Page 1
Features
High Cell Density DMOS Technology
·
Low On-State Resistance
·
High Power and Current Capability
·
Fast Switching Speed
·
High Transient Tolerance
·
Mechanical Data
· SOT-223 Plastic Case
· Terminal Connections: See Outline Drawing
and Internal Circuit Diagram Above
C D
J
DT3055
N-CHANNEL ENHANCEMENT MODE
FIELD EFFECT TRANSISTOR
SOT-223
A
B
D
D
G
E
K
S
G
H
L
M
P
N
S
Dim Min Max
6.30 6.71
A
2.90 3.10
B
6.71 7.29
C
3.30 3.71
D
2.22 2.35
E
0.92 1.00
G
1.10 1.30
H
1.55 1.80
J
R
0.025 0.102
K
0.66 0.79
L
4.55 4.70
M
— 10°
N
10° 16°
P
0.254 0.356
R
10° 16°
S
All Dimensions in mm
Maximum Ratings
Drain-Source Voltage
Gate-Source Voltage - Continuous
Drain Current Note 1a Continuous
Maximum Power Dissipation Note 1a
Operating and Storage Temperature Range
25°C unless otherwise specified
Characteristic Symbol Value Unit
Pulsed
Note 1b
Note 1c
Thermal Characteristics
Characteristic Symbol Value Unit
Thermal Resistance, Junction-to-Ambient Note 1
Thermal Resistance, Junction-to-Case
Notes: 1. R
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as
QJA
the solder mounting surface of the drain pins. R
1a. With 1 in
1b. With 0.0066 in2oz 2 oz. copper mounting pad R
1c. With 0.0123 in2oz 2 oz. copper mounting pad R
2
oz 2 oz. copper mounting pad R
V
DSS
V
GSS
I
D
P
d
T
j,TSTG
R
QJA
R
QJC
is guaranteed by design while R
QJC
QJA = 42°C/W.
QJA = 95°C/W.
QJA = 110°C/W.
60 V
±20 V
±4
±25
3.0
1.3
1.1
-65 to +150 °C
42 °C/W
12 °C/W
is determined by the user’s board design.
QCA
A
W
DS11604 Rev. C-4 1 of 4 DT3055
Page 2
Electrical Characteristics
25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
T
=125°C
j
Gate-Body Leakage, Forward
Gate-Body Leakage, Reverse
BV
IDSS
I
GSSF
I
GSSR
DSS
60 — — V
—
—
— — 100 nA
— — -100 nA
ON CHARACTERISTICS (Note 2)
Gate Threshold Voltage
Static Drain-Source On-Resistance
T
j = 100°C
T
= 125°C
j
On-State Drain Current
Forward Transconductance
VGS(th)
R
DS (ON)
I
D(ON)
g
FS
2.0
1.5
—
—
0.075
15 — — A
— 3.5 — m
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
C
ISS
C
OSS
C
RSS
— 350 — pF
— 135 — pF
—40—pF
SWITCHING CHARACTERISTICS (Note 2)
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
t
D(ON)
t
t
D(OFF)
t
Q
Q
Q
—1825ns
r
—2550ns
—4365ns
f
g
gs
gd
—3460ns
—1015nC
— 2.0 4.0 nC
— 6.0 10 nC
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
Max Continuous Drain-Source Diode
Forward Current
Source-Drain Diode Forward Voltage
I
S
V
SD
— — 2.5 A
— — 1.2 V
—
—
2.9
2.3
0.13
10
100
4.0
3.0
0.10
0.22
µA
= 0V, ID= 250µA
V
GS
= 48V, VGS= 0V
V
DS
= 20V, VDS= 0V
V
GS
= -20V, VDS= 0V
V
GS
V
W
V
DS=VGS
V
GS
V
GS
V
DS
V
DS
f = 1.0MHz
V
DD
V
GS
V
DS
V
GS
V
GS
, ID= 250µA
= 10V, ID= 4.0A
= 10V. VDS= 10V
= 15V, ID= 4.0A
= 30V, VGS= 0V
= 25V, ID= 1.2A
= 10V, R
= 40V. ID= 4.0A.
= 10V
GEN
= 50W
= 0V, IS= 4.0A (Note 2)
Notes: 2. Pulse Test: Pulse width l 300µs, duty cycle l 2.0%.
DS11604 Rev. C-4 2 of 4 DT3055
Page 3
12
1
g
10
O
O
O
O
O
O
t
5
V = 10V
GS
8.0
7.0
3.0
ANCE
2.5
V = 5.0V
GS
5.5
6.0
7.0
N-RESIST
9
6
D
I , DRAIN-SOURCE CURRENT
3
0
01234
2.0
ANCE
1.8
1.6
N-RESIST
1.4
URCE
1.2
6.0
5.5
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fi
. 1, On-Region Characteristics
I=4A
D
V = 10V
GS
5.0
4.5
2.0
URCE
1.5
1.0
RMALIZED DRAIN-S
0.5
0 4 8 121620
DS(ON)
R,N
Fig. 2, On-Resistance vs Gate Voltage and Drain Curren
V = 10V
DS
8
I , DRAIN CURRENT (A)
D
T = -55 C
J
125 C
25 C
6
8.0
10
D
I , DRAIN CURRENT (A)
4
2
1.0
0.8
0.6
RMALIZED DRAIN-S
0.4
-50 -25 0 25 50 75 100 125 150
DS(ON)
R,N
T , JUNCTION TEMPERATURE ( C)
j
Fig. 3, On-Resistance Variation vs Temperature
0
2468
V , GATE TO SOURCE VOLTAGE (V)
Fig. 4, On-Resistance vs Gate Voltage & Temperature
GS
DS11604 Rev. C-4 3 of 4 DT3055
Page 4
40
C
(
)
O
10
100 s
1.0
D = 0.5
A
1
URRENT
D
-.1
I , DRAIN
DS(ON)
R LIMIT
100ms
1s
10s
dc
0.01
0.1 1 10 100
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 5, Maximum Safe Operating Area
0.2
0.1
RMALIZED EFFECTIVE
0.01
r(t), N
TRANSIENT THERMAL RESISTANCE
0.1
0.05
0.02
0.01
Single Pulse
R (t) = r(t) b R
QJA QJA
R = See Note 1c
QJA
P
(pk)
t
1
t
2
T - T = P b R (t)
J A PK QJA
Duty Cycle,D=t /t
12
0.001
0.0001 0.001 0.01 0.1 1.0 10 100
t , SQUARE WAVE PULSE DURATION (seconds)
1
1000 3000
Fig. 6, Typical Normalized Transient Thermal Impedance Curves
Remark: Thermal characterization performed under conditions
described in note 1c. Transient thermal response will change
depending on the circuit board design.
DS11604 Rev. C-4 4 of 4 DT3055
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