
FB2041
7-bit Futurebus+ transceiver
Product specification
IC19 Data Handbook
1995 May 25
INTEGRATED CIRCUITS

Philips Semiconductors Product specification
FB20417-bit Futurebus+ transceiver
2
1995 May 25 853-1561 15279
DESCRIPTION
The FB2041 is a 7-bit bidirectional BTL transceiver and is intended
to provide the electrical interface to a high performance wired-OR
bus. The FB2041 is an inverting transceiver.
The B-port drivers are Low-capacitance open collectors with
controlled ramp and are designed to sink 100mA. Precision band
gap references on the B-port insure very good noise margins by
limiting the switching threshold to a narrow region centered at 1.55V .
FEA TURES
•7-bit BTL transceiver
•Separate I/O on TTL A-port
•Inverting
•Three separate pairs of driver enables in a 1 bit, 3 bit, 3 bit
arrangement
•Drives heavily loaded backplanes with equivalent load
impedances down to 10Ω.
•High drive 100mA BTL open collector drivers on B-port
•Allows incident wave switching in heavily loaded backplane buses
•Reduced BTL voltage swing produces less noise and reduces
power consumption
•Built-in precision band-gap reference provides accurate receiver
thresholds and improved noise immunity
•Compatible with IEEE Futurebus+ or proprietary BTL backplanes
•Controlled output ramp and multiple GND pins minimize ground
bounce
•Each BTL driver has a dedicated Bus GND for a signal return
•Glitch-free power up/power down operation
•Low I
CC
current
•Tight output skew
•Supports live insertion
•Pins for the optional JTAG boundary scan function are provided
•High density packaging in plastic Quad Flatpack
QUICK REFERENCE DA TA
SYMBOL PARAMETER TYPICAL UNIT
t
PLH
Propagation delay 3.7
t
PLH
Propagation delay 3.4
C
OB
Output capacitance (B0 - B6 only) 6 pF
I
OL
Output current (B0 - B6 only) 100 mA
Standby 19
AIn to Bn (outputs Low or High) 40
Bn to AOn (outputs Low) 22
Bn to AOn (outputs High) 19
ORDERING INFORMATION
PACKAGE
COMMERCIAL RANGE
VCC = 5V±10%; T
amb
= 0 to +70°C
INDUSTRIAL RANGE
VCC = 5V±10%; T
amb
= -40 to +85°C
DWG
No.
52-pin Plastic Quad Flatpack FB2041BB CD3207BB SOT379-1

Philips Semiconductors Product specification
FB20417-bit Futurebus+ transceiver
1995 May 25
3
PIN CONFIGURATION
52 51 50 49 48 47 46 45 44 43 42 41 40
39
38
37
36
35
34
33
32
31
30
29
28
27
1
2
3
4
5
6
7
8
9
10
11
12
13
14 15 16 17 18 19 20 21 22 23 24 25 26
BUS GND
B1
BUS GND
B2
BUS GND
B3
BUS GND
B4
BUS GND
B5
BUS GND
B6
BUS GND
LOGIC GND
AI1
AI2
AO2
LOGIC GND
AO3
LOGIC GND
AI3
AI4
AO4
LOGIC GND
AO5
LOGIC GND
AI5
LOGIC GND
AO6
LOGIC GND
TDO (option)
TDI (option)
AI6
OEB3
BUS V
CC
LOGIC V
CC
AO1
AO0
OEA1
TCK (option)
TMS (option)
BUS GND
OEB1
BIAS V
B0
BUS V
CC
LOGIC V
CC
OEB0
7-Bit Transceiver
FB2041
52-lead PQFP
AI0
OEB2
OEA3
OEA2
The B-port interfaces to “Backplane Transceiver Logic” (See the
IEEE 1194.1 BTL standard). BTL features low power consumption
by reducing voltage swing (1Vp-p, between 1V and 2V) and reduced
capacitive loading by placing an internal series diode on the drivers.
BTL also provides incident wave switching, a necessity for high
performance backplanes.
There are three separate pairs of driver enables in a 1 bit, 3 bit, 3 bit
arrangement. The TTL/BTL output drivers for bit 0 are enabled with
OEA1/OEB1
, output drivers for bits 1–2–3 are enabled with
OEA2/OEB2
and output drivers for bits 4–5–6 are enabled with
OEA3/OEB3
.
The A-port operates at TTL levels with separate I/O. The 3-state
A-port drivers are enabled when OEAn goes High after an extra 6ns
delay which is built in to provide a break-before-make function.
When OEAn goes Low, A-port drivers become High impedance
without any extra delay. During power on/of f cycles, the A-port
drivers are held in a High impedance state when V
CC
is below 2.5V .
The B-port has an output enable, OEB0, which affects all seven
drivers. When OEB0 is High and OEBn
is Low the output driver will
be enabled. When OEB0 is Low or if OEBn
is High, the B-port
drivers will be inactive and at the level of the backplane signal.
To support live insertion, OEB0 is held Low during power on/off
cycles to insure glitch free B port drivers. Proper bias for B port
drivers during live insertion is provided by the BIAS V pin when at a
5V level while V
CC
is Low. If live insertion is not a requirement, the
BIAS V pin should be tied to a V
CC
pin.
The LOGIC GND and BUS GND pins are isolated in the package to
minimize noise coupling between the BTL and TTL sides. These
pins should be tied to a common ground external to the package.
Each BTL driver has an associated BUS GND pin that acts as a
signal return path and these BUS GND pins are internally isolated
from each other. In the event of a ground return fault, a “hard” signal
failure occurs instead of a pattern dependent error that may be very
infrequent and impossible to trouble-shoot.
The LOGIC V
CC
and BUS VCC pins are also isolated internally to
minimize noise and may be externally decoupled separately or
simply tied together.
JTAG boundary scan functionality is provided as an option with
signals TMS, TCK, TDI and TDO. When this option is not present,
TMS and TCK are no-connects (no bond wires) and TDI and TDO
are shorted together internally.

Philips Semiconductors Product specification
FB20417-bit Futurebus+ transceiver
1995 May 25
4
PIN DESCRIPTION
SYMBOL PIN NUMBER TYPE NAME AND FUNCTION
AI0 – AI6 51, 2, 3, 8, 9, 14, 18 Input Data inputs (TTL)
AO0 – AO6 50, 52, 4, 6, 10, 12, 16 Output 3-state outputs (TTL)
B0 – B6 40, 38, 36, 34, 32, 30, 28 I/O Data inputs/Open Collector outputs, High current drive (BTL)
OEB0 46 Input Enables the Bn outputs when High
OEB1 45 Input Enables the B0 output when Low
OEB2 25 Input Enables the B1 – B3 outputs when Low
OEB3 26 Input Enables the B4 – B6 outputs when Low
OEA1 47 Input Enables the A0 outputs when High
OEA2 20 Input Enables the A1 – A3 outputs when High
OEA3 24 Input Enables the A4 – A6 outputs when High
BUS GND 41, 39, 37, 35, 33, 31, 29, 27 GND Bus ground (0V)
LOGIC GND 1, 5, 7, 11, 13, 15, 19 GND Logic ground (0V)
BUS V
CC
23, 43 Power Positive supply voltage
LOGIC V
CC
17, 49 Power Positive supply voltage
BIAS V 48 Power Positive supply voltage
TMS 42 Input Test Mode Select (no-connect)
TCK 44 Input Test Clock (no-connect)
TDI 22 Input Test Data In (shorted to TDO)
TDO 21 Output Test Data Out (TDI)
ABSOLUTE MAXIMUM RATINGS
Operation beyond the limits set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free-air temperature range.
SYMBOL
PARAMETER RATING UNIT
V
CC
Supply voltage -0.5 to +7.0 V
AI0 – AI6, OEB0, OEBn, OEAn -1.2 to +7.0 V
B0 – B6 -1.2 to +5.5
I
IN
Input current -18 to +5.0 mA
V
OUT
Voltage applied to output in High output state -0.5 to +V
CC
V
Current applied to output in AO0 – AO6 48 mA
OUT
Low output state B0 – B6 200
T
STG
Storage temperature -65 to +150 °C
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
COMMERCIAL LIMITS
VCC = 5V±10%;
T
amb
= 0 to +70°C
INDUSTRIAL LIMITS
VCC = 5V±10%;
T
amb
= -40 to +85°C
UNIT
MIN TYP MAX MIN TYP MAX
V
CC
Supply voltage 4.5 5.0 5.5 4.5 5.0 5.5 V
VIHHigh-level in ut voltage
B0 – B6 1.62 1.55 1.62 1.55
VILLow-level in ut voltage
B0 – B6 1.47 1.47
I
IK
Input clamp current -18 -18 mA
I
OH
High-level output current AO0 – AO6 -3 -3 mA
IOLLow-level out ut current
B0 – B6 100 100
C
OB
Output capacitance on B port 6 7 6 7 pF
T
amb
Operating free-air temperature range 0 +70 -40 +85 °C

Philips Semiconductors Product specification
FB20417-bit Futurebus+ transceiver
1995 May 25
5
FUNCTION TABLE
MODE INPUTS OUTPUTS
AIn Bn* OEB0 OEB1 OEB2 OEB3 OEA1 OEA2 OEA3 AOn Bn*
L — H L L L L L L Z H**
AIn to Bn H — H L L L L L L Z L
L — H L L L H H H L H**
H — H L L L H H H H L
L — H L X X L L L Z H**
AI0 to B0 H — H L X X L L L Z L
L — H L X X H H H L H**
H — H L X X H H H H L
L — H X L X L L L Z H**
AI1 – AI3 to B1 – B3 H — H X L X L L L Z L
L — H X L X H H H L H**
H — H X L X H H H H L
L — H X X L L L L Z H**
AI4 – AI6 to B4 – B6 H — H X X L L L L Z L
L — H X X L H H H L H**
H — H X X L H H H H L
Disable Bn outputs X X L X X X X X X X H**
X X X H H H X X X X H**
Disable B0 outputs X X H H X X X X X X H**
Disable B1 – B3 outputs X X H X H X X X X X H**
Disable B4 – B6 outputs X X H X X H X X X X H**
X L L X X X H H H H Input
Bn to AOn X H L X X X H H H L Input
X L X H H H H H H H Input
X H X H H H H H H L Input
X L L X X X H X X H Input
B0 to AO0 X H L X X X H X X L Input
X L X H H H H X X H Input
X H X H H H H X X L Input
X L L X X X X H X H Input
B1 – B3 to AO1 – AO3 X H L X X X X H X L Input
X L X H H H X H X H Input
X H X H H H X H X L Input
X L L X X X X X H H Input
B4 – B6 to AO4 – AO6 X H L X X X X X H L Input
X L X H H H X X H H Input
X H X H H H X X H L Input
Disable AOn outputs X X X X X X L L L Z X
Disable AO0 outputs X X X X X X L X X Z X
Disable AO1 – AO3 outputs X X X X X X X L X Z X
Disable AO4 – AO6 outputs X X X X X X X X L Z X
NOTES:
H = High voltage level
L = Low voltage level
X = Don’t care
Z = High-impedance (OFF) state
— = Input not externally driven
H** = Goes to level of pull-up voltage
B* = Precaution should be taken to ensure B inputs do not float.
If they do, they are equal to Low state.
Z = High-impedance (OFF) state
— = Input not externally driven
H** = Goes to level of pull-up voltage
B* = Precaution should be taken to ensure B inputs do not float.
If they do, they are equal to Low state.

Philips Semiconductors Product specification
FB20417-bit Futurebus+ transceiver
1995 May 25
6
LOGIC DIAGRAM
SG00071
46
45
OEB0
OEB1
47
OEA1
BTL
Levels
TTL
Levels
TMS
TCK
TDI
TDO
42
44
22
21
(Future JTAG Boundary Scan option)
LOGIC V
CC
= 17, 49
LOGIC GND = 1, 5, 7, 11, 13, 15, 19
BUS V
CC
= 23, 43
BUS GND = 27, 29, 31, 33, 35, 37, 39, 41
BIAS V = 48
51
AI0
50
AO0
B0
40
25
OEB2
38
B1
20
2
52
OEA2
AI1
AO1
36
3
4
B2
AI2
AO2
34
8
6
B3
AI3
AO3
26
32
24
9
10
30
14
12
28
18
16
OEB3
B4
OEA3
AI4
AO4
B5
AI5
AO5
B6
AI6
AO6

Philips Semiconductors Product specification
FB20417-bit Futurebus+ transceiver
1995 May 25
7
LIVE INSERTION SPECIFICA TIONS
V
BIASV
Bias pin voltage VCC = 0 to 5.25V , Bn = 0 to 2.0V 4.5 5.5 V
VCC = 0 to 4.75V , Bn = 0 to 2.0V,
Bias V = 4.5 to 5.5V
1 mA
VCC = 4.5 to 5.5V , Bn = 0 to 2.0V,
Bias V = 4.5 to 5.5V
10 µA
V
Bn
Bus voltage during prebias B0 – B8 = 0V, Bias V = 5.0V 1.62 2.1 V
I
LM
Fall current during prebias B0 – B8 = 2V, Bias V = 4.5 to 5.5V 1 µA
I
HM
Rise current during prebias B0 – B8 = 1V, Bias V = 4.5 to 5.5V -1 µA
IBnPEAK
Peak bus current during
insertion
VCC = 0 to 5.25V , B0 – B8 = 0 to 2.0V,
Bias V = 4.5 to 5.5V, OEB0 = 0.8V, tr = 2ns
10 mA
V
CC
= 0 to 5.25V , OEB0 = 0.8V 100
V
CC
= 0 to 2.2V, OEB0 = 0 to 5V 100
µ
t
GR
Input glitch rejection VCC = 5.0V 1.0 1.35 ns
DC ELECTRICAL CHARACTERISTICS
Over recommended operating free-air temperature range unless otherwise noted.
I
OH
High level output current B0 – B6 VCC = MAX, VIL = MAX, VIH = MIN, VOH = 2.1V 100 µA
I
OFF
Power-off output current B0 – B6 VCC = 0.0V, VIL = MAX, VIH = MIN, VOH = 2.1V 100 µA
V
OH
High-level output
voltage
AO0 – AO6
3
VCC = MIN, VIL = MAX, VIH = MIN, IOH = -3mA 2.5 2.85 V
AO0 – AO6
3
VCC = MIN, VIL = MAX, VIH = MIN, IOL = 24mA 0.33 0.5
V
OL
Low-level output voltage B0 – B6 VCC = MIN, VIL = MAX, VIH = MIN, IOL = 80mA .75 1.0 1.10 V
VCC = MIN, VIL = MAX, VIH = MIN, IOL = 100mA 1.15
V
IK
Input clamp voltage VCC = MIN, II = I
IK
-1.2 V
I
I
Input current at
maximum input voltage
OEB0, OEBn,
OEAn, AI0 – AI6 VCC = MAX, VI = GND or 5.5V ±50 µA
I
IH
High-level input current
OEB0, OEBn,
OEAn, AI0 – AI6 VCC = MAX, VI = 2.7V 20
B0 – B6 VCC = MAX, VI = 2.1V 100
I
IL
Low-level input current
OEB0, OEBn,
OEAn, AI0 – AI6
VCC = MAX, VI = 0.5V
-20
B0 – B6 VCC = MAX, VI = 0.75V -100
I
OZH
Off-state output current AO0 – AO6 VCC = MAX, VO = 2.7V 50 µA
I
OZL
Off-state output current AO0 – AO6 VCC = MAX, VO = 0.5V -50 µA
I
O
Output current AO0 – AO6 only VCC = MAX -30 -55 -150 mA
I
CCZ
(standby) VCC = MAX 19 30
I
CCB,
AIn to Bn VCC = MAX, outputs Low or High 40 60
ICCSupply current (total)
I
CCA,
Bn to AOn VCC = MAX, outputs Low 22 35
I
CCA,
Bn to AOn VCC = MAX, outputs High 19 35
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operation conditions for the applicable type.
2. All typical values are at V
CC
= 5V, TA = 25°C.
3. Due to test equipment limitations, actual test conditions are V
IH
= 1.8V and VIL = 1.3V for the B side.

Philips Semiconductors Product specification
FB20417-bit Futurebus+ transceiver
1995 May 25
8
AC ELECTRICAL CHARACTERISTICS (Commercial)
A PORT LIMITS
SYMBOL PARAMETER
TEST
CONDITION
T
amb
= +25°C, VCC = 5V,
CL = 50pF, RL = 500Ω
T
amb
= 0 to 70°C,
VCC = 5V±10%,
CL = 50pF, RL = 500Ω
UNIT
MIN TYP MAX MIN MAX
t
PLH
t
PHL
Propagation delay,
Bn
to AOn
Waveform 1, 2
1.8
1.6
3.4
3.2
5.0
4.9
1.6
1.6
5.5
5.0
ns
t
PZH
t
PZL
Output enable time,
OEA to AOn
Waveform 4, 5
2.2
2.0
5.0
4.0
6.5
6.5
2.0
1.8
10.0
8.0
ns
t
PHZ
t
PLZ
Output disable time,
OEA to AOn
Waveform 4, 5
1.5
1.8
3.3
3.0
4.8
5.0
1.2
1.5
5.0
5.5
ns
t
TLH
t
THL
Transition time, AOn Port
(10% to 90% or 90% to 10%)
Test Circuit and
Waveforms
1.5
1.5
2.2
2.4
3.0
3.0
1.5
1.5
3.5
3.5
ns
tSK(o)
Output skew between receivers
in same package
1
Waveform 3 0.4 1.0 1.0 ns
B PORT LIMITS
SYMBOL
PARAMETER TEST CONDITION
T
amb
= +25°C, VCC = 5V,
CD = 30pF, RU = 9Ω
T
amb
= 0 to 70°C,
VCC = 5V±10%,
CD = 30pF, RU = 9Ω
UNIT
t
PLH
t
PHL
Propagation delay,
AIn to Bn
Waveform 1, 2
2.4
1.5
3.7
2.7
4.9
4.4
1.9
1.5
5.7
5.0
ns
t
PLH
t
PHL
Enable/disable time,
OEB0 to Bn
Waveform 2
2.4
1.9
3.7
3.5
4.9
4.9
1.9
1.8
6.4
5.4
ns
t
PLH
t
PHL
Enable/disable time,
OEB1 to Bn
Waveform 1
2.4
1.9
4.0
3.6
5.5
5.5
1.9
2.5
5.9
5.9
ns
t
TLH
t
THL
Transition time, Bn Port
(1.3V to 1.8V)
Test Circuit and
Waveforms
1.0
0.5
1.4
1.1
3.0
3.0
1.0
0.5
3.0
3.0
ns
tSK(o)
Output skew between drivers in
same package
1
Waveform 3 0.3 1.0 1.0 ns
SYMBOL PARAMETER TEST CONDITION RU = 16.5Ω RU = 16.5Ω UNIT
t
PLH
t
PHL
Propagation delay,
AIn to Bn
Waveform 1, 2
2.5
1.6
3.8
2.8
5.0
4.5
2.0
1.6
5.8
5.1
ns
t
PLH
t
PHL
Enable/disable time,
OEB0 to Bn
Waveform 2
2.5
2.0
3.8
3.6
5.0
5.0
2.0
1.9
6.5
5.5
ns
t
PLH
t
PHL
Enable/disable time,
OEB1 to Bn
Waveform 1
2.5
2.0
4.1
3.7
5.6
5.6
2.0
2.6
6.0
6.0
ns
t
TLH
t
THL
Transition time, Bn Port
(1.3V to 1.8V)
Test Circuit and
Waveforms
1.0
0.5
1.5
1.1
3.0
3.0
1.0
0.5
3.0
3.0
ns
tSK(o)
Output skew between drivers in
same package
1
Waveform 3 0.3 1.0 1.0 ns
NOTES:
1. t
PN
actual – tPMactual for any data input to output path compared to any other data input to output path where N and M are either LH or
HL. Skew times are valid only under same test conditions (temperature, V
CC
, loading, etc.).

Philips Semiconductors Product specification
FB20417-bit Futurebus+ transceiver
1995 May 25
9
AC ELECTRICAL CHARACTERISTICS (Industrial)
A PORT LIMITS
SYMBOL PARAMETER
TEST
CONDITION
T
amb
= +25°C, VCC = 5V,
CL = 50pF, RL = 500Ω
T
amb
= -40 to +85°C,
VCC = 5V±10%,
CL = 50pF, RL = 500Ω
UNIT
MIN TYP MAX MIN MAX
t
PLH
t
PHL
Propagation delay,
Bn
to AOn
Waveform 1, 2
1.8
1.6
3.4
3.2
5.0
4.9
1.6
1.6
5.5
5.5
ns
t
PZH
t
PZL
Output enable time,
OEA to AOn
Waveform 4, 5
2.2
2.0
5.0
4.0
6.5
6.5
1.5
1.5
8.0
8.0
ns
t
PHZ
t
PLZ
Output disable time,
OEA to AOn
Waveform 4, 5
1.5
1.5
3.3
3.0
4.8
5.0
0.8
1.2
6.0
6.0
ns
t
TLH
t
THL
Transition time, AOn Port
(10% to 90% or 90% to 10%)
Test Circuit and
Waveforms
1.5
1.5
2.2
2.4
3.0
3.0
1.5
1.5
3.5
3.5
ns
tSK(o)
Output skew between receivers
in same package
1
Waveform 3 0.4 1.0 1.0 ns
B PORT LIMITS
SYMBOL PARAMETER TEST CONDITION
T
amb
= +25°C, VCC = 5V,
CD = 30pF, RU = 9Ω
T
amb
= -40 to +85°C,
VCC = 5V±10%,
CD = 30pF, RU = 9Ω
UNIT
t
PLH
t
PHL
Propagation delay,
AIn to Bn
Waveform 1, 2
2.4
1.5
3.7
2.7
4.9
4.4
1.9
1.5
5.9
5.0
ns
t
PLH
t
PHL
Enable/disable time,
OEB0 to Bn
Waveform 2
2.4
1.9
3.7
3.5
4.9
4.9
1.9
1.8
6.4
5.9
ns
t
PLH
t
PHL
Enable/disable time,
OEB1 to Bn
Waveform 1
2.4
1.9
4.0
3.6
5.5
5.5
1.9
1.5
6.8
6.8
ns
t
TLH
t
THL
Transition time, Bn Port
(1.3V to 1.8V)
Test Circuit and
Waveforms
1.0
0.5
1.4
1.1
3.0
3.0
1.0
0.5
3.0
3.0
ns
tSK(o)
Output skew between drivers in
same package
1
Waveform 3 0.3 1.0 1.0 ns
SYMBOL PARAMETER TEST CONDITION RU = 16.5Ω RU = 16.5Ω UNIT
t
PLH
t
PHL
Propagation delay,
AIn to Bn
Waveform 1, 2
2.5
1.6
3.8
2.8
5.0
4.5
2.0
1.6
6.0
5.1
ns
t
PLH
t
PHL
Enable/disable time,
OEB0 to Bn
Waveform 2
2.5
2.0
3.8
3.6
5.0
5.0
2.0
1.9
6.5
6.0
ns
t
PLH
t
PHL
Enable/disable time,
OEB1 to Bn
Waveform 1
2.5
2.0
4.1
3.7
5.5
5.5
2.0
1.6
6.9
6.9
ns
t
TLH
t
THL
Transition time, Bn Port
(1.3V to 1.8V)
Test Circuit and
Waveforms
1.0
0.5
1.5
1.1
3.0
3.0
1.0
0.5
3.0
3.0
ns
tSK(o)
Output skew between drivers in
same package
1
Waveform 3 0.3 1.0 1.0 ns
NOTES:
1. t
PN
actual – tPMactual for any data input to output path compared to any other data input to output path where N and M are either LH or
HL. Skew times are valid only under same test conditions (temperature, V
CC
, loading, etc.).

Philips Semiconductors Product specification
FB20417-bit Futurebus+ transceiver
1995 May 25
10
AC WAVEFORMS
NOTE: V
M
= 1.55V for Bn, V
M
= 1.5V for all others.
AIn, Bn or Bn
OEBn
AOn or Bn
V
M
V
M
V
M
V
M
t
PLH
t
PHL
Waveform 1. Propagation Delay for Data
or Output Enable to Output
V
M
V
M
V
M
V
M
t
PHL
t
PLH
AOn, Bn
Waveform 2. Propagation Delay for Data
or Output Enable to Output
AIn, Bn
OEB0
AIn, Bn
AOn, Bn
V
M
V
M
tSK(o)
Waveform 3. Output Skews
AOn
OEA
V
M
V
M
V
M
VOH -0.3V
OV
t
PHZ
t
PZH
Waveform 4. 3-State Output Enable Time to High Level
and Output Disable Time from High Level
t
PZL
AOn
OEAn
V
M
V
M
t
PLZ
V
M
VOL +0.3V
Waveform 5. 3-State Output Enable Time to Low Level
and Output Disable Time from Low Level
SG00079

Philips Semiconductors Product specification
FB20417-bit Futurebus+ transceiver
1995 May 25
11
TEST CIRCUIT AND WAVEFORMS
2.5ns
2.5ns500ns
500ns
INPUT PULSE REQUIREMENTS
Rep. RateAmplitude t
TLHtTHL
1MHz3.0V
2.5ns
Input Pulse Definitions
VM = 1.55V for Bn, VM = 1.5V for all others.
V
CC
Family
FB+
D.U.T.
PULSE
GENERATOR
7.0V
R
L
R
L
C
L
R
T
V
IN
V
OUT
Test Circuit for 3-State Outputs on A Port
TEST SWITCH
SWITCH POSITION
t
PLZ,
t
PZL
All other
closed
open
DEFINITIONS:
RL= Load Resistor; see AC CHARACTERISTICS for value.
CL= Load capacitance includes jig and probe capacitance; see AC
CHARACTERISTICS for value.
R
T
= Termination resistance should be equal to Z
OUT
of pulse generators.
CD= Load capacitance includes jig and probe capacitance; see AC
CHARACTERISTICS for value.
RU= Pull up resistor; see AC CHARACTERISTICS for value.
t
W
90%
V
M
10%
90%
V
M
10%
90%
V
M
10%
90%
V
M
10%
NEGATIVE
PULSE
POSITIVE
PULSE
LOW V
LOW V
t
THL
(tf)
t
TLH
(tr)
t
W
BIAS
V
t
W
Low V
0.0V
t
TLH
(tr)
t
THL
(tf)
A Port
1MHz2.0V
2.5ns
1.0VB Port
V
CC
D.U.T.
PULSE
GENERATOR
R
U
C
D
R
T
V
IN
V
OUT
Test Circuit for Outputs on B Port
BIAS
V
2.0V (for RU = 9 Ω)
2.1V (for RU = 16.5 Ω)
SG00059
V
IN
V
IN

Philips Semiconductors Product specification
FB20417-bit Futurebus+ transceiver
1995 May 25
12
QFP52: plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2.0 mm SOT379-1

Philips Semiconductors Product specification
FB20417-bit Futurebus+ transceiver
1995 May 25
13
NOTES

Philips Semiconductors Product specification
FB20417-bit Futurebus+ transceiver
1995 May 25
14
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 08-98
Document order number:
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
[1]
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
Data sheet status
[1] Please consult the most recently issued datasheet before initiating or completing a design.