Datasheet ES6U41 Datasheet (ROHM)

Page 1
2.5V Drive Nch+SBD MOSFET
ES6U41
Structure Dimensions (Unit : mm)
Silicon N-channel MOSFET / Schottky barrier diode
Features
1) Nch MOSFET and schottky barrier diode­are put in WEMT6 package.
2) High-speed switching, Low On-resistance.
3) Low voltage drive (2.5V drive).
4) Built-in Low V
F schottky barrier diode.
Applications
Switching
Package specifications Inner circuit
Type
ES6U41
Package
Code
Basic ordering unit (pieces)
Taping
T2R
8000
Absolute maximum ratings (Ta=25C)
<MOSFET>
Parameter
Drain-source voltage Gate-source voltage
Drain current
Source current (Body diode)
Continuous Pulsed Continuous Pulsed
Channel temperature
Power dissipation W / ELEMENT0.7
∗1 Pw≤10μs, Duty cycle≤1% ∗2 Mounted on a ceramic board
Symbol
DSS
GSS
D
DP
S
SP
P
D
Limits Unit
30
±12
±1.5
∗1
±6.0
0.75
∗1
6.0
150
∗2
VV VV AI AI AI AI
°CTch
<Di>
Parameter
Repetitive peak reverse voltage Reverse voltage Forward current
Forward current surge peak Junction temperature Power dissipation W / ELEMENT
∗1 60Hz 1cycle ∗2 Mounted on ceramic board
Symbol
RM
R
I
F
I
FSM
Tj
P
D
∗1
∗2
Limits Unit
25 20
0.5
2.0
150
VV VV A
A
°C
0.5
<MOSFET and Di>
Parameter Symbol
Power dissipation Range of storage temperature
∗ Mounted on a ceramic board
∗
D
Limits Unit
0.8
−55 to +150
W / TOTALP
°CTstg
∗1 ESD protection diode ∗2 Body diode
(6) (5) (4)
(1) (2) (3)
Abbreviated symbol : U41
(6)
∗1
(1) (2)
(4)
(5)
∗2
(3)
(1)Gate (2)Source (3)Anode (4)Cathode (5)Drain (6)Drain
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○c 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.B
Page 2
ES6U41
Electrical characteristics
<MOSFET>
Parameter Symbol
Gate-source leakage Drain-source breakdown voltage Zero gate voltage drain current Gate threshold voltage
Static drain-source on-state resistance
Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
∗Pulsed
<Body diode characteristics (Source-drain)>
Parameter Symbol
<Di>
Parameter Symbol
Forward voltage
Reverse current
I
V
(BR) DSS
I
V
GS (th)
R
DS (on)
C
C C
t
d (on)
t
d (off)
Q
Q
V
GSS
DSS
Y
t
t
Q
V
I
oss
rss
SD
R
∗
∗
fs
iss
∗
∗
r
∗
∗
f
∗
g
∗
gs
∗
gd
F
Min.−Typ. Max.
Unit
−±10 μAVGS=±12V, VDS=0V
mΩ
mΩ
Unit
D
D
I
D
D
V
ID= 0.75A V R R
V ID= 1.5A, R R
= 1mA, VGS=0V
DS
DS
= 1.5A, VGS= 4.5V = 1.5A, VGS= 4V = 1.5A, VGS= 2.5V
DS
DS
GS
DD
GS
L
G
DD
G
30 −−VI
−−1 μAV
0.5 − 1.5 V V
− 170 240 I
− 180 250 mΩ
− 240 340 I
1.5 −−SV
− 80 − pF V
− 1412− pF V
−
−
−
−
−
−
−
−−nC
− pF f=1MHz
7
− ns
9
− ns
15
− ns
6
− ns
1.6
2.2 nC
0.5
− nC
0.3
Min. Typ. Max.
−−1.2 V IS= 0.75A, VGS=0VForward voltage
Min. Typ. Max.
−−
−−
−−
Unit
0.36 V
0.52 V
100
μA
= 0.1A
I
F
= 0.5A
I
F
V
R
Conditions
= 30V, VGS=0V = 10V, ID= 1mA
= 10V, ID= 1.5A = 10V =0V
15V
= 4.5V
20Ω
= 10Ω
15V, VGS= 4.5V
10Ω
L
= 10Ω
Conditions
Conditions
= 20V
Data Sheet
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○c 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.B
Page 3
ES6U41
Electrical characteristics curves
<MOSFET>
2
1.5
[A]
D
1
0.5
DRAIN CURRENT : I
0
0 0.2 0.4 0.6 0.8 1
DRAIN-SOURCE VOLTAGE : VDS[V] DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.1 Typical Output Characteristics(Ⅰ) Fig.2 Typical Output Characteristics(Ⅱ) Fig.3 Typical Transfer Characteristics
1000
Ta=25°C
]
Pulsed
Ω
(ON)[m
DS
100
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
10
0.01 0.1 1 10
DRAIN-CURRENT : I
Fig.4 Static Drain-Source On-State Resistance vs. Drain Current(Ⅰ)
1000
VGS= 2.5V
]
Pulsed
Ω
(ON)[m
DS
100
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
10
0.01 0.1 1 10
DRAIN-CURRENT : ID[A]
Fig.7 Static Drain-Source On-State Resistance vs. Drain Current(Ⅳ)
VGS= 10V
V
V
V
V
V
VGS= 1.7V
VGS= 1.6V
VGS= 2.5V
V
GS
V
GS
[A]
D
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
= 4.5V
GS
= 4.0V
GS
= 2.5V
GS
= 2.2V
GS
= 1.8V
GS
Ta=25°C Pulsed
= 4.0V
= 4.5V
2
VGS= 10V
= 2.5V
V
[A]
D
1.5
1
0.5
DRAIN CURRENT : I
0
0246810
1000
VGS= 4.5V
Pulsed
]
Ω
(ON)[m
DS
100
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
10
0.01 0.1 1 10
10
VDS= 10V
Pulsed
1
0.1
0.01 0.1 1 10
FORWARD TRANSFER ADMITTANCE : |Yfs| [S]
GS
= 2.2V
V
GS
DRAIN-CURRENT : ID[A]
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current(Ⅱ)
DRAIN-CURRENT : ID[A]
Fig.8 Forward Transfer Admittance vs. Drain Current
Ta=25°C Pulsed
VGS= 1.8V
VGS= 1.7V
VGS= 1.6V
VGS= 1.5V
Ta=125°C Ta=75°C Ta=25°C Ta= -25 °C
Ta= -25 °C Ta= 25°C Ta= 75°C Ta=125°C
10
VDS= 10V
Pulsed
[A]
1
D
Ta= 125°C
Ta= 75 °C Ta= 25 °C
Ta= - 25 °C
0.1
0.01
DRAIN CURRENT : I
0.001
0.5 1.0 1.5 2.0
GATE-SOURCE VOLTAGE : VGS[V]
1000
VGS= 4.0V
Pulsed
]
Ω
(ON)[m
DS
100
RESISTANCE : R
10
STATIC DRAIN-SOURCE ON-STATE
0.01 0.1 1 10
DRAIN-CURRENT : ID[A]
Fig.6 Static Drain-Source On-State Resistance vs. Drain Current(Ⅲ)
10
VGS=0V
Pulsed
Ta=125°C
1
Ta= 75°C Ta= 25°C
Ta= -25°C
0.1
REVERSE DRAIN CURRENT : Is [A]
0.01
0.2 0.4 0.6 0.8 1.0 1.2
SOURCE-DRAIN VOLTAGE : VSD [V]
Fig.9 Reverse Drain Current vs. Sourse-Drain Voltage
Data Sheet
Ta=125°C Ta=75°C Ta=25°C Ta= -25°C
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○c 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.B
Page 4
ES6U41
<Di>
]
Ω
(ON)[m
DS
RESISTANCE : R
STATIC DRAIN-SOURCE ON-STATE
CAPACITANCE : C [pF]
1000
800
600
400
200
0
0246810
GATE-SOURCE VOLTAGE : VGS[V]
Fig.10 Static Drain-Source On-State Resistance vs. Gate Source Voltage
1000
100
Crss
10
1
0.01 0.1 1 10 100
DRAIN-SOURCE VOLTAGE : V
Fig.13 Typical Capacitance vs. Drain-Source Voltage
ID= 1.50A
ID= 0.75A
Coss
Ciss
Ta=25°C Pulsed
Ta=25°C f=1MHz V
GS
=0V
Data Sheet
1000
100
10
SWITCHING TIME : t [ns]
1
0.01 0.1 1 10
[V]
DS
td(off)
td(on)
DRAIN-CURRENT : ID[A]
Fig.11 Switching Characteris tics
Ta=25°C V
= 15V
DD
= 4.5V
V
GS
R
=10Ω
G
Pulsed
t
f
t
r
5
[V]
4
GS
3
2
1
GATE-SOURCE VOLTAGE : V
0
00.511.52
TOTAL GATE CHARGE : Qg [nC]
Fig.12 Dynamic Input Characteristics
Ta=25°C V
= 15V
DD
= 1.5A
I
D
=10Ω
R
G
Pulsed
(A)
F
:IR (A)
100000
10000
1000
100
pulsed
Ta = 75
℃
Ta = 25
℃
10
Ta= - 2 5
1
℃
1
pulsed
(A)
F
0.1
Ta = 75
℃
Ta = 25
℃
Ta= - 25
0.01
℃
0.1
REVERSE CURRENT : I
0.01
0 5 10 15 20 25
REVERSE VOLTAGE : VR[V]
Fig.1 Reverse Current vs. Reverse Voltage
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FORWARD CURRENT : I
0.001
0 0.1 0.2 0.3 0.4 0.5 0.6
FORWARD VOLTAGE : V
Fig.2 Forward Current vs. Forward Voltage
F
[V]
2012.02 - Rev.B
Page 5
Notes
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