Datasheets ESL-R3040VBCE095 Datasheet

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DATA SHEET

ESL NO.. : ESL-R3040VBCE095

CUS NO. : 90702

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Producer： Auditor： Approver：

CUSTOMER’SAPPROVAL : _______________ DCC : ____________

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3.0 mm ROTUNDITY LED LAMP

PACKAGE DIMENSIONS

ESL-R3040VBCE095

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Note:

1.All Dimensions are in millimeters.

2.Tolerance is ±0.25mm(0.010 ")Unless otherwise specified.

3.Protruded resin under flange is 1.0mm(0.039 ") max.

4.The lamps have sharp and hard points that may injure human eyes or fingers etc., so please pay enough care in the handling.

5.ESD≤500V.

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3.0 mm ROTUNDITY LED LAMP ESL-R3040VBCE095

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FEATURES

3.0mm DIAROTUNDITY LED LAMP

LOW POWER CONSUMPTION.

I.C. COMPATIBLE.

LONG LIFE SOLID STATE RELIABILITY.

PB FREE PRODUCTS(Compliant with EU’s RoHS.)

CHIP MATERIALS

Dice Material : GaInN/GaN

Light Color : Ultra Blue

Lens Color : Water Clear

ABSOLUTE MAXIMUM RATING : ( Ta = 25

SYMBOL PARAMETER Ultra Blue UNIT

PAD Power Dissipation 105 mW

VR Reverse Voltage 5 V

IF Average Forward Current 30 mA

°C)

IPF Peak Forward Current Per Chip (Duty=0.1,1KHz) 100 mA

－

Topr Operating Temperature Range -25°Cto85°C

Tstg Storage Temperature Range -40°Cto85°C

Derating Linear From 25°C0.4mA/

ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25°C)

SYMBOL DESCRIPTION

Vf Forward Voltage IF=20mA 2.9 3.2 3.6 V

λd Dominant Wavelength IF=20mA 465 -- 475 nm

Δλ Spectral Line Half-Width IF=20mA 18 nm

2θ Half Intensity Angle IF=20mA 20 deg

Reverse Current VR=5V 10 　A

TEST

MIN. TYP. MAX. UNIT

Iv Luminous Intensity IF= 20mA 4000 4500 5000 mcd

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3.0 mm ROTUNDITY LED LAMP

ESL-R3040VBCE095

SOLDERING

METHOD SOLDERING CONDITIONS REMARK

REFLOWER

DIP SOLDERING

SOLDERING

IRON

Bath temperature: 240

Immersion time: with 5 sec，1time

Bath temperature: 240℃

Immersion time: with 5 sec ,1time

Soldering iron: 30W or smaller

Temperature at tip of iron: 260℃or lower

Soldering time: within 5 sec.

℃

 Solder no closer than 3mm from the

base of the package

 Using soldering flux,” RESIN FLUX” is

recommended.

Attached data of temperatuare cure for

your reference

 During soldering, takecare not to press

the tip of iron against the lead.

(To prevent heat from being transferred

directly to the lead, hold the lead with a pair of tweezers while soldering

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1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip.

2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.

Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin & copper and sliver is proposed with the temperature of Celsius 260. The proportion of the alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly 3 seconds.

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3.0 mm ROTUNDITY LED LAMP ESL-R3040VBCE095

3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3).

4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to

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the LED.

5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature.



STORAGE

1) The LEDs should be stored at 30℃or less and 70% RH or less after being shipped from PARAand the storage life limits are 3 months .

2) PARA LED lead frames are comprised of a stannum plated iron alloy. The silver surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LEDs to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the LEDs be used as soon as possible.

Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur.

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LED MOUNTING METHOD

3）When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4)

4）Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs.

Tube

Stand-off

Fig.5

Fig.6

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FORMED LEAD

1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7)

m m 2

Fig.7

2) Forming lead should be carried our prior to soldering and never during or after soldering.

3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8)

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3.0 mm ROTUNDITY LED LAMP

Moisture Resistant Packaging

Static bag

ESL-R3040VBCE095

PCS Bag

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Label

Box

Carton

Bag Box

Box Carton

Jiangsu Everstars Electronics Co.，Ltd.

：

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3.0 mm ROTUNDITY LED LAMP

Reliability Test：

Item

OPERATION LIFE

HIGH TEMPERATURE HIGH HUMIDITY STORAGE

ESL-R3040VBCE095

Test Condition

Lamp & IR

Ta：25±5

IF= 20mA RH

1 DYNAMIC:100mA1ms 1/10 duty

2 STATIC STATE: IF

TEST TIME: 168HRS（-24HRS，+24HRS 500HRS（-24HRS，+24HRS

1000HRS（-24HRS，+72HRS

Ta： 65℃±5℃

RH：90～95%RH

TEST TIME：240HRS±2HRS

：＜

℃

=60%RH

20mA

＝

））

）

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Reference Standard

MIL-STD-750：1026 MIL-STD-883：1005

JIS C 7021：B-1

MIL-STD-202：103B JIS C 7021：B-1

105

TEMPERATURE CYCLING

THERMAL SHOCK

SOLDER

RESISTANCE T，sol：260℃±5

SOLDERABILITY

℃～25℃～

30min 5min 30min 5min

10CYCLES

105℃±5

10min 10min

10CYCLES

DWELL TIME：10±lsec

T，sol：230℃±5

DWELL TIME：5±lsec

℃～

-55

-55℃±5

℃～25℃

℃

MIL-STD-202：107D MIL-STD-750：1051 MIL-STD-883：1010 JIS C 7021：A-4

MIL-STD-202：107D MIL-STD-750：1051 MIL-SYD-883：1011

MIL-STD-202：210A MIL-STD-750-2031 JIS C 7021：A-1 MIL-STD-202：208D MIL-STD-750：2026 MIL-STD-883：2003 JIS C 7021：A-2

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