ELH0101/883/8508901/2YX
Power Operational Amplifier
Applications Information
Ð Contd.
Every attempt should be made to achieve a single point ground system as shown in the figure
below.
0101– 14
Bypass capacitor CBXshould be used if the lead
lengths of bypass capacitors C
B
are long. If a single point ground system is not possible, keep signal, load, and power supply from intermingling
as much as possible. For further information on
proper grounding techniques refer to ‘‘Grounding
and Shielding Techniques in Instrumentation’’
by Morrison, and ‘‘Noise Reduction Techniques
in Electronic Systems’’ by Ott (both published
by John Wiley and Sons).
Leads or PC board traces to the supply pins,
short circuit current limit pins, and the output
pin must be substantial enough to handle the
high currents that the ELH0101 is capable of
producing.
Short Circuit Current Limiting
Should current limiting of the output not be necessary, SC
a
should be shorted to Vaand SC
b
should be shorted to Vb. Remember that the
short circuit current limit is dependent upon the
total resistance seen between the supply and current limit pins. This total resistance includes the
desired resistor plus leads, PC Board traces, and
solder joints.* Assuming a zero TCR current limit resistor, typical temperature coefficient of the
short circuit will be approximately 0.3%.
Thermal Resistance
The thermal resistance between two points of a
conductive system is expressed as:
i
12
e
T
1
b
T
2
P
D
§
C/W (1)
where subscript order indicates the direction of
heat flow. A simplified heat transfer circuit for a
cased semiconductor and heatsink system is
shown in the figure below.
The circuit is valid only if the system is in thermal equilibrium (constant heat flow) and there
are, indeed, single specific temperatures, T
J,TC
,
and T
S
, (no temperature distribution in junction,
case, or heatsink). Nevertheless, this is a reasonable approximation of actual performance.
0101– 15
*Short circuit current will be limited to approximately
0.6
RSC
.
The junction-to-case thermal resistance, iJC,
specified in the data sheet depends upon the material and size of the package, die size and thickness, and quality of the die bond to the case or
lead frame. The case-to-heatsink thermal resistance, i
CS
, depends on the mounting of the device
to the heatsink and upon the area and quality of
the contact surface. Typical i
CS
for a TO-3 pack-
age is 0.5
§
C/W to 0.7§C/W, and 0.3§C/W to
0.5
§
C/W using silicone grease.
The heatsink to ambient thermal resistance, i
SA
,
depends on the quality of the heatsink and the
ambient conditions.
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