Datasheet DSP56001RC33, DSP56001RC20, DSP56001FE33, DSP56001FE27, DSP56001FE20 Datasheet (Motorola)

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Page 1
MOTOROLA
SEMICONDUCTOR
Order this document
by DSP56001/D
TECHNICAL DATA
24-Bit General Purpose Digital Signal Processor
The DSP56001 is a member of Motorola’s family of HCMOS, low-power, general purpose Digital Signal Processors. The DSP56001 features 512 words of full speed, on-chip program RAM (PRAM) memory, two 256 word data RAMs, two preprogrammed data ROMs, and special on -chip boot strap hardware to per­mit convenient loading of user programs into the pro­gram RAM. It is an off-the-sh elf part since th e program
memory is user programmable. The core of the processor consists of three execution units operating in parallel — the data ALU, the address generation unit, and the program controller. The DSP56001 has MCU-style on-chip peripherals, program and data memory, as well as a mem ory ex pan si on p ort. The MPU-style program mi ng m ode l an d in struction set make writ ing efficient, com­pact code, straightforward.
The high throughput of the DSP56001 makes it well-suited for communication, high-speed control, numeric processing, computer and audio applications. The key features which facilitate this throughput are:
Speed
Precision
Parallelism
Integration
Invisible Pipeline
Instruction Set
DSP56000/DSP56001
Compatibility
Low Power
At 16.5 million instructions per second (MIPS) with a 33 MH z clock, the DSP 56001 can execut e a 1024 point complex Fast Fourier Transform in1.98 milliseconds (66,240 clock cycles).
The data paths are 24 bits wide thereby providing 144 dB of dynamic range; intermediate results held in the 56-bit accumulators can range over 336 dB.
The data ALU, address arit hme tic u nits, an d pr ogram c ontro ller ope rate in para llel s o th at an i n­struction prefetch, a 24x24-bit multip licat ion, a 56- bit add ition, two data moves , and two addres s pointer updates using one o f three types of arithmet ic (linear, modulo, o r reverse carry) can b e executed in a single instruction cycle. This parallelism allows a four coefficient Infinite Impulse Re­sponse (IIR) filter section to be executed in only four cycles, the theoretical minimum for a single multiplier architecture.
In addition to the three independent executio n units, the DSP56001 has six on-ch ip memories, three on-chip MCU style periphera ls (Se rial Co mmu nication In terfa ce, Sy nchr ono us Ser ial Inte r­face, and Host Interface), a clock generator and seven buses (three address and four data), mak­ing the overall system functionally complete and powerful, but also very low cost, low power, and compact.
The three-stage instruction pipeline is essentially invisible to the programmer thus allowing straightforward program development in either assembly language or a high-level language such as ANSI C.
The 62 instruction mnemonics are MC U-like making the transiti on from programming mic ropro­cessors to programming the DSP56001 digital signal processor as easy as possible. The orthog­onal syntax supports control o f the pa ralle l exec ution unit s. This synt ax pro vide s 12,8 08, 830 d if­ferent instruction variations using the 62 instruction mnemonics. The no-overhead DO instruction and the REPEAT (REP) instruction make writing straight-line code obsolete.
The DSP56001 is identi cal to the DSP5 6000 except tha t it has 512x24-b its of on-chip progra m RAM instead of 3.75K of program ROM; a 32x24-bit bootstrap ROM for loading the program RAM from either a byte-wide memory mapped ROM or via the Host Interface; and the on-chip X and Y Data ROMs have been preprogrammed as positive Mu- and A-Law to linear expansion tables and a full, four quadrant sine wave table, respectively.
As a CMOS part, the DSP56001 is inherently very low power; however, three other features can reduce power consumption to an exceptionally low level. — The WAIT instruction shuts off the clock in the central processor portion of the DSP56001. — The STOP instruction halts the internal oscillator. — Power increases linearly (appro ximately) with frequency; thus, red ucing the clock frequency
reduces power consumption.
Pin Grid Array (PGA)
Available in an 88 pin ceramic through-hole package.
Ceramic Quad Flat Pack (CQFP)
Available in a 132 pin, small footprint, surface mount package.
Plastic Quad Flat Pack (PQFP)
Available in a 132 pin, small footprint, surface mount package.
DSP56001
This document contains information on a new product. Specifications and information herein are subject to change without notice.
MOTOROLA INC., 1992
Rev. 3
May 4, 1998
Page 2
PORT B OR HOST
15
9
PORT C AND/OR SSI, SCI
ADDRESS
GENERATION
UNIT
ON-CHIP
PERIPHERALS:
HOST, SS I,
SCI, PI/O
INTERNAL DA TA
BUS SWITCH
AND BIT
MANIPUL ATION
UNIT
BOOTSTRAP
ROM
32X24
PROGRAM
RAM
512X24
YAB XAB PAB
X MEMORY
µ
YDB XDB PDB GDB
RAM
256X24
/A ROM
256X24
Y MEMORY
RAM
256X24
SINE ROM
256X24
EXTERNAL ADDRESS
BUS
SWITCH
BUS
CONTROL
EXTERNAL DATA BUS
SWITCH
ADDRESS
7
DA TA
PORT A
DATA ALU
24X24+56→56-BIT MAC
16 BITS 24 BITS
CLOCK
GENERATOR
EXTAL XTA L
PROGRAM
ADDRESS
GENERATOR
PROGRAM
DECODE
CONTROLLER
PROGRAM
INTERRUPT
CONTROLLER
TWO 56-BIT ACCUMULATORS
MODB/IRQB
MODA/IRQA
RESET
Figure 1. DSP56001 Block Diagram
In the USA:
For technical assistance call: DSP Applications Helpline (512) 891-3230
For availability and literature call your local Motorola Sales Office or Authorized Motorola Distr ibutor.
MOTOROLA
2
For free application software and information call the Dr. BuB electronic bulletin board:
9600/4800/2400/1200/300 baud (512) 891-3771 (8 data bits, no parity, 1 stop)
In Europe, Japan and Asia Pacific
Contact your regional sales office or Motorola distributor.
DSP56001
Page 3

SIGNAL DESCRIPTION

The DSP56001 is available in 132 pin surface mount (CQFP and PQFP) or an 88-pin pin-grid array packaging. Its input and output sig­nals are organized into seven functional groups which are listed below and shown in Figure 1.
Port A Address and Data Buses Port A Bus Control Interrupt and Mode Control Power and Clock Host Interface or Port B I/O Serial Communications Interface or Port C I/O Synchronous Serial Interface or Port C I/O
PORT A ADDRESS AND DATA BUS
Address Bus (A0-A15)
These three-state output pins specify the address for external program and data memory accesses. To minimize power dissipation, A0-A15 do not change state when external memory spaces are not being a c­cessed.
Data Bus (D0-D23)
These pins provide the bidirectional data bus for external program and data memory accesses. D0-D23 are in the high-impedance state when the bus grant signal is asserted.
Read Enable (RD)
This three-state output is asserted to read external memory on the data bus D0-D23. This pin is three-stated during RESET
Write Enable (WR
)
.
This three-state output is asserted to write external memory on the data bus D0-D23. This pin is three-stated during RESET
Bus Request (BR
The bus request input BR
/WT)
allows another device such as a processor
.
or DMA controller to become the master of external data bus D0-D23 and external address bus A0-A15. When operating mode register (OMR) bit 7 is clear and BR
is asserted, the DSP56001 will always re­lease the external data bus D0-D23, address bus A0-A15, and bus control pins PS
, DS, X/Y, RD, and WR (i. e., Port A), by placing these
pins in the high-impedance state after execution of the current instruc-
pin should be pulled up when not
tion has been completed.
The BR
in use.
If OMR bit 7 is set, this pin is an input that allows an external device to force wait states during an external Port A operation for as long as WT is asserted.
Bus Grant (BG
/BS)
If OMR bit 7 is clear, this output is asserted to acknowledge an external bus request after Port A has been released. If OMR bit 7 is set, this pin is bus strobe and is asserted when the DSP accesses Port A. This pin is three-stated during RESET
.
PORT A BUS CONTROL
Program Memory Select (PS)
This three-state output is asserted only when external program mem ­ory is referenced. This pin is three-stated during RESET
Data Memory Select (DS
)
.
This three-state output is asserted only when external data memory is referenced. This pin is three-stated during RESET
Select (X/Y)
X/Y
.
This three-state output selects which external data memory space (X or Y) is referenced by data memory select (DS
A0-A15 D0-D23
PS DS RD
WR
X/Y
BR/WT
BG/BS
.
HOST DATA
BUS
H0-H7
HA0
PORT A
VSS
HOST CONTROL
HA1
HA2
PORT B
DSP56001
VDD
XTAL
ed during RESET
ADDRESS
DAT A
BUS
CONTROL
). This pin is three-stat-
HR/W
HEN
HREQ
PORT C
EXTAL
IRQB
MODA/
MODB/
RESET
HACK
RXD TXD SCLK SC0 SC1 SCK SRD STD
IRQA
Figure 2. Functional Signal Groups
INTERRUPT AND MODE CONTROL
Mode Select A/External Interrupt Request A (MODA/IRQA), Mode Select B/External Interrupt Request B (MODB/IRQB
These two inputs have dual functions: 1) to select the initial chip oper­ating mode and 2) to receive an interrupt request from an external source. MODA and MODB are read and internally latched in the DSP when the processor exits the RESET state. Therefore these two pins should be forced into the proper state during reset. After leaving the RESET state, the MODA and MODB pins automatically change to ex­ternal interrupt requests IRQA
and IRQB. After leaving the reset state the chip operating mode can be changed by software. IRQA may be programmed to be level sensitive or negative edge triggered. When edge triggered, triggering occurs at a voltage level and i s not di­rectly related to the fall time of the interrupt signal, however, the prob­ability of noise on IRQA
or IRQ B generating multiple interrupts increas­es with increasing fall time of the interrupt signal. These pins are inputs during RESET
Reset (RESET
.
)
This Schmitt trigger input pin is used to reset the DSP56001. When
is asserted, the DSP56001 is initialized and placed in the reset
RESET state. When the RESET
SCI
mode is latched from the MODA and MODB pins. When coming out of
signal is deasserted, the initial chip operating
reset, deassertion occurs at a voltage level and is not directly related to the rise time of the reset signal; however, the probability of noise on
generating multiple resets increases with increasing rise time
RESET of the reset signal.
SSI
POWER AND CLOCK
Power (Vcc), Ground (GND)
There are five sets of power and ground pins used for the four groups of logic on the chip, two pairs for internal logic, one power and two ground for Port A address and control pins, one power and two ground for Port A data pins, and one pair for peripherals. Refer to the pin as­signments in the
LAYOUT PRACTICES
section.
)
and IRQB
DSP56001 MOTOROLA
3
Page 4
External Clock/Crystal Input (EXTAL)
EXTAL may be used to interface the crystal oscillator input to an exter­nal crystal or an external clock.
Crystal Output (XTAL)
This output connects the internal crystal oscillator output to an external crystal. If an external clock is used, XTAL should not be connected.
HOST INTERFACE
Host Data Bus (H0-H7)
This bidirectional data bus is used to transfer data between the host processor and the DSP56001. This bus is an input unless enabled by a host processor read. H0-H7 may be programmed as general pur­pose parallel I/O pins called PB0-PB7 when the H ost Interface is not being used. These pins are configured as a GPIO input pins during hardware reset.
Host Address (HA0-HA2)
These inputs provide the address selection for each Host Interface register. HA0-HA2 may be programmed as general purpose parallel I/O pins called PB8-PB10 when the Host Interface is not being used. These pins are configured as a GPIO input pins during hardware reset.
Host Read/Write (HR/W
This input selects the direction of data transfer for each host processor access. HR/W called PB11 when the Host Interface is not being used. This pin is con­figured as a GPIO input pins during hardware reset.
Host Enable (HEN
This input enables a data transfer on the host data bus. When HEN asserted and HR/W data may be read by the host processor, When HEN HR/W
is low, H0-H7 become inputs and host data is latched inside the DSP when HEN from host address decoding and an enable clock, is used to generate
. HEN may be programmed as a general purpose I/O pin called
HEN PB12 when the Host Interface is not being used. This pin is configured as a GPIO input pins during hardware reset.
Host Request (HREQ
This open-drain output signal is used by the DSP56001 Host Interface to request service from the host processor, DMA controller, or simple external controller. HREQ I/O pin (not open-drain) called PB13 when the Host interface is not be­ing used. HREQ figured as a GPIO input pins during hardware reset.
Host Acknowledge (HACK
This input has two functions: 1) to receive a Host Acknowledge hand­shake signal for DMA transfers and, 2) to receive a Host Interrupt Ac­knowledge compatible with MC68000 Family processors. HACK be programmed as a general purpose I/O pin called PB14 when the Host Interface is not being used. This pin i s configured as a GPIO input pins during hardware reset.
in use.
may be programmed as a general purpose I/O pin
is deasserted. Normally a chip select signal, derived
should be pulled high when not in use. This pin is con-
)
)
is high, H0-H7 become outputs, and DSP56001
)
may be programmed as a general purpose
)
should be pulled high when not
HACK
is asserted and
may
is
Transmit Data (TXD)
This output transmits serial data from the SCI Transmit Shift Register. Data changes on the negative edge of the transmit clock. This output is stable on the positive edge of the transmit clock. TXD may be pro­grammed as a general purpose I/O pin called PC1 when the SCI is not being used. This pin is configured as a GPIO input pins during hard­ware reset.
SCI Serial Clock (SCLK)
This bidirectional pin provides an input or output clock from which the transmit and/or receive baud rate is derived in the asynchronous mode and from which data is transferred in the synchronous mode. SCLK may be programmed as a general purpose I/O pin called PC 2 when the SCI is not being used. This pin is configured as a GPIO input pins during hardware reset.
SYNCHRONOUS SERIAL INTERFACE (SSI)
Serial Control Zero (SC0)
This bidirectional pin is used for control by the SSI. SC0 may be pro­grammed as a general purpose I/O pin called PC3 when the SSI is not being used. This pin is configured as a GPIO input pins during hard­ware reset.
Serial Control One (SC1)
This bidirectional pin is used for control by the SSI. SC1 may be pro­grammed as a general purpose I/O pin called PC4 when the SSI is not being used. This pin is configured as a GPIO input pins during hard­ware reset.
Serial Control Two (SC2)
This bidirectional pin is used for control by the SSI. SC2 may be pro­grammed as a general purpose I/O pin called PC5 when the SSI is not being used. This pin is configured as a GPIO input pins during hard­ware reset.
SSI Serial Clock (SCK)
This bidirectional pin provides the serial bit rate clock for the SSI when only one clock is used. SCK may be programmed as a general pur­pose I/O pin called PC6 when the SSI is not being used. This pin is configured as a GPIO input pins during hardware reset.
SSI Receive Data (SRD)
This input pin receives serial data into the SSI Receive Shift Register. SRD may be programmed as a general purpose I/O pin called PC7 when the SSI is not being used. This pin is configured as a GPIO input pins during hardware reset.
SSI Transmit Data (STD)
This output pin transmits serial data from the SSI Transmit Shift Reg­ister. STD may be programmed as a general purpos e I/O pin called PC8 when the SSI is not being used. This pin is configured as a GPIO input pins during hardware reset.
SERIAL COMMUNICATIONS INTERFACE (SCI)
Receive Data (RXD)
This input receives byte-oriented data into the SCI Receive Shift Reg­ister. Input data is sampled on the positive edge of the Receive Clock. RXD may be programmed as a general purpose I/O pin called PC0 when the SCI is not being used. This pin is configured as a GPIO input pins during hardware reset.
MOTOROLA
4
DSP56001
Page 5

DSP56001 Electrical Characteristics

Electrical Specifications
The DSP is fabricated in high density CMOS with TTL compatible inputs and outputs.
Maximum Ratings (VSS = 0 Vdc)
Supply Voltage Vcc -0.3 to +7.0 V All Input Voltages Vin V Current Drain per Pin I 10 mA
excluding Vcc and V Operating Temperature Range T Storage Temperature Tstg -55 to +150
Rating Symbol Value Unit
SS
Maximum Electrical Ratings
Thermal Characteristics - PGA Package
Characteristics Symbol Value Rating Thermal Resistance - Ceramic
Junction to Ambient Junction to Case (estimated)
Thermal Characteristics - CQFP Package
Characteristics Symbol Value Rating Thermal Resistance - Ceramic
Junction to Ambient Junction to Case (estimated)
- 0.5 to Vcc + 0.5 V
SS
C/W C/W
C/W C/W
°
C
°
C
J
Θ
JA
Θ
JC
Θ
JA
Θ
JC
-40 to +105
27
6.5
40
7.0
° °
° °
Thermal Characteristics - PQFP Package
Characteristics Symbol Value Rating Thermal Resistance - Plastic
Junction to Ambient Junction to Case (estimated)
This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g., either Gnd or Vcc).
Θ
JA
Θ
JC
38
13.0
° °
C/W C/W
DSP56001 MOTOROLA
5
Page 6
DSP56001 Electrical Characteristics
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from:
= TA + (P
T
J
Where:
= Ambient Temperature, °C
T
A
Θ
= Package Thermal Resistance, Junction-to-Ambient, °C/W
JA
= P
P
D
P
= I
INT
= Power Dissipation on Input and Output Pins - User Determined
P
I/O
For most applications P between P
= K/(TJ + 273° C) (2)
P
D
× Θ
)(1)
D
JA
+ P
INT
I/O
×
Vcc, Watts - Chip Internal Power
CC
and TJ (if P
D
<< P
I/O
is neglected) is:
I/O
and can be neglected; however, P
INT
I/O
+ P
must not
INT
exceed Pd. An appropriate relationship
Solving equations (1) and (2) for K gives: K = P
×
(T
D
+ 273° C) +
A
Θ
Where K is a constant pertaining to the particular part. K can be determined from equation (2) by meas uring P known T T
. Using this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for any value of
A
. The total thermal resistance of a package (
A
heat flow from the semiconductor junction to the package (case) surface (
2
×
P
JA
D
Θ
) can be separated into two components,
JA
(3)
(at equilibrium) for a
D
Θ
and CA, representing the barrier to
Θ
) and from the case to the outside ambient (CA). These
JC
JC
terms are related by the equation:
Θ
Θ
Θ
=
+ C
JA
JC
A
is device related and cannot be influenced by the user. However, CA is user dependent and can be minimized by such thermal
JC
(4)
management techniques as heat sinks, ambient air cooling, and thermal convection. Thus, good thermal management on the part of the user can significantly reduce C
so that
A
Θ
approximately equals
JA
Θ
. Substitution of
JC
Θ
Θ
for
JC
in equation (1) will result in a
JA
lower semiconductor junction temperature. Values for thermal resistance presented in this document, unless estimated, were derived using the procedure described in Motorola Reliability Report 7843, “Thermal Resistance Measurement Method for MC68XX Microcomponent Devices”, and are provided for design purposes only. Thermal measurements are complex and dependent on procedure and setup. User-derived values for thermal resistance may differ.
Layout Practices
Each Vcc pin on the DSP56001 should be provided with a low-impedance path to + 5 volts. Each GND pin should likewise be provided with a low-impedance path to ground. The power supply pins drive four distinct groups of logic on chip. They are:
Vcc GND Function
G12,C6 G11,B7 Internal Logic supply pins
MOTOROLA 6
L8 L6,L9 Address bus output buffer supply pins
G3 D3,J3 Data bus output buffer supply pins
C9 E11 Port B and C output buffer supply pins
Power and Ground Connections for PGA
Vcc GND Function
35, 36, 128, 129 33, 34, 130, 131 Internal Logic supply pins
63, 64 55, 56, 73, 74 Address bus output buffer supply pins
100, 101 90, 91, 111, 112 Data bus output buffer supply pins
12, 13 23, 24 Port B and C output buffer supply pins
Power and Ground Connections for CQFP and PQFP
DSP56001
Page 7
DSP56001 Electrical Characteristics
Power and Ground Connections
The Vcc power supply should be bypassed to ground using at least four 0.1 uF by- pass capacitors located either underneath the chip or as close as possible to the four sides of the pac kage. The capacitor leads and associated printed circuit traces connecting to chip Vcc and Gnd should be kept to less than 1/2" per capacitor lead. A four-layer board is recommended, employing two inner layers as Vcc and Gnd planes. All output pins on the DSP56001 have fast rise and fall times — typically less than 3 ns. with a 10 pf. load. Printed circuit (PC) trace interconnection length should be minimized in order to minimize under shoot and reflections caused by these fast output switching times. This recommendation particularly applies to the address and data buses as well as the RD and HEN loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher capacitive loads because these loads create higher transient currents in the Vcc and GND circuits. Pull up/down all unused inputs or signals that will be inputs during reset.
pins. Maximum PC trace lengths on the order of 6" are recommended. Capacitance calculations should consider all device
Signal Stability
When designing hardware to interface with the Host Interface, it is important to ensure that all signals be clean and free from noise. Particular attention should be given to the quality of the Host Enable (HEN asserted and should remain stable until HEN as ground-bounce and cross-talk can inadvertently cause HEN the full logic transition to V storing two or more copies of a single down loaded data word. Of course, if a full logic transition occurs, the part will compl ete a normal data transfer operation.
, the DSP56001 Host Port may not correctly update the port status information which can result in
ih min
has fully returned to the deasserted state. It is important to note that such phenomena
to temporarily rise above V
). All inputs to the port should be stable when HEN is
.
Should this occur without completing
il max
, WR, IRQA, IRQB,
DSP56001 MOTOROLA
7
Page 8
DSP56001 Electrical Characteristics
DC Electrical Characteristics (Vcc = 5.0 Vdc + 10%; TJ = -40 to +105° C at 20.5 MHz and 27 MHz)
(Vcc = 5.0 Vdc +
Characteristic Symbol Min Typ Max Unit
5%; TJ = -40 to +105° C at 33 MHz)
Supply Voltage 20, 27 MHz 33 MHz
Input High Voltage Except EXTAL, RESET
, MODA/IRQA, MODB/IRQB
Input Low Voltage Except EXTAL, MODA/IRQA
, MODB/IRQB Input High Voltage EXTAL V Input Low Voltage EXTAL V Input High Voltage RESET Input High Voltage MODA/IRQA Input Low Voltage MODA/IRQA
and MODB/IRQB V
and MODB/IRQB V
Input Leakage Current EXTAL, RESET
, MODA/IRQA, MODB/IRQB, BR
Three-State (Off-State) Input Current
Vcc 4.5
4.75
V
IH
V
IL
IHC
ILC
V
IHR
IHM
ILM
I
in
I
TSI
2.0 Vcc V
-0.5 0.8 V
4.0 Vcc V
-0.5 0.6 V
2.5 Vcc V
3.5 Vcc V
-0.5 2.0 V
-1 1 uA
-10 10 uA
5.0 5.5
5.25
(@2.4 V/0.4 V) Output High Voltage (I Output Low Voltage (I
, WR IOL = 1.6 mA; Open Drain
RD HREQ
IOL = 6.7 mA, TXD IOL = 6.7 mA)
= -0.4 mA) V
OH
= 1.6 mA;
OL
Total Supply Current 5.25 V, 33 MHz 5 . 5 V, 27 MHz 5 . 5 V, 20 MHz in WAIT Mode (see Note 1) in STOP Mode (see Note 1)
OH
V
OL
I
DD33
I
DD27
I
DD20
I
DDW
I
DDS
2.4 — —V — 0.4 V
— — — — —
160 130 100 10 100
185 155 115 25 2000
Input Capacitance (see Note 2) Cin 10 pf
V
mA mA mA mA
µ
A
Notes:
1. In order to obtain these results all inputs must be terminated (i.e., not allowed to float).
2. Periodically sampled and not 100% tested.
MOTOROLA 8
DSP56001
Page 9
DSP56001 Electrical Characteristics
AC Electrical Characteristics
The timing waveforms in the all pins, except EXTAL, RESET
Characteristics
50% point of the respective input signal’s transition. DSP56001 output levels are measured with the production test machine V V
reference levels set at 0.8 V and 2.0 V respectively.
OH
. AC timing specifications which are referenced to a device input signal are measured in production with respect to the
AC Electrical Characteristics
, MODA, and MODB. These four pins are tested using the input levels set forth in the
are tested with a VIL maximum of 0.5 V and a VIH minimum of 2.4 V for
DC Electrical
and
OL
AC Electrical Characteristics - Clock Operation
The DSP56001 system clock may be derived from the on-chip crystal oscillator as shown in Clock Figure 1, or it may be externally supplied. An externally supplied square wave voltage source should be connected to EXTAL, leaving XTAL physically unconnected (see Clock Figure 2) to the board or socket. The rise and fall time of this external clock should be 5 ns maximum.
Num
Frequency of Operation (EXTAL Pin)
1
External Clock Input High (tch) — EXTAL Pin (see Note 1 and 2)
2
External Clock Input Low (tcl) — EXTAL Pin (see Note 1 and 2)
3
Clock Cycle Time = cyc = 2T
4
Instruction Cycle Time = Icyc = 4T
Characteristics 20.5 MHz 27 MHz 33 MHz
Min Max Min Max Min Max
4.0 20.5 4.0 27.0 4.0 33.0 MHz 22 150 17 150 13.5 150 ns
22 150 17 150 13.5 150 ns
48.75 250 37 250 30.33 250 ns
97.5 500 74 500 60 500 ns
Unit
Notes:
1. External Clock Input High and External Clock Input Low are measured at 50% of the input transition. tch and tcl are dependent on the duty cycle.
2. T = Icyc / 4 is used in the electrical characteristics. T represents an average which is independent of the duty cycle.
DSP56001 MOTOROLA
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Page 10
DSP56001 Electrical Characteristics
XTAL
C
EXTAL
R
C
XTAL1
Fundamental Frequency
Crystal Oscillator
Suggested Component Values
= 4 MHz:
For f
osc
R = 680 KΩ + C = 20 pf +
For f
osc
R = 680 KΩ + C = 20 pf +
Notes: (1) The suggested crystal source is ICM, # 433163 - 4.00 (4MHz fundamental, 20 pf load) or # 436163 - 30.00 (30 MHz fun­damental, 20 pf load).
10%
20%
= 30 MHz:
10%
20%
L1
EXTAL
C1
C2
rd
Overtone
3
R1
XTAL1*
XTAL
R2
C3
Crystal Oscillator
Suggested Component Values R1 = 470 KΩ + R2 = 330 Ω + C1 = 0.1 µf + C2 = 26 pf + C3 = 20 pf + L1 = 2.37 µH + XTAL =33 MHz, AT cut, 20 pf load, 50Ω max series resistance
Notes:
rd
overtone crystal.
(1) *3 (2) The suggested crystal source is ICM, # 471163 - 33.00 (33
MHz 3 (3) R2 limits crystal current (4) Reference Benjamin Parzen, The Design of Crystal and Other Harmonic Oscillators, John Wiley& Sons, 1983
10%
10%
20% 20% 10%
10%
rd
overtone, 20 pf load).
EXTAL
Note:
MOTOROLA 10
Clock Figure 1. Crystal Oscillator Circuits
V
ILC
The midpoint is V
Clock Figure 2. External Clock Timing
1 2
3
+ 0.5 (V
ILC
IHC
- V
ILC
V
IHC
Midpoint
4
).
DSP56001
Page 11
DSP56001 Electrical Characteristics
AC Electrical Characteristics - Reset, Stop, Mode Select and Interrupt Timing
(
Vcc = 5.0 Vdc +
(
Vcc = 5.0 Vdc +
(See Control Figure 1 through 8) cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles WS = Number of wait states (1 WS = 1 cyc = 2T) programmed into external bus access
using BCR (WS = 0 - 15)
tch = Clock high period tcl = Clock low period
10%, TJ = -40 to +105° C, CL = 50 pf + 1 TTL Load at 20.5 MHz and 27 MHz) 5%, TJ = -40 to +105° C, CL = 50 pf + 1 TTL Load at 33 MHz)
Num
Characteristics 20.5 MHz 27 MHz 33 MHz
Min Max Min Max Min Max
9 Delay from RESET Assertion to
Address High Impedance (periodically sampled and not 100% tested)
10 Minimum Stabilization Duration
Internal Osc. (see Note 1)
11 Delay from Asynchronous RESET
Deassertion to First External Address Output (Internal Reset Negation)
12 Synchronous Reset Setup Time from
RESET External Clock
13 Synchronous Reset Delay Time from
the Synchronous Falling Edge of Exter­nal Clock to the First External Address
Output 14 Mode Select Setup Time 100 77 62 ns 15 Mode Select Hold Time 0 0 0 ns 16
Edge-Triggered Interrupt Request
16a
External Clock (see Note 2)
Deassertion to Falling Edge of
assertion deassertion
75000*cyc
25*cyc
8*cyc
20
8*cyc+5
25 15
50 38 31 ns
— —
9*cyc+40 8*cyc 9*cyc+31 8*cyc 9*cyc+25 ns
cyc-10 15 cyc-8 13 cyc-7 ns
8*cyc+30 8*cyc+5 8*cyc+23 8*cyc+5 8*cyc+19 ns
— —
75000*cyc
25*cyc
17 10
— —
— —
75000*cyc
25*cyc
16 10
— —
— —
Unit
ns ns
ns ns
V
IHR
RESET
10
11
9
A0-A15
First Fetch
Control Figure 1. Reset Timing
DSP56001 MOTOROLA
11
Page 12
DSP56001 Electrical Characteristics
AC Electrical Characteristics - Reset, Stop, Mode Select, and Interrupt Timing
(Continued)
NOTE
IRQA
When using fast interrupts and
to prevent multiple interrupt service. To avoid these timing restrictions, the negative edge-triggered mode is rec­ommended when using fast interrupt. Long interrupts are recommended when using level-sensitive mode.
and IRQB
are defined as
level
-sensitive, then timings 19 through 22 apply
Num
17 Delay from IRQA, IRQB Assertion to
External Memory Access Address Out
Valid Caused by First Interrupt
Instruction Fetch
Instruction Execution 18 Delay from IRQA
General Purpose Transfer Output Valid
Caused by First Interrupt Instruction
Execution 19 Delay from Address Output Valid
Caused by First Interrupt Instruction
Execution to Interrupt Request
Deassertion for Level Sensitive Fast
Interrupts 20 Delay from RD
Request Deassertion for Level
Sensitive Fast Interrupts 21 Delay from WR
Interrupt Request Deassertion for
WS>0 Level Sensitive Fast Interrupts
22 Delay from General-Purpose Output
Valid to Interrupt Request Deassertion
for Level Sensitive Fast Interrupts
- If Second Interrupt Instruction is:
Single Cycle
Two Cycle
Characteristics 20.5 MHz 27 MHz 33 MHz
, IRQB Assertion to
Assertion to Interrupt
Assertion to WS=0
Min Max Min Max Min Max
5*cyc+tch 9*cyc+tch
11+cyc
+tch
— —
— —
—11
2*cyc+tcl+
(cyc*WS)
-44
2*cyc+
(cyc*WS)
-40
2*cyc-40
cyc+tcl+
(cyc*WS)
-40
tcl-60
(2*cyc)+tcl
-60
5*cyc+tch 9*cyc+tch
— —
cyc
*
+tch
—2*cyc+tcl+
— —
— —
—11
(cyc*WS)
-34
2*cyc+
(cyc*WS)
-31
2*cyc-31
cyc+tcl+
(cyc*WS)
-31
tcl-46
(2*cyc)+tcl
-46
5*cyc+tch 9*cyc+tch
cyc
*
+tch
—2
— —
— —
(2*cyc)+tcl
Unit
— —
—ns
cyc+tcl+
*
(cyc*WS)
-27
2*cyc+
(cyc*WS)
-25
2*cyc-25
cyc+tcl+
(cyc*WS)
-25
tcl-37
-37
ns ns
ns
ns
ns ns
ns ns
MOTOROLA 12
DSP56001
Page 13
DSP56001 Electrical Characteristics
AC Electrical Characteristics - Reset, Stop, Mode Select, and Interrupt Timing
(Continued)
Num
Characteristics 20.5 MHz 27 MHz 33 MHz
Min Max Min Max Min Max
23 Synchronous Interrupt Setup Time
from IRQA Synchronous Rising Edge of External Clock (see Notes 5, 6)
24 Synchronous Interrupt Delay Time
from the Synchronous Rising Edge of External Clock to the First External Address Output Valid Caused by the First Instruction Fetch after Coming out of Wait State (see Notes 3, 5)
25 Duration for IRQA
Recover from Stop State (see Note 4) 25 19 16 ns
26 Delay from IRQA
First Instruction (for Stop) for Internal Osc / OMR bit 6 = 0 External Clock / OMR bit 6 = 1 (see Notes 1, 2, and 7)
27 Duration for Level Sensitive IRQA
Assertion to Fetch of First Interrupt Instruction (for Stop) for Internal Osc / OMR bit 6 = 0
External Clock / OMR bit 6 = 1 (see Notes 1, 2, and 7)
28 Delay from Level Sensitive IRQA
Assertion to Fetch of First Interrupt Instruction (for Stop) for Internal Osc / OMR bit 6 = 0 External Clock / OMR bit 6 = 1 (see Notes 1, 2, and 7)
, IRQB Assertion to the
Assertion to
Assertion to Fetch of
25 cyc-10 19 cyc-8 16 cyc-7 ns
13*cyc+
tch+8
65545*cyc
17*cyc
65533*cyc
+tcl
5*cyc+tcl
65545*cyc
17*cyc
13*cyc+
tch+30
— —
— —
— —
13*cyc+
tch+6
65545*cyc
17*cyc
65533*cyc
+tcl
5*cyc+tcl
65545*cyc
17*cyc
13*cyc+
tch+23
— —
— —
— —
13*cyc+
tch+5
65545*cyc
17*cyc
65533*cyc
+tcl
5*cyc+tcl
65545*cyc
17*cyc
13*cyc+
tch+19
— —
— —
— —
Unit
ns
ns ns
ns ns
ns ns
Notes:
1. A clock stabilization delay is required when using the on-chip crystal oscillator in two cases:
1) after power-on reset, and
2) when recovering from Stop mode.
During this stabilization period, T will not be constant. Since this stabilization period
varies, a delay of 150,000T is typically allowed to assure that the oscillator is stabilized before executing programs. While it is possible to set OMR bit 6 = 1 when using the internal crystal oscillator, it is not recommended and these specifications do not guarantee timings for that ca se. See Sec tion 8.5 i n the
DSP56000/DSP56001 Us er’s Manual
for
additional information.
2. Circuit stabilization delay is required during reset when using an external clock in two cases:
1) after power-on reset, and
2) when recovering from Stop mode.
3. For Revision B s ilicon, the min and m ax n umbers are 12cyc+Tc h+8 a nd 12cyc+Tch+30, re spe c­tively.
4. The minimum is spec ified for the du ration of an edg e triggered IRQ A from the STOP state without having the IRQA
interrupt accepted.
interrupt required to recover
5. Timing #23 is for all IRQx interrupts while timing #24 is only when exiting WAIT.
6. Timing #23 triggers off T1 in the normal state and off T1/T3 when exiting the WAIT state.
7. The timings in the table are for Rev. C parts. The timings for Rev. C parts are shorter by 1 cyc than the Rev. B parts when OMR6=0
.
DSP56001 MOTOROLA
13
Page 14
EXTAL
RESET
DSP56001 Electrical Characteristics
12
13
A0-A15, DS
, PS
X/Y
RESET
MODA, MODB
11
Control Figure 2. Synchronous Reset Timing
14
15
V
IHM
V
ILM
Control Figure 3. Operating Mode Select Timing
V
IH
V
IL
V
IHR
IRQA, IRQB
IRQA, IRQB
MOTOROLA 14
16
16a
Control Figure 4. External Interrupt Timing (Negative Edge-Triggered)
DSP56001
Page 15
RD
WR
IRQA IRQB
DSP56001 Electrical Characteristics
First Interrupt Instruction ExecutionA0-A15
20
21
1917
a) First Interrupt Instruction Execution
General Purpose I/O
IRQA IRQB
18 22
b) General Purpose I/O
Control Figure 5. External Level-Sensitive Fast Interrupt Timing
DSP56001 MOTOROLA
15
Page 16
DSP56001 Electrical Characteristics
EXTAL
, IRQB
IRQA
A0-A15, DS PS, X/Y
Control Figure 6. Synchronous Interrupt and Synchronous Wait State Timing
IRQA
25
T0, T2 T1, T3
23
24
26
A0-A15, DS, PS
, X/Y
Control Figure 7. Recovery from Stop State Using IRQA
IRQA
A0-A15, DS, PS
, X/Y
Control Figure 8. Recovery from Stop State Using IRQA Interrupt Service
27
28
First Instruction Fetch
First IRQA Interrupt Instruction Fetch
MOTOROLA 16
DSP56001
Page 17
DSP56001 Electrical Characteristics
HOST PORT USAGE CONSIDERATIONS
Careful synchronization is required when reading multibit registers that are written by another asynchronous system. This is a common problem when two asynchronous systems are connected. The situation exists in the Host port. The considerations for proper operation are discussed below.
Host Programmer Considerations
1. Unsynchronized Reading of Receive Byte Registers When reading receive byte registers, RXH, RXM, or RXL, the Host programmer should use interrupts or poll the RXDF flag which indicates that data is available. This assures that the data in the receive byte registers will be stable.
2. Overwriting Transmit Byte Registers The Host programmer should not write to the transmit byte registers, TXH, TXM, or TXL, unless the TXDE bit is set indicating that the transmit byte registers are empty. This guarantees that the transmit byte registers will transfer valid data to the HRX register.
3. Synchronization of Status Bits from DSP to Host HC, HREQ, DMA, HF3, HF2, TRDY, TXDE, and RXDF (refer to DMA Interface Programming Model for descriptions of these status bits) status bits are set or cleared from inside the DSP and read by the Host processor. The Host can read these status bits very quickly without regard to the clock rate used by the DSP, but the possibility exists that the state of the bit could be changing during the read operation. This is generally not a system problem, since the bit will be read correctly in the next pass of any Host polling routine.
DSP56000/DSP56001 User’s Manual
, I/O Interface section, Host/
However, if the Host asserts the HEN (T32a), then the status is guaranteed to be stable.
A potential problem exists when reading status bits HF3 and HF2 as an encoded pair. If the DSP changes HF3 and HF2 from 00 to 11, there is a small probability that the Host could read the bits during the transition and receive 01 or 10 instead of 11. If the combination of HF3 and HF2 has significance, the Host could read the wrong combination.
Solution:
a. Read the bits twice and check for consensus. b. Assert HEN
4. Overwriting the Host Vector The Host programmer should change the Host Vector register only when the Host Command bit (HC) is clear. This change will guarantee that the DSP interrupt control logic will receive a stable vector.
5. Cancelling a Pending Host Command Exception The Host processor may elect to clear the HC bit to cancel the Host Command Excep tion request at any time before it is recognized by the DSP. Because the Host does not know exactly when the exception will be recognized (due to exception processing synchronization and pipeline delays), the DSP may execute the Host exception after the HC bit is cleared. For these reasons, the HV bits must not be changed at the same time the HC bit is cleared.
access for T31a so that status bit transitions are stabilized.
for more than timing number 31a (T31a), with a minimum cycle time of timing number 32a
DSP Programmer Considerations
1. Reading HF0 and HF1 as an Encoded Pair DMA, HF1, HF0, and HCP, HTDE, and HRDF (refer to Interface Programming Model for descriptions of these status bits) status bits are set or cleared by t he Host processor side of the interface. These bits are individually synchronized to the DSP clock.
DSP56000/DSP56001 User’s Manual
, I/O Interface section, Host/DMA
A potential problem exists when reading status bits HF1 and HF2 as an encoded pair, i.e., the four combinati ons 00, 01, 10, and 11 each have significance. A very small probability exists that the DSP will read the status bits synchronized during transition. The solution to this potential problem is to read the bits twice for consensus.
DSP56001 MOTOROLA
17
Page 18
DSP56001 Electrical Characteristics
AC Electrical Characteristics - Host I/O Ti ming
(Vcc = 5.0 Vdc + 10%, TJ = -40 to +105° C, CL = 50 pf + 1 TTL Load at 20.5 MHz and 27 MHz) (Vcc = 5.0 Vdc + (see Host Figures 1 through 6)
cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles tHSDL = Host Synchronization Delay Time Active low lines should be “pulled up” in a manner consistent with the AC and DC specifications
5%, TJ = -40 to +105° C, CL = 50 pf + 1 TTL Load at 33 MHz)
Num
Characteristics 20.5 MHz 27 MHz 33 MHz
Min Max Min Max Min Max
30 Host Synchronous Delay (see Note 1) tcl cyc+tcl tcl cyc+tcl tcl cyc+tcl ns 31 HEN
32 HEN
32a Minimum Cycle Time Between Two
33 Host Data Input Setup Time Before
34 Host Data Input Hold Time After HEN
35 HEN
36 HEN
37 HEN
38 Output Data Hold Time After HEN
39 HR/W
40 HR/W
41 HR/W
42 HR/W
43 HA0-HA2 Setup Time Before HEN
44 HA0-HA2 Hold Time After HEN
45 DMA HACK
/HACK Assertion Width (see Note 2) a.CVR, ICR, ISR Read (see Note 4) b.Read c.Write
/HACK Deassertion Width (see Note 2 and 5)
Assertion for Consecutive CVR,
HEN ICR, and ISR Reads (see Note 2)
/HACK Deassertion
HEN
Deassertion
HACK
/HACK Assertion to Output Data Active from High Impedance
/HACK Assertion to Output Data Valid (periodically sampled, and not 100% tested)
/HACK Deassertion to Output Data High Impedance
Deassertion
HACK
Low Setup Time Before HEN
Assertion
Low Hold Time After HEN
Deassertion
High Setup Time to HEN
Assertion
High Hold Time After HEN/
Deassertion
HACK
Assertion
Deassertion
Deassertion (see Note 3)
Assertion to HREQ
/
cyc+60
50 25
25 19 16 ns
2*cyc+60 2*cyc+46 2*cyc+37 ns
5—4—4—ns
5—4—4—ns
/
0—0—0—ns
—50—39—31ns
—35—27—22ns
5—4—4—ns
0—0—0—ns
5—4—4—ns
0—0—0—ns
5—4—4—ns
0—0—0—ns
5—4—4—ns
560446449ns
— — —
cyc+46
39 19
— — —
cyc+37
31 16
— — —
Unit
ns ns ns
MOTOROLA 18
DSP56001
Page 19
DSP56001 Electrical Characteristics
AC Electrical Characteristics - Host I/O Timing (Continued)
(Vcc = 5.0 Vdc + 10%, TJ = -40 to +105° C, CL = 50 pf + 1 TTL Load at 20.5 MHz and 27 MHz (Vcc = 5.0 Vdc + see Host Figures 1 through 6)
cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles tHSDL = Host Synchronization Delay Time Active low lines should be “pulled up” in a manner consistent with the AC and DC specifications
5%, TJ = -40 to +105° C, CL = 50 pf + 1 TTL Load at 33 MHz,
Num
46 DMA HACK Deassertion to HREQ
Assertion (see Note 3) for DMA RXL Read
for DMA TXL Write for All Other Cases
47 Delay from HEN
Assertion for RXL Read (see Note 3)
48 Delay from HEN
Assertion for TXL Write (see Note 3)
49 Delay from HEN
Deassertion for RXL Read, TXL Write (see Note 3)
Characteristics 20.5 MHz 27 MHz 33 MHz
Deassertion to HREQ
Deassertion to HREQ
Assertion to HREQ
Notes:
1. “Host synchronization delay (tHSDL)” is the time period required for the DSP56001 to sample any external asynchronous input signal, determine whether it is high or low, and synchronize it to the DSP56001 internal clock.
HOST PORT USAGE CONSIDERATIONS
2. See
3. HREQ
4. This timing must be adhered to only if two consecutive reads from one of these registers are executed.
5. It is recommended that timing #32 be 2cyc+tch+10 minimum for 20.5 MHz, 2cyc+tch+7 minimum for 27 MHz,
is pulled up by a 1kΩ resistor.
and 2cyc+tch+6 minimum for 33 MHz if two consecutive writes to TXL are executed without polling TXDE or HREQ
.
Unit
Min Max Min Max Min Max
tHSDL+cyc
+tch+5
tHSDL+cyc+5
5
tHSDL+cyc
+tch+5
tHSDL+cyc+5 tHSDL+cyc+4 tHSDL+cyc+4 ns
575470465ns
— —
— — tHSDL+cyc
.
tHSDL+cyc
+tch+4
tHSDL+cyc+4
4
+tch+4
— —
— — tHSDL+cyc
tHSDL+cyc
+tch+4
tHSDL+cyc+4
4
+tch+4
— —
— —ns
ns ns
ns
EXTERNAL
3030
INTERNAL
Host Figure 1. Host Synchronization Delay
DSP56001 MOTOROLA
19
Page 20
HREQ (OUTPUT)
HACK (INPUT)
HR/W (INPUT)
DSP56001 Electrical Characteristics
31 32
41 42
3736
35 38
H0-H7 (OUTPUT)
Data Valid
Host Figure 2. Host Interrupt Vector Register (IVR) Read
MOTOROLA 20
DSP56001
Page 21
HREQ (OUTPUT)
DSP56001 Electrical Characteristics
HEN (INPUT)
HA2-HA0 (INPUT)
HR/W (INPUT)
H0-H7 (OUTPUT)
32A
RXH Read
31 32 43 44
Address Valid
41 42
36 37 35 38
Data Valid
Host Figure 3. Host Read Cycle (Non-DMA Mode)
RXM Read
Address Valid
Data Valid
4749
RXL Read
Address Valid
Data Valid
DSP56001 MOTOROLA
21
Page 22
HREQ (OUTPUT)
DSP56001 Electrical Characteristics
HEN (INPUT)
HA2-HA0 (INPUT)
HR/W (INPUT)
H0-H7 (INPUT)
TXH Write
31 32 43 44
Address Valid
39 40
33 34
Data Valid
Host Figure 4. Host Write Cycle (Non-DMA Mode)
TXM Write
Address Valid
Data Valid
49
48
TXL Write
Address Valid
Data Valid
HREQ (OUTPUT)
HACK (INPUT)
H0-H7 (OUTPUT)
MOTOROLA 22
45 46 46
31 32
36
35
RXH Read
RXM Read
37
38
Data Valid
Host Figure 5. Host DMA Read Cycle
Data Valid
RXL Read
46
Data Valid
DSP56001
Page 23
HREQ (OUTPUT)
DSP56001 Electrical Characteristics
HACK (INPUT)
H0-H7 (INPUT)
45 46
31 32
TXH Write
33
Data Valid
Host Figure 6. Host DMA Write Cycle
TXM Write
34
Data Valid
46
46
TXL Write
Data Valid
DSP56001 MOTOROLA
23
Page 24
DSP56001 Electrical Characteristics
AC Electrical Characteristics - SCI Timing
(Vcc = 5.0 Vdc + 10%, TJ = -40 to +105° C, CL = 50 pf + 1 TTL Load at 20.5 MHz and 27 MHz,
Vcc = 5.0 Vdc +
see SCI Figures 1 and 2) cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles tSCC = Synchronous Clock Cycle Time (for internal clock tSCC is determined by the SCI clock control register and Icyc.)
5%, TJ = -40 to +105° C, CL = 50 pf + 1 TTL Load at 33 MHz,
SCI Synchronous Mode Timing
Num
Characteristics 20.5 MHz 27 MHz 33 MHz
Min Max Min Max Min Max
55 Synchronous Clock Cycle — tSCC 8*cyc 8*cyc 8*cyc ns 56 Clock Low Period 4*cyc-20 4*cyc-15 4*cyc-13 ns 57 Clock High Period 4*cyc-20 4*cyc-15 4*cyc-13 ns 59 Output Data Setup to Clock Falling
Edge (Internal Clock)
60 Output Data Hold After Clock Rising
Edge (Internal Clock)
61 Input Data Setup Time Before Clock
Rising Edge (Internal Clock)
62 Input Data Not Valid Before Clock Ris-
ing Edge (Internal Clock)
63 Clock Falling Edge to Output Data
Valid (External Clock)
64 Output Data Hold After Clock Rising
Edge (External Clock)
65 Input Data Setup Time Before Clock
Rising Edge (External Clock)
66 Input Data Hold Time After Clock Ris-
ing Edge (External Clock)
2*cyc
+tcl-50
2*cyc
-tcl-15 2*cyc
+tcl+45
—2
—63—48—39ns
cyc+12 c yc+9 cyc+8 ns
30 23 19 ns
40 31 25 ns
—2
—2
—2
cyc
*
+tcl-10
cyc
*
+tcl-39
cyc
*
-tcl-11 cyc
*
+tcl+35
—2
—2
—2
—2
cyc
*
+tcl-8
cyc
*
+tcl-31
cyc
*
-tcl-9 cyc
*
+tcl+28
—2
—ns
—ns
—ns
cyc
*
+tcl-6
Unit
ns
MOTOROLA 24
DSP56001
Page 25
DSP56001 Electrical Characteristics
AC Electrical Characteristics - SCI Timing
(Vcc = 5.0 Vdc + 10%, TJ = -40 to +105° C, CL = 50 pf + 1 TTL Load at 20.5 MHz and 27 MHz,
Vcc = 5.0 Vdc +
see SCI Figures 1 and 2) cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles tACC = Asynchronous clock cycle time tACC = Asynchronous Clock Cycle Time (for internal clock tACC is determined by the SCI clock control register and Icyc)
5%, TJ = -40 to +105° C, CL = 50 pf + 1 TTL Load at 33 MHz,
SCI Asynchronous Mode Timing - 1X Clock
Num
Characteristics 20.5 MHz 27 MHz 33 MHz
Min Max Min Max Min Max
67 Asynchronous Clock Cycle 64*cyc 64*cyc 64*cyc ns 68 Clock Low Period 32*cyc-20 32*cyc-15 32*cyc-13 ns 69 Clock High Period 32*cyc-20 32*cyc-15 32*cyc-13 ns 71 Output Data Setup to Clock Rising
Edge (Internal Clock)
72 Output Data Hold After Clock Rising
Edge (Internal Clock)
32*cyc
-100
32*cyc
-100
—32
—32
*
-77
*
-77
cyc
cyc
—32
—32
*
-61
*
-61
cyc
cyc
—ns
—ns
Unit
DSP56001 MOTOROLA
25
Page 26
DSP56001 Electrical Characteristics
INTERNAL CLOCK
55
5758 58
SCLK (OUTPUT)
TXD
RXD
EXTERNAL CLOCK
56
6059
DATA VALID
61
62
DATA VALID
55
57
MOTOROLA 26
SCLK (INPUT)
TXD
RXD
56
6463
DATA VALID
6665
DATA VALID
SCI Figure 1. SCI Synchronous Mode Timing
DSP56001
Page 27
1X SCK (OUTPUT)
DSP56001 Electrical Characteristics
67
6970 70
68
71 72
TXD
Note:
DATA VALID
In the wire-OR mode, TXD can be pulled up by 1K
SCI Figure 2. SCI Asynchronous Mode Timing
DSP56001 MOTOROLA
27
Page 28
DSP56001 Electrical Characteristics
AC Electrical Char acteristics - SSI Tim ing
(Vcc = 5.0 Vdc + 10%, TJ = -40 to +105° C, CL = 50 pf + 1 TTL Load at 20.5 MHz and 27 MHz,
Vcc = 5.0 Vdc +
see SSI Figures 1 and 2) cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles tSSICC = SSI clock cycle time TXC (SCK Pin) = Transmit Clock RXC (SC0 or SCK Pin) = Receive Clock FST (SC2 Pin) = Transmit Frame Sync FSR (SC1 or SC2 Pin) = Receive Frame Sync i ck = Internal Clock x ck = External Clock g ck = Gated Clock i ck a = Internal Clock, Asynchronous Mode (Asynchronous implies that TXC and RXC are two different clocks) i ck s = Internal Clock, Synchronous Mode (Synchronous implies that TXC and RXC are the same clock) bl = bit length wl = word length
5%, TJ = -40 to +105° C, CL = 50 pf + 1 TTL Load at 33 MHz,
Num
Characteristics 20.5 MHz 27 MHz 33 MHz
Min Max Min Max Min Max
80 Clock Cycle (see Note 1) 4*cyc 4*cyc 4*cyc ns 81 Clock High Period 2*cyc-20 2*cyc-15 2*cyc-13 ns 82 Clock High Period 2*cyc-20 2*cyc-15 2*cyc-13 ns 84 RXC Rising Edge to FSR Out (bl) High
x ck i ck a
85 RXC Rising Edge to FSR Out (bl) Low
x ck i ck a
86 RXC Rising Edge to FSR Out (wl) High
x ck i ck a
87 RXC Rising Edge to FSR Out (wl) Low
x ck i ck a
88 Data In Setup Time Before RXC (SCK
in Synchronous Mode) Falling Edge x ck i ck a i ck s
89 Data In Hold Time After RXC Falling
Edge x ck i ck a
90 FSR Input (bl) High Before RXC Falling
Edge x ck i ck a
91 FSR Input (wl) High Before RXC
Falling Edge x ck i ck a
92 FSR Input Hold Time After RXC Falling
Edge x ck i ck a
— —
— —
— —
— —
15 35 25
35
15 35
20 55
35
80 50
70 40
70 40
70 40
— — —
5
5
— —
— —
— —
— —
— —
— —
— —
— —
12 27 19
27
12 27
15 42
27
61 38
54 31
54 31
54 31
— — —
4
4
— —
— —
— —
— —
10 22 16
22
10 23
13 34
22
— —
— —
— —
— —
4
4
48 31
43 25
43 25
43 25
— — —
— —
— —
— —
— —
Unit
ns ns
ns ns
ns ns
ns ns
ns ns ns
ns ns
ns ns
ns ns
ns ns
MOTOROLA 28
DSP56001
Page 29
DSP56001 Electrical Characteristics
AC Electrical Characteristics - SSI Timing (Continued)
Note:
1. For internal clock, External Clock Cycle is defined by Icyc and SSI control register.
Num
93 Flags Input Setup Before RXC Falling
Edge x ck i ck a3050
94 Flags Input Hold Time After RXC
Falling Edge x ck i ck a
95 TXC Rising Edge to FST Out (bl) High
x ck i ck a——
96 TXC Rising Edge to FST Out (bl) Low
x ck i ck a——
97 TXC Rising Edge to FST Out (wl) High
x ck i ck a——
98 TXC Rising Edge to FST Out (wl) Low
x ck i ck a——
99 TXC Rising Edge to Data Out Enable
from High Impedance x ck i ck a——
100 TXC Rising Edge to Data Out Valid
x ck i ck a——
101 TXC Rising Edge to Data Out High
Impedance (periodically sampled, and not 100% tested) x ck i ck a——
101a TXC Falling Edge to Data Out High
Impedance for Gated Clock Mode Only g ck cyc+tch cyc+tch cyc+tch ns
102 FST Input (bl) Setup Time Before TXC
Falling Edge x ck i ck a
103 FST Input (wl) to Data Out Enable from
High Impedance
104 FST Input (wl) Setup Time Before TXC
Falling Edge x ck i ck a2055
105 FST Input Hold Time After TXC Falling
Edge x ck i ck a
106 Flag Output Valid After TXC Rising
Edge x ck i ck a——
Characteristics 20.5 MHz 27 MHz 33 MHz
Min Max Min Max Min Max
— —
35
5
15 35
—60—46—37ns
35
5
— —
70 30
65 35
65 35
65 35
65 40
65 40
70 40
— —
— —
— —
70 40
23 39
27
4
— —
— —
— —
— —
— —
— —
— —
12 27
15 42
27
4
— —
— —
— —
54 23
50 27
50 27
50 27
50 31
50 31
54 31
— —
— —
— —
54 31
19 31
22
10 23
13 34
22
Unit
— —
4
— —
— —
— —
— —
— —
— —
— —
4
— —
— —
43 19
40 22
40 22
40 22
40 25
40 25
43 25
— —
— —
— —
43 25
ns
nss
ns ns
ns ns
ns ns
ns ns
ns ns
ns ns
ns ns
ns ns
ns ns
ns ns
ns ns
ns ns
Note:
1. For internal clock, External Clock Cycle is defined by Icyc and SSI control register.
DSP56001 MOTOROLA
29
Page 30
DSP56001 Electrical Characteristics
80
RXC (Input/Output)
FSR (Bit) OUT
FSR (Word) OUT
DATA IN
FSR (Bit) IN
83
81
84 85
90 92
83
82
86 87
88 89
First Bit Last Bit
FSR (Word) IN
FLAGS IN
9291
9493
SSI Figure 1. SSI Receiver Timing
MOTOROLA 30
DSP56001
Page 31
DSP56001 Electrical Characteristics
80
TXC (Input/Output)
FST (Bit) OUT
FST (Word) OUT
DATA OUT
83
102
81
95 96
82
97
83
99
105
100100
First Bit
98
101
101a
Last Bit
FST (Bit) IN
103
104 105
FST (Word) IN
106
(See Note 1)
FLAGS OUT
Note:
1. In the Network mode, output flag transitions can occur at the start of each time slot within the frame. In the Normal mode, the output flag state is asserted for the entire frame period.
SSI Figure 2. SSI Transmitter Timing
DSP56001 MOTOROLA
31
Page 32
DSP56001 Electrical Characteristics
AC Electrical Characteristics —
Capacitance Derating — External Bus Asynchronous Timing
Vcc = 5.0 Vdc + 10%, TJ = -40 to +105° C, CL = 50 pf + 1 TTL Load at 20.5 MHz and 27 MHz, Vcc = 5.0 Vdc +
cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles WS = Number of Wait States, Determined by BCR Register (WS = 0 to 15)
The DSP56001 External Bus Timing Specifications are designed and tested at the maximum capacitive load of 50 pf, including stray capacitance. Typically, the drive capability of the External Bus pins (A0-A15, D0-D23, PS linearly at 1 ns per 12 pf of additional capacitance from 50 pf to 250 pf of loading. Port B and C pins derate linearly at 1 ns per 5 pf of additional capacitance from 50 pf to 250 pf of loading.
Active low inputs should be “pulled up” in a manner consistent with the AC and DC specifications. To conserve power, when an internal memory access follows an external memory access, the RD
deasserted and A0-A15 and X/Y change between two external accesses to the same memory space) indicating that no external memory acces s is occurring. If BR
has been asserted, then the bus signals will be three-stated according to the timing information in this data sheet.
5%, TJ = -40 to +105° C, CL = 50 pf + 1 TTL Load at 33 MHz, see Bus Figures 1 and 2
, DS, RD, WR, X/Y) derates
and WR strobes remain
do not change from their previous state. Both PS and DS will be deasserted (they do not
Num
115 Delay from BR Assertion to BG
Assertion (see Note 1) (see Note 2) (see Note 3)
(see Note 4) (see Note 5)
116 Flags Input Hold Time After RXC
Falling Edge Deassertion 117 BG 118 Delay from Address, Data, and Control
Bus High Impedance to BG 119 Delay from BG
Address, Data, and Control Bus
Enabled 120 Address Valid to WR
WS>0 121 WR
WS>0
122 WR 123 WR
WS>0 124 Data Out Hold Time from WR
Deassertion (The maximum specifica-
tion is periodically sampled, and not
100% tested.) 125 Data Out Setup Time to WR
Deassertion (see Note 6) WS=0
WS>0
126 RD
Charact e ristics 20.5 MHz 27 MHz 33 MHz
Deassertion Duration 2*cyc-10 2*cyc-8 2*cyc-6 ns
Assertion
Deassertion to
Assertion WS=0
Assertion Width WS=0
Deassertion to Address Not Valid tch-12 tch-9 tch-7.5 ns Assertion to Data Out Valid WS=0
Deassertion to Address Not Valid tch-9 tch-7 tch-5.5 ns
Unit
Min Max Min Max Min Max
2*cyc+tch
cyc+tch cyc+tch
Infinity
tch+4 2*cyc 4*cyc+20 2*cyc 4*cyc+15 2*cyc 4*cyc+13 ns
tcl-9
cyc-9 cyc-9
WS*cyc
+tcl-9
tch-9
tch-9 tch+7 tch-7 tch+6 tch-5.5 tch+4.5 ns
tcl-5
WS*cyc
+tcl-5
4*cyc+tch+
20
4*cyc+tch+
cyc*WS+20
6*cyc+tch+ 2*cyc*WS+
20
cyc+tch+30
0—0—0—ns
tch-10 tch-8 tch-6 ns
tcl+5
cyc+5
— —
0
tch+10
10
— —
2*cyc+tch
cyc+tch cyc+tch
Infinity
tch+3
tcl-7
cyc-7 cyc-7
WS*cyc
+tcl-7
tch-7
0
tcl-5
WS*cyc
+tcl-5
4*cyc+tch+
15
4*cyc+tch+
cyc*WS+15
6*cyc+tch+ 2*cyc*WS+
15
cyc+tch+23
tcl+5
cyc+5
— —
tch+8
8
— —
2*cyc+tch
cyc+tch cyc+tch
Infinity
tch+3
tcl-5.5
cyc-5.5 cyc-5.0
WS*cyc
+tcl-5.0
tch-5.50tch+6.5
tcl-5
WS*cyc
+tcl-5
4*cyc+tch+ 4*cyc+tch+
cyc*WS+13
6*cyc+tch+ 2*cyc*WS+
cyc+tch+19
tcl+5
cyc+5
6.5
13
13 —
— —
— —
ns ns ns
ns ns
ns ns
ns ns
ns ns
ns ns
MOTOROLA 32
DSP56001
Page 33
DSP56001 Electrical Characteristics
AC Electrical Characteristics - External Bus Asynchronous Timing
(Continued)
Num
127 Address Valid to WS = 0
RD
128 Input Data Hold Time to RD
Deassertion 129 RD
WS > 0
130 Address Valid to WS = 0
Input Data Valid WS > 0
131 Address Valid to RD 132 RD
Input Data Valid WS>0
133 WR 134 RD 135 WR
WR 136 RD
WR
Charact e ristics 20.5 MHz 27 MHz 33 MHz
deassertion WS > 0
Assertion Width WS = 0
Assertion tcl-9 tcl+5 tcl-7 tcl+5 tcl-5.5 tcl+5 ns
Assertion to WS=0
Deassertion to RD Assertion cyc-15 cyc-12 cyc-10 ns
Deassertion to RD Assertion cyc-10 c yc-8 cyc-6.5 ns
Deassertion to WS=0 Assertion WS>0
Deassertion to WS=0
Assertion WS>0
Unit
Min Max Min Max Min Max
cyc+tcl-8 ((WS+1)
cyc)+tcl-8
0—0—0—ns
cyc-9
((WS+1)*
cyc)-9
— —
— —
cyc-15
cyc+tch-15
cyc-10
cyc+tch-10
*
cyc+tcl-18
((WS+1)
cyc)+tcl-18
((WS+1)*
cyc)-14
— —
— —
cyc-14
— —
— —
cyc+tcl-6 ((WS+1)
cyc)+tcl-6
((WS+1)*
*
cyc+tch-12
cyc+tch-8
cyc-7
cyc)-7
— —
— —
cyc-12
cyc-8
*
cyc+tcl-14
((WS+1)
cyc)+tcl-14
((WS+1)*
cyc)-11
— —
— —
cyc-11
— —
— —
cyc+tcl-6 ((WS+1)
cyc)+tcl-6
cyc-5.5
((WS+1)*
cyc)-5.5
*
cyc-10
cyc+tch-10
cyc-6.5
cyc+tch-
— —
— —
6.5
*
cyc+tcl-11
((WS+1)
cyc)+tcl-11
((WS+1)*
— —
— —
cyc-9
cyc)-9
— —
— —
ns ns
ns ns
ns ns
*
ns ns
ns ns
ns ns
Notes:
1. With no external access from the DSP.
2. During external read or write access.
3. During external read-modify-write access.
4. During the STOP mode the external bus will not be released and BG if the bus is released (BG
released while the DSP is in the stop state and BG
5. During the WAIT mode the BR
6. Typical values at 5V are: at 20.5 MHz and WS=0, Min = tcl-4
= 0) and the STOP instruction is executed while BG = 0 then the bus will remain
will remain low.
/BG circuits remain active.
at 20.5 MHz and WS>0, Min = WS*cyc+tcl-4 at 27 MHz and WS=0, Min = tcl-3
at 27 MHz and WS>0, Min = WS*cyc+tcl-3 at 33 MHz and WS=0, Min = tcl-2.5
at 33 MHz and WS>0, Min = WS*cyc+tcl-2.5
will not go low. However,
DSP56001 MOTOROLA
33
Page 34
BR
BG
A0-A15, PS, DS
, X/Y,
RD
, WR
D0-D23
DSP56001 Electrical Characteristics
115 116
117
119
118
Async. Bus Figure 1. Bus Request / Bus Grant Timing
A0-A15, DS, PS
, X/Y
(See Note 1)
127
131 129
RD
120
135 121
WR
123
125 124
D0-D23
Note:
1. During Read-Modify-Write instructions and internal instructions,
the address lines do not change state.
122
133
130
DATA OUT
126
134
136
132
128
DATA IN
MOTOROLA 34
Async. Bus Figure 2. External Bus Asynchronous Timing
DSP56001
Page 35
DSP56001 Electrical Characteristics
AC Electrical Characteristics - External Bus Synchronous Timing
Vcc = 5.0 Vdc + 10%; TJ = -40 to 105° C at 20.5 MHz 27 MHz Vcc = 5.0 Vdc +
5%; TJ = -40 to 105° C at 33 MHz
Num
Charact e ristics 20.5 MHz 27 MHz 33 MHz
Min Max Min Max Min Max
140
Clk Low Transition To Address Valid 141 Clk High Transition To WR
Assertion (see Note 2) WS > 0 142 Clk High Transition To WR
Deassertion 143 Clk High Transition To RD 144 Clk High Transition To RD 145 Clk Low Transition To Data-Out Valid 25 19 19 ns 146 Clk Low Transition To Data-Out Invalid
(see Note 3) 147 Data-In Valid To Clk High Transition
(Setup) 148 Clk High Transition To Data-In Invalid
(Hold) 149 Clk Low To Address Invalid
(see Note 3)
WS = 0
Assertion 0 19 0 15 0 16 ns Deassertion 5 17 5 13 4.5 10.5 ns
—24—19—19ns
0 0
521516513ns
5—4—3.5—ns
0—0—0—ns
12 12 13 ns
3—3—3—ns
19
tch+19
0 0
15
tch+15
0 0
17
tch+17nsns
Notes:
1. AC timing specifications which are referenced to a device input signal are measured in production with respect to the 50% point of the respective input signal’s transition.
2. WS are wait state values specified in the BCR.
3. Clk low to data-out invalid (spec. 146) and Clk low to address invalid (spec.
149) indicate the time after which data/address are no longer guaranteed to be valid.
Unit
ns
DSP56001 MOTOROLA
35
Page 36
CLK in
A0-A15 DS,PS X/Y
RD
140
DSP56001 Electrical Characteristics
T0 T1 T2 T3 T0 T1 T2 T3 T0
141
143
142
144
149
WR
D0-D23
Note:
147
148
Data InData Out
145 146
Sync. Bus Figure 1. DSP56001 Synchronous Bus Timing
During Read-Modify-Write Instructions, the address lines do not change states.
MOTOROLA 36
DSP56001
Page 37
DSP56001 Electrical Characteristics
AC Electrical Characteristics - Bus Strobe / Wait Timing
Num
150
Clk Low Transition To BS Assert ion 151 WT
(setup time) 152 Clk Low Transition To WT
For Minimum Timing 153 WT
For Maximum Timing (2 wait states 154 Clk High Transition To BS 155 BS 156 BS
(see Note 2) 157 BS
(See Note 2 and Note 4) WS <
WS >
158 WT
159 Minimum BS
Consecutive External Accesses 160 BS
(see Note 3) 161 Data-In Valid to RD
(Set Up)
Charact e ristics 20.5 MHz 27 MHz 33 MHz
Assertion To Clk Low Transition
Deassertion To Clk Low Transition
Assertion To Address Valid -2 10 -2 8 -2 6.5 ns Assertion To WT Assertion
Assertion To WT Deassertion
Deassertion To BS Deassertion cyc+tcl 2*cyc+tcl
Deassertion Width For
Deassertion To Address Invalid
Deassertion
Unit
Min Max Min Max Min Max
4 24 3 19 2.5 19 ns 4—3—2.5—ns
Deassertion
Deassertion 5 26 4 20 3.5 19 ns
2 2
14 cyc-8 11 cyc-6 12 cyc-5 ns
8—6—5—ns
0 cyc-15 0 cyc-11 0 cyc-10 ns
cyc
(WS-1)
cyc
*
tch-7 tch-6 tch-4.5 ns
tch-10 tch-8 tch-6.5
16 12 10 ns
2*cyc-15
WS*cyc
-15
+23
cyc
(WS-1)
cyc
*
cyc+tcl 2*cyc+tcl
2*cyc-11
WS*cyc
-11
+17
cyc+4
(WS-1)
cyc+4
* cyc+tcl 2*cyc+tcl
2*cyc-10
WS*cyc
-10
+15 ns
ns
ns ns
Note:
1. AC timing specifications which are referenced to a device input signal are measured in production with respect to the 50% point of the respective input signal’s transition.
2. If wait states are also inserted using the BCR and if the number of wait states is greater than 2, then specification numbers 156 and 157 can be increased accordingly.
3. BS
deassertion to address invalid indicates the time after which the address are no longer guaranteed
to be valid.
4. The minimum number of wait states when using BS
5. For read-modify-write instructions, the address lines will not change states between the read and the write cycle. However, BS sired for each of the read and write cycle, the WT
will deassert before asserting again for the write cycle. If wait states are de-
/WT is two (2).
pin must be asserted once for each cycle.
DSP56001 MOTOROLA
37
Page 38
EXTAL
A0-A15,
, DS,
PS X/Y
BS
WT
DSP56001 Electrical Characteristics
T0 T1 T2 Tw T2 Tw T2 T3 T0
140 149
150
152
153
151
154
RD
D0-D23
WR
D0-D23
143
147
Data In
141 142
145
Data Out
Bus Arbitration Figure 1. DSP56001 Synchronous BS / WT Timings
144
148
146
Note:
MOTOROLA 38
During Read-Modify-Write Instructions, the address lines do not change state. However, BS
will deassert before asserting again for the write cycle.
DSP56001
Page 39
A0-A15, PS
, DS,
X/Y
BS
DSP56001 Electrical Characteristics
155
160
WT
RD
D0-D
WR
23
156
131
120
157
159
158
126
128
161
Data In
122
124
123
D0-D23
Bus Arbitration Figure 2. DSP56001 Asynchronous BS / WT Timings
125
Data Out
Note:
DSP56001 MOTOROLA
During Read-Modify-Write Instructions, the address lines will not change states. However, BS
will deassert before asserting again for the write cycle.
39
Page 40
DSP56001 Electrical Characteristics
MOTOROLA 40
DSP56001
Page 41
APPENDIX A
ORDERING INFORMATION
DSP56001FE 33
Frequency
20 = 20.5 MHz. 27 = 27 MHz 33 = 33 MHz.
Pack age Type
DSP Type
56001 = RAM Part
DSP56001 SOCKET INFORMATION
PGA
Supplier Telephone Socket Type Part Number Comment
Advanced Interconnections
(401) 823-5200 Standard 88 Pin 4CS088-01TG
AMP
(717) 564-0100 Standard 88 Pin 1-916223-3 Low Insertion Force
1-55283-9 ZIF Production
Standard 128 Pin 1-55383-4 ZIF Burn-In and Test
Robinson Nugent
(812) 945-0211 Custom Pinout PGA-088CM3P-S-TG
PGA-088CHP3-SL-TG
Samtec
(812) 944-6733 Standard 120 Pin MVAS-120-ZSTT-13
Custom 88 Pin CPAS-88-ZSTT-13BF
NOTES:
1. Please specify wirewrap and plating options. The part numbers shown specify low profile solder tail pins having a tin contact and tin shell.
2. Please specify wirewrap and plating options. The part number shown specifies gold contact and tin shell.
3. Cutout in the center, unused holes are plugged, solder tail.
2
RC = Pin Grid Array FE = Ceramic Quad
Flat Pack (CQFP)
FC = Plastic Quad
Flat Pac k (PQFP)
Includes Cutout in Center
3
3
High Temp, Longer Leads
1
1
Includes Cutout in Center No Cutout
CQFP
Supplier Telephone Socket Type Part Number Comment
AMP
(717)564-0100 822054-2
NOTES:
1. This part is not a socket. It is a converter that allows a CQFP part to be used in the PQFP socket described below.
1
Converts CQFP to fit AMP’s 132 position PQFP “Micro-Pitch Socket”.
PQFP
Supplier Telephone Socket Type Part Number Comment
AMP
(717)564-0100 132 Pin 821949-5
821942-1
NOTES:
1. One housing sub-assembly and one cover are required for each socket.
1 1
Housing Sub-Assembly and Cover for 132 position PQFP “Micro-Pitch Socket”.
DSP56001 MOTOROLA
A-41
Page 42
PIN ASSIGNMENT
N
D0 A14 A13 A12 A10 A8 A7 A6 A4 A2 A1 PS X/Y
M
D3 D1 A15 A11 A9 A5 A3 A0 DS WR
L
D4 D2 GND VCC GND RD BR
K
D6 D5 BG SC1
J
D8 D7 GND SRD STD
H
D9 SC2
G
D10 VCC GND VCC SCK
F
D11 D12 SC0 SCLK
E
D13 GND TXD
D
D14 D16 GND H0 RXD
C
D15 D18 VCC VCC H2 H1
B
D17 D20 D23 IRQA EXTAL GND HA0 HREQ H7 H4 H3
A
D19 D21 D22 IRQB RESET XTAL HA2 HA1 HACK HEN HR/W H6 H5
12345678910111213
BOTTOM VIEW
RC SUFFIX CERAMIC CASE 789D-01
–B–
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 34.04 35.05 1.340 1.380 B 34.04 35.05 1.340 1.380 C 2.16 3.04 0.085 0.120 D 0.44 0.55 0.017 0.022 G 2.54 BSC 0.100 BSC K 4.20 5.08 0.165 0.200
–T– –X–
–A–
C
K
N M L K J H G F E D C B A
12345678910111213
D 88 PL
O 0.76 (0.030) O T A S B S O 0.25 (0.010) O X
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M. 1982.
2. CONTROLLING DIMENSION: INCH.
G
G
MATRIX
PINS
A-42
Mechanical Specification Figure A-1. Pin Grid Array Mechanical Specification
DSP56001MOTOROLA
Page 43
Mechanical Specification Table A-1. CQFP and PQFP Pin Out
PIN # FUNCTION P IN # FUNCTION PIN # FUNCTION PIN # FUNCTION
17 NO CONNECT 116 NO CONNECT 83 NO CONNECT 50 NO CONNECT 16 H4 115 D20 82 D1 49 DS 15 H5 114 D19 81 D0 48 X/Y 14 H6 113 D18 80 A15 47 RD 13 PERIPHERAL VCC 112 DATA BUS GND 79 A14 46 WR 12 PERIPHERAL VCC 111 DATA BUS GND 78 NO CONNECT 45 BR 11 H7 110 NO CONNECT 77 A13 44 NO CONNECT 10 HREQ
9 HR/W 108 D16 75 A11 42 SRD 8HEN 7 NO CONNECT 106 D15 73 ADDRESS BUS GND 40 SC1 6HACK 5 HA0 104 D13 71 A10 38 NO CONNECT 4 NO CONNECT 103 NO CONNECT 70 A9 37 SC2 3 NO CONNECT 102 D12 69 NO CONNECT 36 INTERNAL LOGIC VCC 2 HA1 101 DATA BUS VCC 68 A8 35 INTERNAL LOGIC VCC
1 HA2 100 DATA BUS VCC 67 A7 34 INTERNAL LOGIC GND 132 NO CONNECT 99 D11 66 NO CONNECT 33 INTERNAL LOGIC GND 131 INTERNAL LOGIC GND 98 NO CONNECT 65 A6 32 SCK 130 INTERNAL LOGIC GND 97 D10 64 ADDRESS BUS VCC 31 SC0 129 INTERNAL LOGIC VCC 96 D9 63 ADDRESS BUS VCC 30 NO CONNECT 128 INTERNAL LOGIC VCC 95 NO CONNECT 62 NO CONNECT 29 SCLK 127EXTAL 94D8 61A5 28TXD 126 XTAL 93 D7 60 A4 27 RXD 125 NO CONNECT 92 D6 59 NO CONNECT 26 NO CONNECT 124 RESET 123 MODA/IRQA 122 NO CONNECT 89 NO CONNECT 56 ADDRESS BUS GND 23 PERIPHERAL GND 121 NMI/MODB/IRQB 120 D23 87 D4 54 A1 21 NO CONNECT 119 D22 86 D3 53 A0 20 H2 118 D21 85 D2 52 PS 117 NO CONNECT 84 NO CONNECT 51 NO CONNECT 18 NO CONNECT
109 D17 76 A12 43 BG
107 NO CONNECT 74 ADDRESS BUS GND 41 NO CONNECT
105 D14 72 NO CONNECT 39 STD
91DATA BUS GND 58A3 25H0 90 DATA BUS GND 57 A2 24 PERIPHERAL GND
88 D5 55 ADDRESS BUS GND 22 H1
19 H3
Note: Do not connect to “NO CONNECT” pins.
“NO CONNECT” pins are reserved for future enhancements.
DSP56001 MOTOROLA
A-43
Page 44
Mechanical Specification Figure A-2. Ceramic Quad Flat Pack
A-44
DSP56001MOTOROLA
Page 45
Mechanical Specification Figure A-2. Ceramic Quad Flat Pack (Continued)
DSP56001 MOTOROLA
A-45
Page 46
Mechanical Specification Figure A-3. Plastic Quad Flat Pack
A-46
DSP56001MOTOROLA
Page 47
Mechanical Specification Figure A-3. Plastic Quad Flat Pack (Continued)
DSP56001 MOTOROLA
A-47
Page 48
APPENDIX B
APPLICATION EXAMPLES
The lowest cost DSP56001 based system is shown in Figure B-
1. It uses no run time external memory and requires only two chips, the DSP56001 and a low cost EPROM. The EPROM read access time should be less than 780 nanoseconds when the DSP56001 is operating at a clock rate of 20.5 MHz.
A system with external data RAM memory requires no glue logic to select the external EPROM from bootstrap mode. PS to enable the EPROM and DS data memories as shown in Figure B-2.
is used to enable the high speed
is used
Note: When in RESET, IRQA and IRQB must be deasserted by external peripherals.
FROM OPEN COLLECTOR BUFFER
FROM RESET FUNCTION
FROM OPEN COLLECTOR BUFFER
Figure B-1. No Glue Logic, Low Cost Memory Port Bootstrap — Mode 1
+5 V
15K 15K 15K 15K
+5 V
MBD301
MBD301
DSP56001
D23
MODA/IRQA
*
RESET
*
MODB/IRQB
BR
HACK
PS
A0-A10
D0-D7
+5 V
15K
Note *:
+5 V
15K
CE
11
A0-A10
8
D0-D7
These diodes
2716
must
be Schottky diodes.
FROM OPEN COLLECTOR BUFFER
FROM RESET FUNCTION
FROM OPEN COLLECTOR BUFFER
+5 V
15K 15K 15K
15K 15K
MBD301
MBD301
DSP56001
BR HACK
MODA/IRQA
*
RESET
*
MODB/IRQB
RD
WR
DS
X/Y
A0-A10
PS
D0-D23
11
CE A0-A10
2716
+5 V
15K
D23
D0-D7
8
Note *:
10
These diodes
A0-A9 A10 CS WE OE
2018-55
D0-D23
must
be Schottky diodes.
(3)
24
B-48
Figure B-2. Port A Bootstrap with External Data RAM — Mode 1
DSP56001MOTOROLA
Page 49
Figure B-3 shows the DSP56001 bootstrapping via the Host Port from an MC68000.
Systems with external program memory can load the on-chip PRAM without using the bootstrap mode. In Figure B-4, the
+5 V
DSP56001 is operated in mode 2 with external program memory at location $E000. The programmer can overlay the high speed on-chip PRAM with DSP algorithms by using the MOVE M in­struction.
FROM OPEN COLLECTOR BUFFER
FROM RESET FUNCTION
FROM OPEN COLLECTOR BUFFER
15K 15K 15K
+5 V
15K 15K
MBD301
MBD301
15K
DSP56001
BR HACK
HEN
F32
MODA/IRQA
F32
ADDRESS DECODE
*
+5 V
RESET
*
MODB/IRQB
D23
HR/W
H0-H7
HA0-HA2
Note *:
LS09
F32
8
3
These diodes
F32
must
be Schottky diodes.
Figure B-3. DSP56001 Host Bootstrap Example — Mode 1
LDS
AS
A4-A23
1K
DTACK
R/W
D0-D7 A1-A3
MC68000
(12.5MHz)
FROM OPEN COLLECTOR BUFFER
FROM RESET FUNCTION
FROM OPEN COLLECTOR BUFFER
DSP56001 MOTOROLA
15K 15K 15K
Figure B-4. 32K Words of External Program ROM — Mode 2
MBD301
MBD301
DSP56001
MODA/IRQA
*
RESET
*
MODB/IRQB
RD
PS
A0-A14
HACK
BR
D0-D23
+5V
+5V
15
15
ΚΩ
ΚΩ
15
24
Note *:
These diodes
A0-A14 CS OE
2756-30
(3)
D0-D23
must
be Schottky diodes.
B-49
Page 50
Figure B-5 shows an alternative clock oscillator circuit used in the Graphic Equalizer application note (APR2). The 330 tor provides additional current limiting in the crystal. Figure B-6 shows a circuit which waits until Vcc on the DSP is at least 4.5 V
resis-
before initiating a 3.75 ms minimum (150,000T) oscillator stabili­zation delay required for the on-chip oscillator (only 50T is re­quired for an external oscillator). This insures that the DSP is op­erational and stable before releasing the reset signal.
330
XTAL
470K
EXTAL
10 pf10 pf
20.5 MHz
Figure B-5. Alternative Clock Circuit from the Graphic Equalizer (APR2)
+5V
DLY
In
R
C
DLY
1 -
2 (2)
MC34064 MC33064
-
+
1.2 V
ref
U1
1 (1)
••
t
= RC
DLY
LOGIC RESET
3 (4)
Notes:
1. IRQA be hardwired.
and IRQB must
Where: t
= 150,000T min.
DLY
= 5 V
V
in
R = 8.2K +
= 20.5 MHz
f
osc
5%
1
V
th
Vin - V
V V C T = 25 ns
RESET
ol
= 2.5 V
th
= 0.4 V
ol
= 1 µf + 20%
DLY
B-50
2. MODA and MODB must be hard wired.
Figure B-6. Reset Circuit Using MC34064/MC33064
DSP56001MOTOROLA
Page 51
Figure 7 illustrates how to connect a 20 ns static RAM with a 33 MHz. DSP56001. The important parameters are T
< 10 ns, and T
T
DOE
to minimize decoding delays. This example maps the static RAM
= 20 ns maximum. A 7.5 ns PLD is used
AA
< 10 ns,
DW
DSP56001
27 MHZ
DATA
into the ranges X:$1000-1FFF and Y:$1000-1FFF. The PLD equation is:
RAM_ENABLE = PS & !DS & !A15 & !A14 & !A13 & !A12
MCM6264D
(8K X 8) 20 ns
ADDRESS
DS PS
RD
WR
16L8-7
7.5ns PLD
4
A12
5
A13
6
A14
7
A15
8
DS
9
PS
RAM_ENABLE
12
Figure B-7. 27 MHz DSP56001 with 20 ns SRAM
DATA
ADDRESS
E
OE
WR
CS
DSP56001 MOTOROLA
B-51
Page 52
Figure B-8 shows the DSP56001 connected to the bus of an IBM-PC computer. The PAL equations and other details of this circuit are available in “An ISA BUS INTERFACE FOR THE
NOTE: CONNECTOR is J1 of ISA BUS All Series Resistors 15K OHMS
IRQA
IRQB
B30 A27 A26 A25 A24 A23 A22 A17 A11 B14 B13
OSC A04 A05 A06 A07 A08 A09 A14 AEN IOR IOW
1 2 3 4 5 6 7 8
9 10 11
23 13
17 16
14 22
PAL22V10
15
DSP56001” which is provided on request by the Mo torola DSP Marketing Department (512-891-2030).
+5v
L13
BR
B10
HREQ
A9
HACK
A10
HEN
A11
HR/W
B5
MODA/IRQA
A4
MODB/IRQB
A521
RESET
A02 A03
A04 A05 A06
A07 A08 A09
A31 A30 A29
B4
D23
19
1
OE
DIR
D07 D06 D05 D04 D03 D02 D01 D00
11 12
13 14
15 16 17 18
9 8
7 6
5 4 3
MC74ACT245
2
B11 A12
A13 B12
B13 C12 C13 D12
A00 A01 A02
Figure B-8. DSP56001-to-ISA Bus Interface Schematic
DSP56001
H7 H6 H5 H4 H3 H2 H1 H0
B8
HA0
A8
HA1
A7
HA2
B-52
DSP56001MOTOROLA
Page 53
APPENDIX C
MU-LAW / A-LAW EXPANSION TABLES
ORG X:$100 ; M_00 DC $7D7C00 ; 8031 M_01 DC $797C00 ; 7775 M_02 DC $757C00 ; 7519 M_03 DC $717C00 ; 7263 M_04 DC $6D7C00 ; 7007 M_05 DC $697C00 ; 6751 M_06 DC $657C00 ; 6495 M_07 DC $617C00 ; 6239 M_08 DC $5D7C00 ; 5983 M_09 DC $597C00 ; 5727 M_0A DC $557C00 ; 5471 M_0B DC $517C00 ; 5215 M_0C DC $4D7C00 ; 4959 M_0D DC $497C00 ; 4703 M_0E DC $457C00 ; 4447 M_0F DC $417C00 ; 4191 M_10 DC $3E7C00 ; 3999 M_11 DC $3C7C00 ; 3871 M_12 DC $3A7C00 ; 3743 M_13 DC $387C00 ; 3615 M_14 DC $367C00 ; 3487 M_15 DC $347C00 ; 3359 M_16 DC $327C00 ; 3231 M_17 DC $307C00 ; 3103 M_18 DC $2E7C00 ; 2975 M_19 DC $2C7C00 ; 2847 M_1A DC $2A7C00 ; 2719 M_1B DC $287C00 ; 2591 M_1C DC $267C00 ; 2463 M_1D DC $247C00 ; 2335 M_1E DC $227C00 ; 2207 M_1F DC $207C00 ; 2079 M_20 DC $1EFC00 ; 1983 M_21 DC $1DFC00 ; 1919 M_22 DC $1CFC00 ; 1855 M_23 DC $1BFC00 ; 1791 M_24 DC $1AFC00 ; 1727 M_25 DC $19FC00 ; 1663 M_26 DC $18FC00 ; 1599 M_27 DC $17FC00 ; 1535 M_28 DC $16FC00 ; 1471 M_29 DC $15FC00 ; 1407 M_2A DC $14FC00 ; 1343 M_2B DC $13FC00 ; 1279 M_2C DC $12FC00 ; 1215 M_2D DC $11FC00 ; 1151 M_2E DC $10FC00 ; 1087 M_2F DC $0FFC00 ; 1023 M_30 DC $0F3C00 ; 975 M_31 DC $0EBC00 ; 943 M_32 DC $0E3C00 ; 911 M_33 DC $0DBC00 ; 879 M_34 DC $0D3C00 ; 847 M_35 DC $0CBC00 ; 815 M_36 DC $0C3C00 ; 783 M_37 DC $0BBC00 ; 751 M_38 DC $0B3C00 ; 719 M_39 DC $0ABC00 ; 687 M_3A DC $0A3C00 ; 655 M_3B DC $09BC00 ; 623 M_3C DC $093C00 ; 591 M_3D DC $08BC00 ; 559 M_3E DC $083C00 ; 527
Figure C-1. Mu-Law/A-Law Expansion Table Contents (Sheet 1 of 2)
DSP56001 MOTOROLA
M_3F DC $07BC00 ; 495 M_40 DC $075C00 ; 471 M_41 DC $071C00 ; 455 M_42 DC $06DC00 ; 439 M_43 DC $069C00 ; 423 M_44 DC $065C00 ; 407 M_45 DC $061C00 ; 391 M_46 DC $05DC00 ; 375 M_47 DC $059C00 ; 359 M_48 DC $055C00 ; 343 M_49 DC $051C00 ; 327 M_4A DC $04DC00 ; 311 M_4B DC $049C00 ; 295 M_4C DC $045C00 ; 279 M_4D DC $041C00 ; 263 M_4E DC $03DC00 ; 247 M_4F DC $039C00 ; 231 M_50 DC $036C00 ; 219 M_51 DC $034C00 ; 211 M_52 DC $032C00 ; 203 M_53 DC $030C00 ; 195 M_54 DC $02EC00 ; 187 M_55 DC $02CC00 ; 179 M_56 DC $02AC00 ; 171 M_57 DC $028C00 ; 163 M_58 DC $026C00 ; 155 M_59 DC $024C00 ; 147 M_5A DC $022C00 ; 139 M_5B DC $020C00 ; 131 M_5C DC $01EC00 ; 123 M_5D DC $01CC00 ; 115 M_5E DC $01AC00 ; 107 M_5F DC $018C00 ; 99 M_60 DC $017400 ; 93 M_61 DC $016400 ; 89 M_62 DC $015400 ; 85 M_63 DC $014400 ; 81 M_64 DC $013400 ; 77 M_65 DC $012400 ; 73 M_66 DC $011400 ; 69 M_67 DC $010400 ; 65 M_68 DC $00F400 ; 61 M_69 DC $00E400 ; 57 M_6A DC $00D400 ; 53 M_6B DC $00C400 ; 49 M_6C DC $00B400 ; 45 M_6D DC $00A400 ; 41 M_6E DC $009400 ; 37 M_6F DC $008400 ; 33 M_70 DC $007800 ; 30 M_71 DC $007000 ; 28 M_72 DC $006800 ; 26 M_73 DC $006000 ; 24 M_74 DC $005800 ; 22 M_75 DC $005000 ; 20 M_76 DC $004800 ; 18 M_77 DC $004000 ; 16 M_78 DC $003800 ; 14 M_79 DC $003000 ; 12 M_7A DC $002800 ; 10 M_7B DC $002000 ; 8 M_7C DC $001800 ; 6 M_7D DC $001000 ; 4 M_7E DC $000800 ; 2 M_7F DC $000000 ; 0
C-53
Page 54
A_80 DC $158000 ; 688 A_81 DC $148000 ; 656 A_82 DC $178000 ; 752 A_83 DC $168000 ; 720 A_84 DC $118000 ; 560 A_85 DC $108000 ; 528 A_86 DC $138000 ; 624 A_87 DC $128000 ; 592 A_88 DC $1D8000 ; 944 A_89 DC $1C8000 ; 912 A_8A DC $1F8000 ; 1008 A_8B DC $1E8000 ; 976 A_8C DC $198000 ; 816 A_8D DC $188000 ; 784 A_8E DC $1B8000 ; 880 A_8F DC $1A8000 ; 848 A_90 DC $0AC000 ; 344 A_91 DC $0A4000 ; 328 A_92 DC $0BC000 ; 376 A_93 DC $0B4000 ; 360 A_94 DC $08C000 ; 280 A_95 DC $084000 ; 264 A_96 DC $09C000 ; 312 A_97 DC $094000 ; 296 A_98 DC $0EC000 ; 472 A_99 DC $0E4000 ; 456 A_9A DC $0FC000 ; 504 A_9B DC $0F4000 ; 488 A_9C DC $0CC000 ; 408 A_9D DC $0C4000 ; 392 A_9E DC $0DC000 ; 440 A_9F DC $0D4000 ; 424 A_A0 DC $560000 ; 2752 A_A1 DC $520000 ; 2624 A_A2 DC $5E0000 ; 3008 A_A3 DC $5A0000 ; 2880 A_A4 DC $460000 ; 2240 A_A5 DC $420000 ; 2112 A_A6 DC $4E0000 ; 2496 A_A7 DC $4A0000 ; 2368 A_A8 DC $760000 ; 3776 A_A9 DC $720000 ; 3648 A_AA DC $7E0000 ; 4032 A_AB DC $7A0000 ; 3904 A_AC DC $660000 ; 3264 A_AD DC $620000 ; 3136 A_AE DC $6E0000 ; 3520 A_AF DC $6A0000 ; 3392 A_B0 DC $2B0000 ; 1376 A_B1 DC $290000 ; 1312 A_B2 DC $2F0000 ; 1504 A_B3 DC $2D0000 ; 1440 A_B4 DC $230000 ; 1120 A_B5 DC $210000 ; 1056 A_B6 DC $270000 ; 1248 A_B7 DC $250000 ; 1184 A_B8 DC $3B0000 ; 1888 A_B9 DC $390000 ; 1824 A_BA DC $3F0000 ; 2016 A_BB DC $3D0000 ; 1952 A_BC DC $330000 ; 1632 A_BD DC $310000 ; 1568 A_BE DC $370000 ; 1760 A_BF DC $350000 ; 1696
A_C0 DC $015800 ; 43 A_C1 DC $014800 ; 41 A_C2 DC $017800 ; 47 A_C3 DC $016800 ; 45 A_C4 DC $011800 ; 35 A_C5 DC $010800 ; 33 A_C6 DC $013800 ; 39 A_C7 DC $012800 ; 37 A_C8 DC $01D800 ; 59 A_C9 DC $01C800 ; 57 A_CA DC $01F800 ; 63 A_CB DC $01E800 ; 61 A_CC DC $019800 ; 51 A_CD DC $018800 ; 49 A_CE DC $01B800 ; 55 A_CF DC $01A800 ; 53 A_D0 DC $005800 ; 11 A_D1 DC $004800 ; 9 A_D2 DC $007800 ; 15 A_D3 DC $006800 ; 13 A_D4 DC $001800 ; 3 A_D5 DC $000800 ; 1 A_D6 DC $003800 ; 7 A_D7 DC $002800 ; 5 A_D8 DC $00D800 ; 27 A_D9 DC $00C800 ; 25 A_DA DC $00F800 ; 31 A_DB DC $00E800 ; 29 A_DC DC $009800 ; 19 A_DD DC $008800 ; 17 A_DE DC $00B800 ; 23 A_DF DC $00A800 ; 21 A_E0 DC $056000 ; 172 A_E1 DC $052000 ; 164 A_E2 DC $05E000 ; 188 A_E3 DC $05A000 ; 180 A_E4 DC $046000 ; 140 A_E5 DC $042000 ; 132 A_E6 DC $04E000 ; 156 A_E7 DC $04A000 ; 148 A_E8 DC $076000 ; 236 A_E9 DC $072000 ; 228 A_EA DC $07E000 ; 252 A_EB DC $07A000 ; 244 A_EC DC $066000 ; 204 A_ED DC $062000 ; 196 A_EE DC $06E000 ; 220 A_EF DC $06A000 ; 212 A_F0 DC $02B000 ; 86 A_F1 DC $029000 ; 82 A_F2 DC $02F000 ; 94 A_F3 DC $02D000 ; 90 A_F4 DC $023000 ; 70 A_F5 DC $021000 ; 66 A_F6 DC $027000 ; 78 A_F7 DC $025000 ; 74 A_F8 DC $03B000 ; 118 A_F9 DC $039000 ; 114 A_FA DC $03F000 ; 126 A_FB DC $03D000 ; 122 A_FC DC $033000 ; 102 A_FD DC $031000 ; 98 A_FE DC $037000 ; 110 A_FF DC $035000 ; 106
C-54
Figure C-1. Mu-Law/A-Law Expansion Table Contents (Sheet 2 of 2)
DSP56001MOTOROLA
Page 55
APPENDIX D
SINE WAVE TABLE
This sine wave table is normally used by FFT routines which use bit reversed address pointers. This table can be used as it is for up to 512 point FFTs; howev er , f or larger FFTs , the table m ust be copied to a different memory location to allow the re v erse-carry address­ing mode to be used (see
Processor User’s Manual
ORG Y:$100 ; S_00 DC $000000 ; +0.0000000000 S_01 DC $03242B ; +0.0245412998 S_02 DC $0647D9 ; +0.0490676016 S_03 DC $096A90 ; +0.0735644996 S_04 DC $0C8BD3 ; +0.0980170965 S_05 DC $0FAB27 ; +0.1224106997 S_06 DC $12C810 ; +0.1467303932 S_07 DC $15E214 ; +0.1709619015 S_08 DC $18F8B8 ; +0.1950902939 S_09 DC $1C0B82 ; +0.2191012055 S_0A DC $1F19F9 ; +0.2429800928 S_0B DC $2223A5 ; +0.2667128146 S_0C DC $25280C ; +0.2902846038 S_0D DC $2826B9 ; +0.3136816919 S_0E DC $2B1F35 ; +0.3368898928 S_0F DC $2E110A ; +0.3598949909 S_10 DC $30FBC5 ; +0.3826833963 S_11 DC $33DEF3 ; +0.4052414000 S_12 DC $36BA20 ; +0.4275551140 S_13 DC $398CDD ; +0.4496113062 S_14 DC $3C56BA ; +0.4713967144 S_15 DC $3F174A ; +0.4928981960 S_16 DC $41CE1E ; +0.5141026974 S_17 DC $447ACD ; +0.5349975824 S_18 DC $471CED ; +0.5555701852 S_19 DC $49B415 ; +0.5758082271 S_1A DC $4C3FE0 ; +0.5956993103 S_1B DC $4EBFE9 ; +0.6152315736 S_1C DC $5133CD ; +0.6343932748 S_1D DC $539B2B ; +0.6531729102 S_1E DC $55F5A5 ; +0.6715589762 S_1F DC $5842DD ; +0.6895405054 S_20 DC $5A827A ; +0.7071068287 S_21 DC $5CB421 ; +0.7242470980 S_22 DC $5ED77D ; +0.7409511805 S_23 DC $60EC38 ; +0.7572088242 S_24 DC $62F202 ; +0.7730104923 S_25 DC $64E889 ; +0.7883464098 S_26 DC $66CF81 ; +0.8032075167 S_27 DC $68A69F ; +0.8175848722 S_28 DC $6A6D99 ; +0.8314697146 S_29 DC $6C2429 ; +0.8448535204 S_2A DC $6DCA0D ; +0.8577286005 S_2B DC $6F5F03 ; +0.8700870275 S_2C DC $70E2CC ; +0.8819212914 S_2D DC $72552D ; +0.8932244182 S_2E DC $73B5EC ; +0.9039893150 S_2F DC $7504D3 ; +0.9142097235 S_30 DC $7641AF ; +0.9238795042 S_31 DC $776C4F ; +0.9329928160 S_32 DC $788484 ; +0.9415441155 S_33 DC $798A24 ; +0.9495282173 S_34 DC $7A7D05 ; +0.9569402933 S_35 DC $7B5D04 ; +0.9637761116 S_36 DC $7C29FC ; +0.9700313210 S_37 DC $7CE3CF ; +0.9757022262
Section 5.3.2.3 REVERSE-CARRY MODIFIER (Mn=$0000)
for additional information).
S_38 DC $7D8A5F ; +0.9807853103
S_39 DC $7E1D94 ; +0.9852777123
S_3A DC $7E9D56 ; +0.9891765118
S_3B DC $7F0992 ; +0.9924796224
S_3C DC $7F6237 ; +0.9951847792
S_3D DC $7FA737 ; +0.9972904921
S_3E DC $7FD888 ; +0.9987955093
S_3F DC $7FF622 ; +0.9996988773
S_40 DC $7FFFFF ; +0.9999998808
S_41 DC $7FF622 ; +0.9996988773
S_42 DC $7FD888 ; +0.9987955093
S_43 DC $7FA737 ; +0.9972904921
S_44 DC $7F6237 ; +0.9951847792
S_45 DC $7F0992 ; +0.9924796224
S_46 DC $7E9D56 ; +0.9891765118
S_47 DC $7E1D94 ; +0.9852777123
S_48 DC $7D8A5F ; +0.9807853103
S_49 DC $7CE3CF ; +0.9757022262
S_4A DC $7C29FC ; +0.9700313210
S_4B DC $7B5D04 ; +0.9637761116
S_4C DC $7A7D05 ; +0.9569402933
S_4D DC $798A24 ; +0.9495282173
S_4E DC $788484 ; +0.9415441155
S_4F DC $776C4F ; +0.9329928160
S_50 DC $7641AF ; +0.9238795042
S_51 DC $7504D3 ; +0.9142097235
S_52 DC $73B5EC ; +0.9039893150
S_53 DC $72552D ; +0.8932244182
S_54 DC $70E2CC ; +0.8819212914
S_55 DC $6F5F03 ; +0.8700870275
S_56 DC $6DCA0D ; +0.8577286005
S_57 DC $6C2429 ; +0.8448535204
S_58 DC $6A6D99 ; +0.8314697146
S_59 DC $68A69F ; +0.8175848722
S_5A DC $66CF81 ; +0.8032075167
S_5B DC $64E889 ; +0.7883464098
S_5C DC $62F202 ; +0.7730104923
S_5D DC $60EC38 ; +0.7572088242
S_5E DC $5ED77D ; +0.7409511805
S_5F DC $5CB421 ; +0.7242470980
S_60 DC $5A827A ; +0.7071068287
S_61 DC $5842DD ; +0.6895405054
S_62 DC $55F5A5 ; +0.6715589762
S_63 DC $539B2B ; +0.6531729102
S_64 DC $5133CD ; +0.6343932748
S_65 DC $4EBFE9 ; +0.6152315736
S_66 DC $4C3FE0 ; +0.5956993103
S_67 DC $49B415 ; +0.5758082271
S_68 DC $471CED ; +0.5555701852
S_69 DC $447ACD ; +0.5349975824
S_6A DC $41CE1E ; +0.5141026974
S_6B DC $3F174A ; +0.4928981960
S_6C DC $3C56BA ; +0.4713967144
S_6D DC $398CDD ; +0.4496113062
S_6E DC $36BA20 ; +0.4275551140
S_6F DC $33DEF3 ; +0.4052414000
S_70 DC $30FBC5 ; +0.3826833963
S_71 DC $2E110A ; +0.3598949909
S_72 DC $2B1F35 ; +0.3368898928
DSP56000/DSP56001 Digital Signal
in the
Figure D-1. Sine Wave Table Contents (Sheet 1 of 3)
DSP56001 MOTOROLA
D-55
Page 56
S_73 DC $2826B9 ; +0.3136816919 S_74 DC $25280C ; +0.2902846038 S_75 DC $2223A5 ; +0.2667128146 S_76 DC $1F19F9 ; +0.2429800928 S_77 DC $1C0B82 ; +0.2191012055 S_78 DC $18F8B8 ; +0.1950902939 S_79 DC $15E214 ; +0.1709619015 S_7A DC $12C810 ; +0.1467303932 S_7B DC $0FAB27 ; +0.1224106997 S_7C DC $0C8BD3 ; +0.0980170965 S_7D DC $096A90 ; +0.0735644996 S_7E DC $0647D9 ; +0.0490676016 S_7F DC $03242B ; +0.0245412998 S_80 DC $000000 ; +0.0000000000 S_81 DC $FCDBD5 ; -0.0245412998 S_82 DC $F9B827 ; -0.0490676016 S_83 DC $F69570 ; -0.0735644996 S_84 DC $F3742D ; -0.0980170965 S_85 DC $F054D9 ; -0.1224106997 S_86 DC $ED37F0 ; -0.1467303932 S_87 DC $EA1DEC ; -0.1709619015 S_88 DC $E70748 ; -0.1950902939 S_89 DC $E3F47E ; -0.2191012055 S_8A DC $E0E607 ; -0.2429800928 S_8B DC $DDDC5B ; -0.2667128146 S_8C DC $DAD7F4 ; -0.2902846038 S_8D DC $D7D947 ; -0.3136816919 S_8E DC $D4E0CB ; -0.3368898928 S_8F DC $D1EEF6 ; -0.3598949909 S_90 DC $CF043B ; -0.3826833963 S_91 DC $CC210D ; -0.4052414000 S_92 DC $C945E0 ; -0.4275551140 S_93 DC $C67323 ; -0.4496113062 S_94 DC $C3A946 ; -0.4713967144 S_95 DC $C0E8B6 ; -0.4928981960 S_96 DC $BE31E2 ; -0.5141026974 S_97 DC $BB8533 ; -0.5349975824 S_98 DC $B8E313 ; -0.5555701852 S_99 DC $B64BEB ; -0.5758082271 S_9A DC $B3C020 ; -0.5956993103 S_9B DC $B14017 ; -0.6152315736 S_9C DC $AECC33 ; -0.6343932748 S_9D DC $AC64D5 ; -0.6531729102 S_9E DC $AA0A5B ; -0.6715589762 S_9F DC $A7BD23 ; -0.6895405054 S_A0 DC $A57D86 ; -0.7071068287 S_A1 DC $A34BDF ; -0.7242470980 S_A2 DC $A12883 ; -0.7409511805 S_A3 DC $9F13C8 ; -0.7572088242 S_A4 DC $9D0DFE ; -0.7730104923 S_A5 DC $9B1777 ; -0.7883464098 S_A6 DC $99307F ; -0.8032075167 S_A7 DC $975961 ; -0.8175848722 S_A8 DC $959267 ; -0.8314697146 S_A9 DC $93DBD7 ; -0.8448535204 S_AA DC $9235F3 ; -0.8577286005 S_AB DC $90A0FD ; -0.8700870275 S_AC DC $8F1D34 ; -0.8819212914 S_AD DC $8DAAD3 ; -0.8932244182 S_AE DC $8C4A14 ; -0.9039893150 S_AF DC $8AFB2D ; -0.9142097235 S_B0 DC $89BE51 ; -0.9238795042 S_B1 DC $8893B1 ; -0.9329928160 S_B2 DC $877B7C ; -0.9415441155 S_B3 DC $8675DC ; -0.9495282173
S_B4 DC $8582FB ; -0.9569402933 S_B5 DC $84A2FC ; -0.9637761116 S_B6 DC $83D604 ; -0.9700313210 S_B7 DC $831C31 ; -0.9757022262 S_B8 DC $8275A1 ; -0.9807853103 S_B9 DC $81E26C ; -0.9852777123 S_BA DC $8162AA ; -0.9891765118 S_BB DC $80F66E ; -0.9924796224 S_BC DC $809DC9 ; -0.9951847792 S_BD DC $8058C9 ; -0.9972904921 S_BE DC $802778 ; -0.9987955093 S_BF DC $8009DE ; -0.9996988773 S_C0 DC $800000 ; -1.0000000000 S_C1 DC $8009DE ; -0.9996988773 S_C2 DC $802778 ; -0.9987955093 S_C3 DC $8058C9 ; -0.9972904921 S_C4 DC $809DC9 ; -0.9951847792 S_C5 DC $80F66E ; -0.9924796224 S_C6 DC $8162AA ; -0.9891765118 S_C7 DC $81E26C ; -0.9852777123 S_C8 DC $8275A1 ; -0.9807853103 S_C9 DC $831C31 ; -0.9757022262 S_CA DC $83D604 ; -0.9700313210 S_CB DC $84A2FC ; -0.9637761116 S_CC DC $8582FB ; -0.9569402933 S_CD DC $8675DC ; -0.9495282173 S_CE DC $877B7C ; -0.9415441155 S_CF DC $8893B1 ; -0.9329928160 S_D0 DC $89BE51 ; -0.9238795042 S_D1 DC $8AFB2D ; -0.9142097235 S_D2 DC $8C4A14 ; -0.9039893150 S_D3 DC $8DAAD3 ; -0.8932244182 S_D4 DC $8F1D34 ; -0.8819212914 S_D5 DC $90A0FD ; -0.8700870275 S_D6 DC $9235F3 ; -0.8577286005 S_D7 DC $93DBD7 ; -0.8448535204 S_D8 DC $959267 ; -0.8314697146 S_D9 DC $975961 ; -0.8175848722 S_DA DC $99307F ; -0.8032075167 S_DB DC $9B1777 ; -0.7883464098 S_DC DC $9D0DFE ; -0.7730104923 S_DD DC $9F13C8 ; -0.7572088242 S_DE DC $A12883 ; -0.7409511805 S_DF DC $A34BDF ; -0.7242470980 S_E0 DC $A57D86 ; -0.7071068287 S_E1 DC $A7BD23 ; -0.6895405054 S_E2 DC $AA0A5B ; -0.6715589762 S_E3 DC $AC64D5 ; -0.6531729102 S_E4 DC $AECC33 ; -0.6343932748 S_E5 DC $B14017 ; -0.6152315736 S_E6 DC $B3C020 ; -0.5956993103 S_E7 DC $B64BEB ; -0.5758082271 S_E8 DC $B8E313 ; -0.5555701852 S_E9 DC $BB8533 ; -0.5349975824 S_EA DC $BE31E2 ; -0.5141026974 S_EB DC $C0E8B6 ; -0.4928981960 S_EC DC $C3A946 ; -0.4713967144 S_ED DC $C67323 ; -0.4496113062 S_EE DC $C945E0 ; -0.4275551140 S_EF DC $CC210D ; -0.4052414000 S_F0 DC $CF043B ; -0.3826833963 S_F1 DC $D1EEF6 ; -0.3598949909 S_F2 DC $D4E0CB ; -0.3368898928 S_F3 DC $D7D947 ; -0.3136816919 S_F4 DC $DAD7F4 ; -0.2902846038
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Figure D-1. Sine Wave Table Contents (Sheet 2 of 3)
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S_F5 DC $DDDC5B ; -0.2667128146 S_F6 DC $E0E607 ; -0.2429800928 S_F7 DC $E3F47E ; -0.2191012055 S_F8 DC $E70748 ; -0.1950902939 S_F9 DC $EA1DEC ; -0.1709619015 S_FA DC $ED37F0 ; -0.1467303932
Figure D-1. Sine Wave Table Contents (Sheet 3 of 3)
S_FB DC $F054D9 ; -0.1224106997 S_FC DC $F3742D ; -0.0980170965 S_FD DC $F69570 ; -0.0735644996 S_FE DC $F9B827 ; -0.0490676016 S_FF DC $FCDBD5 ; -0.0245412998
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APPENDIX E
BOOTSTRAP MODE — OPERATING MODE 1
The bootstrap feature of the DSP56001 consists of four special on-chip modules: the 512 words of PRAM, a 32-word bootstrap ROM, the bootstrap control logic, and the bootstrap firmware program.
BOOTSTRAP ROM
This 32-word on-chip ROM has been factory programmed to per­form the actual bootstrap operation from the memory expansion port (Port A) or from the Host Interface. You have no access to the bootstrap ROM other than through the bootstrap process. Control logic will disable the bootstrap ROM during normal oper­ations.
BOOTSTRAP CONTROL LOGIC
The bootstrap mode control logic is activated when the DSP56001 is placed in Operating Mode 1. The control logic maps the bootstrap ROM into program memory space as long as the DSP56001 remains in Operating Mode 1. The bootstrap firm­ware changes operating modes when the bootstrap load is com­pleted. When the DSP56001 exits the reset state in Mode 1, the following actions occur.
1. The control logic maps the bootstrap ROM into the inter­nal DSP program memory space starting at location $0000. This P: space is read-only.
2. The control logic forces the entire P: space to be write­only memory during the bootstrap loading process. At­tempts to read from this space will result in fetches from the read-only bootstrap ROM.
3. Program execution begins at location $0000 in the boot­strap ROM. The bootstrap ROM program is able to per­form the PRAM load through either the memory expan­sion port from a byte-wide external memory, or through the Host Interface.
4. The bootstrap ROM program executes the following se­quence to end the bootstrap operation and begin your program execution.
A. Enter Operating Mode 2 by writing to the OMR.
This action will be timed to remove the bootstrap ROM from the program memory map a nd re- en­able read/write access to the PRAM.
B. The change to Mode 2 is timed exactly to allow
the boot program to execute a single cycle in­struction then a JMP #00 and begin execution of the program at location $0000.
You may also select the bootstrap mode by writing Operating Mode 1 into the OMR. This initiates a timed operation to map the bootstrap ROM into the program address space after a delay to allow execution of a single cycle instruction and then a JMP #<00 (e.g., see Bootstrap code for DSP56001) to begin the boot­strap process as described above in s teps 1-4. This technique allows the DSP56001 user to reboot the system (with a different program if desired).
through the Host Interface. The particular method used is select­ed by the level of program memory location $C000, bit 23. If lo­cation P:$C000, bit 23 is read as a one, the external bus version of the bootstrap program will be selected. Typically, a byte wide EPROM will be connected to the DSP56001 Address and Data Bus as shown in Figure B-1 of the applications examples given
APPENDIX B APPLICATIONS EXAMPLES
in tents of the EPROM must be organized as shown below.
Address of External Contents Loaded
Byte Wide P Memory to Internal PRAM at:
P:$C000 P:$0000 low byte P:$C001 P:$0000 mid byte P:$C002 P:$0000 high byte
••
••
•• P:$C5FD P:$01FF low byte P:$C5FE P:$01FF mid byte P:$C5FF P:$01FF high byte
If location P:$C000, bit 23 is read as a zero, the Host Interface version of the bootstrap program will be selected. Typically a host microprocessor will be connected to the DSP56001 Host In­terface. The host microprocessor must write the Host Interface registers THX, TXM, and then TSL with the desired contents of PRAM from location P:$0000 up to P:$01FF. If less than 512 words are to be loaded, the host programmer can exit the boot­strap program and force the DSP56001 to begin executing at lo­cation P:$0000 by setting HF0=1 in the Host Interface during the bootstrap load. In most systems, the DSP56001 responds so fast that handshaking between the DSP56001 and the host is not necessary.
The bootstrap program is shown in flowchart form in Figure E-1 and in assembler listing format in Figure E-2.
. The data con-
BOOTSTRAP FIRMWARE PROGRAM
Bootstrap ROM contains the bootstrap firmware program that performs initial loading of the DSP56001 PRAM. The program is written in DSP56000/DSP56001 assembly language. It contains two separate methods of initializing the PRAM: loading from a byte-wide memory starting at location P:$C000 or loading
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START
INITIALIZE ADDRESS
REGISTERS
R0=0 R1=$C000 R2=$FFE9
GET P:$C000 BIT 23
AND PUT IT IN THE
CARRY FLAG
INTERFACE
WAS
P:$C000 BIT 23
=0?
EXTERNAL
N
MEMORY
SET L FLAG = 1
(INDICATES A BOOT
FROM EXTERNAL
MEMORY WAS
SELECTED)
HOST
Y
IS
L FLAG
=0?
LOAD FROM
EXTERNAL
N
MEMORY
DO 3 TIMES
(GET 8-BIT DATA
AND SHIFT INTO
24-BIT WORD)
GET 8-BIT DATA
FROM P MEMORY
PUT I N A2,
INCREMENT R1
SHIFT 8 BITS
FROM A3 INTO
ACCUMULATOR
A1’S 8 MSBS
LOAD FROM
HOST
INTERFACE
Y
WAIT FOR HOST TO FILL INPUT REGISTER
HOST INTE R FACE
HOST FLAG 0
CONTINUE LOADING
Y
HOST RECEIVE
FLAG = 0?
PUT DATA FROM
HOST RECEIVE
DATA REGISTER
ACCUMULATOR A1
ENABLE
LOGIC
IS
=0?
Y
IS THE
DATA AVAILABLE
N
INTO
N
ENDDO
STOP BOOT
LOAD
START DO LOOP, 512
ITERATIONS
REPEAT UNTIL
512 PROGRAM WORDS
HAVE BEEN LOADED
FINISHED
3 LOOPS?
Y
MOVE A1 INTO
NEXT INTERNAL
P MEMORY LOCATION.
INCREMENT R0
POINTER.
N
FINISHED
512 LOOPS?
Y
SET OPERATING
MODE TO
MODE 2
N
REPEAT UNTIL
24-BIT DATA IS IN A1
CLEAR
STATUS
REGISTER
JUMP TO P:0
Figure E-1. Bootstrap Program Flowchart
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Motorola DSP56000 Macro Cross Assembler Version 2.00 87-08-23 09:57:46 bootcode.asm Page 1
1 PAGE 132,50,0,10 2 ; BOOTSTRAP SOURCE CODE FOR DSP56001 - (C) Copyright 1986 Motorola Inc. 4 ; Host algorithm / AND / external bus method 6 ; This is the Bootstrap source code contained in the DSP56001 32 word boot ROM. 7 ; This program can load the internal program memory from one of two external sources. 8 ; The program reads P:$C000 bit 23 to decide which external source to access. If 9 ; P:$C000 bit 23 = 0 then it loads internal PRAM from H0-H7, using the Host Interface 10 ; logic. If P:$C000 bit 23 = 1 then it loads from 1,536 consecutive byte-wide P: 11 ; memory locations (starting at P:$C000). 13 0000C000 BOOT EQU $C000 ; The location in P: memory 14 ; where the external byte-wide 15 ; EPROM is expected to be mapped. 16 17 p:0000 ORG PL:$0 ; Bootstrap code starts at P:$0 18 19 P:0000 62F400 START MOVE #$FFE9,R2 ; R2 = address of the Host
00FFE9 20 ; Interface status register. 21 P:0002 61F400 MOVE #BOOT,R1 ; R1 = starting P: address of
00C000 22 ; external bootstrap byte-wide ROM. 23 P:0004 300000 MOVE #0,R0 ; R0 = starting P: address of 24 ; internal memory where program 25 ; will begin loading. 26 27 P:0005 07E18C MOVE P:(R1),Al ; Get the data at P:$C000 28 P:0006 200037 ROL A ; Shift bit 23 into the Carry flag 29 P:0007 0E0009 JCC <INLOOP ; Perform load from Host Interface 30 ; if carry is zero. 31 32 ; IMPORTANT NOTE: This routine assumes that the L bit has been cleared before entering 33 ; this program and that M0 and M1 have been preloaded with $FFFF (linear addressing). 34 ; This would be the case after a reset. If this program is entered by changing the OMR
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Figure E-2. Assembler Listing for Bootstrap Program (Sheet 1 of 3)
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Motorola DSP56000 Macro Cross Assembler Version 2.00 87-08-23 09:57:46 bootcode.asm Page 2
35 ; to bootstrap operating mode, make certain that the L bit is cleared and registers M0 36 ; and M1have been set to $FFFF. Also, make sure the BCR is set to $xxFx since 37 ; EPROMS are slow and BCR is set to $FFFF after a reset. If the L bit was set before 38 ; changing modes, the program will load from external program memory. 39 40 P:0008 0040F9 ORI #$40,CCR ; Set the L bit to indicate 41 ; that the bootstrap program 42 ; is being loaded from the 43 ; external P: space. 44 45 ; The first routine will load 1,536 bytes from the external P: memory space beginning 46 ; at P:$C000 (bits 7-0). These will be packed into 512 24-bit words and stored in 47 ; contiguous internal PRAM memory locations starting at P:$0. 48 49 ; The shifter moves the 8-bit input data from register A2 into register A1 eight bits 50 ; at a time. After assembling one 24-bit word (this takes three loops) it stores the 51 ; result in internal PRAM and continues until internal PRAM is filled. Note that the 52 ; first routine loads data starting with the least significant byte of P:$0 first. 53 54 ; The second routine loads the internal PRAM using the Host Interface logic. 55 ; If the host only wants to load a portion of the PRAM, the Host Interface bootstrap 56 ; load program can be aborted and execution of the loaded program started, by setting 57 ; the Host Flag (HF0) = 1 at any time during the load from the Host Processor. 58 59 P:0009 060082 INLOOP D0 #512,_LOOP1 ; Load 512 instruction words.
00001B 60 61 ; This is the context switch 62 63 P:000B 0E6012 JLC < _HOSTLD ; Load from the Host Interface 64 ; if the Limit flag is clear.
65 66 ; This is the first routine. It loads from external P: memory. 67 68 P:000C 060380 DO #3, _LOOP2 ; Each instruction has 3 bytes.
000010
Figure E-2. Assembler Listing for Bootstrap Program (Sheet 2 of 3)
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Motorola DSP56000 Macro Cross Assembler Version 2.00 87-08-23 09:57:46 bootcode.asm Page 3
69 P:000E 07D98A MOVE P:(R1)+,A2 ; Get the 8 LSB from external 70 ; P: memory. 71 P:000F 0608A0 REP #8 ; Shift 8 bit data into A1 72 P:0010 200022 ASR A 73 _LOOP2 ; Get another byte 74 P:0011 0C001B JMP < _STORE ; then put the word in PRAM. 75 76 ; This is the second routine. It loads from the Host Interface pins. 77 78 P:0012 0AA020 _HOSTLD BSET #0,X:$FFE0 ; Configure Port B as Host Interface 79 P:0013 0AA983 _LBLA JCLR #3,X:$FFE9, _LBLB ; If HF0=1, stop loading data.
80 P:0015 00008C ENDDO ; Must terminate the DO loop 81 P:0016 0C001C JMP <_BOOTEND 82 83 P:0017 0A6280 _LBLB JCLR #0,X:(R2), _LBLA ; Wait for HRDF to go high
84 ; (meaning 24-bit data is present) 85 P:0019 54F000 MOVE X:$FFEB,A1 ; Put 24-bit host data in A1
86 87 P:001B 07588C _STORE MOVE A1,P:(R0)+ ; Store 24-bit result in PRAM. 88 89 _LOOP1 ; and return for another 24-bit word 90 91 ; This is the exit handler that returns execution to normal expanded mode 92 ; and jumps to the RESET location. 93 94 P:001C 0502BA _BOOTEND MOVEC #2,0MR ; Set the operating mode to 2 95 ; (and trigger an exit from 96 ; bootstrap mode).
000017
000013
00FFEB
97 P:001D 0000B9 ANDI #$0,CCR ; Clear SR as if RESET and 98 ; introduce delay needed for 99 ; Op. Mode change. 100 P:001E 0C0000 JMP <$0 ; Start fetching from PRAM P:$0000 101
Motorola DSP56000 Macro Cross Assembler Version 2.00 87-08-23 09:57:46 bootcode.asm Page 4
0 Errors 0 Warnings
Figure E-2. Assembler Listing for Bootstrap Program (Sheet 3 of 3)
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