pulse Period
Gate Pulse Period
IFM, Body Diode Forward Current
IFM, Body Diode Forward Current
I
I
RM
RM
Body Diode Reverse Current
Body Diode Reverse Current
Body Diode Recovery dv/dt
Body Diode Recovery dv/dt
V
V
SD
SD
Body Diode
Body Diode
Forward Voltage Drop
Forward Voltage Drop
di/dt
di/dt
10V
10V
V
V
DD
DD
FDA70N20 Rev. A
6 www.fairchildsemi.com
Page 7
Mechanical Dimensions
FDA70N20 200V N-Channel MOSFET
TO-3PN
FDA70N20 Rev. A
Dimensions in Millimeters
7 www.fairchildsemi.com
Page 8
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACEx™
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DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FDA70N20 200V N-Channel MOSFET
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design
Preliminary First Production This datasheet contains preliminary data, and
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Obsolete Not In Production This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
8 www.fairchildsemi.com
FDA70N20 Rev. A
Rev. I14
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