dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
TABLE 2:dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X MOTOR CONTROL
FAMILIES
Remappable Peripherals
Device
Page Erase Size (Instructions)
Program Flash Memory (Kbytes)
RAM (Kbytes)
16-bit/32-bit Timers
Input Capture
Output Compare
(4)
Motor Control PWM
(2)
SPI
UART
(Channels)
Quadrature Encoder Interface
ECAN™ Technology
(3)
C™
2
I
CTMU
PTG
I/O Pins
Pins
Packages
CRC Generator
External Interrupts
Op am ps/Co mparators
10-bit/12-bit ADC (Channels)
PIC24EP32MC202512 324
PIC24EP64MC2021024 648
PIC24EP128MC2021024 128 16
PIC24EP256MC2021024 256 32
544 6 122—32162/3
(1)
Yes Yes 2128
SPDIP,
SOIC,
SSOP
QFN-S
(5)
PIC24EP512MC2021024 512 48
PIC24EP32MC203512 324
PIC24EP64MC2031024 648
5446122—32183/4 Yes Yes 25 36VTLA
PIC24EP32MC204512 324
PIC24EP64MC2041024 648
PIC24EP128MC2041024 128 16
PIC24EP256MC2041024 256 32
5446122—32193/4 Yes Yes 35 44
VTLA
TQFP,
QFN
(5)
PIC24EP512MC2041024 512 48
PIC24EP64MC2061024 648
PIC24EP128MC2061024 128 16
PIC24EP256MC2061024 256 32
5446122—321163/4 Yes Yes 53 64
TQFP,
QFN
PIC24EP512MC2061024 512 48
dsPIC33EP32MC202512 324
dsPIC33EP64MC202 1024 648
dsPIC33EP128MC202 1024 128 16
dsPIC33EP256MC202 1024 256 32
544 6 122—32162/3
(1)
Yes Yes 2128
SPDIP,
SOIC,
SSOP
QFN-S
(5)
dsPIC33EP512MC202 1024 512 48
dsPIC33EP32MC203512 324
dsPIC33EP64MC203 1024 648
5446122—32183/4 Yes Yes 25 36VTLA
dsPIC33EP32MC204512 324
dsPIC33EP64MC204 1024 648
dsPIC33EP128MC204 1024 128 16
dsPIC33EP256MC204 1024 256 32
5446122—32193/4 Yes Yes 35 44
VTLA
TQFP,
QFN
(5)
dsPIC33EP512MC204 1024 512 48
dsPIC33EP64MC206 1024 648
dsPIC33EP128MC206 1024 128 16
dsPIC33EP256MC206 1024 256 32
5446122—321163/4 Yes Yes 53 64
TQFP,
QFN
dsPIC33EP512MC206 1024 512 48
dsPIC33EP32MC502512 324
dsPIC33EP64MC502 1024 648
dsPIC33EP128MC502 1024 128 16
dsPIC33EP256MC502 1024 256 32
544 6 122132162/3
(1)
Yes Yes 21 28
SPDIP,
SOIC,
SSOP
QFN-S
(5)
dsPIC33EP512MC502 1024 512 48
dsPIC33EP32MC503512 324
dsPIC33EP64MC503 1024 648
5446122132183/4 Yes Yes 25 36VTLA
Note 1:On 28-pin devices, Comparator 4 does not have external connections. Refer to Section 25.0 “Op amp/Comparator Module” for details.
2:Only SPI2 is remappable.
3:INT0 is not remappable.
4:Only the PWM Faults are remappable.
5:The SSOP and VTLA packages are not available for devices with 512 KB of memory.
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
TABLE 2:dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X MOTOR CONTROL
FAMILIES (CONTINUED)
Remappable Peripherals
(4)
Device
RAM (Kbytes)
Page Erase Size (Instructions)
Program Flash Memory (Kbytes)
dsPIC33EP32MC504512 324
dsPIC33EP64MC504 1024 648
dsPIC33EP128MC504 1024 128 16
dsPIC33EP256MC504 1024 256 32
dsPIC33EP512MC504 1024 512 48
dsPIC33EP64MC506 1024 648
dsPIC33EP128MC506 1024 128 16
dsPIC33EP256MC506 1024 256 32
dsPIC33EP512MC506 1024 512 48
Note 1:On 28-pin devices, Comparator 4 does not have external connections. Refer to Section 25.0 “Op amp/Comparator Module” for details.
2:Only SPI2 is remappable.
3:INT0 is not remappable.
4:Only the PWM Faults are remappable.
5:The SSOP and VTLA packages are not available for devices with 512 KB of memory.
2.0Guidelines for Getting Started with 16-bit Digital Signal Controllers and Microcontrollers......................................................... 27
5.0Flash Program Memory............................................................................................................................................................ 117
21.0 Enhanced CAN (ECAN™) Module (dsPIC33EPXXXGP/MC50X Devices Only) ..................................................................... 287
22.0 Charge Time Measurement Unit (CTMU) ............................................................................................................................... 313
27.0 Special Features ...................................................................................................................................................................... 375
28.0 Instruction Set Summary .......................................................................................................................................................... 383
29.0 Development Support............................................................................................................................................................... 393
31.0 DC and AC Device Characteristics Graphs.............................................................................................................................. 463
Index ................................................................................................................................................................................................. 499
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The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
Referenced Sources
This device data sheet is based on the following
individual chapters of the “dsPIC33E/PIC24E FamilyReference Manual”. These documents should be
considered as the general reference for the operation
of a particular module or device feature.
Note 1: To access the documents listed below,
browse to the documentation section of
the dsPIC33EP64MC506 product page
of the Microchip web site
(www.microchip.com) or select a family
reference manual section from the
following list.
In addition to parameters, features, and
other documentation, the resulting page
provides links to the related family
reference manual sections.
• Section 1. “Introduction” (DS70573)
• Section 2. “CPU” (DS70359)
• Section 3. “Data Memory” (DS70595)
• Section 4. “Program Memory” (DS70613)
• Section 5. “Flash Programming” (DS70609)
• Section 6. “Interrupts” (DS70600)
• Section 7. “Oscillator” (DS70580)
• Section 8. “Reset” (DS70602)
• Section 9. “Watchdog Timer and Power-Saving Modes” (DS70615)
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
PORTA
Power-up
Timer
Oscillator
Start-up
OSC1/CLKI
MCLR
VDD, VSS
UART1,
Timing
Generation
ECAN1
(2)
I2C1,
ADC
Timers
Input
Capture
Output
Compare
AV
DD, AVSS
UART2
SPI2
SPI1,
Watchdog
Timer
POR/BOR
CRC
I2C2
QEI1
(1)
PWM
(1)
Remappable
Pins
Note 1: This feature or peripheral is only available on dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X devices.
2: This feature or peripheral is only available on dsPIC33EPXXXGP/MC50X devices.
Op amp/
Comparator
CTMU
PTG
CPU
Refer to Figure 3-1 for CPU diagram details.
16
16
PORTA
PORTC
PORTD
PORTE
PORTF
PORTG
PORTS
Peripheral Modules
Timer
1.0DEVICE OVERVIEW
This document contains device-specific information for
the dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/
Note 1: This data sheet summarizes the fea-
tures of the dsPIC33EPXXXGP50X,
dsPIC33EPXXXMC20X/50X, and
PIC24EPXXXGP/MC20X families of
devices. It is not intended to be a comprehensive resource. To complement
the information in this data sheet, refer
to the related section of the “dsPIC33E/PIC24E Family Reference Manual”,
which is available from the Microchip
50X, and PIC24EPXXXGP/MC20X Digital Signal
Controller (DSC) and Microcontroller (MCU) devices.
dsPIC33EPXXXMC20X/50X and dsPIC33EPXXXGP50X
devices contain extensive Digital Signal Processor (DSP)
functionality with a high-performance 16-bit MCU
architecture.
Figure 1-1 shows a general block diagram of the core
and peripheral modules. Ta b le 1- 1 lists the functions of
the various pins shown in the pinout diagrams.
web site (www.microchip.com)
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
FIGURE 1-1:dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
TABLE 1-1:PINOUT I/O DESCRIPTIONS
Pin
Pin Name
AN0-AN15IAnalogNo Analog input channels.
CLKI
CLKO
OSC1
OSC2
REFCLKOO—Yes Reference clock output.
IC1-IC4ISTYes Capture inputs 1 through 4.
OCFA
OCFB
OC1-OC4
INT0
INT1
INT2
RA0-RA4, RA7-RA12I/OSTNo PORTA is a bidirectional I/O port.
RB0-RB15I/OSTNo PORTB is a bidirectional I/O port.
RC0-RC13, RC15I/OSTNoPORTC is a bidirectional I/O port.
RD5, RD6, RD8I/OSTNo PORTD is a bidirectional I/O port.
RE12-RE15I/OSTNo PORTE is a bidirectional I/O port.
RF0, RF1I/OSTNo PORTF is a bidirectional I/O port.
RG6-RG9I/OSTNo PORTG is a bidirectional I/O port.
T1CK
T2CK
T3CK
T4CK
T5CK
CTPLS
CTED1
CTED2
U1CTS
U1RTS
U1RX
U1TX
BCLK1
Legend: CMOS = CMOS compatible input or outputAnalog = Analog inputP = Power
Note 1: This pin is available on dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X devices only.
2: This pin is available on dsPIC33EPXXXGP/MC50X devices only.
3: This is the default Fault on Reset for dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X devices. See
4: Not all pins are available in all packages variants. See the “Pin Diagrams” section for pin availability.
Section 16.0 “High-Speed PWM Module (dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X
Devices Only)” for more information.
Typ e
I
O
I
I/O
I
I
O
I
I
I
I
I
I
I
I
O
I
I
I
O
I
O
O
Buffer
Type
ST/
CMOS
—
ST/
CMOS
—
ST
ST
—
ST
ST
ST
ST
ST
ST
ST
ST
ST
ST
ST
ST
—
ST
—
ST
PPSDescription
NoNoExternal clock source input. Always associated with OSC1 pin function.
Oscillator crystal output. Connects to crystal or resonator in Crystal
Oscillator mode. Optionally functions as CLKO in RC and EC modes.
Always associated with OSC2 pin function.
NoNoOscillator crystal input. ST buffer when configured in RC mode; CMOS
otherwise.
Oscillator crystal output. Connects to crystal or resonator in Crystal
Oscillator mode. Optionally functions as CLKO in RC and EC modes.
UART2 clear to send.
UART2 ready to send.
UART2 receive.
UART2 transmit.
UART2 IrDA baud clock output.
Synchronous serial clock input/output for SPI1.
SPI1 data in.
SPI1 data out.
SPI1 slave synchronization or frame pulse I/O.
Synchronous serial clock input/output for SPI2.
SPI2 data in.
SPI2 data out.
SPI2 slave synchronization or frame pulse I/O.
Synchronous serial clock input/output for I2C1.
Synchronous serial data input/output for I2C1.
Alternate synchronous serial clock input/output for I2C1.
Alternate synchronous serial data input/output for I2C1.
Synchronous serial clock input/output for I2C2.
Synchronous serial data input/output for I2C2.
Alternate synchronous serial clock input/output for I2C2.
Alternate synchronous serial data input/output for I2C2.
JTAG Test mode select pin.
JTAG test clock input pin.
JTAG test data input pin.
JTAG test data output pin.
ECAN1 bus receive pin.
ECAN1 bus transmit pin.
PWM Fault input 1 and 2.
PWM Fault input 3 and 4.
PWM Fault input 32 (Class B Fault).
PWM Dead Time Compensation Input 1 through 3.
PWM Low Output 1 through 3.
PWM High Output 1 through 3.
PWM Synchronization Input 1.
PWM Synchronization Output 1.
Quadrature Encoder Index1 Pulse input.
Quadrature Encoder Home1 Pulse input.
Quadrature Encoder Phase A input in QEI1 mode. Auxiliary Timer
External Clock/Gate input in Timer mode.
Quadrature Encoder Phase B input in QEI1 mode. Auxiliary Timer
External Clock/Gate input in Timer mode.
Quadrature Encoder Compare Output 1.
Legend: CMOS = CMOS compatible input or outputAnalog = Analog inputP = Power
Note 1: This pin is available on dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X devices only.
2: This pin is available on dsPIC33EPXXXGP/MC50X devices only.
3: This is the default Fault on Reset for dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X devices. See
Section 16.0 “High-Speed PWM Module (dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X
Devices Only)” for more information.
4: Not all pins are available in all packages variants. See the “Pin Diagrams” section for pin availability.
Note 1: This pin is available on dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X devices only.
2: This pin is available on dsPIC33EPXXXGP/MC50X devices only.
3: This is the default Fault on Reset for dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X devices. See
Section 16.0 “High-Speed PWM Module (dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X
Devices Only)” for more information.
4: Not all pins are available in all packages variants. See the “Pin Diagrams” section for pin availability.
Buffer
Typ e
I
Analog
I
Analog
I
Analog
O
Analog
O
I
Analog
I
Analog
I
Analog
O
Analog
O
I
Analog
I
Analog
I
Analog
O
Analog
O
I
Analog
I
Analog
O
OOAnalog
AnalogNoNo
I/O
I
I/O
I
I/O
I
Type
PPSDescription
No
Op amp/Comparator 1 Negative Input 1.
No
Comparator 1 Negative Input 2.
No
Op amp/Comparator 1 Positive Input 1.
No
Op amp 1 Output.
—
Yes
Comparator 1 Output.
No
Op amp/Comparator 2 Negative Input 1.
No
Comparator 2 Negative Input 2.
No
Op amp/Comparator 2 Positive Input 1.
No
Op amp 2 Output.
—
Yes
Comparator 2 Output.
No
Op amp/Comparator 3 Negative Input 1.
No
Comparator 3 Negative Input 2.
No
Op amp/Comparator 3 Positive Input 1.
No
Op amp 3 Output.
—
Yes
Comparator 3 Output.
No
Comparator 4 Negative Input 1.
No
Comparator 4 Positive Input 1.
—
Yes
Comparator 4 Output.
Op amp/Comparator Voltage Reference Output.
Op amp/Comparator Voltage Reference divided by 2 Output.
ST
ST
ST
ST
ST
ST
No
Data I/O pin for programming/debugging communication channel 1.
No
Clock input pin for programming/debugging communication channel 1.
No
Data I/O pin for programming/debugging communication channel 2.
No
Clock input pin for programming/debugging communication channel 2.
No
Data I/O pin for programming/debugging communication channel 3.
No
Clock input pin for programming/debugging communication channel 3.
I/PSTNoMaster Clear (Reset) input. This pin is an active-low Reset to the
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
2.0GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS AND
MICROCONTROLLERS
Note 1: This data sheet summarizes the features
of the dsPIC33EPXXXGP50X,
dsPIC33EPXXXMC20X/50X, and
PIC24EPXXXGP/MC20X families of
devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet,
refer to the related section of the
“dsPIC33E/PIC24E Family ReferenceManual”, which is available from the
Microchip web site (www.microchip.com)
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
2.1Basic Connection Requirements
Getting started with the dsPIC33EPXXXGP50X,
dsPIC33EPXXXMC20X/50X, and
PIC24EPXXXGP/MC20X families requires attention to a
minimal set of device pin connections before proceeding
with development. The following is a list of pin names,
which must always be connected:
DD and VSS pins
• All V
(see Section 2.2 “Decoupling Capacitors”)
• All AV
•V
•MCLR
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
•V
DD and AVSS pins (regardless if ADC module
is not used)
(see Section 2.2 “Decoupling Capacitors”)
CAP
(see Section 2.3 “CPU Logic Filter Capacitor
Connection (V
pin
(see Section 2.4 “Master Clear (MCLR) Pin”)
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
source is used
(see Section 2.6 “External Oscillator Pins”)
REF+/VREF- pins are used when external voltage
reference for ADC module is implemented
Note:The AV
CAP)”)
DD and AVSS pins must be
connected independent of the ADC
voltage reference source.
2.2Decoupling Capacitors
The use of decoupling capacitors on every pair of
power supply pins, such as V
AVSS is required.
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended to use ceramic capacitors.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
• Handling high frequency noise: If the board is
experiencing high frequency noise, above tens of
MHz, add a second ceramic-type capacitor in
parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing PCB track
inductance.
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
dsPIC33E/PIC24E
VDD
VSS
VDD
VSS
VSS
VDD
AVDD
AVSS
VDD
VSS
0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
C
R
V
DD
MCLR
0.1 µF
Ceramic
VCAP
L1
(1)
R1
10 µF
Tantalum
Note 1: As an option, instead of a hard-wired connection, an
inductor (L1) can be substituted between V
DD and
AV
DD to improve ADC noise rejection. The inductor
impedance should be less than 1Ω and the inductor
capacity greater than 10 mA.
Where:
f
FCNV
2
--------------=
f
1
2π LC()
-----------------------=
L
1
2πfC()
---------------------
⎝⎠
⎛⎞
2
=
(i.e., ADC conversion rate/2)
Note 1: R ≤ 10 kΩ is recommended. A suggested
starting value is 10 kΩ. Ensure that the MCLR
pin VIH and VIL specifications are met.
2: R1 ≤ 470Ω will limit any current flowing into
MCLR
from the external capacitor C, in the
event of MCLR
pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR
pin
V
IH and VIL specifications are met.
C
R1
(2)
R
(1)
VDD
MCLR
dsPIC33EP/PIC24EP
JP
FIGURE 2-1:RECOMMENDED
MINIMUM CONNECTION
The placement of this capacitor should be close to the
CAP pin. It is recommended that the trace length not
V
exceeds one-quarter inch (6 mm). See Section 27.3
“On-Chip Voltage Regulator” for details.
2.4Master Clear (MCLR) Pin
The MCLR pin provides two specific device
functions:
• Device Reset
• Device Programming and Debugging.
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR
specific voltage levels (VIH and VIL) and fast signal
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application and PCB requirements.
For example, as shown in Figure 2-2, it is
recommended that the capacitor C, be isolated from
the MCLR
pin during programming and debugging
operations.
Place the components as shown in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR
pin. Consequently,
pin.
CAP)
2.2.1TANK CAPACITORS
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including DSCs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that connects the power supply source to the device, and the
maximum current drawn by the device in the application. In other words, select the tank capacitor so that it
meets the acceptable voltage sag at the device. Typical
values range from 4.7 µF to 47 µF.
2.3CPU Logic Filter Capacitor
A low-ESR (< 1 Ohms) capacitor is required on the
CAP pin, which is used to stabilize the voltage
V
regulator output voltage. The VCAP pin must not be
connected to VDD, and must have a capacitor greater
than 4.7 µF (10 µF is recommended), 16V connected
to ground. The type can be ceramic or tantalum. See
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
Main Oscillator
Guard Ring
Guard Trace
Oscillator Pins
2.5ICSP Pins
The PGECx and PGEDx pins are used for ICSP and
debugging purposes. It is recommended to keep the
trace length between the ICSP connector and the ICSP
pins on the device as short as possible. If the ICSP connector is expected to experience an ESD event, a
series resistor is recommended, with the value in the
range of a few tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communications to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective
device Flash programming specification for information
on capacitive loading limits and pin input voltage high
IH) and input low (VIL) requirements.
(V
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
ICE™.
For more information on ICD 2, ICD 3 and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip web
site.
• “Using MPLAB
• “MPLAB
• “MPLAB
• “Using MPLAB
®
PICkit™ 3, MPLAB ICD 3, or MPLAB REAL
®
®
®
ICD 3” (poster) DS51765
ICD 3 Design Advisory” DS51764
REAL ICE™ In-Circuit Emulator User’s
Guide” DS51616
®
REAL ICE™ In-Circuit Emulator”
(poster) DS51749
2.6External Oscillator Pins
Many DSCs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator. For details, see Section 9.0
“Oscillator Configuration” for details.
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in Figure 2-3.
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
IPFC
VOUTPUT
ADC Channel
Op amp/
ADC Channel
PWM
k
1
k
2
k
3
FET
dsPIC33EP
VINPUT
Comparator Output
Driver
2.7Oscillator Value Conditions on
Device Start-up
If the PLL of the target device is enabled and
configured for the device start-up oscillator, the
maximum oscillator source frequency must be limited
to 3 MHz < F
IN < 5.5 MHz to comply with device PLL
start-up conditions. This means that if the external
oscillator frequency is outside this range, the
application must start-up in the FRC mode first. The
default PLL settings after a POR with an oscillator
frequency outside this range will violate the device
operating speed.
Once the device powers up, the application firmware
can initialize the PLL SFRs, CLKDIV and PLLDBF to a
suitable value, and then perform a clock switch to the
Oscillator + PLL clock source. Note that clock switching
must be enabled in the device Configuration Word.
2.8Unused I/Os
Unused I/O pins should be configured as outputs and
driven to a logic-low state.
Alternatively, connect a 1k to 10k resistor between V
and unused pins and drive the output to logic low.