Datasheet EM638165 Datasheet

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EtronTech
EM638165
Preliminary (Rev 0.6, 2/2001)
Features
Fast access time from clock: 5/6/6/6/7 ns
•
Fast clock rate: 166/143/133/125/100 MHz
•
Fully synchronous operation
•
Internal pipelined architecture
•
1M word x 16-bit x 4-bank
•
Programmable Mode registers
•
- CAS# Latency: 2, or 3
- Burst Length: 1, 2, 4, 8, or full page
- Burst Type: interleaved or linear burst
- Burst stop function Auto Refresh and Self Refresh
•
4096 refresh cycles/64ms
•
CKE power down mode
•
Single +3.3V ± 0.3V power supply
•
Interface: LVTTL
•
54-pin 400 mil plastic TSOP II package
•
Overview
The EM638165 SDRAM is a high-speed CMOS synchronous DRAM containing 64 Mbits. It is internally configured as 4 Banks of 1M word x 16 DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of a BankActivate command which is then followed by a Read or Write command.
The EM638165 provides for programmable Read or Write burst lengths of 1, 2, 4, 8, or full page, with a burst termination option. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. The refresh functions, either Auto or Self Refresh are easy to use.
By having a programmable mode register, the system can choose the most suitable modes to maximize its performance. These devices are well suited for applications requiring high memory bandwidth and particularly well suited to high performance PC applications.
Pin Assignment (Top View)
VDD
DQ0
VDDQ
DQ1 DQ2
VSSQ
DQ3 DQ4
VDDQ
DQ5 DQ6
VSSQ
DQ7
VDD
LDQM
WE# CAS# RAS#
CS# BA0 BA1
A10/AP
A0 A1 A2 A3
VDD
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28
VSS DQ15 VSSQ DQ14 DQ13 VDDQ DQ12 DQ11 VSSQ DQ10 DQ9 VDDQ DQ8 VSS NC/RFU UDQM CLK CKE NC A11 A9 A8 A7 A6 A5 A4 VSS
Key Specifications
EM638165
Clock Cycle time(min.)
t
CK3
Access time from CLK(max.)
t
AC3
Row Active time(max.)
t
RAS
Row Cycle time(min.)
t
RC
-
6/7/7.5/8/10
6/7/7.5/8/10 ns
5/5.4/5.4/6/7 ns 42/45/45/48/50 ns 60/63/68/70/80 ns
Ordering Information
Part Number Frequency
EM638165TS-6 EM638165TS-7 EM638165TS-7.5
166MHz TSOP II 143MHz TSOP II
133MHz TSOP II EM638165TS-8 125MHz TSOP II EM638165TS-10 100MHz TSOP II
Package
Etron Technology, Inc.
No. 6, Technology Rd. V, Science-Based Industrial Park, Hsinchu, Taiwan 30077, R.O.C. TEL: (886)-3-5782345 FAX: (886)-3-5778671
Etron Technology, Inc., reserves the right to make changes to its products and specifications without notice.
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EtronTech
Block Diagram
CLOCK
CKE
CS# RAS# CAS#
WE#
UDQM
LDQM
COMMAND
CLOCK
CLOCL
BUFFER
BUFFER
DECODER
COLUMN
COUNTER
EM638165
1MX16
CELL ARRAY
Decoder
CONTROL
SIGNAL
GENERATOR
(BANK #A)
Column Decoder
Buffer
DQ0
|
DQ15
A0
~
A11 BA0 BA1
ADDRESS
BUFFER
REFRESH
COUNTER
MODE
REGISTER
1MX16
CELL ARRAY
Decoder
(BANK #B)
Column Decoder
1MX16
CELL ARRAY
Decoder
(BANK #C)
Column Decoder
1MX16
CELL ARRAY
Decoder
(BANK #D)
Preliminary
2
Column Decoder
Rev 0.6 Feb. 2001
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EtronTech
CLK is driven by the system clock. All SDRAM input signals are
nal burst
CKE activates(HIGH) and deactivates(LOW) the CLK signal. If
up and hold time same as other
the next clock cycle and the state of output and burst address is frozen as long as the CKE remains low. When all banks are in the idle state, deactivating the clock controls the entry to the Power
ter the device enters Power Down and Self Refresh modes, where CKE becomes asynchronous until exiting the same mode. The input buffers, including CLK, are disabled during Power Down and Self Refresh modes, providing low
A11 are sampled during the BankActivate command (row
A7 with A10 defining Auto Precharge) to select one location out of the 2M available in the respective bank. During a Precharge command, A10 is sampled to determine if
dress inputs also provide
CS# enables (sampled LOW) and disables (sampled HIGH) the
command decoder. All commands are masked when CS# is sampled HIGH.
lection on systems with multiple banks. It is
The RAS# signal defines the operation commands in
conjunction with the CAS# and WE# signals and is latched at the positive edges
RAS# and CS# are asserted "LOW" and CAS# is asserted "HIGH," either the BankActivate command or the Precharge command is selected by the WE# signal. When the WE# is asserted "HIGH," the
ned on to the active state. When the WE# is asserted "LOW," the Precharge command is selected and the bank designated by BS is switched to the idle state after the
n commands in conjunction with the RAS# and WE# signals and is latched at the positive edges of CLK. When RAS# is held "HIGH" and CS# is asserted "LOW," the column access is started by asserting CAS# "LOW." Then, the Read or Write command
EM638165
Pin Descriptions
Symbol Type Description
CLK Input
CKE Input
BA0,BA1 Input
Table 1. Pin Details of EM638165
Clock:
sampled on the positive edge of CLK. CLK also increments the inter counter and controls the output registers.
Clock Enable:
CKE goes low synchronously with clock(set­inputs), the internal clock is suspended from
Down and Self Refresh modes. CKE is synchronous except af
standby power.
Bank Select:
BA0,BA1 input select the bank for operation.
BA1 BA0 Select Bank
0 0 BANK #A 0 1 BANK #B 1 0 BANK #C 1 1 BANK #D
A0-A11 Input
CS# Input
RAS# Input
CAS# Input
Address Inputs:
address A0-A11) and Read/Write command (column address A0-
all banks are to be precharged (A10 = HIGH). The ad the op-code during a Mode Register Set command.
Chip Select:
CS# provides for external bank se considered part of the command code.
Row Address Strobe:
of CLK. When
BankActivate command is selected and the bank designated by BS is tur
precharge operation.
Column Address Strobe:
A0-
The CAS# signal defines the operatio
Preliminary
3
is selected by asserting WE# "LOW" or "HIGH."
Rev 0.6 Feb. 2001
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EtronTech
EM638165
The WE# signal defines the operation commands in conjunction
with the RAS# and CAS# signals and is latched at the positive edges of CLK.
mand and
15 input and output data are synchronized with the positive
WE# Input
LDQM, UDQM
DQ0-DQ15
NC/RFU -
V
DDQ
V
SSQ
V
DD
V
SS
Input
Input /
Output
Supply
Supply
Supply Supply
Write Enable:
The WE# input is used to select the BankActivate or Precharge com Read or Write command.
Data Input/Output Mask:
Input data in write mode.
Data I/O:
edges of CLK. The I/Os are maskable during Reads and Writes.
No Connect: DQ Power:
( 3.3V± 0.3V )
DQ Ground:
( 0 V )
Power Supply: Ground
The DQ0-
These pins should be left unconnected.
Provide isolated power to DQs for improved noise immunity.
Provide isolated ground to DQs for improved noise immunity.
+3.3V ± 0.3V
Controls output buffers in read mode and masks
Preliminary
4
Rev 0.6 Feb. 2001
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EM638165
Operation Mode
Fully synchronous operations are performed to latch the commands at the positive edges of CLK.
Table 2 shows the truth table for the operation commands.
Table 2. Truth Table (Note (1), (2) )
BankActivate BankPrecharge PrechargeAll Write Write and AutoPrecharge Read Read and Autoprecharge Mode Register Set No-Operation Burst Stop Device Deselect AutoRefresh SelfRefresh Entry SelfRefresh Exit
Clock Suspend Mode Entry Power Down Mode Entry
Clock Suspend Mode Exit Power Down Mode Exit
Data Write/Output Enable Data Mask/Output Disable
Note:
1. V=Valid X=Don't Care L=Low level H=High level
2. CKEn signal is input level when commands are provided.
3. These are states of bank designated by BS signal.
4. Device state is 1, 2, 4, 8, and full page burst operation.
5. Power Down Mode can not enter in the burst operation. When this command is asserted in the burst cycle, device state is clock suspend mode.
Command State CKE
(3)
Idle
Any H X X V L X L L H L Any H X X X H
(3)
Active
(3)
Active
(3)
Active
(3)
Active
Idle H X X OP code L L L L Any H X X X X
(4)
Active
Any H X X X X Idle H H X X X Idle H L X X X Idle L H X X X
(SelfRefresh)
Active
(5)
Any
Active
Any L H X X X
(PowerDown)
Active Active
CKE
signal is input level one clock cycle before the commands are provided.
n-1
n-1
CKE
DQM BA
n
0,1
A
10
A
0-9,11
CS# RAS# CAS# WE#
H X X V Row address L L H H
X L L H L H X X V L L H L L H X X V H H X X V L L H L H H X X V H
Column address
(A0 ~ A7)
Column address
(A0 ~ A7)
L H L L
L H L H
X L H H H H X X X X
X L H H L
X H
X X X X L L L H X L L L H
H L X X X H L X X X
X H
X X X H
X X X
L H H H
X X X
X X X
L H H H
L H X X X
H X L X X H X H X X
X X X H
X X X X
X X X
X X X
L H H H
X X X
X X X
Preliminary
5
Rev 0.6 Feb. 2001
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EtronTech
EM638165
Commands
1 BankActivate (RAS# = "L", CAS# = "H", WE# = "H", BAs = Bank, A0-A11 = Row Address)
The BankActivate command activates the idle bank designated by the BA0,1 signals. By
latching the row address on A0 to A11 at the time of this command, the selected row access is initiated. The read or write operation in the same bank can occur after a time delay of t from the time of bank activation. A subsequent BankActivate command to a different row in the same bank can only be issued after the previous active row has been precharged (refer to the following figure). The minimum time interval between successive BankActivate commands to the same bank is defined by tRC(min.). The SDRAM has four internal banks on the same chip and shares part of the internal circuitry to reduce chip area; therefore it restricts the back-to-back activation of the four banks. t different banks. After this command is used, the Write command and the Block Write command perform the no mask write operation.
(min.) specifies the minimum time required between activating
RRD
T0 T 1 T2 T3 Tn+3 Tn+4 Tn+5 Tn+6
RCD
(min.)
CLK
ADDRESS
COM M A ND
Bank A
Row Addr.
Bank A
Activate
RAS# - CAS# delay (tRCD)
: "H" or "L"
BankActivate Command Cycle
2 BankPrecharge command
(RAS# = "L", CAS# = "H", WE# = "L", BAs = Bank, A10 = "L", A0-A9 and A11 = Don't care)
The BankPrecharge command precharges the bank disignated by BA signal. The precharged bank is switched from the active state to the idle state. This command can be asserted anytime after t
(min.) is satisfied from the BankActivate command in the desired bank. The maximum time any
RAS
bank can be active is specified by t in any active bank within t state and is ready to be activated again.
3 PrechargeAll command
(RAS# = "L", CAS# = "H", WE# = "L", BAs = Don’t care, A10 = "H", A0 -A9 and A11 = Don't care)
The PrechargeAll command precharges all banks simultaneously and can be issued even if all banks are not in the active state. All banks are then switched to the idle state.
NOP
..............
NOP
Bank A
Col Addr.
R/W A with
AutoPrecharge
RAS# Cycle time (tRC)
..............
..............
(Burst Length = n, CAS# Latency = 3)
(max.). Therefore, the precharge function must be performed
RAS
(max.). At the end of precharge, the precharged bank is still in the idle
RAS
Bank B
Row Addr.
Bank B
Activate
AutoPrecharge
Begin
RAS# - RAS# delay time (tRRD)
NOP
NOP
Row Addr.
Bank A
Bank A
Activate
4 Read command
(RAS# = "H", CAS# = "L", WE# = "H", BAs = Bank, A10 = "L", A0-A7 = Column Address)
The Read command is used to read a burst of data on consecutive clock cycles from an active row in an active bank. The bank must be active for at least t issued. During read bursts, the valid data-out element from the starting column address will be available following the CAS# latency after the issue of the Read command. Each subsequent data­out element will be valid by the next positive clock edge (refer to the following figure). The DQs go into high-impedance at the end of the burst unless other command is initiated. The burst length, burst sequence, and CAS# latency are determined by the mode register, which is already programmed. A full-page burst will continue until terminated (at the end of the page it will wrap to column 0 and continue).
Preliminary
6
(min.) before the Read command is
RCD
Rev 0.6 Feb. 2001
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CLK
EM638165
T0 T 1 T2 T3 T4 T5 T6 T7 T8
COMMAND
CAS# latency=2 t
, DQ's
CK2
CAS # latency=3 t
, DQ's
CK3
(i.e. DQM latency is two clocks for output buffers). A read burst without the auto precharge function may be interrupted by a subsequent Read or Write command to the same bank or the other active bank before the end of the burst length. It may be interrupted by a BankPrecharge/ PrechargeAll command to the same bank too. The interrupt coming from the Read command can occur on any clock cycle following a previous Read command (refer to the following figure).
CLK
COMMAND
CAS# latency=2 t
, DQ's
CK2
CAS# latency=3 t
, DQ's
CK3
READ A NOP
NOP NOP NOP NOP NOP NOP NOP
DOUT A
DOUT A
0
DOUT A0DOUT A
DOUT A2DOUT A
1
DOUT A2DOUT A
1
3
3
Burst Read Operation
(Burst Length = 4, CAS# Latency = 2, 3)
The read data appears on the DQs subject to the values on the DQM inputs two clocks earlier
T0 T 1 T2 T3 T4 T5 T6 T7 T8
READ A READ B NOP NOP NOP NOP NOP NOP NOP
DOUT A0DOUT B
DOUT A0DOUT B
DOUT B1DOUT B
0
DOUT B1DOUT B
0
DOUT B
2
3
DOUT B
2
3
from a Write command. The DQMs must be asserted (HIGH) at least two clocks prior to the Write command to suppress data-out on the DQ pins. To guarantee the DQ pins against I/O contention, a single cycle with high-impedance on the DQ pins must occur between the last read data and the Write command (refer to the following three figures). If the data output of the burst read occurs at the second clock of the burst write, the DQMs must be asserted (HIGH) at least one clock prior to the Write command to avoid internal bus contention.
CLK
DQM
COM M AND
DQ's
: "H" or "L"
Read Interrupted by a Read
(Burst Length = 4, CAS# Latency = 2, 3)
The DQM inputs are used to avoid I/O contention on the DQ pins when the interrupt comes
T0 T 1 T2 T3 T4 T5 T6 T7 T8
NOP
READ A NOP NOP NOP NOP WRIT E B NOP NOP
DOUT A
Read to Write Interval
0
Must be Hi-Z before the Write Command
(Burst Length ≥ 4, CAS# Latency = 3)
DINB
0
DINB
DINB
1
2
Preliminary
7
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EM638165
T0 T 1 T2 T3 T4 T5 T6 T7 T8
CLK
DQM
COMMAND
CAS# latency=2 t
, DQ's
CK2
: "H" or "L"
CLK
DQM
COMMAND
CAS# latency=2 t
, DQ's
CK2
: "H" or "L"
1 Clk Interval
NOP NOP NOP NOP NOP NOP
Read to Write Interval
T0 T 1 T2 T3 T4 T5 T6 T7 T8
NOP
NOP
BANKA
ACTIVATE
READ A
(Burst Length ≥ 4, CAS# Latency = 2)
NOP WRITE B NOP NOP NOP
READ A
NOP
WRIT E A
DIN A
DIN B
DIN A
0
0
DIN B
1
1
DIN A
DIN B
DIN A
2
DIN B
2
3
3
Read to Write Interval
CLK
ADDRESS
COMMAND
CAS # latency=2 t
CK2
CAS # latency=3 t
CK3
A read burst without the auto precharge function may be interrupted by a BankPrecharge/ PrechargeAll command to the same bank. The following figure shows the optimum time that BankPrecharge/ PrechargeAll command is issued in different CAS# latency.
T0 T 1 T2 T3 T4 T5 T6 T7 T8
Bank,
Col A
READ A
, DQ's
, DQ's
NOP
Read to Precharge
5 Read and AutoPrecharge command
(RAS# = "H", CAS# = "L", WE# = "H", BAs = Bank, A10 = "H", A0-A7 = Column Address)
The Read and AutoPrecharge command automatically performs the precharge operation after the read operation. Once this command is given, any subsequent command cannot occur within a time delay of {tRP(min.) + burst length}. At full-page burst, only the read operation is performed in this command and the auto precharge function is ignored.
(Burst Length ≥ 4, CAS# Latency = 2)
Bank(s)
NOP Precharge
DOUT A
NOP
DOUT A
0
DOUT A
DOUT A
1
DOUT A
0
(CAS# Latency = 2, 3)
Bank,
tRP
NOP
DOUT A
2
DOUT A
1
NOP
3
DOUT A
2
Row
Activate
3
NOP
Preliminary
8
Rev 0.6 Feb. 2001
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EtronTech
6 Write command
(RAS# = "H", CAS# = "L", WE# = "L", BAs = Bank, A10 = "L", A0-A7 = Column Address)
The Write command is used to write a burst of data on consecutive clock cycles from an active row in an active bank. The bank must be active for at least t issued. During write bursts, the first valid data-in element will be registered coincident with the Write command. Subsequent data elements will be registered on each successive positive clock edge (refer to the following figure). The DQs remain with high-impedance at the end of the burst unless another command is initiated. The burst length and burst sequence are determined by the mode register, which is already programmed. A full-page burst will continue until terminated (at the end of the page it will wrap to column 0 and continue).
CLK
EM638165
(min.) before the Write command is
RCD
T0 T 1 T2 T3 T4 T5 T6 T 7 T8
COM M A ND
DQ0 - DQ3
BankPrecharge/PrechargeAll, or Read command before the end of the burst length. An interrupt coming from Write command can occur on any clock cycle following the previous Write command (refer to the following figure).
CLK
COM MAND
DQ's
issued one cycle after the clock edge in which the last data-in element is registered. In order to avoid data contention, input data must be removed from the DQs at least one clock cycle before the first read data appears on the outputs (refer to the following figure). Once the Read command is registered, the data inputs will be ignored and writes will not be executed.
NOP WRITE A
DIN A
0
The first data element and the write are registered on the same clock edge.
NOP NOP
DIN A
Burst Write Operation
NOP
DIN A
1
DIN A
2
3
Extra data is masked.
NOP
don't care
(Burst Length = 4, CAS# Latency = 1, 2, 3)
NOP
NOP
NOP
A write burst without the auto precharge function may be interrupted by a subsequent Write,
T0 T 1 T2 T3 T4 T5 T6 T 7 T8
NOP WRITE A
1 Clk Interval
DIN A
WRITE B NOP
DIN B
0
NOP
DIN B
0
NOP
DIN B
1
DIN B
2
3
NOP
NOP
NOP
Write Interrupted by a Write
The Read command that interrupts a write burst without auto precharge function should be
(Burst Length = 4, CAS# Latency = 1, 2, 3)
T0 T 1 T2 T3 T4 T5 T6 T7 T8
CLK
COMMAND
CAS# latency=2 t
, DQ's
CK2
CAS# latency=3 t
, DQ's
CK3
NOP WRIT E A
Write Interrupted by a Read
Preliminary
9
READ B NOP
DIN A
DIN A
Input data for the write is masked.
don't care
0
don't care don't care
0
NOP
NOP
DOUT B
Input data must be removed from the DQ's at least one clock cycle before the Read data appear s on the outputs to avoid data contention.
DOUT B
0
DOUT B
NOP
DOUT B
DOUT B
2
1
1
0
(Burst Length = 4, CAS# Latency = 2, 3)
Rev 0.6 Feb. 2001
NOP
DOUT B
DOUT B
NOP
3
DOUT B
2
3
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EM638165
The BankPrecharge/PrechargeAll command that interrupts a write burst without the auto precharge function should be issued m cycles after the clock edge in which the last data-in element is registered, where m equals tWR/tCK rounded up to the next whole number. In addition, the DQM signals must be used to mask input data, starting with the clock edge following the last data-in element and ending with the clock edge on which the BankPrecharge/PrechargeAll command is entered (refer to the following figure).
T0 T 1 T2 T3 T4 T5 T6
CLK
DQM
t
RP
COMMAND
WRITE
NOP
NOPPrecharge NOP NOP Activate
ADDRESS
DQ
BANK COL n
DIN
n
DIN n + 1
BANK (S)
t
WR
ROW
: don't care
Note:
The DQMs can remain low in this example if the length of the write burst is 1 or 2.
Write to Precharge
7 Write and AutoPrecharge command (RAS# = "H", CAS# = "L", WE# = "L", BAs = Bank, A10 = "H",
A0-A7 = Column Address)
CLK
COMMAND
CAS# latency=2 t
CK2
CAS# latency=3 t
CK3
The Write and AutoPrecharge command performs the precharge operation automatically after the write operation. Once this command is given, any subsequent command can not occur within a time delay of {(burst length -1) + tWR + tRP(min.)}. At full-page burst, only the write operation is performed in this command and the auto precharge function is ignored.
T0 T 1 T2 T3 T4 T5 T6 T7 T8
, DQ's
, DQ's
Bank A
Activate
NOP NOP
NOP NOP
Write A
AutoPrecharge
DIN A
0
DIN A
0
DIN A
DIN A
NOP
tDAL
1
*
tDAL
1
*
NOP
NOP
DAL= tWR + tRP
t
Burst Write with Auto-Precharge
8 Mode Register Set command (RAS# = "L", CAS# = "L", WE# = "L", A0-A11 = Register Data)
The mode register stores the data for controlling the various operating modes of SDRAM. The Mode Register Set command programs the values of CAS# latency, Addressing Mode and Burst Length in the Mode register to make SDRAM useful for a variety of different applications. The default values of the Mode Register after power-up are undefined; therefore this command must be issued at the power-up sequence. The state of pins A0~A9 and A11 in the same cycle is the data written to the mode register. One clock cycle is required to complete the write in the mode register (refer to the following figure). The contents of the mode register can be changed using the same command and the clock cycle requirements during operation as long as all banks are in the idle state.
Preliminary
10
Begin AutoPrecharge Bank can be rea ctivated at completion of
*
DAL
t
(Burst Length = 2, CAS# Latency = 2, 3)
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CLK
CKE
CS#
RAS#
CAS#
WE#
A 11
A 10
EM638165
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10
t
CK2
Clock min.
Address Key
A0-A9
DQM
tRP
Mode Register
Set Command
Any Command
(CAS# Latency = 2, 3)
DQ
Hi-Z
PrechargeAll
Mode Register Set Cycle
The mode register is divided into various fields depending on functionality.
Address BS0,1 A11,10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
Function RFU* RFU* WBL Test Mode
CAS Latency BT Burst Length
*Note: RFU (Reserved for future use) should stay “0” during MRS cycle.
Burst Length Field (A2~A0)
•
This field specifies the data length of column access using the A2~A0 pins and selects the Burst Length to be 2, 4, 8, or full page.
A2 A1 A0 Burst Length
0 0 0 1 0 0 1 2 0 1 0 4 0 1 1 8 1 0 0 Reserved 1 0 1 Reserved 1 1 0 Reserved 1 1 1 Full Page
Preliminary
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EM638165
2 words:
Burst Type Field (A3)
•
The Burst Type can be one of two modes, Interleave Mode or Sequential Mode.
A3 Burst Type
0 Sequential 1 Interleave
--- Addressing Sequence of Sequential Mode An internal column address is performed by increasing the address from the column address which
is input to the device. The internal column address is varied by the Burst Length as shown in the following table. When the value of column address, (n + m), in the table is larger than 255, only the least significant 8 bits are effective.
Data n 0 1 2 3 4 5 6 7 - 255 256 257 -
Column Address
--- Addressing Sequence of Interleave Mode A column access is started in the input column address and is performed by inverting the address
bits in the sequence shown in the following table.
Data n Data 0 A7 A6 A5 A4 A3 A2 A1 A0 Data 1 A7 A6 A5 A4 A3 A2 A1 A0# 4 words Data 2 A7 A6 A5 A4 A3 A2 A1# A0 Data 3 A7 A6 A5 A4 A3 A2 A1# A0# Data 4 A7 A6 A5 A4 A3 A2# A1 A0 Data 5 A7 A6 A5 A4 A3 A2# A1 A0# Data 6 A7 A6 A5 A4 A3 A2# A1# A0 Data 7 A7 A6 A5 A4 A3 A2# A1# A0#
Burst Length 4 words:
n n+1 n+2 n+3 n+4 n+5 n+6 n+7 - n+255 n n+1 -
8 words:
Full Page: Column address is repeated until terminated.
Column Address Burst Length
8 words
CAS# Latency Field (A6~A4)
•
This field specifies the number of clock cycles from the assertion of the Read command to the first read data. The minimum whole value of CAS# Latency depends on the frequency of CLK. The minimum whole value satisfying the following formula must be programmed into this field.
t
(min) ≤ CAS# Latency X t
CAC
A6 A5 A4 CAS# Latency
0 0 0 Reserved 0 0 1 Reserved 0 1 0 2 clocks 0 1 1 3 clocks 1 X X Reserved
Preliminary
12
CK
Rev 0.6 Feb. 2001
Page 13
EtronTech
EM638165
Test Mode field (A8~A7)
•
These two bits are used to enter the test mode and must be programmed to "00" in normal operation.
A8 A7 Test Mode
0 0 normal mode 0 1 Vendor Use Only 1 X Vendor Use Only
Write Burst Length (A9)
•
This bit is used to select the burst write length.
A9 Write Burst Length
0 Burst 1 Single Bit
9 No-Operation command
(RAS# = "H", CAS# = "H", WE# = "H")
The No-Operation command is used to perform a NOP to the SDRAM which is selected (CS#
is Low). This prevents unwanted commands from being registered during idle or wait states.
10 Burst Stop command
(RAS# = "H", CAS# = "H", WE# = "L")
The Burst Stop command is used to terminate either fixed-length or full-page bursts. This command is only effective in a read/write burst without the auto precharge function. The terminated read burst ends after a delay equal to the CAS# latency (refer to the following figure). The termination of a write burst is shown in the following figure.
T0 T 1 T2 T3 T4 T5 T6 T7 T8
CLK
COMMAND
CAS# latency=2 t
, DQ's
CK2
CAS# latency=3 t
, DQ's
CK3
READ A
NOP
NOP Burst Stop
DOUT A
0
Termination of a Burst Read Operation
T0 T 1 T2 T3 T4 T5 T6 T7 T8
NOP
DOUT A1DOUT A
DOUT A
DOUT A
0
(Burst Length ¡Ö 4, CAS# Latency = 2, 3)
NOP
The burst ends after a delay equal to the CAS# latency.
DOUT A
2
DOUT A
1
NOP
3
DOUT A
2
NOP
3
NOP
CLK
COMMAND
CAS# latency= 2, 3 DQ's
NOP WRITE A
Termination of a Burst Write Operation
Preliminary
13
DIN A
NOP Burst Stop
DIN A
0
1
NOP
DIN A
don't care
2
Input data for the Write is masked.
NOP
NOP
NOP
NOP
(Burst Length = X, CAS# Latency = 1, 2, 3)
Rev 0.6 Feb. 2001
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EtronTech
EM638165
11 Device Deselect command (CS# = "H")
12 AutoRefresh command
(RAS# = "L", CAS# = "L", WE# = "H",CKE = "H", A11 = “Don‘t care, A0 -A9 = Don't care)
13 SelfRefresh Entry command
(RAS# = "L", CAS# = "L", WE# = "H", CKE = "L", A0-A9 = Don't care)
The Device Deselect command disables the command decoder so that the RAS#, CAS#, WE# and Address inputs are ignored, regardless of whether the CLK is enabled. This command is similar to the No Operation command.
The AutoRefresh command is used during normal operation of the SDRAM and is analogous to CAS#-before-RAS# (CBR) Refresh in conventional DRAMs. This command is non-persistent, so it must be issued each time a refresh is required. The addressing is generated by the internal refresh controller. This makes the address bits a "don't care" during an AutoRefresh command. The internal refresh counter increments automatically on every auto refresh cycle to all of the rows. The refresh operation must be performed 2048 times within 32ms. The time required to complete the auto refresh operation is specified by tRC(min.). To provide the AutoRefresh command, all banks need to be in the idle state and the device must not be in power down mode (CKE is high in the previous cycle). This command must be followed by NOPs until the auto refresh operation is completed. The precharge time requirement, tRP(min), must be met before successive auto refresh operations are performed.
The SelfRefresh is another refresh mode available in the SDRAM. It is the preferred refresh mode for data retention and low power operation. Once the SelfRefresh command is registered, all the inputs to the SDRAM become "don't care" with the exception of CKE, which must remain LOW. The refresh addressing and timing is internally generated to reduce power consumption. The SDRAM may remain in SelfRefresh mode for an indefinite period. The SelfRefresh mode is exited by restarting the external clock and then asserting HIGH on CKE (SelfRefresh Exit command).
14 SelfRefresh Exit command
15 Clock Suspend Mode Entry / PowerDown Mode Entry command (CKE = "L")
16 Clock Suspend Mode Exit / PowerDown Mode Exit command (CKE= "H")
17 Data Write / Output Enable, Data Mask / Output Disable command (DQM = "L", "H")
This command is used to exit from the SelfRefresh mode. Once this command is registered, NOP or Device Deselect commands must be issued for tRC(min.) because time is required for the completion of any bank currently being internally refreshed. If auto refresh cycles in bursts are performed during normal operation, a burst of 4096 auto refresh cycles should be completed just prior to entering and just after exiting the SelfRefresh mode.
When the SDRAM is operating the burst cycle, the internal CLK is suspended(masked) from the subsequent cycle by issuing this command (asserting CKE "LOW"). The device operation is held intact while CLK is suspended. On the other hand, when all banks are in the idle state, this command performs entry into the PowerDown mode. All input and output buffers (except the CKE buffer) are turned off in the PowerDown mode. The device may not remain in the Clock Suspend or PowerDown state longer than the refresh period (64ms) since the command does not perform any refresh operations.
When the internal CLK has been suspended, the operation of the internal CLK is reinitiated from the subsequent cycle by providing this command (asserting CKE "HIGH"). When the device is in the PowerDown mode, the device exits this mode and all disabled buffers are turned on to the active state. t subsequent commands can be issued after one clock cycle from the end of this command.
During a write cycle, the DQM signal functions as a Data Mask and can control every word of the input data. During a read cycle, the DQM functions as the controller of output buffers. DQM is also used for device selection, byte selection and bus control in a memory system.
(min.) is required when the device exits from the PowerDown mode. Any
PDE
Preliminary
14
Rev 0.6 Feb. 2001
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EtronTech
EM638165
Absolute Maximum Rating
Symbol Item Rating Unit Note
P
I
OUT
OPR STG
D
OUT
DDQ
Input, Output Voltage - 1.0 ~ 4.6 V 1
Power Supply Voltage -1.0 ~ 4.6 V 1
Operating Temperature 0 ~ 70 °C 1
Storage Temperature - 55 ~ 125 °C 1
Soldering Temperature (10 second) 255 °C 1
Short Circuit Output Current 50 mA 1
VIN, V
VDD, V
T T
T
SOLDER
Recommended D.C. Operating Conditions (Ta = -40~85°C)
Symbol
V
DD
V
DDQ
V
IH
V
IL
Power Supply Voltage(for I/O Buffer)
LVTTL Input High Voltage 2.0
LVTTL Input Low Voltage - 0.3
Parameter Min. Typ. Max. Unit Note
Power Supply Voltage 3.0 3.3 3.6 V 2
Power Dissipation 1 W 1
3.0 3.3 3.6 V 2
¡Ð ¡Ð
4.6 V 2
0.8 V 2
Capacitance (VDD = 3.3V, f = 1MHz, Ta = 25°C)
Symbol Parameter Min. Max. Unit
C
I
C
I/O
Input Capacitance 2 Input/Output Capacitance
4
5 pF
6.5 pF
Note: These parameters are periodically sampled and are not 100% tested.
Preliminary
15
Rev 0.6 Feb. 2001
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EtronTech
EM638165
Recommended D.C. Operating Conditions (VDD = 3.3V ± 0.3V, Ta = 0~70°C)
- 6/7/7.5/8/10 Max.
85 3
20 15
2 3
1 30 25
100 3, 4 130 3
1
Description/Test condition Symbol
Operating Current
t
≥ tRC(min), Outputs Open
RC
Precharge Standby Current in non-power down mode
t
= 15ns, CS# ≥ VIH(min), CKE ≥ V
CK
Precharge Standby Current in non-power down mode
tCK = ∞, CLK ≤ VIL(max), CKE ≥ V
Precharge Standby Current in power down mode
IH
IH
tCK = 15ns, CKE ≤ VIL(max) Precharge Standby Current in power down mode
tCK = ∞, CKE ≤ VIL(max) Active Standby Current in non-power down mode CKE ≥ VIH(min), CS# ≥ VIH(min), tCK = 15ns Active Standby Current in non-power down mode CKE ≥ VIH(min), CLK ≤ VIL(max), tCK = ∞ Operating Current (Burst mode) t
CK =tCK
(min), Outputs Open, Multi-bank interleave Refresh Current t
≥ tRC(min)
RC
Self Refresh Current V
≥ V
- 0.2, 0V ≤ VIL ≤ 0.2V
IH
DD
Parameter
Description Min. Max. Unit Note
I
DD1
I
DD2N
I
DD2NS
I
DD2P
I
DD2PS
I
DD3N
I
DD3NS
I
DD4
I
DD5
I
DD6
Unit
mA
Note
3
I
IL
Input Leakage Current
- 1 1
A
µ
( 0V ≤ VIN ≤ VDD, All other pins not under test = 0V )
I
OL
V
OH
V
OL
Output Leakage Current
Output disable, 0V ≤ V
OUT
≤ V
DDQ
LVTTL Output "H" Level Voltage
( I
= -2mA )
OUT
LVTTL Output "L" Level Voltage
( I
= 2mA )
OUT
)
- 1 1
2.4
¡Ð
¡Ð
0.4 V
µ
V
A
Preliminary
16
Rev 0.6 Feb. 2001
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EtronTech
EM638165
Electrical Characteristics and Recommended A.C. Operating Conditions
(VDD = 3.3V
¡Ó
0.3V, Ta = -40~85°C) (Note: 5, 6, 7, 8)
Symbol
t
RC
Row cycle time
A.C. Parameter
(same bank)
t
RCD
RAS# to CAS# delay
(same bank)
t
Precharge to refresh/row activate command
RP
(same bank)
t
RRD
Row activate to row activate delay
(different banks)
t
RAS
Row activate to precharge time
(same bank)
t
WR
t
CCD
t
CK2
t
CK3
t
CH
t
CL
t
AC2
t
AC3
t
OH
t
LZ
t
HZ
t
IS
t
IH
t
PDE
Write recovery time
CAS# to CAS# Delay time
Clock cycle time
Clock high time
Clock low time
Access time from CLK
(positive edge)
Data output hold time
Data output low impedance
Data output high impedance
Data/Address/Control Input set-up time
Data/Address/Control Input hold time
Power Down Exit set-up time
CL* = 2 CL* = 3
CL* = 2 CL* = 3
-
6/7/7.5/8/10
Min. Max. Unit Note
60/63/68/70/80
18/20/20/20/24
18/20/20/20/24
12/14/15/20/25
42/45/45/48/50
2
ns
CLK
1
- / - /10/10/13 6/7/7.5/8/10
2/2.5/2.5/3/3 2/2.5/2.5/3/3
- / - /6/6/7 5/5.4/5.4/6/7
ns
2.5/2.7/3/3/3 9 1
5/5.4/5.4/6/7
1/1.5/1.3/2/2.5
1/0.8/0.8/0.8/0.8
10 10
8
6/7/7.5/8/10
9
10 10 10
*
CL is CAS# Latency.
Note:
1. Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
2. All voltages are referenced to VSS.
3. These parameters depend on the cycle rate and these values are measured by the cycle rate under the minimum value of tCK and tRC. Input signals are changed one time during tCK.
4. These parameters depend on the output loading. Specified values are obtained with the output open.
5. Power-up sequence is described in Note 11.
Preliminary
17
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EtronTech
6. A.C. Test Conditions
LVTTL Interface
Reference Level of Output Signals 1.4V / 1.4V
Output Load Reference to the Under Output Load (B)
Input Signal Levels 2.4V / 0.4V
EM638165
Transition Time (Rise and Fall) of Input Signals
3.3V
1.2k
870
Ω
Ω
Output
Z0=
50
Reference Level of Input Signals 1.4V
Output
30pF
LVTTL D.C. Test Load (A) LVTTL A.C. Test Load (B)
7. Transition times are measured between VIH and VIL. Transition(rise and fall) of input signals are in a fixed slope (1 ns).
8. tHZ defines the time in which the outputs achieve the open circuit condition and are not at reference levels.
9. If clock rising time is longer than 1 ns, ( tR / 2 -0.5) ns should be added to the parameter.
1ns
1. 4V
50Ω
Ω
30pF
10. Assumed input rise and fall time tT ( tR & tF ) = 1 ns If tR or tF is longer than 1 ns, transient time compensation should be considered, i.e., [(tr + tf)/2 - 1] ns
should be added to the parameter.
11. Power up Sequence
Power up must be performed in the following sequence.
1) Power must be applied to VDD and V
and both CKE = "H" and DQM = "H." The CLK signals must be started at the same time.
2) After power-up, a pause of 200µseconds minimum is required. Then, it is recommended that DQM
is held "HIGH" (VDD levels) to ensure DQ output is in high impedance.
3) All banks must be precharged.
4) Mode Register Set command must be asserted to initialize the Mode register.
5) A minimum of 2 Auto-Refresh dummy cycles must be required to stabilize the internal circuitry of
the device.
Preliminary
18
(simultaneously) when all input signals are held "NOP" state
DDQ
Rev 0.6 Feb. 2001
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EtronTech
EM638165
Timing Waveforms
Figure 1. AC Parameters for Write Timing
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCL
CKE
CS#
RAS#
CAS#
CH
t
tIS
tIS tIH
tCK2
Begin AutoPrecharge
Bank A
(Burst Length=4, CAS# Latency=2)
Begin AutoPrecharge
Bank B
tIS
WE#
BA0,1
A 10
A0-A9,A11
DQM
DQ
Hi-Z
IH
t
RAx
IS
t
RBx
CAx
tRCD
Ax0 Ax1 Ax2 Ax3 Bx0 Bx1 Bx2 Bx3 Ay0 Ay1 Ay2 Ay3
Activate
Command
Bank A
Write with
AutoPrecharge
Command
Bank A
RBx
RBx
RC
t
Activate
Command
Bank B
CBx RAy
DAL
t
Write with
AutoPrecharge
Command
Bank B
RAy
Activate
Command
Bank A
t
IS
CAy
Write
Command
Bank A
tIH
WR
t
Precharge Command
Bank A
RP
t
RAz
RAz
Activate
Command
Bank A
t
RRD
RBy
RBy
Activate
Command
Bank B
Preliminary
19
Rev 0.6 Feb. 2001
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EtronTech
EM638165
Ban
k B
Figure 2. AC Parameters for Read Timing
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13
CLK
(Burst Length=2, CAS# Latency=2)
CKE
CS#
RAS#
CAS#
WE#
BA0 ,1
A10
A 0-A9,A11
DQM
DQ
Hi-Z
tCH
tIS
tI S
t
CK2
tI H
Begin AutoPrecharge
Bank B
tIH
t
CL
tIH
RAx
t
IS
RAx
CAx RBx
RBx
CBx
RAy
RAy
tRRD
tRAS
tRC
t
AC2
tRCD
tLZ
Ax0
tAC2
tHZ
Ax1
t
RP
Bx0 Bx1
Preliminary
20
Activate
Command
Bank A
Read
Command
Bank A
t
Activate
Command
Bank B
OH
Read with
Auto Precharge
Command
Precharge Command
Bank A
tHZ
Activate
Command
Bank A
Rev 0.6 Feb. 2001
Page 21
EtronTech
Bank A
Figure 3. Auto Refresh (CBR)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK2
CKE
CS#
RAS#
CA S#
EM638165
(Burst Length=4, CAS# Latency=2)
WE#
BA0,1
A 10
A0 -A9,A11
DQM
DQ
PrechargeAll
Command
tRP
AutoRefresh
Command
RAx
RAx CAx
RC
t
AutoRefresh
Command
RC
t
Activate
Command
Read
Command
Bank A
Ax0
Ax1
Ax2
Ax3
Preliminary
21
Rev 0.6 Feb. 2001
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EtronTech
EM638165
sta
ble fo
r 200
µs
Figure 4. Power on Sequene and Auto Refresh (CBR)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T 18 T 19 T 20 T21 T22
CLK
tCK2
CKE
CS#
RAS#
CAS#
WE#
High level is reauired
Minimum of 2 Refresh Cycl es are required
BA0,1
A10
A0-A9,A11
DQM
DQ
Hi-Z
Inputs must be
PrechargeA LL
Command
Address Key
tRP
1st AutoRefresh
Mode Register Set Command
Command
2nd Auto Refresh
Command
tRC
Any
Command
Preliminary
22
Rev 0.6 Feb. 2001
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EtronTech
EM638165
T0T1T2T3T4T5T6T7T8T9T10
T11
T12
T13
T14
T15
T16
T17
T18
T19
Sel
f Refr
esh En
ter
Self
Refresh
Exit
Aut
oRef
resh
Figure 5. Self Refresh Entry & Exit Cycle
CLK
CKE
CS#
RAS#
C AS#
B A0,1
A 0-A9,A11
WE#
*Note 1
*Note 8
tIS
*Note 2
*Note 3
*Note 4
tRC(min) *Note 7
SRX
t
*Note 5
*Note 6
tPDE
*Note 8
DQM
DQ
Hi-Z
Hi-Z
Note: To Enter SelfRefresh Mode
1. CS#, RAS# & CAS# with CKE should be low at the same clock cycle.
2. After 1 clock cycle, all the inputs including the system clock can be don't care except for CKE.
3. The device remains in SelfRefresh mode as long as CKE stays "low".
Once the device enters SelfRefresh mode, minimum t
is required before exit from SelfRefresh.
RAS
To Exit SelfRefresh Mode
1. System clock restart and be stable before returning CKE high.
2. Enable CKE and CKE should be set high for minimum time of t
SRX
.
3. CS# starts from high.
4. Minimum tRC is required after CKE going high to complete SelfRefresh exit.
5. 2048 cycles of burst AutoRefresh is required before SelfRefresh entry and after SelfRefresh exit if the
system uses burst refresh.
Preliminary
23
Rev 0.6 Feb. 2001
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EtronTech
EM638165
Figure 6.1. Clock Suspension During Burst Read (Using CKE)
CLK
CKE
CS#
RAS#
CAS#
WE#
(Burst Length=4, CAS# Latency=1)
T0 T 1 T2 T3 T4 T5 T6 T7T8 T9 T10 T 11 T1 T13 T14 T15 T16 T17 T1 T19 T20 T21 T22
CK1
t
BA0,1
A10
A0-A9 ,A11
DQM
DQ
Hi-Z
Note:
CKE to CLK disable/enable = 1 clock
RAx
RAx CAx
Activate
Command
Bank A
Command
Ax0 Ax1
Read
Bank A
Clock Suspend
1 Cycle
Ax2
Clock Suspend
2 Cycles
tHZ
Ax3
Clock Suspend
3 Cycles
Preliminary
24
Rev 0.6 Feb. 2001
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EtronTech
EM638165
Figure 6.2. Clock Suspension During Burst Read (Using CKE)
CLK
CKE
CS#
RAS#
CAS#
(Burst Length=4, CAS# Latency=2)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tCK2
WE#
BA0,1
A10
A0-A9 ,A11
DQM
Hi-Z
DQ
Note:
CKE to CLK disable/enable = 1 clock
RAx
RAx
Activate
Command
Bank A
CAx
Read
Command
Bank A
Ax0 Ax1
Clock Suspend
1 Cycle
Ax2
Clock Suspend
2 Cycles
Ax3
Clock Suspend
3 Cycles
HZ
t
Preliminary
25
Rev 0.6 Feb. 2001
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EtronTech
EM638165
Bank A
Bank A
Figure 6.3. Clock Suspension During Burst Read (Using CKE)
(Burst Length=4, CAS# Latency=3)
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
A0-A9 ,A11
T0 T 1 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
RAx
RAx
T 2
tCK3
CAx
DQM
Hi-Z
DQ
Activate
Command
Note:
CKE to CLK disable/enable = 1 clock
Read
Command
Ax0 Ax1 Ax2
Clock Suspend
1 Cycle
Clock Suspend
2 Cycles
Ax3
Clock Suspend
3 Cycles
tHZ
Preliminary
26
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EtronTech
EM638165
Bank A
Figure 7.1. Clock Suspension During Burst Write (Using CKE)
CLK
CKE
CS#
RAS#
CAS#
(Burst Length = 4, CAS# Latency = 1)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tCK1
WE#
BA0,1
A10
A0-A9 ,A11
DQM
DQ
Hi-Z
Note:
CKE to CLK disable/enable = 1 clock
RAx
RAx CAx
Activate
Command
Bank A
Command
DAx0
Clock Suspend
Write
1 Cycle
DAx1
Clock Suspend
2 Cycles
DAx2 DAx3
Clock Suspend
3 Cycles
Preliminary
27
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EM638165
Figure 7.2. Clock Suspension During Burst Write (Using CKE)
CLK
CKE
CS#
RAS#
CAS#
WE#
(Burst Length=4, CAS# Latency=2)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21
tCK2
T2 2
BA0,1
A 10
A0-A9,A11
DQM
Hi-Z
DQ
Note:
CKE to CLK disable/enable = 1 clock
RAx
RAx CAx
Activate
Command
Bank A
DAx0
Write
Command
Bank A
Clock Suspend
1 Cycle
DAx1
Clock Suspend
2 Cycles
DAx2 DAx3
Clock Suspend
3 Cycles
Preliminary
28
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EM638165
Bank A
Figure 7.3. Clock Suspension During Burst Write (Using CKE)
CLK
CKE
CS#
RAS#
CAS#
WE#
(Burst Length=4, CAS# Latency=3)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tCK3
BA0,1
A10
A0-A9 ,A11
DQM
DQ
Hi-Z
Note:
CKE to CLK disable/enable = 1 clock
RAx
RAx
Activate
Command
Bank A
CAx
DAx0
Write
Command
DAx1
Clock Suspend
1 Cycle
Clock Suspend
2 Cycles
DAx2 DAx3
Clock Suspend
3 Cycles
Preliminary
29
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EM638165
Mode
Entry
Figure 8. Power Down Mode and Clock Mask
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK2
CKE
CS#
RAS#
CA S#
tIS
(Burst Lenght=4, CAS# Latency=2)
t
PDE
Valid
WE#
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAx
RAx
Activate
Command
Bank A
Power Down
Mode Entry
ACTIVE
STANDBY
Command
Bank A
Power Down
Mode Exit
CAx
Read
Ax0
Clock Mask
Ax1
Start
Ax2
Clock Mask
End
t
HZ
Ax3
Precharge Command
Bank A
Power Down
PRECHARGE
STANDBY
Power Down
Mode Exit
Any
Command
Preliminary
30
Rev 0.6 Feb. 2001
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EtronTech
EM638165
Bank A
Figure 9.1. Random Column Read (Page within same Bank)
CLK
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=4, CAS# Latency=1)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tCK1
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAw
RAw
Activate
Command
Bank A
Command
CAw
Aw0 Aw1 Aw2 Aw3Ax0 Ax1
Command
Read
CAx
Read
Bank A
CAy
Read
Command
Bank A
Ay0
Ay1Ay2 Ay3
Precharge Command
Bank A
RAz
RAz
Activate
Command
Bank A
CAz
Read
Command
Bank A
Az0
Az1Az2 Az3
Preliminary
31
Rev 0.6 Feb. 2001
Page 32
EtronTech
EM638165
Bank A
Bank A
Bank A
Bank A
Bank A
Bank A
Bank A
Figure 9.2. Random Column Read (Page within same Bank)
CLK
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=4, CAS# Latency=2)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tCK2
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAw
RAw
Activate
Command
CAw CAx
Aw0 Aw1 Aw2 Aw3 Ax0 Ax1
Read
Command
Read
Command
CAy
Read
Command
Ay0
Ay1 Ay2 Ay3
Precharge Command
RAz
RAz
Activate
Command
CAz
Read
Command
Az0
Az1 Az2 Az3
Preliminary
32
Rev 0.6 Feb. 2001
Page 33
EtronTech
EM638165
Bank A
Bank A
Bank A
Bank A
Bank A
Bank A
Bank A
Figure 9.3. Random Column Read (Page within same Bank)
CLK
CKE
CS#
RAS#
CA S#
(Burst Length=4, CAS# Latency=3)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tCK3
WE#
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAw
RAw
Activate
Command
CAw
Read
Command
CAx
Aw0 Aw1 Aw2 Aw3 Ax0 Ax1
Read
Command
CAy
Read
Command
Ay0
Ay1 Ay2 Ay3
Precharge Command
RAz
RAz
Activate
Command
CAz
Read
Command
Az0
Preliminary
33
Rev 0.6 Feb. 2001
Page 34
EtronTech
EM638165
Ban
k B
Ban
k B
Figure 10.1. Random Column Write (Page within same Bank)
CLK
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=4, CAS# Latency=1)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tCK1
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RBw
CBw
RBw
DBw0DBw1DBw2 DBw3 DBx0 DBx1
Activate
Command
Bank A
Write
Command
CBx
Write
Command
Bank A
CBy
DBy0
Write
Command
Bank B
DBy1 DBy2 DBy3
Precharge Command
Bank B
RBz
RBz
Activate
Command
CBz
DBz1 DBz2 DBz3
DBz0
Write
Command
Bank B
Preliminary
34
Rev 0.6 Feb. 2001
Page 35
EtronTech
EM638165
Bank A
Ban
k B
Ban
k B
Ban
k B
Ban
k B
Ban
k B
Ban
k B
Figure 10.2. Random Column Write (Page within same Bank)
CLK
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=4, CAS# Latency=2)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tCK2
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RBw
RBw
Activate
Command
CBw
DBw0 DBw1DBw2 DBw3 DBx0 DBx1
Write
Command
CBx
Write
Command
CBy
DBy0
DBy1 DBy2 DBy3
Write
Command
Precharge Command
RBz
RBz
Activate
Command
CBz
DBz0
Write
Command
DBz1
DBz2 DBz3
Preliminary
35
Rev 0.6 Feb. 2001
Page 36
EtronTech
EM638165
Bank A
Ban
k B
Ban
k B
Ban
k B
Ban
k B
Ban
k B
Ban
k B
Figure 10.3. Random Column Write (Page within same Bank)
CLK
CKE
CS#
RAS#
CA S#
(Burst Length=4, CAS# Latency=3)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
t
CK3
WE#
B A0 ,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RBw
RBw
Activate
Command
CBw
DBw0DBw1DBw2 DBw3 DBx0 DBx1
Write
Command
CBx
Write
Command
CBy
DBy0
Write
Command
DBy1 DBy2 DBy3
Precharge Command
RBz
RBz
Activate
Command
CBz
DBz0
Write
Command
DBz1
DBz2
Preliminary
36
Rev 0.6 Feb. 2001
Page 37
EtronTech
EM638165
Bank A
Figure 11.1. Random Row Read (Interleaving Banks)
CLK
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=8, CAS# Latency=1)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
t
CK1
High
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RBx
RBx
t
RCD
Activate
Command
Bank B
CBx
t
AC1
Bx0 Bx1 Bx2 Bx3 Bx4 Bx5
Read
Command
Bank B
RAx
RAx
Bx6
Activate
Command
Bank A
CAx
Bx7
Precharge Command
Read
Command
t
Ax0 Ax1
Bank B
RBy
RBy
RP
Ax2 Ax3 Ax4 Ax5 Ax6 Ax7
Activate
Command
Bank B
CBy
Read
Command
Bank B
By0 By1 By2
Precharge Command
Bank A
Preliminary
37
Rev 0.6 Feb. 2001
Page 38
EtronTech
EM638165
Bank A
Figure 11.2. Random Row Read (Interleaving Banks)
CLK
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=8, CAS# Latency=2)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
t
CK2
High
BA0,1
A10
A0 ~A9,A11
DQM
DQ
Hi-Z
RBx
RBx
Activate
Command
Bank B
CBx
t
RCDtAC2
Read
Command
Bank B
RAx
RAx
Bx0 Bx1 Bx2 Bx3 Bx4 Bx5 Bx6 Bx7
Activate
Command
Bank A
CAx
Precharge Command
Read
Command
Bank B
t
RP
Ax0
RBy
RBy
Ax1
Activate
Command
Bank B
Ax2 Ax3
Ax4 Ax5
CBy
Ax6 Ax7
Read
Command
Bank B
By0 By1
Preliminary
38
Rev 0.6 Feb. 2001
Page 39
EtronTech
EM638165
Ban
k B
Figure 11.3. Random Row Read (Interleaving Banks)
CLK
High
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=8, CAS# Latency=3)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tCK3
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RBx
RBx
Activate
Command
Bank B
t
RCD
CBx
Read
Command
RAx
RAx
t
AC3
Bx0 Bx1 Bx2 Bx3 Bx4 Bx5
Activate
Command
Bank A
CAx
Read
Command
Bank A
Bx6
Bx7 Ax0 Ax1
Precharge Command
Bank B
RBy
RBy
tRP
Ax2 Ax3 Ax4 Ax5 Ax6
Activate
Command
Bank B
CBy
Read
Command
Bank B
Ax7 By0
Precharge Command
Bank A
Preliminary
39
Rev 0.6 Feb. 2001
Page 40
EtronTech
EM638165
Bank A
Figure 12.1. Random Row Write (Interleaving Banks)
CLK
CKE
High
CS#
RAS#
CA S#
(Burst Length=8, CAS# Latency=1)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
t
CK1
WE#
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAx
RAx
CAx
t
RCD
DAx0 DAx1 DAx2DAx3 DAx4 DAx5
Activate
Command
Bank A
Write
Command
RBx
RBx
DAx6
DAx7 DBx0 DBx1
Activate
Command
Bank B
CBx
Write
Command
Bank B
RAy
RAy
t
RP
DBx2 DBx3DBx4 DBx5 DBx6
Precharge Command
Bank A
Activate
Command
Bank A
DBx7
t
WR
Precharge Command
Bank B
CAy
DAy0 DAy1 DAy2
Write
Command
Bank A
DAy3
Preliminary
40
Rev 0.6 Feb. 2001
Page 41
EtronTech
EM638165
Bank A
Ban
k B
Figure 12.2. Random Row Write (Interleaving Banks)
CLK
High
CKE
CS#
RAS#
CA S#
(Burst Length=8, CAS# Latency=2)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tCK2
WE#
BA0,1
A 10
A0 ~A9,A11
RAx
RAx
CAx CBx
tRCD
DQM
Hi-Z
DQ
Activate
Command
Bank A
DAx0 DAx1 DAx2 DAx3 DAx4DAx5
Write
Command
Bank A
* tWR > tWR(min.)
RBx
RBx
DAx6
Activate
Command
Bank B
RAy
RAy
tWR* tRP tWR*
DAx7 DBx0 DBx1
Write
Command
Bank B
DBx2 DBx3 DBx4DBx5 DBx6
Activate
Command
Precharge Command
Bank A
CAy
DBx7
DAy0 DAy1DAy2 DAy4
Write
Command
Bank A
Precharge Command
DAy3
Preliminary
41
Rev 0.6 Feb. 2001
Page 42
EtronTech
EM638165
Ban
k B
Bank A
Ban
k B
Bank A
Ban
k B
Bank A
Figure 12.3. Random Row Write (Interleaving Banks)
CLK
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=8, CAS# Latency=3)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
t
CK3
High
BA0,1
A 10
A0 ~A9,A11
DQM
*
tWR > tWR(min.)
RAx
RAx RAy
Hi-Z
DQ
Activate
Command
Bank A
CAx CBx
t
RCD
DAx0DAx1
Write
Command
DAx2 DAx3DAx4 DAx5
RBx
Activate
Command
RBx
DAx6
DAx7 DBx0 DBx1
t
WR* t
Write
Command
RP
DBx2 DBx3 DBx4
Precharge Command
RAy
DBx5 DBx6
Activate
Command
CAy
t
WR*
DAy0 DAy1 DAy2
DBx7
Write
Command
Bank A
Precharge Command
DAy3
Preliminary
42
Rev 0.6 Feb. 2001
Page 43
EtronTech
EM638165
Bank A
Figure 13.1. Read and Write Cycle
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
t
CK1
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=4, CAS# Latency=1)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAx
RAx CAx
Activate
Command
Bank A
Ax0 Ax1 Ax2 Ax3 DAy0DAy1
Read
Command
CAy CAz
DAy3 Az0 Az1
The Write Data
Write
Bank A
is Masked with a
Zero Clock
Latency
Command
Read
Command
Bank A
The Read Data
is Masked with a
Two Clock
Latency
Az3
Precharge Command
Bank B
Preliminary
43
Rev 0.6 Feb. 2001
Page 44
EtronTech
EM638165
La
ten
cy
La
ten
cy
Figure 13.2. Read and Write Cycle
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK2
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=4, CAS# Latency=2)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAx
RAx CAx
Activate
Command
Bank A
Read
Command
Bank A
CAy
Ax0 Ax1 Ax2 Ax3 DAy0 DAy1
Write
is Masked with a
Command
Bank A
DAy3 Az0 Az1
The Write Data
Zero Clock
Command
Bank A
CAz
Read
The Read Data
is Masked with a
Two Clock
Az3
Preliminary
44
Rev 0.6 Feb. 2001
Page 45
EtronTech
EM638165
La
ten
cy
La
ten
cy
Figure 13.3. Read and Write Cycle
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
t
CK3
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=4, CAS# Latency=3)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAx
RAx
Activate
Command
Bank A
CAx
Read
Command
Bank A
CAy CAz
Ax0 Ax1 Ax2 Ax3 DAy0 DAy1
The Write Data
Write
Bank A
is Masked with a
Command
DAy3 Az0 Az1
Read
Zero Clock
Command
Bank A
The Read Data
is Masked with a
Two Clock
Az3
Preliminary
45
Rev 0.6 Feb. 2001
Page 46
EtronTech
EM638165
Bank A
Figure 14.1. Interleaving Column Read Cycle
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
t
CK1
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=4, CAS# Latency=1)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAx
RAx
tRCD
Activate
Command
Bank A
RBw
RBw
RAx
CBw
CBx
CBy
CAy
tAC1
Ax0 Ax1 Ax2 Ax3 By0 Ay1 Bz1
Activate
Command
Read
Command
Bank B
Bw0 Bw1 Bx0 Bx1 By1 Ay0
Read
Command
Bank B
Read
Command
Bank B
Read
Command
Bank B
Read
Command
Bank A
Command
CBz
Read
Bank B
Bz0
Precharge Command
Bank A
Bz2 Bz3
Precharge Command
Bank B
Preliminary
46
Rev 0.6 Feb. 2001
Page 47
EtronTech
EM638165
Bank A
Figure 14.2. Interleaving Column Read Cycle
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK2
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=4, CAS# Latency=2)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAx
RAx
Activate
Command
Bank A
CAy
tRCD tAC2
Read
Command
Bank A
RAx
RAx
Ax0 Ax1 Ax2 Ax3 By0 Ay1 Bz1
Activate
Command
Bank B
CBw
Read
Command
Bank B
CBx CBy CAy CBz
Bw0 Bw1 Bx0 Bx1 By1 Ay0
Read
Command
Bank B
Read
Command
Bank B
Read
Command
Bank A
Read
Command
Bank B
Precharge Command
Bz0
Bz2 Bz3
Precharge Command
Bank B
Preliminary
47
Rev 0.6 Feb. 2001
Page 48
EtronTech
EM638165
Ban
k B
Figure 14.3. Interleaved Column Read Cycle
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK3
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=4, CAS# Latency=3)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAx
RAx
Activate
Command
Bank A
tRCD
CAx RBx
Read
Command
Bank A
Activate
Command
RBx
CBx
t
AC3
Ax0 Ax1 Ax2 Ax3 Bz0 Ay1 Ay3
Read
Command
Bank B
CBy
Read
Command
Bank B
CBz
Bx0 Bx1 By0 By1 Bz1 Ay0
Read
Command
Bank B
CAy
Read
Command
Bank A
Prechaerge
Command
Bank B
Precharge Command
Bank A
Ay2
Preliminary
48
Rev 0.6 Feb. 2001
Page 49
EtronTech
EM638165
Bank A
Figure 15.1. Interleaved Column Write Cycle
(Burst Length=4, CAS# Latency=1)
CLK
CKE
CS#
RAS#
CA S#
WE#
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
T0 T 1 T2 T3 T4 T5 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
t
CK1
RAx
RAx
t
RBw
CAx RBw
RCD
CBw
T6
CBx
CBy
CAy
CBz
t
RP
tWRt
RP
tRRD
Hi-Z
DAx0
DAx1 DAx2 DAx3 DBy0 DAy1 DBz0
DBw0DBw1 DBx0 DBx1 DBy1DAy0
DBz1
DBz2
DBz3
Preliminary
Activate
Command
Bank A
Command
Write
Command
Activate
Bank B
Write
Command
Bank B
Write
Command
Bank B
Write
Command
Bank B
Write
Command
Bank A
Precharge Command
Bank A
Write
Command
Bank B
49
Precharge Command
Bank B
Rev 0.6 Feb. 2001
Page 50
EtronTech
Bank A
EM638165
Figure 15.2. Interleaved Column Write Cycle
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK2
CKE
CS#
RAS#
CA S#
WE#
BA0,1
(Burst Length=4, CAS# Latency=2)
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAx
RAx
Activate
Command
Bank A
t
RCD
RBw
CAx
RBw
CBw CBx CBy
tRRD
DAx0
DAx1 DAx2 DAx3 DBy0 DAy1 DBz0
Write
Command
Bank A
Activate
Command
Bank B
DBw0 DBw1 DBx0 DBx1 DBy1DAy0
Write
Command
Bank B
Write
Command
Bank B
Write
Command
Bank B
Command
Bank A
CAy
Write
CBz
Write
Command
Bank B
Precharge Command
DBz1
RP
t
DBz2
DBz3
WR
t
Precharge Command
Bank B
RP
t
Preliminary
50
Rev 0.6 Feb. 2001
Page 51
EtronTech
EM638165
Bank A
Figure 15.3. Interleaved Column Write Cycle
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK3
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=4, CAS# Latency=3)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAx
RAx
Activate
Command
Bank A
CAx RBw
tRCD
t
RRD > tRRD(min)
DAx0
Write
Command
Bank A
RBw
CBw CBx CBy
DAx1 DAx2 DAx3 DBy0 DAy1 DBz0
Activate
Command
Bank B
DBw0 DBw1DBx0 DBx1 DBy1 DAy0
Write
Command
Bank B
Write
Command
Bank B
Write
Command
Bank B
CAy
Write
Command
Bank A
CBz
tWR
Write
Command
Bank B
Precharge Command
DBz1
tRP
DBz2
DBz3
tWR(min)
Precharge Command
Bank B
Preliminary
51
Rev 0.6 Feb. 2001
Page 52
EtronTech
EM638165
Bank A
Ban
k B
Figure 16.1. Auto Precharge after Read Burst
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
t
CK1
CKE
CS#
RAS#
CA S#
WE#
High
(Burst Length=4, CAS# Latency=1)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
Activate
Command
Bank A
RAx
RAx
CAx
Read
Command
Bank A
RBx
CBx
RBx
Ax1 Ax2 Ax3 Ay0 Ay3 By0
Ax0
Activate
Command
Bank B
Bx0 Bx1 Bx2 Bx3 Ay1 Ay2
Read with
Auto Precharge
Command
Bank B
RBy RBz
RBy CBy
CAy
Activate
Command
Bank B
Read with
Auto Precharge
Command
Read with
Auto Precharge
Command
Bank B
By1
By2
By3
Command
Activate
Bank B
RBz
CBz
Read with
Auto Precharge
Command
Bz0 Bz1
Bz2
Bz3
Preliminary
52
Rev 0.6 Feb. 2001
Page 53
EtronTech
Ban
k B
Bank A
Ban
k B
Bank A
EM638165
Figure 16.2. Auto Precharge after Read Burst
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK2
High
CKE
CS#
RAS#
CA S#
WE#
BA0,1
A 10
RAx
RBx
(Burst Length=4, CAS# Latency=2)
RBy
RAz
A0 ~A9,A11
DQM
DQ
Hi-Z
Command
RAx
Activate
Bank A
CAx
Read
Command
Bank A
RBx
Ax0
Activate
Command
Bank B
CBx
Ax1 Ax2 Ax3 Ay0 Ay3 By0
Read with
Auto Precharge
Command
Bx0 Bx1 Bx2 Bx3 Ay1 Ay2
RAy CBy
Read with
Auto Precharge
Command
RBy
Activate
Command
Bank B
Auto Precharge
Read with Command
RAz
Activate
Command
Bank A
CAz
By1
By2
Read with
Auto Precharge
Command
By3
Az0 Az1
Az2
Preliminary
53
Rev 0.6 Feb. 2001
Page 54
EtronTech
EM638165
Bank A
Figure 16.3. Auto Precharge after Read Burst
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK3
High
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=4, CAS# Latency=3)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
Activate
Command
Bank A
RAx
RAx
CAx
Read
Command
Bank A
RBx
RBx
Activate
Command
Bank B
RBy
CBx
Ax0
Ax1 Ax2 Ax3 Ay0 Ay3 By0
Read with
Auto Precharge
Command
Bank B
CAy
Bx0 Bx1 Bx2 Bx3 Ay1 Ay2
Read with
Auto Precharge
Command
RBy
Activate
Command
Bank B
CBy
Read with
Auto Precharge
Command
Bank B
By1
By2
By3
Preliminary
54
Rev 0.6 Feb. 2001
Page 55
EtronTech
EM638165
Bank A
Figure 17.1. Auto Precharge after Write Burst
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK1
High
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=4, CAS# Latency=1)
T 11
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
Command
RAx
RAx
Activate
Bank A
RBx
CAx
DAx0
Write
Command
Bank A
RBx
DAx1 DAx2 DAx3 DAy0 DAy3 DBy0
Activate
Command
Bank B
CBx
DBx0 DBx1 DBx2 DBx3 DAy1DAy2
Write with
Auto Precharge
Command
Bank B
CAy
Write with
Auto Precharge
Command
Bank A
Activate
Command
Bank B
RBy
RBy
CBy
DBy1 DBy2 DBy3
Write with
Auto Precharge
Command
Bank B
RAz
RAz
CAz
DAz0 DAz0
Activate
Command
Bank A
Write with
Auto Precharge
Command
DAz0DAz0
Preliminary
55
Rev 0.6 Feb. 2001
Page 56
EtronTech
Ban
k B
Bank A
Ban
k B
Bank A
EM638165
Figure 17.2. Auto Precharge after Write Burst
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK2
High
CKE
CS#
RAS#
CA S#
WE#
BA0,1
A 10
RAx
RBx
(Burst Length=4, CAS# Latency=2)
RBy
RAz
A0 ~A9,A11
DQM
DQ
Hi-Z
Command
RAx
Activate
Bank A
CAx
DAx0
Write
Command
Bank A
RBx
DAx1 DAx2 DAx3 DAy0 DAy3 DBy0
Activate
Command
Bank B
CBx
DBx0 DBx1DBx2 DBx3 DAy1 DAy2
Write with
Auto Precharge
Command
CAy
Write with
Auto Precharge
Command
RBy
Activate
Command
Bank B
CBy
DBy1
Write with
Auto Precharge
Command
RAz
DBy2 DBy3
Activate
Command
Bank A
CAz
DAz0 DAz1
Write with
Auto Precharge
Command
DAz2 DAz3
Preliminary
56
Rev 0.6 Feb. 2001
Page 57
EtronTech
Bank A
EM638165
Figure 17.3. Auto Precharge after Write Burst
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK3
High
CKE
CS#
RAS#
CA S#
WE#
BA0,1
A9
RAx
RBx
(Burst Length=4, CAS# Latency=3)
`
RBy
A0 ~A9,A11
DQM
DQ
Hi-Z
Command
RAx
Activate
Bank A
RBx
DAx0
DAx1 DAx2 DAx3 DAy0 DAy3 DBy0
Activate
Command
Bank B
Write
Command
CBx
DBx0 DBx1 DBx2 DBx3 DAy1 DAy2
Write with
Auto Precharge
Command
Bank B
CAyCAx
Write with
Auto Precharge
Command
Bank A
RBy
Activate
Command
Bank B
CBy
Write with
Auto Precharge
Command
Bank B
DBy1 DBy2DBy3
Preliminary
57
Rev 0.6 Feb. 2001
Page 58
EtronTech
EM638165
bu
rsting b
egi
nning wi
th
the star
tin
g addres
s.
Figure 18.1. Full Page Read Cycle
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK1
High
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=Full Page, CAS# Latency=1)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAx
RAx
Activate
Command
Bank A
Command
Bank A
RBx
RBx RBy
CAx
CBx
tRRD
Bx+6 Bx+7
Burst Stop
Command
Read
Ax+1
Ax
Activate
Command
The burst counter wraps
Bank B
from the highest order page address back to zero during this time interval
Ax+2
Ax-2 Ax-1 Bx+2 Bx+5
Ax Ax+1 Bx
Read
Command
Bank B
Bx+1
Full Page burst operation does not terminate when the burst length is satisfied; the burst counter increments and continues
Bx+3 Bx+4
Precharge Command
Bank B
RBy
tRP
Activate
Command
Bank B
Preliminary
58
Rev 0.6 Feb. 2001
Page 59
EtronTech
EM638165
Comma
nd
Figure 18.2. Full Page Read Cycle
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
t
CK2
High
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=Full Page, CAS# Latency=2)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
RAx
RAx
Activate
Command
Bank A
Read
Command
Bank A
RBx
RBxCAx RBy
CBx
tRP
Ax
Ax+1
Activate
Command
Bank B
The burst counter wraps from the highest order page address back to zero during this time interval
Ax+2Ax-2 Ax-1 Bx+2 Bx+5
Ax Ax+1 Bx Bx+1 Bx+3 Bx+4
Read
Full Page burst operation does not
Command
terminate when the burst length is satisfied;
Bank B
the burst counter increments and continues bursting beginning with the starting address.
Burst Stop
Bx+6
Precharge Command
Bank B
RBy
Activate
Command
Bank B
Preliminary
59
Rev 0.6 Feb. 2001
Page 60
EtronTech
EM638165
du
ring
th
is t
ime
in
terv
al
Figure 18.3. Full Page Read Cycle
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK3
High
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=Full Page, CAS# Latency=3)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
Activate
Command
Bank A
RAx
RAx
Read
Command
Bank A
RBx
RBxCAx
Activate
Command
Bank B
Ax+1
Ax
Ax+2 Ax-2 Ax-1 Bx+2 Bx+5
The burst counter wraps from the highest order page address back to zero
CBx
Ax Ax+1 Bx Bx+1 Bx+3 Bx+4
Read
Full Page burst operation does not
Command
terminate when the burst length is
Bank B
satisfied; the burst counter increments and continues bursting beginning with the starting address.
Burst Stop
Command
Precharge Command
Bank B
tRP
RBy
RBy
Activate
Command
Bank B
Preliminary
60
Rev 0.6 Feb. 2001
Page 61
EtronTech
be
gin
ning wit
h t
he
starting
ad
dre
ss.
EM638165
Figure 19.1. Full Page Write Cycle
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK1
High
CKE
CS#
RAS#
CA S#
WE#
BA0,1
(Burst Length=Full Page, CAS# Latency=1)
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
Activate
Command
Bank A
RAx
RAx
Write
Command
Bank A
RBx
RBxCAx
DAx+1DAx
DAx+2 DAx+3 DAx-1 DAx
Activate
Command
Bank B
The burst counter wraps from the highest order page address back to zero during this time interval
CBx
DBx DBx+ 1
DAx+1
Write
Command
Bank B
Full Page burst operation does not terminate when the burst length is satisfied; the burst counter increments and continues bursting
DBx+ 2
DBx+ 3
DBx+4 DBx+5 DBx+6 DBx+7
Data is ignored
Precharge Command
Burst Stop
Command
Bank B
RBy
RBy
Activate
Command
Bank B
Preliminary
61
Rev 0.6 Feb. 2001
Page 62
EtronTech
EM638165
be
gin
ning wit
h t
he
starting
ad
dre
ss.
Figure 19.2. Full Page Write Cycle
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
t
CK2
High
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=Full Page, CAS# Latency=2)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
Command
RAx
RAx
Activate
Bank A
CAx
Write
Command
Bank A
RBx
RBx
DAx+1DAx
DAx+2 DAx+3 DAx-1 DAx
Activate
Command
Bank B
The burst counter wraps from the highest order page address back to zero during this time interval
CBx
DAx+1
DBx DBx+ 1
Write
Command
Bank B
Full Page burst operation does not terminate when the burst length is satisfied; the burst counter increments and continues bursting
DBx+2
DBx+3
DBx+4 DBx+5 DBx+6
Data is ignored
Precharge Command
Burst Stop
Command
Bank B
RBy
RBy
Activate
Command
Bank B
Preliminary
62
Rev 0.6 Feb. 2001
Page 63
EtronTech
EM638165
be
gin
ning wit
h t
he
starting
ad
dre
ss.
Figure 19.3. Full Page Write Cycle
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
t
CK3
High
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=Full Page, CAS# Latency=3)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
Hi-Z
Command
RAx
RAx
Activate
Bank A
Write
Command
Bank A
RBx
RBxCAx
DAx+1DAx
DAx+2 DAx+3 DAx-1 DAx
Activate
Command
Bank B
The burst counter wraps from the highest order page address back to zero during this time interval
CBx
DBx
Write
Command
Bank B
DBx+1
DBx+2
DBx+3
DAx+1
Full Page burst operation does not terminate when the burst length is satisfied; the burst counter increments and continues bursting
DBx+4 DBx+5
Precharge Command
Burst Stop
Command
Data is ignored
Bank B
RBy
RBy
Activate
Command
Bank B
Preliminary
63
Rev 0.6 Feb. 2001
Page 64
EtronTech
EM638165
Bank A
Figure 20. Byte Write Operation
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T 14 T15 T16 T 17 T18 T19 T20 T21 T22
CLK
tCK2
High
CKE
CS#
RAS#
CAS#
WE#
(Burst Length=4, CAS# Latency=2)
BA0,1
A10
A0~A9,A11
LDQM
UDQM
DQ0 - DQ7
DQ8 - DQ15
RAx
RAx
Activate
Command
Bank A
CAx
Read
Command
Bank A
Ax0 Ax1 Ax2
Upper 3 Bytes
are masked
Ax1 Ax2 Ax3
Lower Byte
is masked
CAy
DAy2
DAy1
DAy0 DAy1 DAy3
Write
Upper 3 Bytes
Command
Bank A
are masked
CAz
Read
Command
Az0
Lower Byte
is masked
Az1 Az2
Az1 Az2
Az3
Lower Byte
is masked
Preliminary
64
Rev 0.6 Feb. 2001
Page 65
EtronTech
EM638165
Precha
rge
Precha
rge
Precha
rge
Precha
rge
Precha
rge
Precha
rge
Precha
rge
Precha
rge
Precha
rge
Precha
rge
Precha
rge
Figure 21. Random Row Read (Interleaving Banks)
CLK
High
CKE
CS#
RAS#
CA S#
WE#
BA0,1
RBu
A 10
(Burst Length=2, CAS# Latency=1)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tCK1
RAu
Begin Auto
Precharge
Bank B
RBv
Begin Auto
Precharge
Bank A
RAv
Begin Auto
Precharge
Bank B
RBw
Begin Auto
Precharge
Bank A
RAw
Begin Auto
Precharge
Bank B
RBx
Begin Auto Precharge
Bank A
RAx
Begin Auto
Precharge
Bank B
RBy
Begin Auto
Precharge
Bank A
RAy
Begin Auto
Precharge
Bank B
RBz
Begin Auto
Precharge
Bank A
RAz
A0 ~A9,A11
DQM
DQ
RBu
Activate
Command
Bank B
CBu
RAu CAu
Bu0 Bu1 Au0 Au1 Bv0 Bv1 Av0 Av1 Bw0 Bw1 Aw0 Aw1Bx0 Bx1 Ax0 Ax1 By0 By1 Ay0 Ay1 Bz0
Activate
Command
Bank A
Read
Bank B
with Auto
Activate
Command
Read
Bank A
with Auto
RBv
t
RP
Bank B
CBv
t
RP
Activate
Command
Bank A
Read
Bank B
with Auto
RAv
CAv
Activate
Command
Bank B
Read
Bank A
with Auto
CBw
RAw
t
RP
Activate
Command
Bank A
CAw
Read
Bank A
with Auto
RBw
t
RP
Read
Bank B
with Auto
RBx
t
RP
Activate
Command
Bank B
CBx
t
RP
Activate
Command
Read
Bank B
with Auto
RAx CAx
Bank A
t
RP
Activate
Command
Read
Bank A
with Auto
RBy CBy
Bank B
t
Activate
Command
Bank A
Read
Bank B
with Auto
RAy CAy
RP
Activate
Command
Read
Bank A
with Auto
RBz CBz
t
RP
Bank B
with Auto
t
RP
Command
Read
Bank B
RAz
Activate
Bank A
Preliminary
65
Rev 0.6 Feb. 2001
Page 66
EtronTech
EM638165
Bank A
Figure 22. Full Page Random Column Read
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
t
CK2
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=Full Page, CAS# Latency=2)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
RAx
RAx
Activate
Command
Bank A
RBx
RBx CAx
tRRD tRCD
Activate
Command
Bank B
Command
CBx CAy CBy
Ax0 Bx0 Ay0 Ay1 By0 By1 Az0 Az1 Az2 Bz0 Bz1 Bz2
Read
Command
Bank B
Read
Read
Command
Bank A
Read
Command
Bank B
CAz
Read
Command
Bank A
CBz
Read
Command
Bank B
tRP
Precharge
Command Bank B
(Precharge Temination)
RBw
RBw
Activate
Command
Bank B
Preliminary
66
Rev 0.6 Feb. 2001
Page 67
EtronTech
EM638165
is
mask
ed
Figure 23. Full Page Random Column Write
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK2
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=Full Page, CAS# Latency=2)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
RAx
RAx
Activate
Command
Bank A
t
RRD
RBx
RBx CAx
Activate
Command
Bank B
CBx CAy CBy
t
RCD
DAx0DBx0DAy0 DAy1 DBy0 DBy1 DAz0 DAz1 DAz2 DBz0DBz1
Command
Write
Command
Bank A
Write
Bank B
Write
Command
Bank A
Write
Command
Bank B
CAz
Write
Command
Bank A
CBz
Write
Command
Bank B
tRP
t
WR
DBz2
Precharge
Command Bank B
(Precharge Temination)
Write Data
RBw
RBw
Activate
Command
Bank B
Preliminary
67
Rev 0.6 Feb. 2001
Page 68
EtronTech
EM638165
Bank A
Figure 24.1. Precharge Termination of a Burst
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
t
CK1
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=Full Page, CAS# Latency=1)
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
RAx
RAx
CAx RAy
DAx0 DAx1DAx2 DAx3 DAx4
Activate
Command
Bank A
Precharge Termination
of a Write Burst.
Write data is masked.
Write
Command
Bank A
tWR
Precharge Command
Bank A
RAy
t
RP
Activate
Command
CAy
Read
Command
Bank A
Ay0 Ay1 Ay2
Precharge Command
Bank A
RAz
RAz
t
RP
Activate
Command
Bank A
CAz
Precharge
Termination of
a Read Burst.
DAz3DAz2DAz0
DAz1 DAz4 DAz5
Write
Command
Bank A
DAz6 DAz7
Preliminary
68
Rev 0.6 Feb. 2001
Page 69
EtronTech
EM638165
Figure 24.2. Precharge Termination of a Burst
(Burst Length=8 or Full Page, CAS# Latency=2)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
tCK2
High
CKE
CS#
RAS#
CA S#
WE#
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
RAx
RAx
Activate
Command
Bank A
CAx
DAx0 DAx1DAx2 DAx3
Write
Command
Bank A
Precharge Termination
of a Write Burst.
Write data is masked.
tWR
Precharge Command
Bank A
tRP
Command
RAy
RAy CAy
Activate
Bank A
Command
Read
Bank A
Precharge Command
Bank A
t
RP
Ay2Ay0 Ay1
RAz
RAz
Activate
Command
Bank A
CAz
Read
Command
Bank A
Precharge Termination of a Read Burst
RP
t
Az0 Az1 Az2
Precharge Command
Bank A
Preliminary
69
Rev 0.6 Feb. 2001
Page 70
EtronTech
EM638165
Figure 24.3. Precharge Termination of a Burst
CLK
CKE
CS#
RAS#
CA S#
WE#
(Burst Length=4, 8 or Full Page, CAS# Latency=3)
T0 T 1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T 11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CK3
t
High
BA0,1
A 10
A0 ~A9,A11
DQM
DQ
RAx
RAx
Activate
Command
Bank A
CAx
DAx0
Write
Command
Bank A
Write Data
is masked
WR
t
DAx1
Precharge Command
Bank A
Precharge Termination
of a Write Burst
RP
t
RAy
RAy
Activate
Command
Bank A
CAy
Read
Command
Bank A
Ay0 Ay1 Ay2
Precharge Command
Bank A
t
RP
RAz
RAz
Activate
Command
Bank A
Precharge Termination
of a Read Burst
Preliminary
70
Rev 0.6 Feb. 2001
Page 71
EtronTech
EM638165
54 Pin TSOP II Package Outline Drawing Information
5 4
28
0.254
E
E
H
θ°
L
1
L
1
D
S
B e
y
27
Symbol Dimension in inch Dimension in mm
Min Normal Max Min Normal Max
0.047
-
0.0059 0.05 0.1 0.150
0.0411
-
5° 0°
A -
A1
0.002 0.00395
A2 -
B c D E e
HE
L
0.012 0.015 0.016 0.3 0.35 0.40
0.0047 0.0065 0.0083 0.120 1.165 0.210
0.872 0.8755 0.879 22.149 22.238 22.327
0.3960 0.400 0.4040 10.058 10.16 10.262
0.462 0.466 0.470 11.735 11.8365
0.016 0.020 0.0235 0.406 0.50 0.597
L1
S y
θ
- 0.0315 - - 0.80 -
- 0.033 - - 0.84 -
- 0.035 - - 0.88 -
- - 0.004 - - 0.10
0°
-
-
-
Notes:
1. Dimension D&E do not include interiead flash.
2. Dimension B does not include dambar protrusion/intrusion.
3. Dimension S includes end flash.
4. Controlling dimension : mm
A
A2
L
A1
-
-
1.194
1.044
L
C
1
11.938
-
5°
Preliminary
71
Rev 0.6 Feb. 2001
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