dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X AND PIC24EPXXXGP/MC20X
dsPIC33EPXXXGP50X,
dsPIC33EPXXXMC20X/50X AND
PIC24EPXXXGP/MC20X PRODUCT
FAMILIES
The device names, pin counts, memory sizes and
peripheral availability of each device are listed in
Table 1 (General Purpose Families) and Table 2 (Motor
Control Families). Their pinout diagrams appear on the
following pages.
T A BL E 1:dsPIC33EPXXXGP50X a nd PIC24 EPX XXGP 20X GEN ERAL PUR POSE FA MILIE S
Remappable Peripherals
(3)
Device
RAM (Kbyte)
Page Erase Size (Instructions)
Program Flash Memor y (Kbytes)
PIC24EP32GP202512324
PIC24EP64GP2021024 648
PIC24EP128GP2021024 12816
PIC24EP256GP2021024 25632
PIC24EP512GP2021024 51248
PIC24EP32GP203512324
PIC24EP64GP2031024 648
PIC24EP32GP204512324
PIC24EP64GP2041024 648
PIC24EP128GP2041024 12816
PIC24EP256GP2041024 25632
PIC24EP512GP2041024 51248
PIC24EP64GP2061024 648
PIC24EP128GP2061024 12816
PIC24EP256GP2061024 25632
PIC24EP512GP2061024 51248
dsPIC33EP32GP502512324
dsPIC33EP64GP5021024 648
dsPIC33EP128GP502 1024 12816
dsPIC33EP256GP502 1024 25632
dsPIC33EP512GP502 1024 51248
dsPIC33EP32GP503512324
dsPIC33EP64GP5031024 648
dsPIC33EP32GP504512324
dsPIC33EP64GP5041024 648
dsPIC33EP128GP504 1024 12816
dsPIC33EP256GP504 1024 25632
dsPIC33EP512GP504 1024 51248
dsPIC33EP64GP5061024 648
dsPIC33EP128GP506 1024 12816
dsPIC33EP256GP506 1024 25632
dsPIC33EP512GP506 1024 51248
Note 1:On 28-pin devices, Comparator 4 does not have external connections. Refer to Section 25.0 “Op Amp/Comparator Module” for details.
2:Only SPI2 is remappable.
3:INT0 is not remappable.
4:The SSOP and VTLA packages are not available for devices with 512 Kbytes of memory.
Input Capture
16-Bit/32-Bit Timers
54422—32162/3
54422—32183/4YesYes2536VTLA
54422—32193/4YesYes35
54422—321163/4YesYes5364
54422132162/3
54422132183/4YesYes2536VTLA
54422132193/4YesYes35
544221321163/4YesYes5364
Output Compare
UART
(2)
SPI
C™
2
I
CRC Generator
ECAN™ Technology
External Interrupts
Op Am ps/Com parators
10-Bit/12-Bit ADC (Channels)
(1)
(1)
PTG
CTMU
Yes Yes 2128
Yes Yes 2128
I/O Pins
44/
44/
Pins
Packages
SPDIP,
SOIC,
SSOP
QFN-S
VTLA
TQFP,
QFN,
48
UQFN
TQFP,
QFN
SPDIP,
SOIC,
SSOP
QFN-S
VTLA
TQFP,
QFN,
48
UQFN
TQFP,
QFN
(4)
,
(4)
,
(4)
,
(4)
,
DS70000657H-page 2 2011-2013 Microchip Technology Inc.
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X AND PIC24EPXXXGP/MC20X
TABLE 2:dsPI C3 3E PXXX MC20 X/ 50 X and PIC 24 EPX XXMC2 0X MOTOR C ONTR OL
FAMILIES
Remappable Peripherals
Device
(4)
(2)
SPI
RAM (Kbytes)
Input Capture
16-Bit/32-Bit Timers
Page Erase Size (Instructions)
Program Flash Memory (Kbytes)
(Channels)
Output Compare
Motor Control PWM
UART
Quadrature Encoder Interface
(3)
C™
2
I
PTG
CTMU
Pins
I/O Pins
CRC Generator
ECAN™ Technology
External Interrupts
Op Amps/Comparators
10-Bit/12-Bit ADC (Channels)
PIC24EP32MC202512 324
PIC24EP64MC2021024 648
PIC24EP128MC2021024 128 16
PIC24EP256MC2021024 256 32
544 6 122—32162/3
(1)
Yes Yes 21 28
SPDIP,
SOIC,
SSOP
QFN-S
PIC24EP512MC2021024 512 48
PIC24EP32MC203512 324
PIC24EP64MC2031024 648
544 6 122—32183/4YesYes2536VTLA
PIC24EP32MC204512 324
PIC24EP64MC2041024 648
PIC24EP128MC2041024 128 16
PIC24EP256MC2041024 256 32
544 6 122—32193/4YesYes35
44/
48
VTLA
TQFP,
QFN,
UQFN
PIC24EP512MC2041024 512 48
PIC24EP64MC2061024 648
PIC24EP128MC2061024 128 16
PIC24EP256MC2061024 256 32
544 6 122—321163/4YesYes5364
TQFP,
QFN
PIC24EP512MC2061024 512 48
dsPIC33EP32MC202512 324
dsPIC33EP64MC2021024 648
dsPIC33EP128MC202 1024 128 16
dsPIC33EP256MC202 1024 256 32
544 6 122—32162/3
(1)
Yes Yes 21 28
SPDIP,
SOIC,
SSOP
QFN-S
dsPIC33EP512MC202 1024 512 48
dsPIC33EP32MC203512 324
dsPIC33EP64MC2031024 648
544 6 122—32183/4YesYes2536VTLA
dsPIC33EP32MC204512 324
dsPIC33EP64MC2041024 648
dsPIC33EP128MC204 1024 128 16
dsPIC33EP256MC204 1024 256 32
544 6 122—32193/4YesYes35
44/
48
VTLA
TQFP,
QFN,
UQFN
dsPIC33EP512MC204 1024 512 48
dsPIC33EP64MC2061024 648
dsPIC33EP128MC206 1024 128 16
dsPIC33EP256MC206 1024 256 32
544 6 122—321163/4YesYes5364
TQFP,
QFN
dsPIC33EP512MC206 1024 512 48
dsPIC33EP32MC502512 324
dsPIC33EP64MC5021024 648
dsPIC33EP128MC502 1024 128 16
dsPIC33EP256MC502 1024 256 32
544 6 122132162/3
(1)
Yes Yes 21 28
SPDIP,
SOIC,
SSOP
QFN-S
dsPIC33EP512MC502 1024 512 48
dsPIC33EP32MC503512 324
dsPIC33EP64MC5031024 648
544 6 122132183/4YesYes2536VTLA
Note 1:On 28-pin devices, Comparator 4 does not have external connections. Refer to Section 25.0 “Op Amp/Comparator Module” for details.
2:Only SPI2 is remappable.
3:INT0 is not remappable.
4:Only the PWM Faults are remappable.
5:The SSOP and VTLA packages are not available for devices with 512 Kbytes of memory.
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X AND PIC24EPXXXGP/MC20X
T ABLE 2:dsPIC33E PXXX MC 20 X/50 X and PI C24 EPX XXM C2 0X MOTOR CO NTROL
FAMILIES (CONTINUED)
Remappable Peripheral s
(4)
Device
RAM (Kbytes)
Page Erase Size (Instructions)
Program Flash Memory (Kbytes)
dsPIC33EP32MC504512 324
dsPIC33EP64MC5041024 648
dsPIC33EP128MC504 1024 128 16
dsPIC33EP256MC504 1024 256 32
dsPIC33EP512MC504 1024 512 48
dsPIC33EP64MC5061024 648
dsPIC33EP128MC506 1024 128 16
dsPIC33EP256MC506 1024 256 32
dsPIC33EP512MC506 1024 512 48
Note 1:On 28-pin devices, Comparator 4 does not have external connections. Refer to Section 25.0 “Op Amp/Comparator Module” for details.
2:Only SPI2 is remappable.
3:INT0 is not remappable.
4:Only the PWM Faults are remappable.
5:The SSOP and VTLA packages are not available for devices with 512 Kbytes of memory.
Input Capture
16-Bit/32-Bit Timers
544 6 122132193/4YesYes35
544 6 1221321163/4YesYes5364
(Channels)
Output Compare
Motor Control PWM
Quadrature Encoder Interface
UART
(2)
SPI
(3)
C™
2
I
CRC Generator
ECAN™ Technology
External Interrupts
Op Amps/Comparators
10-Bit/12-Bit ADC (Channels)
PTG
CTMU
Pins
I/O Pins
VTLA
44/
TQFP,
48
QFN,
UQFN
TQFP,
QFN
Packages
(5)
,
DS70000657H-page 4 2011-2013 Microchip Technology Inc.
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X AND PIC24EPXXXGP/MC20X
28-Pin SPDIP/SOIC/SSOP
(1,2)
Note 1:The RPn/RPIn pins can be used by any remappable peripheral with some limitation. See Section 11.4
“Peripheral Pin Sele ct (PPS )” for available peripherals and for information on limitations.
2:Every I/O port pin (RAx-RGx) can be used as a Change Notification pin (CNAx-CNGx). See Section 11.0 “I/O
Ports” for more information.
3:There is an internal pull-up resistor connected to the TMS pin when the JTAG interface is active. See the
Note 1:The RPn/RPIn pins can be used by any remappable peripheral with some limitation. See Section 11.4
“Peripheral Pin Select (PPS)” for available peripherals and for information on limitations.
2:Every I/O port pin (RAx-RGx) can be used as a Change Notification pin (CNAx-CNGx). See Section 11.0 “I/O
Ports” for more information.
3:This pin is not available as an input when OPMODE (CMxCON<10>) = 1.
4:The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected
to V
SS externally.
5:There is an internal pull-up resistor connected to the TMS pin when the JTAG interface is active. See the
Note 1:The RPn/RPIn pins can be used by any remappable peripheral with some limitation. See Section 11.4
“Peripheral Pin Select (PPS)” for available peripherals and for information on limitations.
2:Every I/O port pin (RAx-RGx) can be used as a Change Notification pin (CNAx-CNGx). See Section 11.0 “I/ O
Ports” for more information.
3:This pin is not available as an input when OPMODE (CMxCON<10>) = 1.
4:The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected
to V
SS externally.
5:There is an internal pull-up resistor connected to the TMS pin when the JTAG interface is active. See the
2.0Guidelines for Getting Started with 16-bit Digital Signal Controllers and Microcontrollers ......................................................... 29
5.0Flash Program Memory ............................................................................................................................................................ 119
10.0 Power-Saving Features ............................................................................................................................................................ 163
21.0 Enhanced CAN (ECAN™) Module (dsPIC33EPXXXGP/MC50X Devices Only) ..................................................................... 287
22.0 Charge Time Measurement Unit (CTMU) ............................................................................................................................... 315
27.0 Special Features ...................................................................................................................................................................... 379
28.0 Instruction Set Summary .......................................................................................................................................................... 387
29.0 Development Support............................................................................................................................................................... 397
32.0 DC and AC Device Characteristics Graphs.............................................................................................................................. 475
Index ................................................................................................................................................................................................. 517
The Microchip Web Site..................................................................................................................................................................... 525
Customer Change Notification Service .............................................................................................................................................. 525
Customer Support .............................................................................................................................................................................. 525
DS70000657H-page 22 2011-2013 Microchip Technology Inc.
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X AND PIC24EPXXXGP/MC20X
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
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The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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DS70000657H-page 24 2011-2013 Microchip Technology Inc.
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X AND PIC24EPXXXGP/MC20X
PORTA
Power-up
Timer
Oscillator
Star t-up
OSC1/CLKI
MCLR
VDD, VSS
UART1,
Timing
Generation
ECAN1
(2)
I2C1,
ADC
Timers
Input
Capture
Output
Compare
AV
DD, AVSS
UART2
SPI2
SPI1,
Watchdog
Timer
POR/BOR
CRC
I2C2
QEI1
(1)
PWM
(1)
Remappable
Pins
Note 1:This feature or peripheral is only available on dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X devices.
2:This feature or peripheral is only available on dsPIC33EPXXXGP/MC50X devices.
Op Amp/
Comparator
CTMU
PTG
CPU
Refer to Figure 3-1 for CPU diagram details.
16
16
PORTB
PORTC
PORTD
PORTE
PORTF
PORTG
PORTS
Peripheral Modules
Timer
1.0DEVICE OVERVIEW
This document contains device-specific information for
the dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/
Note 1: This data sheet summarizes the
features of the dsPIC33EPXXXGP50X,
dsPIC33EPXXXMC20X/50X and
PIC24EPXXXGP/MC20X families of
devices. It is not intended to be a comprehensive resource. To complement
the information in this data sheet, refer
to the related section of the “dsPIC33/PIC24 Family Reference Manual”,
which is available from the Microchip
50X and PIC24EPXXXGP/MC20X Digital Signal
Controller (DSC) and Microcontroller (MCU) devices.
dsPIC33EPXXXMC20X/50X and dsPIC33EPXXXGP50X
devices contain extensive Digital Signal Processor
(DSP) functionality with a high-performance, 16-bit
MCU architecture.
Figure 1-1 shows a general block diagram of the core
and peripheral modules. Table 1-1 lists the functions of
the various pins shown in the pinout diagrams.
web site (www.microchip.com)
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
FIGURE 1-1:dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X AND PIC24EPXXXGP/MC20X
Note 1:This pin is available on dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X devices only.
2:This pin is available on dsPIC33EPXXXGP/MC50X devices only.
3:This is the default Fault on Reset for dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X devices. See
Section 16.0 “High-Speed PWM Module (dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X
Devices Only)” for more information.
4:Not all pins are available in all packages variants. See the “Pin Diagrams” section for pin availability.
5:There is an internal pull-up resistor connected to the TMS pin when the JTAG interface is active. See the
JTAGEN bit field in Table 27-2.
Type
I
I/O
I
I
O
I
I
I
I
I
I
I
I
O
I
I
I
O
I
O
O
Buffer
Type
CMOS
ST/
CMOS
—
ST
ST
—
ST
ST
ST
ST
ST
ST
ST
ST
ST
ST
ST
ST
—
ST
—
ST
PPSDescription
No External clock source input. Always associated with OSC1 pin function.
Oscillator mode. Optionally functions as CLKO in RC and EC modes.
Always associated with OSC2 pin function.
NoNoOscillator crystal input. ST buffer when configured in RC mode; CMOS
otherwise.
Oscillator crystal output. Connects to crystal or resonator in Crystal
Oscillator mode. Optionally functions as CLKO in RC and EC modes.
Yes
Compare Fault A input (for Compare channels).
No
Compare Fault B input (for Compare channels).
Yes
Compare Outputs 1 through 4.
No
External Interrupt 0.
Yes
External Interrupt 1.
Yes
External Interrupt 2.
No
Timer1 external clock input.
Yes
Timer2 external clock input.
No
Timer3 external clock input.
No
Timer4 external clock input.
No
Timer5 external clock input.
No
CTMU pulse output.
No
CTMU External Edge Input 1.
No
CTMU External Edge Input 2.
No
UART1 Clear-To-Send.
No
UART1 Ready-To-Send.
Yes
UART1 receive.
Yes
UART1 transmit.
No
UART1 IrDA
®
baud clock output.
DS70000657H-page 26 2011-2013 Microchip Technology Inc.
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X AND PIC24EPXXXGP/MC20X
Synchronous serial clock input/output for SPI1.
SPI1 data in.
SPI1 data out.
SPI1 slave synchronization or frame pulse I/O.
Synchronous serial clock input/output for SPI2.
SPI2 data in.
SPI2 data out.
SPI2 slave synchronization or frame pulse I/O.
Synchronous serial clock input/output for I2C1.
Synchronous serial data input/output for I2C1.
Alternate synchronous serial clock input/output for I2C1.
Alternate synchronous serial data input/output for I2C1.
Synchronous serial clock input/output for I2C2.
Synchronous serial data input/output for I2C2.
Alternate synchronous serial clock input/output for I2C2.
Alternate synchronous serial data input/output for I2C2.
JTAG Test mode select pin.
JTAG test clock input pin.
JTAG test data input pin.
JTAG test data output pin.
ECAN1 bus receive pin.
ECAN1 bus transmit pin.
PWM Fault Inputs 1 and 2.
PWM Fault Inputs 3 and 4.
PWM Fault Input 32 (Class B Fault).
PWM Dead-Time Compensation Inputs 1 through 3.
PWM Low Outputs 1 through 3.
PWM High Outputs 1 through 3.
PWM Synchronization Input 1.
PWM Synchronization Output 1.
Quadrature Encoder Index1 pulse input.
Quadrature Encoder Home1 pulse input.
Quadrature Encoder Phase A input in QEI1 mode. Auxiliary timer
external clock/gate input in Timer mode.
Quadrature Encoder Phase B input in QEI1 mode. Auxiliary timer
external clock/gate input in Timer mode.
Quadrature Encoder Compare Output 1.
Legend: CMOS = CMOS compatible input or outputAnalog = Analog inputP = Power
Note 1:This pin is available on dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X devices only.
2:This pin is available on dsPIC33EPXXXGP/MC50X devices only.
3:This is the default Fault on Reset for dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X devices. See
Section 16.0 “High-Speed PWM Module (dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X
Devices Only)” for more information.
4:Not all pins are available in all packages variants. See the “Pin Diagrams” section for pin availability.
5:There is an internal pull-up resistor connected to the TMS pin when the JTAG interface is active. See the
Note 1:This pin is available on dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X devices only.
2:This pin is available on dsPIC33EPXXXGP/MC50X devices only.
3:This is the default Fault on Reset for dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X devices. See
Section 16.0 “High-Speed PWM Module (dsPIC33EPXXXMC20X/50X and PIC24EPXXXMC20X
Devices Only)” for more information.
4:Not all pins are available in all packages variants. See the “Pin Diagrams” section for pin availability.
5:There is an internal pull-up resistor connected to the TMS pin when the JTAG interface is active. See the
JTAGEN bit field in Table 27-2.
DS70000657H-page 28 2011-2013 Microchip Technology Inc.
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X AND PIC24EPXXXGP/MC20X
2.0GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS AND
MICROCONTROLLERS
Note 1: This data sheet summarizes the
features of the dsPIC33EPXXXGP50X,
dsPIC33EPXXXMC20X/50X and
PIC24EPXXXGP/MC20X families of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the related section of the
“dsPIC33/PIC24 Family ReferenceManual”, which is available from the
Microchip web site (www.microchip.com)
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
2.1Basic ConnectionRequirements
Getting started with the dsPIC33EPXXXGP50X,
dsPIC33EPXXXMC20X/50X and
PIC24EPXXXGP/MC20X families requires attention
to a minimal set of device pin connections before
proceeding with development. The following is a list
of pin names, which must always be connected:
DD and VSS pins
•All V
(see Section 2.2 “Decoupling Capacitors”)
•All AV
•V
•MCLR
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
•V
DD and AVSS pins (regardless if ADC module
is not used)
(see Section 2.2 “Decoupling Capacitors”)
CAP
(see Section 2.3 “CPU Logic Filter Capacitor
Connection (V
pin
(see Section 2.4 “Master Clear (MCLR) Pin”)
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
source is used
(see Section 2.6 “External Oscillator Pins”)
REF+/VREF- pins are used when external voltage
reference for the ADC module is implemented
Note:The AV
CAP)”)
DD and AVSS pins must be
connected, independent of the ADC
voltage reference source.
2.2DecouplingCapacitors
The use of decoupling capacitors on every pair of
power supply pins, such as V
SS is required.
AV
Consider the following criteria when using decoupling
capacitors:
• Va lue and type of cap a citor: Recommendation
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended to use ceramic capacitors.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
• Handling high-frequency noise: If the board is
experiencing high-frequency noise, above tens
of MHz, add a second ceramic-type capacitor in
parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing PCB track
inductance.
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X AND PIC24EPXXXGP/MC20X
dsPIC33E/PIC24E
VDD
VSS
VDD
VSS
VSS
VDD
AVDD
AVSS
VDD
VSS
0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
C
R
V
DD
MCLR
0.1 µF
Ceramic
VCAP
L1
(1)
R1
10 µF
Tantalum
Note 1: As an option, instead of a hard-wired connection, an
inductor (L1) can be substituted between V
DD and
AV
DD to improve ADC noise rejection. The inductor
impedance should be less than 1 and the inductor
capacity greater than 10 mA.
Where:
f
F
CNV
2
--------------
=
f
1
2 LC
-----------------------
=
L
1
2fC
--------------------- -
2
=
(i.e., ADC conversion rate/2)
Note 1: R 10 k is recommended. A suggested
starting value is 10 k. Ensure that the MCLR
pin V
IH and VIL specifications are met.
2: R1 470 will limit any current flowing into
MCLR
from the external capacitor, C, in the
event of MCLR
pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR
pin
V
IH and VIL specifications are met.
C
R1
(2)
R
(1)
VDD
MCLR
dsPIC33E/PIC24E
JP
FIGURE 2-1:RECOMMENDED
MINIMUM CONNECTION
2.2.1TANK CAPACITORS
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including DSCs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that connects the power supply source to the device and the
maximum current drawn by the device in the application. In other words, select the tank capacitor so that it
meets the acceptable voltage sag at the device. Typical
values range from 4.7 µF to 47 µF.
2.3CPU Logic FilterCapacitor
Connection (V
A low-ESR (< 1 Ohm) capacitor is required on the VCAP
pin, which is used to stabilize the voltage regulator
output voltage. The V
DD and must have a capacitor greater than 4.7 µF
V
(10 µF is recommended), 16V connected to ground. The
type can be ceramic or tantalum. See Section 30.0
“Electrical Characteristics” for additional information.
The placement of this capacitor should be close to the
CAP pin. It is recommended that the trace length not
V
exceeds one-quarter inch (6 mm). See Section 27.3
“On-Chip Voltage Regulator” for details.
CAP)
CAP pin must not be connected to
2.4Master Clear (MCLR)Pin
The MCLR pin provides two specific device functions:
• Device Reset
• Device Programming and Debugging.
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR
specific voltage levels (V
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application and PCB requirements.
For example, as shown in Figure 2-2, it is recommended
that the capacitor, C, be isolated from the MCLR
during programming and debugging operations.
Place the components as shown in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR
FIGURE 2-2:EXAMPLE OF MCLR PIN
CONNECTIONS
pin. Consequently,
IH and VIL) and fast signal
pin
pin.
DS70000657H-page 30 2011-2013 Microchip Technology Inc.
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