5
EN27LV020 / EN27LV020B
READ MODE
The EN27LV020 / EN27LV020B has two contr ol funct ions, both of whic h must be logic ally
satisfi ed in order to obtain data at the out puts. Chip Enable (
CE) is the power control and
should be used for device selection. Output Enable (
OE) is the output c ontrol and should be
used to gate data to the output pins, independent of device selec tion. Assuming that
addresses are stable, address access time (t
ACC
) is equal to t he delay from CE to output
(t
CE
). Data is avail able at the outputs (tOE) after the falling edge of OE, assuming the CE
has been LOW and addr esses hav e been stable for at least t
ACC
- tOE.
STANDBY MODE
The EN27LV020 / EN27LV020B has CMO S standby mode which reduces the m aximum V
CC
current to 10µA. It is placed in CMOS standby when CE is at VCC ± 0.3 V. The E N27LV 020
/ EN27LV020B also has a TTL- standby mode which reduces the m aximum V
CC
current to 0. 6
mA. I t is placed in TTL-standby when
CE is at VIH. When in standby mode, the outputs are
in a high-impedance state, independent of the
OE input.
TWO-LINE OUT PUT CONTROL FUNCTION
To accommodate multiple memor y c onnec tions, a two-line control functi on is provided to
allow for:
1. Low memory power dissipat ion,
2. Assurance that output bus contention will not occur.
It is recommended that
CE be decoded and used as the primary device-sel ec tion func tion,
while
OE be made a common connection to all devices in the array and c onnec ted to the
READ line from the system control bus. This assures that all desel ec ted mem or y devic es are in
their l ow-power standby m ode and that the output pins are only active when data is desired
from a particular memory dev ice.
SYSTEM CONSIDERATIONS
During the switch bet ween active and standby c onditions, t r ansi ent current peaks are produced
on the rising and falling edges of Chip Enable. The magnitude of these transient cur r ent peaks
is dependent on the output c apac itance loading of the devic e. At a minimum, a 0.1µF ceramic
capacitor ( high frequency , low inherent inductance) should be used on each device bet ween
VCC and VSS to minimize t r ansi ent effects. In additi on, to overcome the voltage drop caused
by the induct ive eff ec ts of the pri nted circuit board traces on EPRO M ar r ay s, a 4.7µF bulk
electrolytic capac itor should be used between V
CC
and VSS for each eight dev ices. The loc ation
of the capac itor should be cl ose to where the power supply is connected to the ar r ay .