StorageTemperature- 40 to 150°C
MaximumOperatingJunctionTtemperature150
1/6
Page 2
DTV32G-1500B
THERMAL RESISTANCE
SymbolParameterValueUnit
R
th(j-c)
Junctionto Case2°C/W
STATICELECTRICAL CHARACTERISTICS
SymbolTestConditionsMinTypMaxUnit
I
R*
VR=V
RWM
Tj= 25°C200
Tj= 100°C1mA
V
F**
IF=6ATj= 25°C1.5V
Tj= 100°C1.4
pulse test : * tp = 5 ms ,δ<2%
** tp = 380 µs, δ <2%
RECOVERYCHARACTERISTICS
SymbolTestConditionsMinTypMaxUnit
t
(1)Tj = 25°CI
rr
t
rr
Tj = 25°CIF=1AI
=1 A dIF/dt = -50A/µsVR=30V175ns
F
=1 A dIF/dt = -15A/µsVR=30V250
I
F
=100mA140ns
R
A
µ
TURN-ON SWITCHINGCHARACTERISTICS
SymbolTest ConditionsMinTypMaxUnit
tfr(2)Tj = 100°CI
(2)39V
V
Fp
=6AdIF/dt= 80 A/µs
F
=2V
V
FR
0.6
(1)Test followingJEDEC standard
(2)Test representativeof the application
Toevaluate themaximum conductionlosses use the following equation:
V
= 1.2+ 0.034 I
F
F
P= 1.2 x IF(av)+ 0.034x I
F2(RMS)
s
µ
2/6
Page 3
DTV32G-1500B
Fig. 1: Averageforward power dissipation versus
averageforwardcurrent.
T
=tp/T
tp
Fig.3:Averagecurrentversusambient
temperature.
Fig.2: Peakcurrent versus form factor.
=0.5
T
=tp/T
tp
Fig. 4: Nonrepetitive surge peak forward current
versusoverloadduration(maximumvalues).
IM
=0.5
T
=tp/T
tp
Fig. 5: Relative variation of thermal transient
impedancejunctiontocaseversuspulse duration.
=0.5
T
=0.5
Fig. 6: Forward voltage drop versus forward
current(maximumvalues).
=tp/T
tp
3/6
Page 4
DTV32G-1500B
Fig. 7: Junction capacitance versus reverse
voltageapplied (typicalvalues).
Fig.9: Peakreversecurrent versus dI
F
/dt.
Fig.8: Recoverycharge versusdI
F
/dt.
Fig. 10: Dynamic parameters versus junction
temperature.
;
4/6
Fig.12: Peakforward voltageversusdI
/dt.Fig.11: Recoverytime versusdIF/dt.
F
Page 5
BASIC HORIZONTAL DEFLECTIONCIRCUIT
+V
TRANSFORMER
EHT
DTV32G-1500B
LINE YOKE
L
T
(BUH715)
(D=DAMPER DIODE DTV32-1500)
BASIC E-WDIODE MODULATOR CIRCUIT
+V
TRANSFORMER
EHT
C1
T
(BUH715)
C
D1
D
LINE YOKE
L
C2
D2
D1=DTV32-1500D2=BYT08-400
5/6
Page 6
DTV32G-1500B
PACKAGEDATA
2
PAK
D
DIMENSIONS
REF.
A
E
L2
C2
A4.304.60 0.1690.181
MillimetersInches
Min.Typ.Max. Min.Typ.Max.
A12.492.69 0.0980.106
A20.030.23 0.0010.009
R
V2
D
B0.700.93 0.0270.037
B21.251.40 0.0490.055
C0.450.60 0.0170.024
C21.211.36 0.0470.054
D9.009.35 0.3540.368
E10.0010.28 0.3930.405
G4.885.28 0.1920.208
L15.0015.85 0.5900.624
L
L3
A1
B2
B
G
2.0MIN.
FLATZONE
C
A2
L21.271.37 0.0500.054
L31.401.75 0.0550.069
R0.400.016
V20°8°0°8°
Marking:DTV32G-1500B
Coolingmethod : C.
Weight: 1.8g.
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from itsuse. No
license is granted by implication orotherwise under anypatentor patentrights ofSGS-THOMSON Microelectronics.Specifications mentioned
in this publication are subject to change without notice. This publicationsupersedesand replaces all informationpreviously supplied.
SGS-THOMSONMicroelectronics products are notauthorized for use as critical componentsinlifesupport devices or systemswithoutexpress
writtenapproval of SGS-THOMSON Microelectronics.
1997SGS-THOMSON Microelectronics - Printed in Italy -All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - France - Germany- Italy - Japan - Korea - Malaysia- Malta - Morocco - The Nether-
lands - Singapore - Spain - Sweden - Switzerland - Taiwan- Thailand - United Kingdom - U.S.A.
6/6
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