Datasheet EM6K1 Datasheet (ROHM)

Page 1
Transistor
e
e
2.5V Drive Nch+Nch MOS FET
EM6K1
zStructure Silicon N-channel MOS FET
zFeatures
1) Two 2SK3019 transistors in a single EMT package.
2) The MOS FET elements are independent, eliminating mutual interference.
3) Mounting cost and area can be cut in half.
4) Low on-resistance.
5) Low voltage drive (2.5V) makes this device i deal for portable equipment.
zApplications Interfacing, switching (30V, 100mA)
zPackaging specifications zEquivalent circuit
Taping
T2R
8000
Type EM6K1
Package Code
Basic ordering unit (pieces)
zAbsolute maximum ratings (Ta=25°C) <It is the same ratings for Tr1 and T r2.>
Parameter Drain−source voltage Gate−source voltage
Drain current
Total power dissipation
Channel temperature Storage temperature
∗1 Pw≤10µs, Duty cycle≤1% ∗2 With each pin mounted on the recommended lands.
Continuous Pulsed
Symbol
DSS
V VGSS
D
I
IDP
PD
Tch
Tstg
∗
1
∗
2
Limits Unit
30
±20 ±100 ±400
150
150
−55 to +150
zExternal dimensions (Unit : mm)
EMT6
1.6
1.0
0.5
0.5
(5)
(6)
(4)
1.2
1.6
(2)
(1)
1pin mark
(3)
0.22
Each lead has same dimensions
Abbreviated symbol : K1
Gate Protection Diode ∗
Tr1
Tr2
∗ Gate Protection
(1)
∗ A protection diode has been built in between the gate and
the source to protect against static electricity when the product is in use. Use the protection circuit when rated voltages are exceeded.
V
V mA mA
mW / TOTAL
mW / ELEMENT120
°C °C
Diode
(2) (3)
0.13
EM6K1
0.5
(4)(5)(6)
(1)Tr1 Sourc (2)Tr1 Gate (3)Tr2 Drain (4)Tr2 Sourc (5)Tr2 Gate (6)Tr1 Drain
Rev.C 1/3
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Transistor
5
s
s
)
0
.
5
)
5
)
0
zElectrical characteristics (T a=25°C) <It is the same characteristics for Tr1 and Tr2.>
Parameter Symbol
GSS
Gate−source leakage Drain−source breakdown voltage
Zero gate voltage drain current
Gate threshold voltage
Static drain−source on−starte resistance
Forward transfer admittance
Input capacitance Output capacitance Reverse transfer capacitance Turn−on delay time Rise time Turn−off delay time Fall time
I
V
(BR)DSS
I
V
R
DS(on)
R
DS(on)
Y
C C C
d(on)
t
d(off)
t
DSS
GS(th)
fs
iss
oss
rss
r
t
f
t
zElectrical characteristic curves
0.15
(A)
D
0.1
0.05
DRAIN CURRENT : I
4V
0
01234
DRAIN-SOURCE VOLTAGE : V
3V
3.5V
2.5V
2V
VGS=1.5V
DS
Fig.1 Typical Output Characteristic
(V)
200m 100m
50m
(A)
D
20m 10m
5m 2m
1m
0.5m
DRAIN CURRENT : I
0.2m
0.1m
Fig.2 Typical Transfer Characteristic
50
) (Ω)
(on
DS
Ta=125
−25
°C
75
°C
25
°C
°C
20
10
5
V
GS
Pulsed
=4V
(on) (Ω)
DS
Typ. Max. Unit Conditions
Min.
GS
=
±20V, V
DS
=
−
−
±1
µAV
30
0.8
20
04
50
20
10
−
−
−
−
1.0
−
1.5
−
5 713
−
13
−
9
−
4
−
15
−
35
−
80
−
80
−
V
DS
=3V
Pulsed
1
75°C 25°C
−25°C
2
GATE-SOURCE VOLTAGE : V
Ta=125°C
5
−
8
−
−
−
−
−
−
−
−
Ta=125°C
75°C 25°C
−25°C
µA
Ω Ω
mS
pF pF pF
ns ns ns ns
3
V
V
GS
V
Pulsed
(V)
GS
I V V I I V
V V f
I V R
R
=2.5V
D
=
10µA, V
DS
=
DS
=
D
=
10mA, V
D
=
1mA, V
DS
=
DS
=
GS
=
=
1MHz
D
=
10mA, V
GS
=
L
=
500Ω
G
=
10Ω
30V, V 3V, I
3V, I 5V
0V
5V
0V
GS
=
0V
GS
=
0V
D
=
100µA
GS
=
4V
GS
=
2.5V
D
=
10mA
DD
5V
2
(th) (V
GS
1.5
1
0.5
GATE THRESHOLD VOLTAGE : V
0
−25 25 50 75 100 125 15
−50 0
CHANNEL TEMPERATURE : Tch (°C)
Fig.3 Gate Threshold Voltage vs
Channel Temperature
15
) (Ω)
(on
DS
10
EM6K1
V
DS
=3V
I
D
=0.1mA
Ta=25
°C
Pulsed
2
1
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
0.5
0.001
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0. DRAIN CURRENT : I
Fig.4 Static Drain-Source On-State
Resistance vs. Drain Current (Ι
D
(A)
2
1
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
0.5
0.001
0.002 0.005 0.01 0.02 0.05 0.1 0.2 0. DRAIN CURRENT : I
Fig.5 Static Drain-Source On-State
Resistance vs. Drain Current (ΙΙ
D
(A)
Rev.C 2/3
5
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
0
0 5 10 15 2
GATE-SOURCE VOLTAGE : V
Fig.6 Static Drain-Source On-State
Resistance vs. Gate-Source Voltage
ID=0.1A
ID=0.05A
GS
(
V)
Page 3
Transistor
0
te
.5
e
.5
.
.5
.
)
0
0
S
9
8
) (Ω)
7
(on
DS
6 5 4 3 2 1
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
0
−50
Fig.7 Static Drain-Source On-Sta
ID=100mA
ID=50mA
0
50 75 100 125
−25
CHANNEL TEMPERATURE : Tch (
25 15
Resistance vs.
Channel Temperature
VGS=4V Pulsed
°C)
0.5
0.2
0.1
0.05
⏐ Yfs ⏐(S)
0.02
0.01
0.005
FORWARD TRANSFER
ADMITTANCE :
0.002
0.001
0.0001
0.0002 0.0005 0.001 0.002 0.005 0.01 0.02 0.05
Fig.8 Forward Transfer Admittanc
200m
(A)
100m
DR
50m 20m
V
GS
=4V
10m
5m 2m
1m
0.5m
REVERCE DRAIN CURRENT : I
0.2m
0.1m
SOURCE-DRAIN VOLTAGE : V
Fig.10 Reverse Drain Current vs
0V
10.50
Source-Drain Voltage (ΙΙ
Ta=25°C Pulsed
SD
(V)
1
50
20
10
5
2
CAPACITANCE : C (pF)
1
0.5
0.1
0.2 0.5 1 2 5 10 20 5
DRAIN-SOURCE VOLTAGE : V
Fig.11 Typical Capacitance vs.
zSwitching characteristics measurement circuits
Ta=−25°C
25°C 75°C
125°C
DRAIN CURRENT : I
vs. Drain Current
Drain-Source Voltage
Pulse Width
D
(A)
Ta=25
f=1MH VGS=0V Pulsed
C
DS
V
DS
Pulsed
0.1 0.2 0
°C
Z
C
iss
oss
C
rss
(V)
200m
=3V
(A)
100m
DR
50m 20m
10m
5m 2m
1m
0.5m
REVERCE DRAIN CURRENT : I
0.2m
0.1m
SOURCE-DRAIN VOLTAGE : V
Fig.9 Reverse Drain Current vs
1000
500
200 100
50
20
t
d(on)
10
SWITHING TIME : t (ns)
5
2
0.2 0.5 1 2 5 10 20 50
0.1
Fig.12 Switching Characteristics
EM6K1
Ta=125°C
−25°C
10.50
Source-Drain Voltage (Ι)
t
f
t
d(off)
t
r
DRAIN CURRENT : I
D
(mA)
V
Pulsed
75°C 25°C
SD
Ta=25°C
VDD=5V V
GS
R
G
GS
=0V
(V)
=5V
=10Ω
1
10
GS
V
V
GS
R
G
Fig.13 Switching Time Test Circuit
Rev.C 3/3
D
I
D.U.T.
V
D
R
L
V
DD
V
DS
50%
10%
10%
90%
t
r
t
d(on)
t
on
Fig.14 Switching Time Waveforms
90%
t
d(off)
50%
10%
90%
t
f
t
off
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Appendix
No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design.
Notes
The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control Order in Japan. In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause) on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.1
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