Datasheet ESDALC6V1xxM6 Datasheet (ST)

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ESDALC6V1xxM6

4 and 5 line low capacitance TRANSIL™ array for ESD protection

Main applications

Where transient overvoltage protection in ESD sensitive equipment is required, such as:

■ Computers

■ Printers

■ Communication systems

■ Cellular phone handsets and accessories

■ Video equipment

Features

■ 4 unidirectional TRANSIL diodes

(ESDALC6V1M6)

■ 5 unidirectional TRANSIL diodes

(ESDALC6V1-5M6)

■ Breakdown Voltage V

■ Low diode capacitance (12 pF typ at 0 V)

■ Low leakage current < 70 nA

■ Very small PCB area: 1.45 mm

■

500 microns pitch

■ Leadfree package

= 6.1 V min

BR

²

Functional diagram

Micro QFN Package

ESDALC6V1M6

1

I/O1

2

GND

I/O2

3

ESDALC6V1-5M6

1

I/O1

2

GND

I/O2

3

6

5

4

6

5

4

I/O5

GND

I/O3

I/O5

I/O4

I/O3

Description

The ESDALC6V1xxM6 is monolithic arrays designed to protect up to 4 or 5 lines against ESD transients.

The device is ideal for applications where both reduced print circuit board space and power absorption capability are required.

Benefits

■ High ESD protection level

■ High integration

■ Suitable for high density boards

January 2006 1/8

Order Code

Part number Marking

ESDALC6V1M6 G

ESDALC6V1-5M6 H

Complies with the following standards:

IEC61000-4-2

15 kV (air discharge)

8 kV (contact discharge)

MIL STD 883E- Method 3015-7: class3

25 kV (human body model)

TM: TRANSIL is a trademark of STMicroelectronics

Rev 3

www.st.com

8

1 Characteristics ESDALC6V1xxM6

1 Characteristics

1.1 Absolute maximum ratings (T

Symbol Parameter Value Unit

V

PP

P

PP

I

pp

T

stg

T

L

T

OP

1. For a surge greater than the maximum values, the diode will fail in short-circuit.

1.2 Electrical characteristics (T

Symbol Parameter

V

RM

V

BR

V

CL

I

RM

I

PP

αT Voltage temperature coefficient

V

F

ESD discharge – IEC61000-4-2 air discharge IEC61000-4-2 contact discharge

Peak pulse power dissipation (8/20 µs)

Repetitive peak pulse current typical value (8/20 µs) 3 A

Junction temperature 125 °C

j

Storage temperature range -55 + 150 °C

Maximum lead temperature for soldering during 10 s 260 °C

Operating temperature range -40 + 125 °C

amb

Stand-off voltage

Breakdown voltage

Clamping voltage

Leakage current @ V

Peak pulse current

Forward voltage drop

RM

= 25 °C)

amb

(1)

= 25 °C)

Tj initial = T

VV V

BR

RM

Slope= 1/R

± 15

± 8

V

F

30 W

V

VVCLV

V

amb

I

F

I

RM

I

R

d

I

PP

kV

Parameter Test Condition Min Typ Max Unit

V

BR

I

RM

V

F

R

d

(1)

αT

C

1. ∆VBR = αT * (T

V

=0 V DC, F = 1 MHz, V

R

- 25 °C) * VBR (25 °C)

amb

IR = 1 mA

V

= 3 V

RM

IF = 10 mA

IR = 1 mA,

osc

2/8

= 30 mV

RMS

6.1 7.2 V

70 nA

1V

23 Ω

5

10

12 15 pF

-4

/°C

ESDALC6V1xxM6 1 Characteristics

Figure 1. Relative variation of peak pulse

power versus initial junction temperature

PPP[Tjinitial] /PPP[Tjinitial=25 ]

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0 25 50 75 100 125 150

°C

Tj(°C)

Figure 3. Clamping voltage versus peak pulse

current (typical values, rectangular waveform)

IPP(A)

100.0

8/20µs

initial =25°C

T

j

Figure 2. Peak pulse power versus

exponential pulse duration

PPP(W)

1000

100

10

1 10 100

tP(µs)tP(µs)

Tjinitial = 25°C

Figure 4. Forward voltage drop versus peak

forward current (typical values)

IFM(A)

1.E+00

10.0

1.0

0.1

0 10203040506070

VCL(V)VCL(V)

Figure 5. Junction capacitance vesus reverse

voltage applied (typical values)

C(pF)C(pF)

14

13

12

11

10

9

8

7

6

5

4

3

2

1

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

VR(V)VR(V)

V

F=1MHz

OSC

Tj=25°C

=30mV

RMS

1.E-01

1.E-02

1.E-03

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

Tj=125°C

Tj=25°C

VFM(V)

Figure 6. Relative variation of leakage current

versus junction temperature (typical values)

IR[Tj]/IR[Tj=25 ]

100

10

1

25 50 75 100 125

°C

VR=3V

Tj(°C)

3/8

1 Characteristics ESDALC6V1xxM6

Figure 7. S21 attenuation measurement

results of each channel

dB

0.00

-10.00

-20.00

-30.00

f/Hz

-40.00

100.0k 1.0M 10.0M 100.0M 1.0G

Figure 9. ESD response to IEC6100-4-2

(+15 kV air discharge) on each channel

36V

Figure 8. Analog crosstalk measurements

between channels

dB

0.00

-30.00

-60.00

-90.00

f/Hz

-120.00

100.0k 1.0M 10.0M 100.0M 1.0G

Figure 10. ESD response to IEC6100-4-2

(-15 kV air discharge) on each channel

-34V-34V

4/8

ESDALC6V1xxM6 2 Ordering information scheme

2 Ordering information scheme

ESDA LC 6V1 xx M6

ESD Array

Low capacitance

Breakdown voltage

6V1 = 6.1 Volts min

Number of lines

blank = 4 line

-5 = 5 line protection

Package

M6 = Micro QFN 6 leads

3 Package information

Table 1. Mechanical data

D

112

A

A1

2

b

e

L

k

DIMENSIONS

REF

E

A 0.50 0.55 0.60 0.20 0.22 0.24

A1 0.00 0.02 0.05 0.00 0.01 0.02

b 0.19 0.25 0.30 0.07 0.10 0.12

D 1.34 1.45 1.51 0.53 0.57 0.59

E 0.94 1.00 1.05 0.37 0.39 0.41

e 0.45 0.50 0.55 0.18 0.20 0.22

L 0.30 0.35 0.40 0.12 0.14 0.16

Millimeters Inches

Min Typ Max Min Typ Max

k 0.25 0.30 0.35 0.10 0.12 0.14

5/8

3 Package information ESDALC6V1xxM6

Figure 11. Footprint

0.50

0.25

Figure 12. Tape and reel specification

Dot identifying Pin A1 location

0.65

0.30

2.0+/-0.05

1.60

4.00+/-0.1

Measurements in mm

φ 1.5 +/- 0.1

1.75 +/- 0.1

3.5 +/- 0.03

8.0 +/- 0.3

1.65

0.75

X: Marking

X

XX

1.20

User direction of unreeling

X

4.00

X

XX

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

6/8

ESDALC6V1xxM6 4 Ordering information

4 Ordering information

Part number Marking Package Weight Base qty Delivery mode

ESDALC6V1M6 G Micro QFN 2.2 mg 30,000 Tape and reel

ESDALC6V1-5M6 H Micro QFN 2.2 mg 30,000 Tape and reel

5 Revision history

Date Revision Changes

19-Sep-2005 1 Initial release.

10-Oct-2005 2 Package title changed from DFN to QFN. No technical changes.

21-Dec-2005 3 Updated package dimensions in Table 1

7/8

5 Revision history ESDALC6V1xxM6

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