Datasheet EMIF4100 Datasheet (Protekdevices)

Page 1
EMIF4100
105193.R0 8/03 www.protekdevices.com
EMI FILTER/TVS ARRAY
Only One Name Means ProTek’Tion™
APPLICATIONS
Cellular PhonesColor Display PanelNotebooksPersonal Digital Assistant (PDA)Ground Positioning System (GPS)SMART Cards
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV61000-4-4 (EFT): 40A - 5/50ns
FEATURES
ESD Protection > 25 kilovoltsBidirectional EMI Filtering/TVS Low Pass FiltersLow Insertion Loss: -3db Roll-Off @ 132MHzProtects Up to Four(4) Data Lines
MECHANICAL CHARACTERISTICS
Flip Chip PackageWeight 0.73 milligrams (Approximate)Flammability rating UL 94V-08mm Tape and Reel Per EIA Standard 481
05193
PIN CONFIGURATION
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EMIF4100
DEVICE CHARACTERISTICS
FIGURE 1
RESISTANCE VS TEMPERATURE
(Normalized to Resistance at 25°C)
Temperature °C
0.900
Normalized Resistance
1.100
1.060
1.020
0.940
0.980
-40 -20 0 20 40 60 80 100
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
Operating Temperature
SYMBOL VALUE
-55°C to 150°C
°C
°C
-40°C to 85°C
UNITS
T
J
T
STG
PARAMETER
Storage Temperature DC Power Per Resistor mW400P Typical Resistance @ ± 20% OHMS100R
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PA RT
NUMBER
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
MAXIMUM REVERSE
LEAKAGE
CURRENT
@ 3V
I
D
µA
TYPICAL
FORWARD
VOLTAGE
@10mA
V
F
VOLTS
TYPICAL
CAPACITANCE
PER LINE
(See Note 1)
@2.5V, 1 MHz
C
pF
EMIF4100 6.0 0.1 0.8
30
CUT-OFF
FREQUENCY
(50 Ohms I/O
ZERO BIAS)
fc
MHz
132
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
5.0
MINIMUM
ATTENUATION
@
800-3000 MHz
dB
28
Note 1: 42pF @ 0V, 1MHz, ±20% tolerance.
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EMIF4100
GRAPHS
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0123456
VR - Reverse Voltage - Volts
C
j
- Capacitance (Normalized) - pF
FIGURE 2
CAPACITANCE VS REVERSE VOLTAGE
(Normalized to Capacitance at 2.5V DC & 25°C
-35
-30
-25
-20
-15
-10
-5
0
0.1 1 10 100 1000 10000
FIGURE 3
INSERTION LOSS - EMIF4100
(TA = 25°C, DC Bias = 0V, 50 Ohm Environment)
Gain (dB)
Frequency (MHz)
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EMIF4100
FIGURE 5
RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
FIGURE 6
SOLDER REFLOW PROFILE
0.275mm Round Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round 50/50 By Volume No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm 60 Seconds 240°C
Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
225°C
5-10 sec
Instantaneous
to 200°C
Soldering
Time
Cool Down
Time
1-2 Minutes
to 150°C
1-2 Minutes to 25°C
Pre-Heat
Time
100°C
200°C
Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material.
APPLICATION INFORMATION
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EMIF4100
COPYRIGHT © ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
PACKAGE OUTLINE & DIMENSIONS
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
A
B
C
G
H
I
J
2.362
1.173
0.495
0.180
0.495
0.064
0.356
0.093
0.0462
0.0195
0.0071
0.0195
0.0025
0.014
DIM
MILLIMETERS INCHES
PACKAGE DIMENSIONS
PACKAGE OUTLINE
2.413
1.250
0.505
0.280
0.505
0.102
0.457
0.095
0.0492
0.0199
0.0110
0.0199
0.004
0.018
MIN MINMAX
MAX
NOTE:
1. Controlling dimensions in millimeters.
12345
O
G
I
O
OO
G
I
I
I
A
C
G
H
J
I
B
0.30 DIA. 63/37 Sn/Pb Solder Bumps
BOTTOM VIEW
SIDE VIEW
TAPE & REEL SPECIFICATIONS
PART NUMBER CHI P SIZ E (mm )
POCKET SIZE (mm)
B
0
x A0 x K
0
TAPE WIDTHWREEL
DIAMETER
QTY PER
REEL
P
0
P
1
EMIF4100 2.96 x 1.33 x 0.6 3.18 x 1.52 x 0.76 8mm 7 5,000 4mm 4mm
Top Cover Tape
For Tape Feeder Reference Only Including Draft Concentric Around B
K
0
P
0
A
0
P
1
Embossment
B
0
Direction of Feed
10 Pitches Cumulative Tolerance On Tape ±0.2mm
W
Outline & Dimensions: Rev 0 - 8/03, 60xx
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA-481.
2. Suffix-T75-1 = 7 Inch Reel - 5,000 pieces per 8mm reel, i.e.,
EMIF4100-T7.
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