Datasheet ESDA19-5SC6, ESDA17-5SC6 Datasheet (SGS Thomson Microelectronics)

®

ESDA17/19-5SC6

Application Specific Discretes

A.S.D.™

APPLICATIONS

Where transient overvoltage protection in ESD
sensitive equipment is required, such as :

Computers

■

Printers and other peripherals

■

Communications systems

■

Cellular phone handsets and accessories

■

Other telephone sets

■

Consumer Electronics (Set top boxes, DVD

■

players, TV sets)

DESCRIPTION

The ESDA17/19-5SC6 is a monolithic array
designed to protect up to 5 lines against ESD
transients.

The device is ideal for applications where board
space savind is required.

TRANSIL™ ARRAY

FOR ESD PROTECTION

SOT23-6L

ESDAxx-5SC6

FUNCTIONAL DIAGRAM

SOT23-6L

FEATURES

■

5 Unidirectional transil™ functions

■

Minimumbreakdown voltagerange v

BRmin

=17V

or 19V

■

Peak pulse power (8/20µs); 150W

■

Tiny leakage current at stand-off voltage: <
100nA

BENEFITS

■

High ESD protection level

■

High integration

■

Suitable for high density boards

COMPLIES WITH THE FOLLOWING STANDARDS:

- IEC61000-4-2: 15 kV (air discharge)
8 kV (contact discharge)

- MIL STD 883E-Method 3015-7: class3
25kV (human body model)

I/O1

Gnd

I/O2

I/O5

I/O4

I/O3

November 2002 -Ed: 1A

1/5

ESDA17/19-5SC6

ABSOLUTE MAXIMUM RATINGS (T

amb

= 25°C)

Symbol Test conditions Value Unit

V

PP

P

PP

ESD discharge - IEC61000-4-2 air discharge

IEC61000-4-2 contact discharge

Peak pulse power dissipation (8/20µs)

Tj initial = Tamb

±15

±8

150 W

Note 1

T

j

T

stg

T

L

Junction temperature
Storage temperature range
Maximum lead temperature for soldering during 10s at 5mm for

125 °C

-55 to +150 °C
260 °C

case

T

op

Note 1: For a surge greater than the maximum values, the diode will fail in short-circuit.

ELECTRICAL CHARACTERISTICS (T

Operating temperature range

= 25°C)

amb

Symbol Parameter

V
V

V

I

RM

I

PP

αT

V

RM
BR

CL

F

Stand-off voltage
Breakdown voltage

Clamping voltage
Leakage current @ V

RM

Peak pulse current
Voltage temperature coefficient
Forward voltage drop

V

CL

V

BR

V

RM

Rd

-40 to +125 °C

I

I

F

VF

I

RM

I

PP

kV

V

V

@IRIRM@V

BR

Type

min. max. max. typ. max.

V V mA nA V Ω 10

ESDA17-5SC6
ESDA19-5SC6

Note 1 : Square pulse, Ipp = 15A, tp=2.5µs.
Note 2: ∆ VBR= αT* (Tamb-25°C) * VBR(25°C)

17 19 1 75 14 1 10 33 1.2 10
19 21 1 100 15 1 8.5 33 1.2 10

RM

Rd αTCV

note 1 note 2 0V bias

-4

/°C pF V mA

F@IF

2/5

ESDA17/19-5SC6

Fig. 1: Relative variation of peak pulse power

versus initial junction temperature.

PP PP

P [Tj initial] / P [Tj initial = 25°C]

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0
0 25 50 75 100 125 150

Tj (°C)

Fig. 3: Clamping voltage versus peak pulse

current (typical values, rectangular waveform).

I (A)PP

100.0

Fig. 2: Peak pulse power versus exponential pulse

duration.

P (W)PP

1000

100

Tjinitial = 25°C

tp (µs)

10

1 10 100

Fig. 4: Forward voltage drop versus peak forward

current (typical values).

I (A)FM

1.E+00

10.0

ESDA17-5SC6

1.0

0.1
0 10203040506070

ESDA19-5SC6

V (V)CL

tP=2.5µs

T

initial =25°C

j

Fig. 5: Junction capacitance versus reverse volt­age applied (typical values).

C(pF)

40

35

30

25

20

15

10

5

0

01234567891011121314151617

V (V)R

V

F=1MHz

osc

Tj=25°C

=30mV

RMS

1.E-01

1.E-02

Tj=125°C

Tj=25°C

V (V)FM

1.E-03

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

Fig. 6: Relative variationof leakage current versus

junction temperature (typical values).

IR [Tj] / IR [Tj = 25°C]

100

VR=14V

10

Tj(°C)

1

25 50 75 100 125

3/5

ESDA17/19-5SC6

ORDER CODE

ESDA 17 - 5 SC6

PACKAGE:

ESD ARRAY

V min.

BR

5 lines protected

OTHER INFORMATIONS

Type Marking Package Weight Base Qty Delivery mode

ESDA17-5SC6 175 SOT23-6L 16.7mg 3000 Tape & Reel
ESDA19-5SC6 195 SOT23-6L 16.7mg 3000 Tape & Reel

Epoxy meets UL94, V0

■

SC6: SOT23-6L

4/5

PACKAGE MECHANICAL DATA

SOT23-6L

ESDA17/19-5SC6

e

D

e

C

FOOTPRINT

A

E

A2

REF. DIMENSIONS

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 0.90 1.45 0.035 0.057

A1 0 0.10 0 0.004

b

A2 0.90 1.30 0.035 0.0512

b 0.35 0.50 0.0137 0.02

c 0.09 0.20 0.004 0.008
D 2.80 3.00 0.11 0.118
E 1.50 1.75 0.059 0.0689

e 0.95 0.0374
H 2.60 3.00 0.102 0.118

θ

H

A1

L

0.60

0.024

L 0.10 0.60 0.004 0.024

θ 10° 10°

1.20

0.047

3.50

2.30

0.138

0.090

Informationfurnishedis believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequencesof
useofsuchinformation nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap­proval of STMicroelectronics.

mm
inch

0.95

0.037

1.10

0.043

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