Datasheet EL7562CU Datasheet (ELANT)

Page 1
(3.3V,
EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
EL7562C - Preliminary
Features
• Integrated synchronous MOSFETs and current mode controller
• 2A continuous output current
• Up to 95% efficiency
• 4.5V to 5.5V input voltage
• Adjustable output from 1V to 3.8V
• Cycle-by-cycle current limit
• Precision reference
• ±0.5% load and line regulation
• Adjustable switching frequency to 1MHz
• Oscillator synchronization possible
• Internal soft start
• Over temperature protection
• Under voltage lockout
• 16-pin QSOP package
Applications
• DSP, CPU Core and IO Supplies
• Logic/Bus Supplies
• Portable Equipment
• DC:DC Converter Modules
• GTL + Bus Power Supply
Ordering Information
Part No Package Tape & Reel Outline #
EL7562CU 16-Pin QSOP - MDP0040
General Description
The EL7562C is an integrated, synchronous step-down regulator with output voltage adjustable from 1.0V to 3.8V. It is capable of delivering 2A continuous current at up to 95% efficiency. The EL7562C operates at a constant frequency pulse width modulation (PWM) mode, making external synchronization possible. Patented on-chip resistorless cur­rent sensing enables current mode control, which provides cycle-by­cycle current limiting, over-current protection, and excellent step load response. The EL7562C is available in a fused-lead 16-pin QSOP package. With proper external components, the whole converter fits into a less than 0.5 in2 area. The minimal external components and small size make this EL7562C ideal for desktop and portable applications.
The EL7562C is specified for operation over the -40°C to +85°C tem­perature range.
Typical Application Diagram
V
5.5V)
1
C3C
4
0.1µF 270pF
R
3
39
C1C
2
100µF 0.1µF
IN
SGND
2
COSC
3
VDD
4
PGND
5
PGND
6
VIN
7
VIN
8 9
EN
PGND
VREF
VDRV
VHI
PGND
16
15
14
FB
13
12
LX
11
LX
10
C
0.1µF
5
R
1
1k
C
6
0.1µF
R
2.37k
L
4.7µF
2
1
C
7
100µF
2A)
V
O
October 25, 2001
Manufactured under U.S. Patent No. 57,323,974
Note: All information contained in this data sheet has been carefully checked and is believed to be accurate as of the date of publication; however, this data sheet cannot be a “controlled document”. Current revisions, if any, to these specifications are maintained at the factory and are available upon your request. We recommend checking the revision level before finalization of your design documentation.
© 2001 Elantec Semiconductor, Inc.
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EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
Absolute Maximum Ratings (T
Supply Voltage between VIN or VDD and GND +6.5V
VLX Voltage VIN +0.3V
Input Voltage GND -0.3V, VDD +0.3V
VHI Voltage GND -0.3V, V
EL7562C - Preliminary
= 25°C)
A
LX
Storage Temperature -65°C to +150°C
Operating Ambient Temperature -40°C to +85°C
Operating Junction Temperature +135°C
+6V
Important Note:
All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA.
DC Characteristics
V
= V
= 5V, TA = TJ = 25°C, C
DD
IN
Parameter Description Conditions Min Typ Max Unit
V
REF
V
REFTC
V
REFLOAD
V
RAMP
I
OSC_CHG
I
OSC_DIS
I
VDD+VDRVVDD+VDRV
I
VDD_OFF
V
DD_OFF
V
DD_ON
T
OT
T
HYS
I
LEAK
I
LMAX
R
DSON
R
DSONTC
V
FB
V
FB_LINE
V
FB_LOAD
V
FB_TC
I
FB
V
EN_HI
V
EN_LO
I
EN
Reference Accuracy 1.24 1.26 1.28 V
Reference Temperature Coefficient 50 ppm/°C
Reference Load Regulation 0 < I
Oscillator Ramp Amplitude 1.15 V
Oscillator Charge Current 0.1V < V
Oscillator Discharge Current 0.1V < V
Supply Current VEN = 4V, F
V
Standby Current EN = 0 1 1.5 mA
DD
VDD for Shutdown 3.5 3.9 V
VDD for Startup 3.95 4.35 V
Over Temperature Threshold 135 °C
Over Temperature Hysteresis 20 °C
Internal FET Leakage Current EN = 0, LX = 5V (low FET), LX = 0V (high FET) 10 µA
Peak Current Limit 3 A FET On Resistance Wafer level test only 60 120 m
R
Tempco 0.2 m/°C
DSON
Output Initial Accuracy I
Output Line Regulation V
Output Load Regulation 0.1A < I
Output Temperature Stability -40°C < TA < 85°C, I
Feedback Input Pull Up Current V
EN Input High Level 3.2 4 V
EN Input Low Level 1 V
Enable Pull Up Current VEN = 0 -4 -2.5 µA
= 1.2nF, unless otherwise specified.
OSC
LOAD
IN
FB
< 50µA -1 %
REF
< 1.25V 200 µA
OSC
< 1.25V 8 mA
OSC
= 120kHz 2 3.5 5 mA
OSC
= 0A 0.960 0.975 0.99 V
= 5V, ∆V
= 10%, I
IN
< 1A 0.5 %
LOAD
= 0A 0.5 %
LOAD
= 0.5A ±1 %
LOAD
= 0V 100 200 nA
Closed Loop AC Electrical Characteristics
VS = V
= 5V, TA = TJ = 25°C, C
IN
Parameter Description Conditions Min Typ Max Unit
F
OSC
t
SYNC
M
t
BRM
t
LEB
D
SS
MAX
Oscillator Initial Accuracy 105 117 130 kHz
Minimum Oscillator Sync Width 25 ns
Soft Start Slope 0.5 V/ms
FET Break Before Make Delay 15 ns
High Side FET Minimum On Time 150 ns
Maximum Duty Cycle 95 %
= 1.2nF, unless otherwise specified.
OSC
2
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EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
Pin Descriptions
Pin Number Pin Name Pin Function
1 SGND Control circuit negative supply.
2 COSC Oscillator timing capacitor. FOSC can be approximated by: FOSC (kHz) = 0.1843/COSC, COSC in µF.
3 VDD Control circuit positive supply.
4 PGND Ground return of the regulator. Connected to the source of the low-side synchronous NMOS power FET.
5 PGND Ground return of the regulator. Connected to the source of the low-side synchronous NMOS power FET.
6 VIN Power supply input of the regulator. Connected to the drain of the high-side NMOS power FET.
7 VIN Power supply input of the regulator. Connected to the drain of the high-side NMOS power FET.
8 EN Chip Enable, active high. A 2µA internal pull-up current enables the device if the pin is left open.
9 PGND Ground return of the regulator.
10 VHI Positive supply of the high-side driver.
11 LX Inductor drive pin. High current digital output whose average voltage equals the regulator output voltage.
12 LX Inductor drive pin. High current digital output whose average voltage equals the regulator output voltage.
13 VDRV Positive supply of the low-side driver and input voltage for the high-side boot strap.
14 FB Voltage feedback input. Connected to an external resistor divider between VOUT and GND. A 125nA pull-up current
15 VREF Bandgap reference bypass capacitor. Typically 0.1µF to GND.
16 PGND Ground return of the regulator.
forces VOUT to VS in the event that FB is floating.
EL7562C - Preliminary
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EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
Typical Performance Curves
Efficiency vs I
EL7562C - Preliminary
VIN=5V
100
95 90 85 80 75
Efficiency (%)
70 65 60
0.1 1 2
Efficiency vs I VO=3.3V
100
95 90 85 80 75
Efficiency (%)
70 65 60
0 0.5 1 1.5 2
VIN=4.5V
VIN=5.5V
O
VO=1.8V
Load Current IO (A)
O
VIN=5V
Load Current IO (A)
VO=2.5V
VO=1.5V
VO=1.2V
FS=500kHz L=Coilcraft DO3316P-472
VO=3.3V
Power Loss vs I
Power Loss vs I VIN=5V
VIN=5V
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
Power Loss (W)
Power Loss (W)
0.2
0.2
0.1
0.1
0
0
0 0.5 1 1.5 2
0 0.5 1 1.5 2
Load Regulation VO=3.3V
0.8
0.6
0.4
0.2
0
Output Voltage (%)
-0.2
-0.4
-0.6 0 0.5 1 1.5 2
O
O
VO=1.8V
Load Current IO (A)
Load Current IO (A)
VIN=5.5V
VIN=5V
Load Current IO (A)
VO=3.3V
VO=2.5V
VO=1.2V
VO=1.5V
VIN=4.5V
Line Regulation VO=3.3V
0.6
0.4 IO=0.1A
0.2
0
(%)
O
V
-0.2
-0.4
-0.6
4.5 4.7 5.1 5.3 5.5
IO=1A
IO=2A
4.9 VIN (V)
V
vs Temperature
REF
1.258
1.256
1.254
1.252
(V)
1.25
REF
V
1.248
1.246
1.244
1.242
-40 10 60 110 160 Temperature (°C)
4
Page 5
Typical Performance Curves
EL7562C - Preliminary
EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
Oscillator Frequency vs Temperature
390
385
380
375
370
Oscillator Frequency (kHz)
365
360
-40 10 60 110 160 Temperature (°C)
Switching Frequency vs C
1400
1200
1000
800
(kHz)
S
600
F
400
200
0
0 400 600 800 1000
200
OSC
C
(pF)
OSC
Input Current vs Temperature (Enable connected to GND)
0.96
0.94
0.92
0.9
0.88
0.86
Input Current (A)
0.84
0.82
0.8
-40 10 60 110 160 Temperature (°C)
VIN=5.5V
VIN=4.5VVIN=5V
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EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
Block Diagram
EL7562C - Preliminary
VREF COSC
270pF0.1µF
Junction
Temperature
Controlle
VDD
SGND
r Supply
FB
39
0.1µF
EN
Voltage
Reference
PWM
Controller
Current
Sense
Oscillator
Drivers
Power
FET
Power
FET
VDRV
VHI
VIN
PGND
0.1µF
4.7µH
100µF
2370
1k
V
OUT
6
Page 7
Applications Information
EL7562C - Preliminary
EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
Circuit Description
General
The EL7562C is a fixed frequency, current mode con­trolled DC:DC converter with integrated N-channel power MOSFETs and a high precision reference. The device incorporates all the active circuitry required to implement a cost effective, user-programmable 2A syn­chronous step-down regulator suitable for use in DSP core power supplies.
Theory of Operation
The EL7562C is composed of 5 major blocks:
1. PWM Controller
2. NMOS Power FETs and Drive Circuitry
3. Bandgap Reference
4. Oscillator
5. Thermal Shut-down
PWM Controller
The EL7562C regulates output voltage through the use of current-mode controlled pulse width modulation. The three main elements in a PWM controller are the feed­back loop and reference, a pulse width modulator whose duty cycle is controlled by the feedback error signal, and a filter which averages the logic level modulator output. In a step-down (buck) converter, the feedback loop forces the time-averaged output of the modulator to equal the desired output voltage. Unlike pure voltage­mode control systems, current-mode control utilizes dual feedback loops to provide both output voltage and inductor current information to the controller. The volt­age loop minimizes DC and transient errors in the output voltage by adjusting the PWM duty-cycle in response to changes in line or load conditions. Since the output volt­age is equal to the time-averaged of the modulator output, the relatively large LC time constant found in power supply applications generally results in low band­width and poor transient response. By directly monitoring changes in inductor current via a series sense resistor the controller's response time is not entirely lim-
ited by the output LC filter and can react more quickly to changes in line and load conditions. This feed-forward characteristic also simplifies AC loop compensation since it adds a zero to the overall loop response. Through proper selection of the current-feedback to voltage-feed­back ratio the overall loop response will approach a one­pole system. The resulting system offers several advan­tages over traditional voltage control systems, including simpler loop compensation, pulse by pulse current limit­ing, rapid response to line variation and good load step response.
The heart of the controller is an input direct summing comparator which sum voltage feedback, current feed­back, slope compensation ramp and power tracking signals together. Slope compensation is required to pre­vent system instability that occurs in current-mode topologies operating at duty-cycles greater than 50% and is also used to define the open-loop gain of the over­all system. The slope compensation is fixed internally and optimized for 500mA inductor ripple current. The power tracking will not contribute any input to the com­parator steady-state operation. Current feedback is measured by the patented sensing scheme that senses the inductor current flowing through the high-side switch whenever it is conducting. At the beginning of each oscillator period the high-side NMOS switch is turned on. The comparator inputs are gated off for a minimum period of time of about 150ns (LEB) after the high-side switch is turned on to allow the system to settle. The Leading Edge Blanking (LEB) period prevents the detection of erroneous voltages at the comparator inputs due to switching noise. If the inductor current exceeds the maximum current limit (ILMAX) a secondary over­current comparator will terminate the high-side switch on time. If ILMAX has not been reached, the feedback voltage FB derived from the regulator output voltage VOUT is then compared to the internal feedback refer­ence voltage. The resultant error voltage is summed with the current feedback and slope compensation ramp. The high-side switch remains on until all four comparator inputs have summed to zero, at which time the high-side switch is turned off and the low-side switch is turned on. However, the maximum on-duty ratio of the high-side switch is limited to 95%. In order to eliminate cross-con-
7
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EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
duction of the high-side and low-side switches a 15ns break-before-make delay is incorporated in the switch drive circuitry. The output enable (EN) input allows the regulator output to be disabled by an external logic con­trol signal.
EL7562C - Preliminary
Output Voltage Setting
In general:
R

2
V
OUT
0.975V 1
------
+
×=

R

1
However, due to the relatively low open loop gain of the system, gain errors will occur as the output voltage and loop-gain is changed. This is shown in the performance curves. A 100nA pull-up current from FB to VDD forces VOUT to GND in the event that FB is floating.
NMOS Power FETs and Drive Circuitry
The EL7562C integrates low on-resistance (60mΩ)
NMOS FETs to achieve high efficiency at 2A. In order to use an NMOS switch for the high-side drive it is nec­essary to drive the gate voltage above the source voltage (LX). This is accomplished by bootstrapping the VHI pin above the LX voltage with an external capacitor CVHI and internal switch and diode. When the low-side switch is turned on and the LX voltage is close to GND potential, capacitor CVHI is charged through internal switch to VDRV, typically 5V. At the beginning of the next cycle the high-side switch turns on and the LX pins begin to rise from GND to VIN potential. As the LX pin rises the positive plate of capacitor CVHI follows and eventually reaches a value of VDRV+VIN, typically 10V, for VDRV=VIN=5V. This voltage is then level shifted and used to drive the gate of the high-side FET, via the VHI pin. A value of 0.1µF for CVHI is recommended.
Reference
A 1.5% temperature compensated bandgap reference is integrated in the EL7562C. The external VREF capaci­tor acts as the dominant pole of the amplifier and can be increased in size to maximize transient noise rejection. A value of 0.1µF is recommended.
Oscillator
The system clock is generated by an internal relaxation oscillator with a maximum duty-cycle of approximately 95%. Operating frequency can be adjusted through the COSC pin or can be driven by an external source. If the oscillator is driven by an external source care must be taken in selecting the ramp amplitude. Since CSLOPE value is derived from the COSC ramp, changes to COSC ramp will change the CSLOPE compensation ramp which determine the open-loop gain of the system.
When external synchronization is required, always choose C
such that the free-running frequency is at
OSC
least 20% lower than that of sync source to accommo­date component and temperature variations. Figure 1 shows a typical connection.
1 16
2
3
6
7
8
EL7562C
15
14
11
10
9
External
Oscillator
BAT54S100pF
Figure 1. Oscillator Synchronization
Thermal Shut-down
An internal temperature sensor continuously monitors die temperature. In the event that die temperature exceeds the thermal trip-point, the system is in fault state and will be shut down. The upper and low trip-points are set to 135°C and 115°C respectively.
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Page 9
Start-up Delay
A capacitor can be added to the EN pin to delay the con­verter start-up (Figure 2) by utilizing the pull-up current. The delay time is approximately:
t
ms() 1200 C µF()×=
d
1 16
EL7562C - Preliminary
EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
2
3
6
7
C
8
EL7562C
15
14
11
10
9
Figure 2. Start-up Delay
Layout Considerations
The layout is very important for the converter to func­tion properly. Power Ground ( ) and Signal Ground (---) should be separated to ensure that the high pulse current in the Power Ground never interferes with the sensitive signals connected to Signal Ground. They should only be connected at one point (normally at the negative side of either the input or output capacitor.)
The trace connected to pin 14 (FB) is the most sensitive trace. It needs to be as short as possible and in a “quiet” place, preferably between PGND or SGND traces.
V
OUT
t
d
TIME
V
IN
V
O
In addition, the bypass capacitor connected to the VDD pin needs to be as close to the pin as possible.
The heat of the chip is mainly dissipated through the PGND pins. Maximizing the copper area around these pins is preferable. In addition, a solid ground plane is always helpful for the EMI performance.
The demo board is a good example of layout based on these principles. Please refer to the EL7562C Applica­tion Brief for the layout.
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EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
EL7562C - Preliminary
General Disclaimer
Specifications contained in this data sheet are in effect as of the publication date shown. Elantec, Inc. reserves the right to make changes in the cir­cuitry or specifications contained herein at any time without notice. Elantec, Inc. assumes no responsibility for the use of any circuits described herein and makes no representations that they are free from patent infringement.
WARNING - Life Support Policy
Elantec, Inc. products are not authorized for and should not be used within Life Support Systems without the specific written consent of Elantec, Inc. Life Support systems are equipment intended to sup-
Elantec Semiconductor, Inc.
675 Trade Zone Blvd. Milpitas, CA 95035 Telephone: (408) 945-1323
(888) ELANTEC Fax: (408) 945-9305 European Office: +44-118-977-6020 Japan Technical Center: +81-45-682-5820
port or sustain life and whose failure to perform when properly used in accordance with instructions provided can be reasonably expected to result in significant personal injury or death. Users con­templating application of Elantec, Inc. Products in Life Support Systems are requested to contact Elantec, Inc. factory headquarters to establish suitable terms & conditions for these applications. Elan­tec, Inc.’s warranty is limited to replacement of defective components and does not cover injury to persons or property or other consequential damages.
October 25, 2001
10
Printed in U.S.A.
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