Datasheet DSM2190F4V Datasheet (SGS Thomson Microelectronics)

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Page 1

DSM (Digital Signal Processor System Memory)

For Analog Devices ADSP-2191 DSPs (3.3V Supply)

FEATURES SUMMARY

■ Glueless Connection to DSP

– Easily add memory, logic, and I/O to the Exter-

nal Port of ADSP-2191 DSP

■ Dual Flash Memories

– Two independent Flash memory arrays for stor-

ing DSP code and data. DSP may access the two arrays concurrently (read from one while erasing or writing the other)

– 256K x 8 Main Flash memory divided into 8 sec-

tors (32KByte each) – Ample storage for booting DSP code/data

upon reset and subsequent code swaps

– Large capacity for data recording

– 32K x 8 Secondary Flash memory divided into 4

sectors (8 KByte each). Multiple uses: – Small sector size ideal for small data sets,

and calibration or configuration constants

– Store custom start-up code in one or more

sectors and configure DSP to run from external memory upon reset (no boot)

– Concatenate Secondary Flash with Main

Flash for total of 288 KBytes

– Each Flash sector can be write protected. – Built-in programmable address decoding logic

allows mapping individual Flash sectors to any address boundary

■ Up to 16 Multifunction I/O Pins

– Increase total DSP system I/O capability – I/O controlled by DSP software or PLD logic

■ Genera l pu rpo s e P LD

– Over 3,000 Gates of PLD with 16 macro cells – Use for peripheral glue logic to keypads, control

panel, displays, LCDs, and other devices – Eliminate PLDs and external logic devices – Create state machines, chip selects, simple

shifters and counters, clock dividers, delays

– Simple PSDsoft Express

■ Operating Range

: 3.3V±10%; Temperature: –40oC to +85oC

–V

software...Free

DSM2190F4V

Figure 1. Packages

PQFP52 (T)

PLCC52 (K)

■ In-System Programming (ISP) with JTAG

– Program entire chip in 10-25 seconds with no in-

volvement of the DSP – Links with ADSP-2191 JTAG debug port – Eliminate sockets f or pre-prog ramm ed me mory

and logic devices – ISP allows efficient manufacturing and product

testing supporting Just-In-Time inventory – Use low-cost FlashLINK

■ Content Security

– Programmable Security Bit blocks access of de-

vice programmers and readers

■ Zero-Power Technology

– As low as 25µA standby current

■ Packaging

– 52-pin PQFP or 52-pin PLCC

■ Flash Memory Speed, Endurance, Retention

– 150 ns, 100K cycles, 15 year retention

cable with PC

1/61September 2002

Page 2

DSM2190F4

TABLE OF CONTENTS

Summary Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

DSP Address/Data/Control Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Main Flash Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Secondary Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Programmable Logic (PLDs). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Runtime Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Memory Page Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

JTAG ISP Port. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Security and NVM Sector Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Typical connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Typical Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Specifying the Memory Map with PSDsoft ExpressTM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Runtime control register definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5

Detailed Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Flash Memories. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Instruction Sequences. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Reading Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Programming Flash Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Erasing Flash Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Flash Memory Sector Protect.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

DSM Security Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Reset Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Page Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

PLDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Decode PLD (DPLD). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

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DSM2190F4

Complex PLD (CPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

DSP Bus Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Port Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Port B – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Port C – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Port D – Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Power Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

PLD Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8

PSD Chip Select Input (CSI, PD2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Power On Reset, Warm Reset, Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Programming In-Circuit using JTAG ISP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40

AC/DC Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Table: Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43

Table: Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Table: DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Table: CPLD Combinatorial Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47

Table: CPLD Macrocell Synchronous Clock Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Table: CPLD Macrocell Asynchronous Clock Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Table: Input Macrocell Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Table: Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Table: Write Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Table: Flash Memory Program, Write and Erase Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Table: Reset (Reset) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3

Table: ISC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Package Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5

Table: PLCC52 - 52 lead Plastic Leaded Chip Carrier, rectangular . . . . . . . . . . . . . . . . . . . . . . . . 55

Table: Assignments – PLCC52 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Table: PQFP52 - 52 lead Plastic Quad Flatpack. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Table: Pin Assignments – PQFP52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58

Table: Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59

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Page 4

DSM2190F4

SUMMARY DESCRIPTION

The DSM2190F4 is a system memory device for use with the Analog Devices ADSP-2191 DSP. DSM means Digital signal processor System Memory. A DSM device brings In-System Programmable (ISP) Flash memory, param eter storage, programmable logic, and additional I/O to DSP systems. The result is a simple and flexible two-chip solution for DSP designs. DSM devices provide the flexibility of Flash memo ry and smart JTAG programming technique s for both manu facturing and the field. On-chip integrated memory decode logic makes it easy to map dual banks of Flash memory to the ADSP -2191 in a variety of ways for bootloading, code execution, data recording, code swapping, and parameter storage.

JTAG ISP reduces development time, simplifies manufacturing flow, and lowers the cost of field upgrades. The JTAG ISP interface eliminates the need for sockets and pre-programmed memory and logic devices. For man ufacturing, end products may be assembled with a blank DSM device soldered to the circuit board and programmed at the end of the manufacturing line in 10 to 25 seconds with no involvement of the DS P. This a llows efficient means to test product and manage inventory by rapidly programming test code, then appli-

cation code as determined by inventory requirements (Just-In Time inv entory). A ddi tionally, JTAG ISP reduces development time by turning fast iterations of DSP code in the lab. Code updates in the field require n o disassembly o f product. The FlashLINK

JTAG programming cable costs $59 USD and plugs into any PC or notebook parallel port.

In addition to ISP Flash memory, DSM devices add programmable logic (PLD) and up to 16 configurable I/O pins to the DSP system. The state of each I/O pin can be driven by DSP software or PLD logic. PLD and I/O configuration are programmable by JTAG I SP, just like the Flash m emory. The PLD consists of more than 3000 gates and has 16 macro cell registers. Common uses for the PLD include chip selects for external devices, state-machines, simple shifters and counters, keypad and control panel interfaces, clock dividers, handshake delay, multiplexers, etc. This eliminates the need for small external PLDs and l ogic devices. Configuration of PLD, I/O, and Flash memory mapping are easily entered in a pointand-click environment using the software development tool, PSDsoft Express available at no charge from

. This software is

www.st.com/psm

Figure 2. System Block Diagram, Two-C hip Solution

16 FLAGS

TIMER/

CAPTURE

SERIAL DEVICE

UART

DEVICE

HOST

MCU

ANALOG DEVICES

DSP

ADSP-2191

22 ADDRESS

WR, RD, BMS, MSx, IOMS

8 DATA

JTAG DEBUG

DSP SYSTEM MEMORY

LOGIC

ADDR & DECODE

16 MACROCELL PLD

POWER MANAGEMENT

CONTENT SECURITY

DSM2190F4

PRIMARY

FLA SH MEMORY

256K X 8

SECONDARY

FLA SH MEMORY

32K X 8

I/O CONTROL

8 I/O

I/O, PLD, CHIP SELECTS

PORTS

I/O BUS

8 I/O

PORTS

JTAG

ISP TO

ALL

AREAS

I/O, PLD, CHIP SEL

JTAG ISP

AI04959B

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Page 5

DSM2190F4

The two-chip combination of a D SP and a DSM device is ideal for systems which have limitations on size, EMI levels, and power consumption. DSM

memory and logic are “zero-power”, meaning they automatically go to standby between memory accesses or logic input changes , producing low active and standby current consumption, which is ideal for battery powered products.

Table 1. DSM2190F4V DSP Memory S ystem Devi ces

Secondar y

Flash

Memory

32KBytes =

4 sectors x

8KByte

32KBytes =

4 sectors x

8KByte

PLD

macro

-cells

macro

-cells

Part Number

DSM2190F4VV15T6

DSM2190F4VV15K6

Main Flash

Memory

256KBytes =

8 sectors x

32KByte

256KBytes =

8 sectors x

32KByte

Table 2. Compatible Analog Devices DSP

DSP Part Number

A programmable security bit in the DSM protects its contents from unauthorized viewing and copying. When set, the security bit will block access of programming devices (JTAG or others) to the DSM Flash memories and PLD configuration. The only way to defeat the security bit is to erase the entire DSM device, after which the device is blank and may be used again. The DSP will always have access to Flash memory contents through the 8-bit data port even while the security bit is set.

I/O

Ports

Up to

and I/O

3.3V ±10% 150 ns

Operating Voltage, V

Mem

Speed

Package

52-pin PQFP

52-pin PLCC

Operating

Temp

C to

–40

+85

C to

–40

+85

I/O Capability

ADSP-2191M 2.5V 2.5 - 3.6V

Figure 3. PLC C C onnection s Figure 4. PQFP C onnection s

RESET

PB7

CNTL2

CNTL0

CNTL1

PB0

PB1

PB2

PB3

PB4

PB5

GND

PB6

PB7

CNTL1

CNTL2

RESET

AD15

AD14

AD13

AD12

AD11

AD10

AD9

AD8

AD7

AD6

AD5

AD4

PA0

AD2

AD1

AD3

AD0

AI02857

PD2 PD1 PD0 PC7 PC6 PC5 PC4 V GND PC3 PC2 PC1 PC0

52515049484746454443424140

1 2 3 4 5 6 7 8 9 10 11 12 13

14151617181920212223242526

PA7

PA6

PA5

PA4

PA3

PA2

PA1

GND

CNTLO

39 AD15 38 AD14 37 AD13 36 AD12 35 AD11 34 AD10 33 AD9 32 AD8 31 V

30 AD7 29 AD6 28 AD5 27 AD4

PA0

AD0

AD1

AD2

AD3

PD2 PD1 PD0 PC7 PC6 PC5

PC4 V GND PC3

PC2

PC1

PC0

PB0

PB1

PB2

PB3

PB4

PB5

GND

PB6

567

8 9 10 11 12 13 14 15

16 17 18 19 20

21222324252627282930313233

PA7

PA6

PA5

PA4

PA3

PA2

PA1

GND

AI02858

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DSM2190F4

ARCHITECTURAL OVERVIEW

Major functional blocks are shown in Figure 5.

DSP Address/Data/Control Interface

These DSP signals attach directly to the DSM for a glueless connection. An 8-bit data connection is formed and all 22 DSP address lines can be decoded as well as DSP memory strobes;

IOMS, and MSx. There are many different ways the

DSM2190F4 can be configured and used depending on system requirements. One convenient way is to combine the function of t he the

BMS signal. Doing this allows the DS P core t o

MSx signals into

access DSM memory at runtime even after the boot process is complete using only the nal. Comb ining

MSx and BMS consumes less I/O

pin(s) on the DMS device. See Analog Devices ADSP-2191 DSP Hardware Reference Manual, Chapter 7, Code Example: BMS Runtime Access. Alternatively, any of the

MSx signals may also be

used to decode any of the sectors of DSM Main Flash or Secondary flash memories.

Main Flash Memory

The 2M bit (256K x 8) Flash memory is divided into eight equally-sized 32 K byte s ect ors t hat are i ndividually selectable through the Decode PLD. Each Flash memory sector can be located at any address as defined by the user with PSDsoft Express. DSP code and data is easily placed in flash memory using the P SDsoft Express software development tool.

Secondary Flash Memory

The 256K bit (32K x 8) Flash memory is divided into eight equally-sized 8K byte sectors that are individually selectable through the Decode PLD. Each Flash memory sector can be located at any address as defined by the user with PSDsoft Express. DSP code and data can also be placed Secondary Flash memory using the PSDsoft Express development tool.

Secondary flash memory is good for storing dat a because of its small sectors. Additionally, software EEPROM em ulation techniques can be used for small data sets that change frequently on a byteby-byte basis.

Secondary flash may also be used to store custom

start-up code for applications that do not “boot” using DMA, but instead start executing code from external memory upon reset. Storing code here can keep the entire Main Flash free of initialization code for clean software partitioning. If only on e or more 8K byte sectors are needed for start-up code, the remaining sectors of Secondary Flash may be used for data storage.

BMS,

BMS sig-

Secondary Flash may also be used as an extension to Main Flash memory producing a total of 288K bytes

Miscellaneous: Main and Secondary Flash memories are totally independent, allowing concurrent operation if needed. The DSP can read from one memory while erasing or programming the other. The DSP can erase Flash memories by individual sectors or the entire Flash memory array may be erased at one time. Each sector in either Flash memory may be individually write protected, blocking any writes from the DSP (good for boot and start-up code protection). The Flash memories automatically go to standby between DSP read or write accesses to conserve power. Maximum access times include sector decoding time. Maximum erase cycles is 100K and data retention is 15 years minimum. Flash memory, as well as the entire DSM device may be programmed with the JTAG ISP interface with no DSP involvement.

Programm a b le Logic (PLD s)

The DSM family contains two PLDS that m ay optionally run in Turbo or Non-Turbo mode. PLDs operate faster (less propagation delay) while in Turbo mode but consume more power than NonTurbo mode. Non-Turbo mode allows the PLDs to automatically go to standby when no inputs are change to conserve power. The Turbo mode setting is controlled at runtime by DSP software.

Decode PLD (DPLD). This is programmable logic used to select one of the eigh t individual Main Flash memory segments, one of four individual Secondary Flash memory segments, or the group of control registers within the DSM device. The DPLD can also optionally drive external chip select signals on Port D pins. DPLD input signals include: DSP address and control signals, Page Register outputs, DSM Port Pins, CPLD logic feedback.

Complex PLD (CPLD). This programmable logic is used to c reate bo th combinatorial and sequential general purpose logic. The C PLD contains 16 Output Macrocells (OMCs) and 16 Input Macrocells (IMCs). PSD Macrocell registers a re unique in that that have direct connection to the DSP data bus allowing them to be loaded and read directly by the DSP at runtime. This di rect access is g ood for making small peripheral devices (shifters, counters, state machines, etc.) that are accessed directly by the DSP with little overhead. DPLD inputs include DSP address and control signals, Page Register outputs, DSM Port Pins, and CPLD feedback.

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Page 7

Figure 5. Block Diagram

DSM2190F4

SECURITY

LOCK

DSP

ADDR

AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD8 AD9

AD10 AD11 AD12 AD13 AD14 AD15

PD0 PD1 PD2

DSP

CONTROL

CNTL0 CNTL1 CNTL2 PC2

RST\

INTERNAL ADDR, DATA, CONTROL BUS LINKED TO DSP

MAIN FLASH MEMORY

PAGE REG

DECODE PLD

(DPLD)

EXTERNAL

CHIP SELEC T S

COMPL EX PLD

PLD INPUT BUS

PIN FEEDBACK NODE FEED BACK

(CPLD)

ARRAY

AND

FS0-7

CSBOOT0-3

CSIOP

EXTERNAL CHIP SELECTS, ESC0-2

ABA

BCBCBCBCBCBCBCB

16 Output Macrocells

BBB CCCCBCBCBCBC

fs7

fs0

8 SEGMENTS, 32 KB

256 KBytes TOTAL

2nd FLASH MEMORY

csboot3

csboot0

4 SEGMEN T S, 8 KB

32 KBytes TOTAL

RUNTIME CONTROL

CSIOP REGISTER FILE

POWER MANAGEMENT

ABABABABABA

16 Input

Macrocell

JTAG-ISP

TO ALL AREAS

OF CHIP

ALLO-

CATOR

DSM2190F4

DSP SYS T EM

MEMORY

DSP

DATA

PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7

I/O PORT

PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7

I/O PORT

PC0 PC1

PC3 PC4 PC5 PC6

PC7

OMCs: The general structure of the CPLD is similar in nature to a 22V10 PLD device wit h t he familiar sum-of-products (AND-OR) construct. True and compliment versions of 64 input signals are available to a large AND array. AND array outputs feed into a multiple product-term O R gate within each OMC (up to 10 product-terms for each OMC). Logic output of the OR gate can be passed on as combinatorial logic or combined with a flipflop within in each OMC to realize sequential logic. OMCs can be used a s a buried nodes with feedback to the AND array or OMC output can be routed to pins on Port B or PortC.

IMCs: Inputs from pins on Port B or Port C are routed to IMCs for conditioning (clocking or latching) as they enter the chip, which is good for sampling and debouncing inputs. Alternatively, IMCs can pass Port input signals directly to P LD inputs without clocking or latching. The DSP may read the IMCs at any time.

AI04960B

Runtime Control Registers

A block of 256 byt es is decoded inside the DSM device as DSM control and status registers. 27 registers are used in the block of 256 locations to control the output state of I/O pins, to read I/O pins, to control p ower managem ent, to read /write macrocells, and other functions at runtime. See Table 4 for description. The base address of these 256 locations is referred to in this data sheet as

csiop

(Chip Select I/O Port). Individual registers

within this block are accessed with an offset from

csiop

the base address. The DSP accesses ters using I/O memory with the

IOMS strobe.

regis-

csiop

registers are accessed as bytes.

Memory Page Register

This 8-bit register can be l oaded and read b y the

csiop

DSP at runtime as one of the

registers. Its outputs feed directly into the PLDs. The page register can be used for special memory mapping requirements and also for general logic.

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Page 8

DSM2190F4

I/O Po r t s

The DSM has 19 individually configurable I/O pins distributed over the three ports (Ports B, C, and D). Each I/O pin can be individually configured for different functions such as standard MCU I/O p orts or PLD I/O on a pin by pin basis. (MCU I/O means that for each pin, its output state can be controlled or its input value can be read by the DSP at runt-

csiop

ime using the

registers like an MCU would

do.) Port C hosts the JTAG ISP signals. Sinc e JTAG-

ISP does not occur frequently during the life of a product, those Port C pins are under-utilized. In applications that need every I/O pin, JTAG signals can be multiplexed with general I/O signals to use them for I/O when not performing ISP. See section

titled “Programming In-Circuit using JTAG ISP” on page 40 for muxing JTAG pins on Port C, and Application Note

The static configuration of all Port pins is d efined with the PSDsoft Express

AN1153

software development tool. The dynami c ac tion of th e P orts p ins is controlled by DSP runtime software.

JTAG ISP Port

In-System Programming (ISP) can be pe rformed through the JTAG signals on Port C. This serial interface allows programming of the entire DSM device or subsections (that is, only Flash memory but not the PLDs) without the participation of the DSP. A blank DSM device soldered to a circuit board can be completely programmed i n 10 to 25 seconds. The basic JTAG signals; TMS, TCK, TDI, and TDO form the IEEE-1149.1 interface. The DSM device does not implement the IEEE-1149.1 Boundary Scan functions. The DSM uses the JTAG interface for ISP only. However, the DSM device can reside i n a standard JTAG chain with other JTAG devices (including the ADSP-2191) and it will remain in BYPASS mode while other devices perform Boundary Scan.

ISP programming time can be reduced as much as 30% by using two more signals on Port C, TSTAT and TERR

in addition to TMS, TCK, TDI and TDO.

The FlashLINK

JTAG programming cable is

available from STMicroelectronics for $59USD and PSDsoft Express software is available at no charge from

www.st.com/psm

. That is all that is needed to program a DSM device using the parallel port on any PC or note-book. See section titled “Programming In-Circuit using JTAG ISP” on page

40.

Power Management

csiop

The DSM has bits in

control registers that are configured at run -time by the DSP to reduce power consumption of the CPLD. The Turbo bit in the PMMR0 register can be set to logic 1 and the CPLD will go to Non-Turbo mode, meaning it will latch its outputs and go to sleep until the next transition on its inputs. There is a slight penalty in PLD performance (longer propagation delay), but significant power savings are realized.

Additionally, bits in two

csio p

registers can be set by the DSP to selectively block signals from entering the CPLD which reduces power consumption. See section titled “Power Management” on page

37.

Security and NVM Sector Protection

Additionally, the content s of ea ch in dividual F lash memory sector can be write protected (sector protection) by configuration with PSDsoft Express

This is typically used to protect DSP boot code from being corrupted by inadvertent writes to Flash memory from the DSP.

Pin Assign m ent s

Pin assignment are shown for the 52-pin PLCC package in F igure 3, and the 5 2-pin PQFP package in Figure 4.

8/61

Page 9

Table 3. Pin Description

Pin Name Type Description

ADIO0-15 In Sixteen address inputs from the DSP.

DSM2190F4

CNTL0 In Active low write strobe input (WR CNTL1 In Active low read strobe input (RD CNTL2 In Active low Byte Memory Select (BMS

Reset

PA0-7 I/O Eight data bus signals connected to DSP pins D8 - D15.

PB0-7 I/O

PC0-7 I/O

PD0-2 I/O

GND Ground pins

Active low reset input from system. Resets DSM I/O Ports, Page Register contents, and other

DSM configuration registers. Must be logic Low at Power-up.

Eight configurable Port B signals with the following functions:

1. MCU I/O – DSP may write or read pins directly at runtime with csiop registers.

2. CPLD Output Macrocell (McellAB0-7 or McellBC0-7) outputs.

3. Inputs to the PLDs (Input Macrocells).

Note: Each of the four Port B signals PB0-PB3 may be configured at run-time as either standard

CMOS or for high slew rate. Each of the four Port B signals PB3-PB7 may be configured at run-time as either standard CMOS or Open Drain Outputs.

Eight configurable Port C signals with the following functions:

1. MCU I/O – DSP may write or read pins directly at runtime with csiop registers.

2. CPLD Output Macrocell (McellBC0-7) output.

3. Input to the PLDs (Input Macrocells).

4. Pins PC0, PC1, PC5, and PC6 can optionally form the JTAG IEEE-1149.1 ISP serial interface as signals TMS, TCK, TDI, and TDO respectively.

5. Pins PC3 and PC4 can optionally form the enhanced JTAG signals TSTAT and TERR respectively. Reduces ISP programming time by up to 30% when used in addition to the standard four JTAG signals: TDI, TDO, TMS, TCK.

6. Pin PC3 can optionally be configured as the Ready/Busy output to indicate Flash memory programming status during parallel programming. May be polled by DSP or used as DSP interrupt to indicate when Flash memory byte programming or erase operations are complete.

Note 1: Port C pin PC2 input (or any PLD input pin) can be connected to the DSP IOMS Note 2: When used as general I/O, each of the eight Port C signals may be configured at run-time Note 3: The JTAG ISP pins may be multiplexed with other I/O functions.

Three configurable Port D signals with the following functions:

Note 1: Port D pin PD0 (or any PLD input pin) can be connected to the DSP A16 output. See Note 2: Port D pin PD1 (or any PLD input pin) can be connected to the DSP A17 output. See Note 3: Port D pin PD2 (or any PLD input pin) can be connected to the DSP A18 output. See

Supply Voltage

See Figure 6.

as either standard CMOS or Open Drain Outputs.

1. MCU I/O – DSP may write or read pins directly at runtime with csiop registers.

2. Input to the PLDs (no associated Input Macrocells, routes directly into PLDs).

3. CPLD output (External Chip Select). Does not consume Output Macrocells.

4. Pin PD1 can optionally be configured as CLKIN, a common clock input to PLD.

5. Pin PD2 can optionally be configured as CSI memory. Flash memory is disabled to conserve more power when CSI connect CSI

Figure 6 Figure 6. Figure 6

to ADSP-218X PWDACK output signal.

) from the DSP

) from the DSP.

) signal from the DSP.

, an active low Chip Select Input to select Flash

output.

is logic high. Can

9/61

Page 10

DSM2190F4

TYPICAL CONNECTIONS

Figure 6 shows a typical connection scheme. Many connection possibilities exist since many DSM pins are multipurpose. This scheme illustrates the use of a com bined function (functions as

BMS and MSx), and many I/O pins. It

also illustrates how to chain the DSM and DSP devices together on the JTAG bus. The J TAG connector definition depends on development and production environment requi reme nts. A s pe cially defined connector can be devised to combine the signals of the FlashLINK and the Analog Devices emulator. Alternatively, two separate JTAG connectors can be used, one matching the pin out of FlashLINK and the other matching the emulator pinout.

Keep in mind that signals

BMS, IOMS, MSx,

ADDR16, ADDR17, ADDR18 can be connected to any DSM pin t hat is a PLD input. I /O pins on Po rt B and Port C are m ore capable (more PLD functions) than Port D pins. It is recommended to use Port D pins primarily for decode inputs first, leaving pins on Port B and Port C available for general

BSM signal

logic. Figure 6 illustrates a com mon way to m ake connections.

Following are connection options to consider: Port C JTAG: Figure 6 shows four JTAG signals

(TMS, TCK, TDI, TDO) connected to the DSM. Alternatively, using six-pin JTAG (two m ore signal s, TSTAT and

TERR) can reduce ISP time by as

much as 30% compared to four-pin JTAG. Other JTAG options include multiplexing JTAG pins with

general I/O (see “Programming In-Circuit using JTAG ISP” on page 40 and Application Note

AN1153

), or not using J TAG at all. If no JTAG is used, the DSM device has to be programmed on a conventional programmer before it is installed on the circuit board. Using no JTAG makes more DSM I/O available.

Pins PC2 and PD2. If not all 288K a ddress locations need to be decoded in the DSM, then ADDR18 on pin P D2 is n ot needed. In t his case,

IOMS signal can be connected to pin PD2, free-

the ing pin PC2 for general I/O usage.

10/61

Page 11

Figure 6. Typical Connections

DSM2190F4

PA0

PA1

PA2

PA3

PA4

I/O

PB0

PA5

I/O

PB1

PA6

I/O

PB2

PA7

I/O

PB3

PB4

CNTL0

I/O

CNTL1

I/O

PB6

PB5

CNTL2

PC2

I/O

PB7

CONNECTOR

DSM JTAG

VCC

JTAG_TDI

10k ohm

33 ohm

I/O

PC7

PC3

PC4

ADIO0

ADIO1

ADIO2

ADIO3

ADIO4

optional _TERR

optional TSTAT

TMS

TCK

TDI

TDO

PC1

PC0

PC6

PC5

ADIO5

ADIO6

ADIO7

ADIO8

ADIO9

ADIO10

ADIO11

ADIO12

ADIO13

ADIO14

ADIO15

PD1

PD2

PD0

_RESET

DSP JTAG

JTAG_TMS

JTAG_TCK

JTAG_TDO

CONNECTOR

AI04961B

JTAG_TRST

EMULATOR STATUS

33 ohm

DATA1

DATA0

D0D1D2

_BR

BUS_REQUEST

DATA4

DATA2

DATA3

D3D4D5D6D7

ADSP-2191

_BG

_BGH

GRANT_HUNG

BUS_GRANT

DATA6

DATA5

CLKOUT

BYPASS

CLOCK OUT

PLL BYPASS

READ

WRITE

DATA7

I/O MEM SELECT

BOOT MEM SELECT

_RD

_WR

_MSx

_BMS

_IOM S

ADDR1

ADDR0

ADDR2

A0A1A2A3A4A5A6A7A8

ACK

ADDR4

ADDR6

ADDR8

ADDR10

ADDR3

ADDR5

ADDR7

ADDR13

ADDR9

ADDR11

ADDR12

ADDR14

ADDR15

ADDR16

ADDR17

ADDR18

RESET

A12

A13

A14

A15

A18

A16

A10

A11

A17

_RESET

CLKIN

XTAL

PF1

PF2

PF3

PF0

I/O

XTAL

CLOCK or

PF8

PF9

PF6

PF10

PF7

PF4

PF5

I/O

PF11

PF12

PF13

PF14

PF15

SPORT0

SERIAL CHN

I/O

SERIAL

DEVICE

SPORT1

SERIAL CHN

DEVICE

SERIAL CHN

SERIAL

DEVICE

SPORT1

SERIAL

RxD, TxD

UART

DEVICE

JTAG TDI

TDI

JTAG TDO

TDO

TIMER/

JTAG TCK

TCK

TMR2-0

CAPTURE

JTAG _TRST

JTAG TMS

EMULATOR STATUS

TMS

_EMU

_TRST

BMODE0

BMODE1

OPMODE

HOST

PORT

11/61

Page 12

DSM2190F4

TYPICAL MEMORY MAP

There many different ways to plac e (or map) the addresses of DSM memory and I/O depending on system requirements. The DP LD al lows com plete mapping flexibility. Figure 7 shows one possible system memory map. In this case, the DSP will bootload (via DMA) the contents of Main Flash memory upon reset. The Secondary Flash memory can be used for parameter storage or additional code storage. BMS and MS x are conf igured in the DSP to be combined into the the DSP to access both Flash memories at runtime (after DMA boot). The DSP may execute code

BMS signal, allowing

directly from the DSM and well as erase and write new code or data to DSM Flash.

The nomenclature

fs0..f s 7

are designators f or the individual sectors of Main Flash memory, 32K bytes each.

csboot0..csboot3

are designators for the individual Secondary Flash memory segments, 8K bytes each.

csiop

designates the DSM

control register block. The designer may easily specify memory mapping

in a point-and-click software environment using PSDsoft Express

12/61

Page 13

Figure 7. Typ ic a l Sy st em Mem ory Map

DSM2190F4

56000-57FFF 54000-55FFF 52000-53FFF 50000-51FFF

4FFFF

48000

47FFF

40000

3FFFF

38000

37FFF

30000

2FFFF

28000

27FFF

20000

1FFFF

18000

17FFF

10000

DSP Boot Memory

Space (BMS)

csboot

, 8KB 2nd Flash

csboot

, 8KB 2nd Flash

csboot

, 8KB 2nd Flash

csboot

, 8KB 2nd Flash

fs7

32K bytes Main Flash

fs6

32K bytes Main Flash

fs5

32K bytes Main Flash

fs4

32K bytes Main Flash

fs3

32K bytes Main Flash

fs2

32K bytes Main Flash

fs1

32K bytes Main Flash

fs0

32K bytes Main Flash

DSP I/O Memor y

Space (IOMS)

csiop

256 CONTROL REGS

02000-020FF

AI04962

13/61

Page 14

DSM2190F4

SPECIFYING THE MEMORY MAP WITH PSDSOFT EXPRESS

The memory map shown in Figure 7 can be easily implemented using PSDsoft Express and-click environment. PSDsoft Express

in a point-

will

statemen ts of the ABEL language. Figure 8 shows the resulting equations generated by PSDsoft ExpressTM.

generate Hardware Definition Language (HDL)

Figure 8. HDL Statements Generated from PSDsoft Express to Implement Memory M ap

csiop = ((address >= ^h2000) & (address <= ^h20FF) & (!_ioms)); fs0 = ((address >= ^h10000) & (address <= ^h17FFF) & (!_bms)); fs1 = ((address >= ^h18000) & (address <= ^h1FFFF) & (!_bms)); fs2 = ((address >= ^h20000) & (address <= ^h27FFF) & (!_bms)); fs3 = ((address >= ^h28000) & (address <= ^h2FFFF) & (!_bms)); fs4 = ((address >= ^h30000) & (address <= ^h37FFF) & (!_bms)); fs5 = ((address >= ^h38000) & (address <= ^h3FFFF) & (!_bms)); fs6 = ((address >= ^h40000) & (address <= ^h47FFF) & (!_bms)); fs7 = ((address >= ^h48000) & (address <= ^h4FFFF) & (!_bms)); csboot0 = ((address >= ^h50000) & (address <= ^h51FFF) & (!_bms)); csboot1 = ((address >= ^h52000) & (address <= ^h53FFF) & (!_bms)); csboot2 = ((address >= ^h54000) & (address <= ^h55FFF) & (!_bms)); csboot3 = ((address >= ^h56000) & (address <= ^h57FFF) & (!_bms));

Specifying these equations using PSDsoft Ex-

press

is very simple. Figure 9 shows how to

specify the equation for the 32K Byt e Fl ash mem-

fs2

ory se gment,

. Notice

fs2

is qualified with the

signals

BMS. This specif ication proces s is repeat-

ed for all other Flash memory segments, the register block, and any external chip select signals that may be needed (ADC, etc.).

csiop

Figure 9. PSDsoft Express

Memory Mapping

14/61

Page 15

RUNTIME CONTROL REGISTER DEFINITION

There are up to 256 addresses decoded inside the DSM device for control and status information. 27 of these locations contain registers that the DSP can access at runtime. The base address of this block of 256 locations is referred to in this manual as

csiop

(Chip Select I/O Port). Table 4 lists the 27

registers and their offsets (in hexadecimal) from

csiop

the

base address needed t o acc ess in dividual DSM control and status registers. The DSP will access these registers in I/O memory space using

DSM2190F4

its

IOMS strobe. These regis ters are accesses in

bytes, so the DSP should ignore the upper byte of its 16-bit I/O access.

Note1: All reset.

Note2: Do not write to unused locations within the

csiop

logic zero.

csiop

registers are cleared to logic 0 at

block of 256 registers. They should remain

Table 4.

Data In 01 10 11

Data Out 05 12 13

Direction 07 14 15

Drive Select 09 16 17

Input Macrocells 0B 18 Read to obtain state of IMCs. No writes.

Enable Out 0D 1A 1B

Output Macrocells AB 20

Output Macrocells BC 21

Mask Macrocells AB 22

Mask Macrocells BC 23

CSIOP

Registers and their Offsets (in hexadecimal)

MCUI/O input mode. Read to obtain current logic level of Port pins. No writes.

MCU I/O output mode. Write to set logic level on Port pins. Read to check status.

MCU I/O mode. Configures Port pin as input or output. Write to set direction of Port pins. Logic 1 = out, Logic 0 = in. Read to check status.

Write to configure Port pins as either standard CMOS or Open Drain on some pins, while selecting high slew rate on other pins. Read to check status.

Read to obtain the status of the output enable logic on each I/O Port driver. No writes.

Read to get logic state of output of OMC bank AB. Write to load registers of OMC bank AB.

Read to get logic state of output of OMC bank BC. Write to load registers of OMC bank BC.

Write to set mask for loading OMCs in bank AB. A logic 1 in a bit position will block reads/writes of the corresponding OMC. A logic 0 will pass OMC value. Read to check status.

Write to set mask for loading OMCs in bank BC. A logic 1 in a bit position will block reads/writes of the corresponding OMC. A logic 0 will pass OMC value. Read to check status.

Main Flash Sector Protection

Security Bit and Secondary Flash Sector Protection

JTAG Enable C7

PMMR0 B0 Power Management Register 0. Write and read. PMMR2 B4 Power Management Register 2. Write and read. Page E0 Memory Page Register. Write and read.

Read to determine Main Flash Sector Protection

Setting. No writes. Read to determine if DSM devices Security Bit is active.

Logic 1 = device secured.

Also read to determine Secondary Flash Protection Setting status. No Writes.

Write to enable JTAG Pins (optional feature). Read to check status.

15/61

Page 16

DSM2190F4

DETAILED OPERATION

Figure 5 shows major functional areas of the device :

■ Flash Memories

■ PLDs (DPLD, CPLD, Page Register)

■ DSP Bus Interface (Address, Data, Control)

■ I/O Por ts

■ Runtime Control Registers

■ JTAG ISP Interface

The following describes these functions in more detail.

Flash Memories

The Main Flash memory array is divided into eight equal 32K byte sectors. The Secondary Flash memory array is divided into four equ al 8K byte sectors. Each sector is selected by the DPLD can be separately protected from program and erase cycles. This configuration is specified by using PSDsoft Express

Memory Sector Select Signals. The DPLD generates the Select signals for all the internal memory blocks (see Figure 14). Each of the twelve sectors of the Flash mem ories has a sel ec t signal

FS0-FS7, or CSBOOT0-CSBOOT3

( tains up to three product terms. Having t hree product terms for each select signal allows a given sector to be mapped into multiple ar e as of system memory if needed.

Ready/Busy

output the Ready/ output on Ready/ Flash memory array is being written, ther Flash memory array is being erased. The output is a 1 (Ready) wh en no Write o r Erase cycle is

) which con-

(PC3 ). This signal can be used to

Busy status of the device. The

Busy is a 0 (Busy) when either

when ei-

in progress. This signal may be polled by the DSP or used as a DSP interrupt to indicate when an erase or program cycle is complete.

Memory Operation. The Flash memories are accessed through the DSP Address, Data, and Control Bus Interface.

DSPs and MCUs cannot write to Flash memory as it would an SRAM device. Flash memory must first

be “unlocked” with a special sequence of byte write operations to invoke an internal algorithm, then a single data byte is written to the Flash memory array, then programming status is chec ked by a byte read operation or by checking the Ready/

Busy pin (PC3). Table 5 lists all of the special in-

struction sequences to program (write) data to the Flash memory arrays, erase the arrays, and check for different types of status from the arrays. These instruction sequences are different combinations of individual byte write and byte read operations. IMPORTANT: The DSP may not read and execute code from the same Flash memory array for which it is directing an instruction sequence. Or more simply stated, the DSP may not read code the same Flash array that is writing or erasing. Instead, the DSP must execute code from an alternate memory (like its own internal SRAM or a different Flash array) while sending instructions to a given Flash array. Since the two Flash memory arrays inside the DSM device are completely independent, the DSP may read code from one array while sending instructions to the other.

After a Flash memo ry array is programmed (written) it will go to “Read Array” mo de, then th e DSP can read from Flash mem ory just as if would from any 8-bit ROM or SRAM device.

16/61

Page 17

DSM2190F4

Table 5. Instruction Sequences

Instruction

Sequence

Cycle 1 Cycle 2 Cycle 3 Cycle 4 Cycle 5 Cycle 6 Cycle 7

1,2,3,4

Read byte

Read Memory Contents

from any valid Flash memory addr

Read Flash Identifier (Main

Flash only)

6,7

Read Memory Sector Protection

6,7,8

Status

Program a Flash Byte

Flash Bulk Erase

Flash Sector

Erase

Write AAh to XX555h

Write AAh to

XX555h

Write AAh to XX555h

Write 55h to XXAAAh

Write 90h to XX555h

Write A0h to XX555h

Write 80h to XX555h

Read identifier with addr lines A6,A1,A0 = 0,0,1

Read identifier with addr lines A6,A1,A0 = 0,1,0

Write (program) data to addr

Write AAh to XX555h

Write 55h to XXAAAh

Write 10h to XX555h

Write 30h to another Sector

Write B0h to

Suspend Sector

Erase

address that activates any of FS0 - FS7

Write 30h to

Resume Sector

Erase

addr that activates any of FS0 - FS7

Write F0h to

Reset Flash

address that activates any of FS0 - FS7

Note: 1. All val ues are in hexadecimal, X = Don’t Care

2. A d esired int ernal Flash memory sec tor select signal (FS0 - F S 7 or CSBOO T 0 - CSBOOT3 ) m ust be acti ve for each write or read cycle. Only one of these sector select signals will be active at any given time depending on the address presented by the DSP and the memory mapping defi ned in PSDs oft Express. FS0 - FS7 and CSBOOT0- CS BOOT3 are act i ve high logic internal l y.

3. DS P addres ses A18 thr ough A12 ar e Don’t Care during t he instruc tion sequ ence de coding . Only addre ss bits A 11-A0 are used during Fl ash memo ry instructio n sequence decoding b us cycles . The individ ual sector select sign al (FS0 - F S7 or CSB OOT0CSBOOT3) which is active during the instruction sequences determines the complete address.

4. For write operations, addresses are latched on the falling edge of Write Strobe (WR Write Strobe (WR

5. No Unlock or In st ruction cycl es are required when the device is in the Read Arr ay mode. Operation is like reading a ROM device.

6. The Reset Flash instruction is required to return to the normal Read Array mode if the Error Flag (DQ5) bit goes High, or after reading the Flash I dentifier or after read i ng t he Sector Protection Status.

7. The DSP cannot invoke this instruction sequence while executing code from the same Flash memory as that for which the instruction sequence is intended. The DSP must fetch, for example, the code from the DSP SRAM when reading the Flash memory Identifier or Sector Protection Status.

8. The da ta is 00h for an unprote cted sector, and 01h for a pr otected sec tor. In the fo urth cycle, th e Sector Sele ct is active, and (A1,A0)= (1,0)

9. Di recting this comma nd to any in dividua l active Flash memory seg ment (FS 0 - FS7) will invoke th e bulk era se of all eight Flash memory sectors.

10. DS P wr ites c omma nd s eque n ce t o init ial s egme nt t o be erase d, t hen wr ite s the byte 30h to ad diti onal sect ors to b e er ased . Th e byte 30h must be addressed to one of the other Flash memory segments (FS0 - FS7) for each additional segment (write 30h to any address within a desir ed sector). No more than 80uS can elaps e between su bsequent additional sector erase commands .

11. The s y stem ma y perfo rm R ead an d P rogra m c ycl es in n on- erasi ng s ecto rs, read t he Flas h ID o r read t he Se ctor Protec t S tatu s, when in the Suspend Sector Erase mode. The Suspend Sector Erase instruction sequence is valid only during a Sector Erase cycle.

12. The Resume Sector Erase instru ction sequence is valid only during the Suspend Sector Erase mode.

, CNTL0)

, CNTL0), Dat a i s latched on the risin g e dge of

17/61

Page 18

DSM2190F4

Instruction Sequences

An instruction sequence consists of a sequence of specific write or read operations. Each byte written to the device is received and sequentially decoded and not executed as a standard write operation to the memory array. The instruction sequence is executed when the correct number of bytes are properly received and the time between two consecutive bytes is shorter than the time-out period. Some instruction sequences are structured to include read operations after the initial write operations.

The instruction sequence must be followed exac tly. Any in valid com binatio n of ins truction bytes o r time-out between two consecutive bytes while addressing Flash memory resets the device logic into Read Array mode (Flash memory is read like a ROM device). The device s upports the instruction sequences summarized in Table 5:

Flash memory:

■ Erase memory by chip or sector

■ Suspend or resume sector erase

■ Program a Byte

■ Reset to Read Array mode

■ Read primary Flash Identifier value

■ Read Sector Protection Status

These instruction sequences are detailed in Table

5. For efficient decoding of the instruction sequences, the first two bytes of an i nstruction sequence are the coded cycles and are followed by an instruction byte or confirmation byte. The coded cycles consist of writing the data AAh to address XX555h during the first cycle and data 55h to address XXAAAh during the second cycle. Address

signals A18-A12 are Don’t Care during the instruction sequence Write cycles. However, the appropriate internal Sector Select (

CSBOOT0-CSBOOT3

) must be selected internal-

FS0-FS7 or

ly (active, which is logic 1).

Reading Flash Memory

Under typical conditions, the D SP may read the Flash memory using read operations just as it would a ROM or RAM device. Alternately, the DSP may use read operations to obtain status information about a Program or Erase cycle that is currently in progress. Lastly, the DSP may use instruction sequences to read special data from these memory blocks. The following sections describe these read instruction sequences.

Read Memory Contents. Flash memory is placed in the Read Array mode after Power-up, chip reset, or a Reset Flash memory instruction sequence (see Table 5). The DSP can read the memory contents of the Flash memory by using read operations any time the read operation is not part of an instruction sequence.

Read Main Flash Identifier. The Main Flash memory identifier is read with an instruction sequence composed of 4 operations: 3 specific write operations and a read operation (see Table 5). During the read operation, address bits A6, A1, and A0 must be 0,0,1, respectively, and the appropriate internal Sector Select (

FS0-FS7

) must be active. The identifier is 0xE7. Not Applicable to Secondary Flash.

Read Memory Sector Protection Status. The Flash memory Sector Protection Status is read with an instruction sequence composed of 4 operations: 3 specific write operations and a read operation (see Table 5). During the read operation, address bits A6, A1, and A0 must be 0,1,0, respectively, while internal Sector Sele ct (FS0-FS7 or CSBOOT0-CSBOOT3) designates the Flash memory sector whose protection has to be verified. The read operation produces 01h if the Flash memory sector is protected, or 00h if th e sector is not protected.

The sector protection status can also be read by the DSP accessing the Flash memory Prot ection

csiop

registers in

space. See the section ent itled “Flash Memory Sector Protect” for register definitions .

Table 6. Status Bit Definition

Functional Block

Flash Memory

Note: 1. X = Not guaranteed value, can be rea d ei t her 1 or 0.

2. DQ7-DQ0 represent the Data Bus bits, D7-D0.

FS0-FS7, or

CSBOOT0-CSBOOT3

Active (the desired

segment is selected)

DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0

Data

Polling

Reading the Erase/Program Status Bits. The device provides several status bits to be used by the DSP to confirm the completion of an Erase or

18/61

Toggle

Flag

Error

Flag

Erase

Time-

out

XXX

Program cycle of Flash memory. These st atus bits minimize the time that the DSP spends performing these tasks and are defined in Table 6. The status bits can be read as many times as needed.

Page 19

DSM2190F4

For Flash memory, the DS P can perform a read operation to obtain these status bits while an Erase or Program instruction sequence is being executed by the embedded algorithm. See the

section entitled “Programming Flash Memory”, on page 19, for details.

Data Polling Flag (DQ7). When erasing or programming in Flash memory, the Data Polling Flag (DQ7) bit outputs the co mplem ent of the bit bei ng entered for programming/writing on the Data P olling Flag (DQ7) bit. Once the Program instruction sequence or the write operation is c ompleted, t he true logic value is read on the Data Polling Flag (DQ7) bit (in a read operation).

Flash memory instruction features.

■ Data Polling is effective after the fourth Write

pulse (for a Program instruction sequence) or after the sixth Write pulse (for an Erase instruction sequence). It must be performed at the address being programmed or at an address within the Flash memory sector being erased.

■ During an Erase cycle, the Data Polling Flag

(DQ7) bit outputs a 0. After completion of the cycle, the Data Polling Flag (DQ7) bit outputs the last bit programmed (it is a 1 after erasing).

■ If the byte to be programmed is in a protected

Flash memory sector, the instruction sequence is ignored.

■ If all the Flash memory sectors to be erased are

protected, the Data Polling Flag (DQ7) bit is reset to 0 for about 100 µs, and then returns to the previous addressed byte. No erasure is performed.

Toggle Flag ( DQ6 ). The device offers another way for determining when t he F lash memory Program cycle is completed. During the in ternal write operation and when the Sector Select FS0-FS7 (or CSBOOT0-CSBOOT3) is true, the Toggle Flag (DQ6) bit toggles from 0 to 1 and 1 to 0 on subsequent attempts to read any byte of the memory.

When the internal cycle is complete, the toggling stops and the data read on the Data Bus D0-7 is the addressed mem ory byte. The device is now accessible for a new read or write operation. The cycle is finished when two successive reads yield the same output data. Flash m emo ry spe cific features:

■ The Toggle Flag (DQ6) bit is effective after the

fourth write operation (for a Program instruction sequence) or after the sixth write operation (for an Erase instruction sequence).

■ If the byte to be programmed belongs to a

protected Flash memory sector, the instruction sequence is ignored.

■ If all the Flash memory sectors selected for

erasure are protected, the Toggle Flag (DQ6) bit toggles to 0 for about 100 µs and then returns to the previous addressed byte.

Error Flag (DQ5). During a normal Program or Erase cycle, the Error Flag (DQ5) bit is to 0. T his bit is set to 1 when there is a failure during Flash memory Byte Program, Sector Erase, or Bulk Erase cycle.

In the case of Flash memory programming, the Error Flag (DQ5) bit indicates the attempt to program a Flash memory bit from the programmed state, 0, to the erased state, 1, whi ch is not vali d. The Error Flag (DQ5) bit may also indicate a Time-out condition while attempting to program a byte.

In case of an error in a Flash memory Sector Erase or Byte Progra m cycle, the Fl ash memory sector i n which the error occurred or to which the programmed byte belongs must no longer be used. Other Flash memory sectors may still be used. The Error Flag (DQ5) bit is reset after a Reset Flash instruction sequence.

Erase Time-out Flag (DQ3). The Erase Timeout Flag (DQ3) bit reflects the time-out period allowed between two consecutive Sec tor Erase instruction sequence bytes. The Erase Time-out Flag (DQ3) bit is reset to 0 after a Sector Erase cycle for a time period of 100 µs + 20% unless an additional Sector Erase instruction sequence is decoded. After this time period, or when the additional Sector Erase instruction sequence is decoded, the Erase Time-out Flag (DQ3) bit is set to 1.

Programming Flash Memory

When a byte of Flash memory is programmed, individual bits a re p ro grammed to logic 0. You cannot program a bit in Flash memory to a logic 1 once it has b een programmed to a logic 0. A bit must be erased to logic 1, and programmed to logic 0. That means Flash memory must be erased prior to being programmed. A b yte o f Flash memory is erased to all 1s (FFh). The DSP may erase the entire Flash memory array all at once or individual sector-by-sector, but not byte-by-byte. However, the DSP may program Flash memory byte-by-byte.

The Flash memory requires the DSP to send an instruction sequence to program a byte or to erase sectors (see Table 5).

Once the DSP issues a Flash memory Program or Erase instruction sequence, it must check for the status bits for completion. The embedded algorithms that are invoked inside the device provide several ways give status to the DSP. Status may

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Page 20

DSM2190F4

be checked using any of three methods: Data Polling, Data Toggle, or Ready/Busy

(pin PC3).

Data Polling. Polling on the Data Polling Flag (DQ7) bit is a method of checking whether a Program or Erase cycle is in progress or has completed. Figure 10 shows the Data Polling algorithm.

When the DSP issues a Program instruction sequence, the embedded algorithm within the device begins. The DSP then reads the location of the byte to be programmed in Flash memory to check status. The Data Polling Flag (DQ7) bit of this location becomes the compliment of bit 7 of the original data byte to be programmed. The DSP continues to poll this location, comparing the Data Polling Flag (DQ7) bit and monitoring the Error Flag (DQ5) bit. When the Data Polling Flag (DQ7) bit matches bit7 of the original data, and the Error Flag (DQ5) bit remains 0, then the em bedded algorithm is complete. If the Error Flag (DQ5) bit is 1, the DSP should test the Data Polling Flag (DQ7) bit again since the Data Polling Flag (DQ7) bit may have changed simultaneously wi th the Error Flag (DQ5) bit (see Figure 10).

The Error Flag (DQ5) bit is set if either an internal time-out occurred while the embedded algorithm attempted to program the byte or if the DS P attempted to program a 1 to a bit that was not erased (not erased is logic 0).

It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed, to compare the byte that was written to the Flash memory with the byte that was intended to be written.

When using the Data Polling method during an Erase cycle, Figure 10 still applies. However, the Data Polling Flag (DQ7) bit is 0 until the Erase cycle is complete. A 1 on the Error Flag (DQ5) bit indicates a time-out condition on the Erase cycle, a 0 indicates no error. The DSP can read any location within the sector being erased to get the Data Polling Flag (DQ7) bit and the Error Flag (DQ5) bit.

PSDsoft Express generates ANSI C code functions which implement these Data Polling algorithms.

Figure 10. Data Polling Flowchart

START

READ DQ5 & DQ7

at VALID ADDRESS

DQ7

DATA

DQ5

READ DQ7

DQ7

DATA

FAIL PASS

= 1

YES

AI01369B

Data Toggle. Checking the Toggle Flag (DQ6) bit is a method o f det erm ining whether a P rogram or Erase cycle is in progress or has completed. Figure 11 shows the Data Toggle algorithm.

When the DSP issues a Program instruction sequence, the embedded algorithm within the device begins. The DSP then reads the location of the byte to be programmed in Flash memory to check status. The Toggle Flag (DQ6) bit of this location toggles each time the DSP reads this location until the embedded algorithm is complete. The DSP continues to read this location, check ing the Toggle Flag (DQ6) bit and monitoring the Error Flag (DQ5) bit. When the Toggle Flag (DQ6) bit stops toggling (two consecutive reads yield the same value), and the Error Flag (DQ5) bit remains 0, then the embedde d algorithm is complete. If the Error Flag (DQ5) bit is 1, the DSP should test the Toggle Flag (DQ6) bit again, since the Toggle Flag (DQ6) bit may have chan ged simultaneo usly with the Error Flag (DQ5) bit (see Figure 11).

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Page 21

DSM2190F4

Figure 11. Data Toggle Flowchart

START

READ

DQ5 & DQ6

DQ6

TOGGLE

DQ5

= 1

READ DQ6

DQ6

TOGGLE

FAIL PASS

YES

AI01370B

The Error Flag (DQ5) bit is set if either an internal time-out occurred while the embedded algorithm attempted to program the byte, or if the DSP attempted to program a 1 to a bit that was not erased (not erased is logic 0).

It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed, to compare the byte that was written to Flash memory with the byte that was intended to be written.

When using the Data Toggle method after an Erase cycle, Figure 11 still applies. the Toggle Flag (DQ6) bit toggles until the Erase cycle is complete. A 1 on the Error Flag (DQ5) bit indicates a time-out condition on the Erase cycle, a 0 indicates no error. The DSP can read any location within the sector being erased t o get the Toggle Flag (DQ6) bit and the Error Flag (DQ5) bit.

PSDsoft Express generates ANSI C code functions which implement these Data T oggling algorithms.

Erasing Flash Memory Flash Bulk Erase. The Flash Bulk Erase instruc-

tion sequence uses six write operations followed by a read o peration of the status regist er, as described in Table 5. If any byte of the Bulk Erase instruction sequence is wrong, the Bulk Erase instruction sequence aborts and the device is re-

set to the Read Flash memory status. The Bulk Erase command may be addresses to any one individual valid Flash memory segment (

CSBOOT0-CSBOOT3

) and the entire array (all

FS0-FS7 or

segments in one array) will be erased. During a Bulk Erase, the memory status may be

checked by reading the Error Flag (DQ5) bit, the Toggle Flag (DQ6) bi t, and the Dat a Polling Flag

(DQ7) bit, as detailed in the section entitled “Programming Flash Memory”, on page 19. The Error Flag (DQ5) bit returns a 1 if there has been an Erase Failure (maximum number of Erase cycles have been executed).

It is not necessary to program the memory with 00h because the device automatically does this before erasing to 0FFh.

During execution of the Bulk Erase instruction sequence, the Flash memory does not accept any instruction sequences.

The address provided with the Flash Bulk Er ase command sequence (Table 5) may select any one of the eight internal Flash memory Sector Select signals FS0 - FS7 or one of the four signals CSBOOT0-CSBOOT3. An erase of that entire Flash memory array will occur even though the command was sent to just one Flash memory sector.

Flash Sector Erase. The Sector Erase instruction sequence uses six write operations, as described in Table 5. Additional Flash Sector Erase codes and Flash memory sector addresses can be written subsequently to erase other Flash memory sectors in parallel, without further coded cycles, if the additional bytes are transmitted in a shorter time than the time-out period of about 100 µs. The input of a new Sector Erase code restarts the timeout period.

The status of the internal timer can be monitored through the level of the Erase Time-out Flag (DQ3) bit. If the Erase Time-out Flag (DQ3) bit i s 0, the Sector Erase instruction sequence has been received and the time-out p eriod is counting. If the Erase Time-out Flag (DQ3) bit is 1, the time-out period has expired and the device is busy erasing the Flash memory sector(s). Before and during Erase time-out, any instruction sequence other than Suspend Sector Erase an d Resume Sector Erase instruction sequences abort the cycle that is currently in progress, and reset the device to Read Array mode. It is not necessary to program the Flash memory sector with 00h as the device does this automatically before erasing (byte=FFh).

During a Sector Erase, the memory status may be checked by reading the Error Flag (DQ5) bit, the Toggle Flag (DQ6) bi t, and the Dat a Polling Flag (DQ7) bit, as detailed in the section entitled “Programming Flash Memory”, on page 19.

21/61

Page 22

DSM2190F4

During execution of the Erase cycle, the Flash memory accepts only Reset and Suspend Sector Erase instruction sequences. Erasure of one Flash memory sector may be suspended, in order to read data from anot her Flash memory sector, and then resumed.

The address provided with the initial Flash Sector Erase command sequence (Table 5) must select the first desired sector (FS0 - FS7 or CSBOOT0CSBOOT3) to erase. Subsequent sector erase commands that are appended on within the timeout period must be addressed to other desired segments (FS0 - FS7 or CSBOOT0-CSBOOT3).

Suspend Sector Erase. When a Sector Erase cycle is in progress, the Suspend Sector Erase instruction sequence can be used to suspend the cycle by writing 0B0h to any address when an appropriate Sector Select (FS0-FS7 or CSBOOT0CSBOOT3) is selected (See Table 5). This allows reading of data from another Flash memory sector after the Erase cycle has been sus pended. Suspend Sector Erase is accepted only during an Erase cycle and defaults to Read mode. A Suspend Sector Erase instruction sequence executed during an Erase time-out period, in addition to suspending the Erase cycle, terminat es the time out period.

The Toggle Flag (DQ6) bit stops toggling when the device internal logic is suspended. The status of this bit must be m onitored at an address within the Flash memory sector being erased. The Toggle

Flag (DQ6) bit stops toggling between 0.1 µs and 15 µs after the Susp end Sector Erase instruction sequence has been execut ed. The device i s then automatically set to Read mode.

If an Suspend Sector Erase instruction sequence was executed, the following rules apply:

– Attempting to read from a Flash memory sector

that was being erased outputs invalid data.

– Reading from a Flash memory sect or that was

not

being erased is valid.

cannot

– The Flash memory

be programmed, and only responds to Resume Sector Erase and Reset Flash instruction sequences (Read is an operation and is allowed).

– If a Reset Flash instruction sequence is re-

ceived, data in the Flash memory sector that was being erased is invalid.

Resume Sector Erase. If a Suspend Sector Erase instruction sequence was previously executed, the erase cycle may be resumed with this instruction sequence. The Resume Sector Erase instruction sequence consists of writing 030h to any address while an appropriate Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) is active. (See Table 5.)

Flash Memory Sector Protect.

Each Flash memory sector can be separately protected against Program and Erase cycles. Sector Protection provides additional data security because it di sables all Pr ogram o r Erase cycles. This mode can be activated through the JTAG Port or a Device Programmer. Sector protection can be selected for each sector using PSDsoft Express.

This automatically protects selected sectors when the device is programmed through the JTAG Port or a Device Programmer. Flash memory sectors can be unprotected to allow updating of their contents using the JTAG Port or a Device Programmer. The DSP can read (but cannot change) the sector protection bits.

Any attempt to program or erase a protected Flash memory sector is ignored by the device. The Verify operation results in a read of the protected data. This allows a guarantee of the retention of the Protection status.

The sector protection status ca n be read by the DSP through the Main Flash memory protection

csiop

block) as defined in Table 7, and Secondary Flash memory protection register in Table 8.

Table 7. Main Flash Memory Protection Register Definition

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Sec7_Prot Sec6_Prot Sec5_Prot Sec4_Prot Sec3_Prot Sec2_Prot Sec1_Prot Sec0_Prot

Note: Bit Definitio ns:

Sec_Prot 1 = Flash memory sector is write protected. Sec_Prot 0 = Flash memory sector is not wri te p rot ected.

Table 8. Secondary Flash Memory Protection/Security Bit Register Definition

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Security_Bit not used not used not used Sec3_Prot Sec2_Prot Sec1_Prot Sec0_Prot

Note: Securit y_Bit = 1, device is secu re d . Note: Sec_Prot 1 = Flash memory sector is write protected.

Sec_Prot 0 = Flash memory sector is not wri te p rot ected.

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Page 23

DSM2190F4

DSM Security Bit

A programmable security bit in the DSM protects its contents from unauthorized viewing and copying. When set, the security bit will block access of programming devices (JTAG or others) to the DSM Flash memory and PLD configuration. The only way to defeat the security bit is to erase the entire DSM device, after which the device is blank and may be used again. The DSP will always have access to Flash memory contents through the 8-bit data port even while the security bit is set. The DSP can read the status of the security bit (but it cannot change it) by rea ding the Device Se curity register in the

csiop

block as defined in Table 8.

Reset Flash

The Reset Flash instruction sequence resets the internal memory logic state machine and puts Flash memory into Read Array mode. It consists of one write cycle (see Table 5). It must be executed after:

– Reading the Flash Protection Status or Flash ID – An Error condition has occurred (and the device

has set the Error Flag (DQ5) bit to 1) during a Flash memory Program or Erase cycle.

The Reset Flash instruction sequence puts the Flash memory back into normal Read Array mode. It may take the Flash memory up to a few milliseconds to complete the Reset cycle. The Reset Flash instruction sequence is ignored when it is issued during a Program or Bulk Erase cycle of the Flash memory. The Reset Flash instruction sequence aborts any on-going Sector Erase cycle, and returns the Flash memory to the normal Read Array mode within a few milliseconds.

Page Re gi st er

The 8-bit Page Register increases the addressing capability of the DSP by a factor of up to 256. The contents of the register can also be read by the DSP. The outputs of the Page Register (PG0PG7) are inputs to the DPLD decoder and can be included in the Sector Select (

CSBOOT0-CSBOOT3

) equations. See Figure 12.

FS0-FS7 or

If memory paging is not needed, or if not all 8 page register bits are needed for memory paging, then these bits may be used in the CPLD for gen eral logic. The eight flip-flops in the reg ister are connected to the internal data bus D0-D7. The DSP can write to or read from the Page Register. The Page Register can be accessed at address loca-

csiop

tion

+ E0h. Page Register outputs are

cleared to logic 0 at reset.

Figure 12. Page Register

RESET

D0-D7

R/W

D0 Q0 D1 D2 D3 D4 D5 D6 D7

PAGE

PGR0 PGR1

PGR2

PGR3

PGR4

PGR5

PGR6

PGR7

DPLD

AND

CPLD

PLD

INTERNAL SELECTS AND LOGIC

PLDs

The PLDs bring programmable logic to the device. After specifying the logic for the PLDs using PSDsoft Express, the logic is programmed into the device and available upon Power-up.

The PLDs have selectable levels of performance and power consumption.

The device con tains two PLDs: the Decode P LD (DPLD), and the Complex PLD (CPLD), as shown in Figure 13.

Table 9. DPLD and CPLD Inputs

Number

Input Source Input Name

DSP Address Bus DSP Control Signals

Reset RST

A15-A0 16

CNTL2-CNTL0 3

1 PortB Input Macrocells PB7-PB0 8 PortC Input Macrocells PC7-PC0 8 Port D Inputs PD2-PD0 3 Page Register PG7-PG0 8 Macrocell AB

Feedback Macrocell BC

Feedback Flash memory

Program Status Bit

Note: 1. DSP ad dress lines A16 , A17, and others m ay enter the

DSM device on any pin on ports B, C, or D. See Figure 6 for recom m ended connections .

2. Additional DSP control signals may enter the DMS device on any pin on Por ts B, C, o r D. See Fi gure 6 f or re co mmended connections .

MCELLAB FB7-0 8

MCELLBC FB7-0 8

Ready/Busy

Signals

23/61

Page 24

DSM2190F4

The DPLD performs address decoding, and generates select signals for internal and external components, such as memory, registers, and I/O ports. The DPLD can generates External Chip Select (ECS0-ECS2) signals on Port D.

The CPLD can be used for logic functions, such as loadable counters and shift registers, state machines, and encoding and decoding logic. These logic functions can be constructed using the 16 Output Macrocells (OMC), 16 Input Macrocells (IMC), and the AND Array.

The AND Array is used to form product terms. These product terms are configured from the logic definition entered in PSDsoft Express. An Input Bus consisting of 64 signals is connected to the PLDs. Input signals are shown in Table 9.

Figure 13. PLD Diagram

Data

Bus

PAGE

DECODE PLD

(DPLD)

Turbo Bit. The PLDs in the device can minimize power consumption by switching off when inputs remain unchanged for an extended t ime of about 70 ns. Resetting the Turbo bit to 0 (Bit 3 of the PMMR0 register) a utom atically places the PLDs into standby if no inputs are changing. Turning the Turbo mode off increases propagation delays while reducing power consumption. Additionally, five bits are available in the PMMR registers in

csiop

to block DSP control signals from entering the PLDs. This reduces po wer consumption and can be used only when these DSP control signals are not used in PLD logi c equations. Each of the two PLDs has unique characteristics suited for its applications. They are des cribed in the following sect ions.

Main Flash Memory Selects

Secondary Flash Memory Selects

PLD INPUT BUS

Direct Macrocell Input to MCU Data Bus

Output Macrocell Feedback

CPLD

ALLOC.

Input Macrocell and Input Ports

PORT D Inputs

1 3 1

16 Output

Macrocell

16 Input Macrocell

(PORT B,C)

CSIOP Select External Chip Selects to Port D

JTAG Select

Direct Macrocell Access from MCU Data Bus

Macrocell

Alloc.

I/O PORTS

MCELLAB

to PORT B

MCELLBC

to PORT B or C

AI04957B

24/61

Page 25

DECODE PLD (DPLD)

The DPLD, shown in Figure 14, is used for decoding the address for internal and external com ponents. The DPLD can be used to generate the following decode signals:

■ 8 Main Flash memory S ector Se l ect (

FS0-FS7

signals with three product terms each

■ 4 Secondary Flash memory Sector Select

(

CSBOOT0-CSBOOT3

) signals with three

product terms each

Figure 14. DPLD Logic Array

■ 1 internal

and status registers (

csiop

sele c t for DS M device co n trol

csiop

is the base address

of the block of 256 byte locations)

■ 1 JTAG Select signal (enables JTAG operations

)

on Port C when multiplexing JTAG signals with general I/O signals)

■ 3 external chip select output signals for Port D

pins, each with one product term.

DSM2190F4

I/O PORTS (PORT A,B,C)

MCELLAB.FB [7:0] (Feedback)

MCELLBC.FB [7:0] (Feedback )

PG0-PG7

A[15: 0]

PD[2: 0]

CNTRL[2:0] (Read/Write Control Signals)

RESET

RD_BSY

(INPUTS)

(16)

(8)

(16)

(3)

(1)

FS0

FS1

FS7

CSIOP

JTAGSEL

ECS0

CSBOOT0

CSBOOT1

CSBOOT2

CSBOOT3

FS2

FS3

FS4

FS5

FS6

I/O Decoder Select

JTAG ISP

4 Secondary Flash Memory Sector Selects

8 Flash Main Memory Sector Selects

ECS1

ECS2

External Chip Selects to PORT D

AI04958

25/61

Page 26

DSM2190F4

COMPLEX PLD (CPL D )

The CPLD can be used to implement system logic functions, such as loadable counters and shift registers, system mailboxes, ha ndshaking protocols, state machines, and random logic. See application

AN1171

note ing PSDsoft Express.

As shown in Figure 15, the CPLD has the following blocks:

■ 16 Input Macrocells (IMC)

■ 16 Output Macrocells (OMC)

■ Macrocell Allocat o r

■ Product Term Allocator

■ AND Array capable of generating up to 130

product terms

Figure 15. Macrocell and I/O Port

for details on how to specify logic us-

■ Two I/O Ports.

Each of the blocks are described in the sections that fo llow.

The Input Macrocells (IMC) and Output Macrocells (OMC) are connected t o the device internal data bus and can be directly accessed by the DSP. This enables the DSP software to load data into the Output Macroc ells (OMC) or read dat a from both the Input and Output Macrocells (IMC and OMC).

This feature allows efficient implementation of system logic and eliminat es the need to connec t the data bus to the AND Array as required in most standard PLD macro cell architectures.

PLD INPUT BUSPLD INPUT BUS

AND ARRAY

Product Terms

from other MacrocellS

CPLD Macrocells

PRODUCT TERM

ALLOCATOR

UP TO 10

PRODUCT TERMS

POLARITY SELECT

PT CLOCK

GLOBAL CLOCK

CLOCK SELECT

PT CLEAR

PT Output Enable (OE

Macrocell Feedback

I/O Port Input

PT INPUT LATCH GATE/CLOCK

PT PRESET

MUX

MCU DATA IN

PR DI LD D/T

D/T/JK FF

SELECT

)

DSP ADDRESS / DATA BUS

CONTROL

MCU LOAD

Macrocell

MUX

COMB.

/REG

SELECT

DATA LOAD

Out to

MCU

Macrocell

I/O Port

Alloc.

OUTPUT

CPLD

TO OTHER I/O PORTS

I/O PORTS

LATCHED

ADDRESS OUT

DATA

CPLD OUTPUT

PDR

INPUT

DIR

REG.

Input Macrocells

MUX

SELECT

I/O Pin

AI04902B

Output Ma c rocell (O MC) . Eight of the Output Macrocells (OMC) are connected to Port B pins and are named as McellAB0-McellAB7. The other eight Macrocells are connected to Ports B or C pins and are named as McellBC0-McellBC7. OMCs may be used for internal feedback only (buried registers), or their outputs may be routed to external Port pins.

26/61

The Output Macrocell (OMC) architecture is shown in Figure 17. As shown in the figure, there are native product terms a vailable from the AND Array, and borrowed product terms available (if unused) from other Output Macrocells (OMC). The polarity of the product term is controlled by the XOR gate. The Out put Macrocell (OMC) c an implement either sequential logic, usin g the flip-flop

Page 27

DSM2190F4

element, or combinatorial logic. The multiplexer selects between the sequential or combinatorial logic outputs. The multiplexer out put can drive a port pin and has a feedback path to the AND Array

choosing pin functions in PSDsoft Express Routing can occur on a bit-by-bit basis, spitting assignment between the Ports. However, one OMC can be routed to one Port pin only, not both.

inputs. The flip-flop in the Output Macrocell (OMC) block

can be configured as a D, T, JK, or SR type in PSDsoft Express

. The flip-flop’s clock, preset, and

Figure 16. OMC Allocator

clear inputs may be driven from a product term of the AND Array. Alternatively, CLKIN (PD1) can be

01234567 01234567

used for the clock input to the flip-flop. The flip-flop is clocked on the rising edge of CLKIN (PD1). The preset and clear are active High inputs. Each clear input can use up to two product terms.

Output Macrocell Allocator. Outputs of the 16

4567 32104567 32

OMCs (MCELLBC)OMCs (MCELLAB)

OMCs can be routed to a com bination of pins on Port B or Port D as shown in Figure 16. The OMC output pin is automatically determined by

Table 10. Output Macrocell Port and Data Bit Assignments

Output

Macrocell

McellAB0 Port B0 3 6 D0 McellAB1 Port B1 3 6 D1

Port

Assignment

Native Product Terms

Maximum Borrowed

Product Terms

Data Bit for Loading or

PORT C PINSPORT B PINS

Reading

AI04915

McellAB2 Port B2 3 6 D2 McellAB3 Port B3 3 6 D3 McellAB4 Port B4 3 6 D4 McellAB5 Port B5 3 6 D5 McellAB6 Port B6 3 6 D6 McellAB7 Port B7 3 6 D7 McellBC0 Port B0 or C0 4 5 D0 McellBC1 Port B1 or C1 4 5 D1 McellBC2 Port B or, C2 4 5 D2 McellBC3 Port B3 orC3 4 5 D3 McellBC4 Port B4 orC4 4 6 D4 McellBC5 Port B5 or C5 4 6 D5 McellBC6 Port B6 orC6 4 6 D6 McellBC7 Port B7 orC7 4 6 D7

Product Term Al lo c at or. The CPLD has a Product Term Allocator. PSDsoft Express

uses the Product Term Allocator to borrow and plac e product terms from one Macrocell to another. This happens automatically in PSDsoft Express

, but understanding how allocation works will help you if your logic design does not “f it”, in which c ase y ou may try selecting a different pin or different OM C where the allocation resources m ay di ffer and the

design will then fit. The f ollowing list summarizes how product terms are allocated:

■ McellAB0-McellAB7 all have three native

product terms and may borrow up to six more

■ McellBC0-McellBC3 all have four native product

terms and may borrow up to five more

■ McellBC4-McellBC7 all have four native product

terms and may borrow up to six more.

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Page 28

DSM2190F4

Each Macrocell may only borrow product terms from certain other Macrocells. Product terms already in use by one Macrocell are not available for another Macrocell. Product term allocation does not add any propagation delay to the logic.

If an equation requires more product terms than are available to it through product term allocation,

then “external” product terms are required, which consumes other Output Macrocells (OMC). This is called product term expansion and also happens automatically in PSDsoft Express

as needed. Product tern expansion causes additional propagation delay because an OMC is consumed by the expansion and it’s output is rerouted (or fed back) into the AND array.

You can examine the fitter report generated by PSDsoft Express to see resulting product term allocation and product term expansion.

Figure 17. CPLD Output Macrocell

MASK

REG.

Output Macrocell CS

Loading and Reading the Output Macrocells (OMCs). Each of the two OMC blocks (8 OMCs

each) occupies a memory location in the DSP ad-

csiop

dress space, as defined in the

block MCELLAB0-7 and MCELLBC0-7 (see Table 4). The flip-flops in each of the 16 OMCs can be loaded from the data bus by a DSP. Loading the OMCs with data from the DSP takes priority over internal functions. As such, the preset, clear, and clock inputs to the flip-flop can be overridden by the DSP. The ability to load the flip-flops and read them back is useful in such applications as loadable counters and shift registers, mailboxes, and handshaking protocols.

Data is loaded into the Output Macrocells (OMC) on the trailing edge of Write Strobe (WR

INTERNAL DATA BUS

D[7:0

]

, CNTL0).

AND ARRAY

PLD INPUT BUS

PT CLK CLKIN

Allocator

ENABLE (.OE

PRESET(.PR

POLARITY

SELECT

CLEAR (.RE

Feedback (.FB

Port Input

MUX

Direction

)

PRDIN

CLR

Programmable FF (D/T/JK /SR

COMB/REG

SELECT

MUX

Macrocell

Allocator

Port Driver

)

Input

Macrocell

I/O Pin

AI04903B

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Page 29

DSM2190F4

The OMC Mask Register. There is one Mask

Register for each of the two groups of eight Output Macrocells (OMC). The Mask Registers can be used to block the loading of data to individual Output Macrocells (OMC). The def ault value for the Mask Registers is 00h, which allows loading of the Output Macrocells (OMC ). When a given bit in a Mask Register is set to a 1, the DSP is blocked from writing to the associated Ou tput Macrocells (OMC). For example, suppose McellAB0-3 are being used for a state machi ne. You would not want a DSP write to McellAB to overwrite the state machine registers. Therefore, you would want to load the Mask Register for McellAB (Mask Macrocell AB) with the value 0Fh.

Figure 18. Input Macrocell

INPUT MACROCELL_ RD

ENABLE (.OE

)

OUTPUT

Macrocells BC

AND

Macrocells AB

The Output Enable of the OMC. The Output Macrocells (OMC) block can be connected to an I/ O port pin as a P LD output. The output enab le of each port pin driver is controlled by a single product term from the AND Array, ORed with the Direction Register output. The pin is enabled upon Power-up if no output enable equation is defined and if the pin is declared as a PLD output in PSDsoft Express.

If the Output Macrocell (OMC) output is specified as an internal node and not as a port pin output in the PSDsoft Express, then the port pin can be used for other I/O functions. The internal node feedback can be routed as an input to the AND Array.

INTERNAL DATA BUS

DIRECTION

AND ARRAY

PLD INPUT BUS

MUX

Feedback

D FF

LATCH

Input Macrocells (IMC). The CPLD has 16 Input Macrocells (IMC), one for each pin on Ports B and C. The architecture of the IMCs is shown in Figure

18. The IMCs are individually configurable, and can be used as a latch, a register, or t o pass incoming Port signals prior to driving them onto the PLD input bus. This is useful for sampling and debouncing inputs to the AND array (key pad i nput s, etc.). Additionally, the outputs of the IMCs can be read by the DSP asynchronously at any time

I/O Pin

Port

Driver

D G

Input Macrocell

AI04904C

through the internal data bus using the csiop register block (see Table 4).

The enable fo r the latch and c lock f or the regi ster are driven by a product term from the CPLD. Each product term output is used to latch or clock four IMCs. Port inputs 3-0 can be controlled by one product term and 7-4 by another.

Configurations for the IMCs are specified by equations specified in PSDs oft Express. See Application note

AN1171

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Page 30

DSM2190F4

DSP Bus Interface

The “no-glue logic” DSP Bus Interface allows direct connection. DSP address, data, and control signals connect directly to the DSM device. See Figure 6 for typical connections.

DSP address, data an d cont rol sig nals a re rout ed

csio p

to Flash memory, I/O control (

), OMCs, and IMCs within the DMS. The DSP address range for each of these components is specified in PSDsoft Express

I/O Po r t s

There are three programma ble I/O ports: P orts B, C, and D. Each of the ports is eight bits except Port D, which is 3 bits. Each port pin is individually user configurable, thus allowing multiple functions per port. The ports are configured using PSDsoft Ex-

Figure 19. Gene ral I/O P ort A rchi te cture

DATA OUT

REG.

Macrocell Outputs EXT CS

READ MUX

press in the

or by the DSP writing to on-chip registers

csiop

block.

The topics discussed in this section are:

■ General Port archite ctur e

■ Port operating modes

■ Port Configuration Registers (PCR)

■ Port Data Registers

■ Individual Port functionality.

General Port Architecture. The general architecture of the I/O Port block is shown in Figure 19. Individual Port architectures are shown in Figure 20 to Figure 23. In general, once the purpose for a port pin has been defined in PSDsoft Express that pin is no longer available for other purposes. Exceptions are noted.

DATA OUT

OUTPUT

MUX

PORT PIN

INTERNAL DATA BUS

ENABLE PRODUCT TERM (.OE

D B

DIR REG.

CPLD-INPUT

DATA IN

)

As shown in Figure 19, the ports contain an output multiplexer whose select signals are driven by the configuration bits determined by PSDsoft Express. Inputs to the multiplexer include the following:

■ Output data from the Data Out register (for MCU

I/O mode)

■ CPLD Macrocell output (OMC)

OUTPUT SELECT

ENABLE OUT

Input

Macrocell

AI04905B

■ External Chip Selects ESC0-2 from the DPLD to

Port D pins only.

The Port Data Buffer (PDB) is a tri-state buffer that allows only one source at a time to be read by the DSP. The Port Data Buffer (PDB) is connected to the Internal Data Bus for feedback and can be read by the DSP. The Data Out and Macrocell out-

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DSM2190F4

puts, Direction Registers, and port pin input are all connected to the Port Data Buffer (PDB).

The Port pin’s tri-state output driver enable is controlled by a two input OR gate whose inputs come from the CPLD AND Array enable product term and the Direction Register. If the enable product term of any of the Array outputs are not defined and that port pin is not defined as a CPLD ou tput in PSDsoft Exp re s s

, then the Direction Register has sole control of the bu ffer that drives the port pin.

The contents of these registers can be altered by the DSP. The Port Data Buffer (PDB) feedback path allows the DSP to check the contents of the registers.

bouncing), as transparent latches, or direct inp uts to the PLDs. The registers and latches are clocked by a product term from the PLD AND Array. The outputs from the IMCs drive the PLD input bus and can be read by the DSP. See the sec tion entitled “Input Macrocell”, on page 29.

Port Operat in g Mo des

The I/O Ports have several modes of operat ion. Modes are defined using PSDsoft Express then runtime control from the DSP can occur using the registers in the Note

AN1171

for more detail.

csiop

block. See Application

Table 11 summ arizes which modes are available on each port. Each of the port operating m odes

are described in the following sections. Ports B, and C have embedded IMCs. The IMCs can be configured as registers (for sampling or de-

Table 11. Port Operating Modes

Port Mode Port B Port C Port D

MCU I/O Yes Yes Yes PLD I/O

McellAB Outputs McellBC Outputs Additional External CS Outputs PLD Inputs

JTAG ISP No

Note: 1. Can be m ultiplexed with other I/O funct i ons.

MCU I/O Mode. In t he MCU I/O mode, the DSP uses the I/O Ports block to expand its own I/O ports. The DSP can read I/O pins, set the direction of I/O pins, and change the state of I/O pins by accessing the registers in the

csiop

block. The register definition and their addresses may be found in Table 4.

The MCU I/O direction may be changed by writing to the corresponding bit in the Direction Re gister, or by the output enable product term. When the pin is configured as an output, the content of the Data Out Register drives the pin. When configured as an input, the DSP can read the port input through the Data In buffer. See Figure 19.

PLD I/ O Mode. Inputs from Ports B and C to either PLD (DPLD or CPLD) come through IMCs. Inputs from Port D to either PLDs are routed directly in and do not use IMCs. Outputs from the CPLD to Port B come from the OMC gro up MCELLAB0-7. Outputs from the CPLD to Port C come from OMC group MCELLBC0-7. Outputs from the DPLD to Port D come from the external chip select logic block ECS0-2.

All PLD outputs may be tri-stated at the Port pins with a control signal. This output enable control signal can be defined by a product term from the

Yes Yes

Yes

csiop

Yes

PLD, or by resetting the corresponding bit in the Direction Register to 0. The corres ponding bit in the Direction Register must not be set to logic 1 by the DSP if the pin is defined for a PLD input signal in PSDsoft Express. The PLD I/O mode is defined in PSDsoft Express by specifying PLD equations.

JTAG In-System Programming (ISP). Some of the pins on Port C are based on the IEEE 1194.1 JTAG specification and is used for In-System Programming (ISP). You can multiplex the function of these Port C JTAG pins w ith other functions. ISP is not performed very frequently in the life of the product, so multiplexing these pin’s functions with general purpose I/O functions gives more utility from Port C. See the section entitled “Programming In-Circuit Using JTAG ISP” , and Applicat ion Note

AN1153

Port Configuration Registers (PCR). Each Port has a set of Port Configuration Registers (PCR) used for configuration of the pins. The contents of the registers can be accessed by the DSP through normal read/write bus cycles o f the

csiop

listed in Table 4. The pins of a port are individually configurable and

each bit in the register controls its respective pin. For example, Bit 0 in a register refers to Bit 0 of its

No Yes Yes

, and

registers

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Page 32

DSM2190F4

port. The three Port Configuration Registers (PCR), are shown in Table 12. Default is logic 0.

Table 12. Port Configuration Registers (PCR)

Data In B,C,D Read Data Out B,C,D Write/Read Direction B,C,D Write/Read

Drive Select

Note: 1. See Table 16 for Dri ve Register bit defini tion.

B,C,D Write/Read

Data In Register. The DSP may read the Data In

csio p

registers in the

block at any tim e to determine the logic state of a Port pin. This will be the state at the pin regardless of whether it is driven by a source external to the DSM or driven internally from the DSM device. Reading a logic zero for a bit in a Data In register means the corresponding Port pin is also at logic zero. Reading logic one means the pin is logic one. Each bit in a Data In register corresponds to an individual Port pin. For a given Port, bit 0 in a Data In register corresponds to pin 0 of the Port. Example, bit 0 of the Data I n register for Port B corresponds to Port B pin PB0.

Data Out Register. The DSP may write (or read) the Data Out register in the

csiop

block at any time. Writing the Data Out register will change the logic state of a Port pin only if it is not driven or controlled by the CPLD. Writing a logic zero to a bit in a Data Out register will force the corresponding Port pin to be logic zero. Writing logic one will drive the pin to logic one. Each bit in the Data Out registers correspond to Port pins the same way as the Data In registers described above. When some pins of a Port are driven by the CP LD, writing to the corresponding bit in a Data Out register will have no effect as the CPLD overrides the Data Out register.

Direction Register. The Direction Register, in conjunction with the output enable (except for Port D), controls the direction of data flow in the I/O Ports. Any bit set to 1 in the Direction Register causes the corresponding pin to be an output, and any bit set to 0 causes it to be an input. The default mode for all port pins is input.

Table 13. Port Pin Direction Control, Output Enable P.T. Not Defined

Direction Register Bit Port Pin Mode

Table 14. Port Pin Direction Control, Output Enable P.T. Defined

Direction

0 0 Input 0 1 Output 1 0 Output 1 1 Output

Output Enable

P.T.

Port Pin Mode

Table 15. Port Direction Assignment Example

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0 0 0 0 0 1 1 1

Figure 20 and Figure 21 s how the Port Architecture diagrams for Ports B and C, respectively. The direction of data flow for Ports B, and C are controlled not only by the direction register, but also by the output enable product term from the PLD AND Array. If the output enable product term is not active, the Direction Register has sole control of a

given pin’s direction. An example of a configuration for a Port with the

three least significant bits set to output and the remainder set to input is shown in Tab le 15. Since Port D only contains three pins (shown i n Figure

23), the Direction Register for Port D has only the three least significant bits active.

Drive Select Register. The Drive Select Register configures the pin driver as Open Drain or CMOS (standard push/pull) for some port pins, and controls the slew rate for the other port pins. An external pull-up resistor should be used for pins configured as Open Drain. Open Drain outputs are diode clamped, thus t he maximum vol tage on an pin configured as Open Drain is Vcc + 0.7V.

A pin can be configured as Open Drain if its corresponding bit in the Drive Select Register is set to a

1. The default pin drive is CMOS. Note that the slew rate is a measurement o f the

rise and fall times of an output. A higher slew rate means a faster output response and may create more electrical noise. A pin operates in a high slew rate when the corresponding bit in the Drive Register is set to 1. The default rate is s tandard s lew.

Table 16 shows the Drive Register for Ports B , C, and D. It summarizes which pins can be configured as Open Drai n outputs and which pins the slew rate can be set for.

0 Input 1 Output

32/61

Page 33

Table 16. Drive Register Pin Assignment

Drive

Port B

Port C

Port D

Note: 1. NA = Not Applicable.

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Open Drain

Open

Drain

Open

Drain

Figure 20. Port B Structure

DATA OUT

REG.

MACROCELL OUTPUTS

Open Drain

Slew Rate

Open Drain

DATA OUT

DSM2190F4

Slew Rate

Open Drain

Slew Rate

OUTPUT

MUX

Slew Rate

Open Drain

Slew Rate

Open Drain

Slew Rate

PORT B

READ MUX

P D B

INTERNAL DATA BUS

DIR REG.

ENABLE PRODUCT TERM (.OE

)

CPLD-INPUT

Port B – Functionality and Structure

Port B can be configured to perform one or more of the following functions:

■ MCU I/O Mode

■ CPLD Output – Macrocells McellAB7-McellAB0

can be connected to Port B. McellBC7McellBC0 can be connected to Port B or Port C.

OUTPUT

DATA IN

■ CPLD Input – Via the Input Macrocells (IMC).

■ Open Drain/Slew Rate – pins PB3-PB0 can be

SELECT

ENABLE OUT

Macrocell

Input

AI04906B

configured to fast slew rate, pins PB7-PB4 can be configured to Open Drain Mode.

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Page 34

DSM2190F4

Figure 21. Port C Structure

DATA OUT

REG.

DATA OUT

MCELLBC[7:0

INTERNAL DATA BUS

ENABLE PRODUCT TERM (.OE

]

READ MUX

DIR REG.

CPLD-INPUT

JTAG ISP

DATA IN

)

OUTPUT

MUX

OUTPUT

SELECT

ENABLE OUT

INPUT

MACROCELL

JTAG ISP

PORT C PIN

CONFIGURATION

BIT

AI04907

Port C – Functionality and Structure

Port C can be configured to perform one or more of the following functions (see Figure 21):

■ MCU I/O Mode

■ CPLD Output – McellBC7-McellBC0 outputs

can be connected to Port B or Port C.

■ CPLD Input – via the Input Macrocells (IMC)

34/61

■ In-System Programming (ISP) – JTAG port can

be enabled for programming/erase of the device. (See the section entitled “Programming In-Circuit Using JTAG ISP”, and Application Note

AN1153

, for more information on JTAG

programming.)

■ Open Drain – Port C pins can be configured in

Open Drain Mode

Page 35

Figure 22. Port D Structure

ECS[2:0

]

DATA OUT

REG.

READ MUX

DATA OUT

OUTPUT

MUX

DSM2190F4

PORT D PIN

P D B

INTERNAL DATA BUS

DIR REG.

Port D – Functionality and Structure

Port D has three I/O pins. See Figure 22 a nd F igure 23. Port D can be configured to perform one or more of the following functions:

■ MCU I/O Mode

■ DPLD Output – External Chip Selects, ECS0-2

does not consume OMCs

■ CPLD Input – direct input to the CPLD, does not

use IMCs

■ Slew rate – pins can be set up for fast slew rate

Port D pins can be configured in PSDsoft as input pins for other dedicated functions:

■ CLKIN (PD1) as input to the OMCs Flip-flops

OUTPUT

SELECT

DATA IN

ENABLE PRODUCT

TERM (.OE)

CPLD- INPUT

■ PSD Chip Select In put (CSI, PD2). Driving th is

AI02889

signal logic High disables the Flash memory, putting it in standby mode.

External Chip Select. The DPLD also provides three External Chip Select outputs (ESC0-2) on Port D pins that can be used to select external devices as defined in PS Dsoft E xpress . Ea ch E xternal Chip Select consists of one product term that can be configured act ive High or Low. The output enable of the pin is cont rolled by either t he ou tput enable product term or the Direction Register. (See Figure 23.) External Chip Selects f or Port D pins do not consume OMC s. External chip select outputs can also come from the CPLD if c hip select equations are specified in PSDsoft Express for Ports B or C.

35/61

Page 36

DSM2190F4

Figure 23. Port D External Chip Select Signals

PLD INPUT BUS

PT0

POLARITY

CPLD AND ARRAY

PT1

POLARITY

PT2

POLARITY

BIT

ENABLE (.OE)

DIRECTION

ECS0

DIRECTION

ECS1

DIRECTION

ECS2

PD0 PIN

PD1 PIN

PD2 PIN

AI02890

36/61

Page 37

POWER MANAGEMENT

The device offers configurab le power saving options. These options may be used individually or in combinations, as follows:

■ All memory blocks in the device are b uilt with

zero-power management technology. Zeropower technology puts the memories into standby mode when address/data inputs are not changing (zero DC current). As soon as a transition occurs on an input, the affected

memory “wakes up”, changes and latches its outputs, then goes back to standby. The designer does

not

have to do anything special to achieve memory standby mode when no inputs are changing—it happens automat ically.

Both PLDs (DPLD and CPLD) are also Zeropower, but this is not the default operation. The DSP must set a bit at run-time to achieve Zeropower as described next.

■ The PMMR registers can be written by the DSP

at run-time to manage power. The device has a Turbo bit in the PMMR0 register. This bit can be set to turn the Turbo mode off (the default is with Turbo mode turned on). While Turbo mode is off, the PLDs can achieve standby current when no PLD inputs are changing (zero DC current). Even when inputs do change, significant power can be saved at lower frequencies (AC current),

DSM2190F4

compared to when Turbo mode is on. When the Turbo mode is on, there is a significant DC current component and the AC component is higher.

Further significant power savings can be achieved by blocking s ignals that are not used in DPLD or CPLD logic equations. The “blocking bits” in PMMR registers can be set to logic 1 by the DSP to block designated signals from reaching both PLDs. Current consumption of the PLDs is directly related to the composite frequency of the changes on their input s (see F igure 25), so blocking unused PLD inputs can significantly lower PLD operating frequency and power consumption. The DSP a lso has the option of blocking certain PLD input when not needed, then letting them pass for when needed for specific logic operations. Table 17 and Table 18 define the PMMR registers.

■ PSD Chip Sel e ct Input (CSI, PD2) can be used

to disable the internal memories and registers, placing them in standby mode even if inputs are changing. This feature does not block any internal signals or disable the PLDs. There is a slight penalty in memory access time when PSD Chip Select In put (CSI

, PD2 ) make s i ts

initial transition from deselected to selected.

csiop

Table 17. Power Management Mode Registers PMMR0

Bit 0 X 0 Not used, and should be set to zero. Bit 1 X 0 Not used, and should be set to zero. Bit 2 X 0 Not used, and should be set to zero.

Bit 3 PLD Turbo

Bit 4 PLD Array clk

Bit 5 PLD MCell clk

Bit 6 X 0 Not used, and should be set to zero. Bit 7 X 0 Not used, and should be set to zero.

Note: 1. The bit s of this register are cl eared to zero following Power-up. Subsequent Rese t (Reset ) pulses do not cl ear the registers.

0 = on PLD Turbo mode is on 1 = off PLD Turbo mode is off, saving power.

0 = on

1 = off CLKIN (PD1) input to PLD AND Array is blocked, saving power. 0 = on CLKIN (PD1) input to the PLD Macrocells is passed onto PLDs. 1 = off CLKIN (PD1) input to PLD Macrocells is blocked, saving power.

CLKIN (PD1) input to the PLD AND Array is passed onto PLDs. Every change of CLKIN (PD1) Powers-up the PLD when Turbo bit is 0.

37/61

Page 38

DSM2190F4

PLD Powe r M anagemen t

The power and speed of the PLDs are controlled by the Turbo bit (bit 3) in the PMMR0. By set ting the bit to 1, the Turbo mode is off and the PLDs consume the specified stand-by current when the inputs are not switching for an extended time of 70 ns (100 ns for 3.3 V devices). The propagation delay time is increased by 10 ns after the Turbo bit is set to 1 (turned off) when the inputs change at a

Table 18. Power Management Mode Registers PMMR2

Bit 0 X 0 Not used, and should be set to zero. Bit 1 X 0 Not used, and should be set to zero.

Bit 2

Bit 3

Bit 4

Bit 5

Bit 6

PLD Array CNTL0

PLD Array CNTL1

PLD Array CNTL2

PLD Array PD0

PLD Array PC7

0 = on Cntl0 input to the PLD AND Array is passed onto PLDs. 1 = off Cntl0 input to PLD AND Array is blocked, saving power. 0 = on Cntl1 input to the PLD AND Array is passed onto PLDs. 1 = off Cntl1 input to PLD AND Array is blocked, saving power. 0 = on Cntl2 input to the PLD AND Array is passed onto PLDs. 1 = off Cntl2 input to PLD AND Array is blocked, saving power. 0 = on PD0 input to the PLD AND Array is passed onto PLDs. 1 = off PD0 input to PLD AND Array is blocked, saving power. 0 = on PC7 input to the PLD AND Array is passed onto PLDs. 1 = off PC7 input to PLD AND Array is blocked, saving power.

composite frequency of less than 15 MHz (10 MHz for 3.3 V devices). When the Turbo bit is reset to 0 (turned on), the PLDs run at full power and speed.

The Turbo bit affects the PLD’s DC power, AC power, and propagation delay.

Blocking MCU control signals with the bits of the PMMR registers can further reduce PLD AC power consumption by lowering the effective composite frequency of inputs to the PLDs.

Bit 7 X 0 Not used, and should be set to zero.

Note: 1. The bit s of this register are cl eared to zero following Power-up. Subsequent Rese t (Reset ) pulses do not cl ear the registers.

from the PLD AND A rray or the Macrocells block

PSD Chip Select Input (CSI, PD2)

PD2 of Port D can b e configured in PSDsoft Express as PSD Chip Select Input (

CSI). When Low,

the signal selects and enables the internal Flash memory and I/O blocks for Read or Write operations involving the device. A High on PSD Chip Select Inp ut (

CSI, PD2) disa bles the Flash memory

and reduces the device power consumption. However, the PLD and I/O signals remain operational when PSD Chip Select Input (

CSI, PD2) is High.

There may be a timing pena lty when using PSD Chip Select Input (

CSI, PD2) depending on the

speed grade of the device that you are using. See the timing parameter t

in Table 31.

SLQV

Input Clock. The device provides the option to block CLKIN (PD1) from reaching the PLDs to save AC power consumpt ion. CLKIN (PD1) is an input to the PLD AND Array and the OMCs.

If CLKIN (PD1) is not being use d as part of the PLD logic equation, the clock should be blocked to

by setting bits 4 or 5 to a 1 in PMMR0. Input Cont rol Signals. The device provides the

option to block the input control signals (CNTL0, CNTL1, CNTL2, PD0, and PC7) from reaching the PLDs to save AC power consumption. These control signals are inputs to the PLD AND Array. If any of these are not being used as part of the PLD logic equation, these control signals should be disabled to save AC power. They are disconnected from the PLD AND Array by set ting bits 2, 3, 4, 5, and 6 to a 1 in the PMMR2 register. Note: CNTL0 and CNTL1 (DSP

WR and DSP RD) are perma-

nently routed to the Flash m em ory array and cannot be blocked from the array by the PMMR registers (that’s why WR and RD signals do not have to be specified in PSDsoft Express for Flash memory segmen t chip-select equations f or FS0 FS7). CNTL0 and CNTL1 are blocked from the PLDs with PMMR registers bits when thes e signals are specifically used in logic equations specified in PSDsoft Expr e ss.

save AC power. CLKIN (PD1) is disconnected

38/61

Page 39

Figure 24. Reset (RESET) Timing

DSM2190F4

RESET

Power On Reset, Warm Reset, Power-down Power On Reset. Upon Power-up, the device re-

quires a Reset (

RESET) pulse of duration t

after VCC is steady. During this time period, the device loads internal configurat ions, clears som e of the registers and sets the Flash me mory into Operating mode. After the rising e dge of Reset (

SET), the device remains in the Reset mode for an

additional period, t

VCC(min)

NLNH-PO

Power-On Reset

, before the first memory ac-

OPR

NLNH-PO

RE-

NLNH

NLNH-A

Warm Reset

The Flash memory is reset to the Read Array mode upon Power-up. Sector Select FS0-FS7 must all be Low, Write Strobe (

WR, CNTL0) High,

during Power On Reset for maximum security of the data contents and to remove the possibi lity of a byte being written on the first edge of Write Strobe (

WR, CNTL0). Any Flash memory Write cy-

cle initiation is prevented automatically when V is below V

LKO

cess is allowed.

Table 19. Status During Power-On Reset, Warm Reset and Power-down Mode

Port Configuration Power-On Reset Warm Reset Power-down Mode

MCU I/O Input mode Input mode Unchanged

PLD Output

Valid after internal PSD configuration bits are loaded

Valid

Depends on inputs to PLD (addresses are blocked in PD mode)

OPR

AI02866b

PMMR0 and PMMR2 Cleared to 0 Unchanged Unchanged

OMC Flip-flop status

All other registers Cleared to 0 Cleared to 0 Unchanged

Cleared to 0 by internal Power-On Reset

Warm Reset. Once the device is up and running, the device can be reset with a pulse o f a much shorter duration, t

. The same t

NLNH

period is

OPR

needed before the device is operational after warm reset. Figure 24 shows the timing of the Power-up and warm reset.

I/O Pin, Register and PLD Status at Reset. Table 19 shows the I/O pin, register and PLD status

Depends on .re and .pr equations

down mode. PLD output s are always v alid during warm reset, and they are valid in Power On Reset once the internal device Configuration bits are loaded. This loading of the device is completed typically long before t he V

ramps up to operat-

ing level. Once the P LD is active, t he state of t he outputs are determined by the PSDsoft Express equations.

during Power On Reset, warm reset and Power-

39/61

Page 40

DSM2190F4

PROGRAMMING IN-CIRCUIT USING JTAG ISP

In-System Programming (ISP) can be pe rformed through the JTAG signals on Port C. This serial interface allows programming of the entire DSM device or subsections (i.e. only Flash memory but not the PLDs) without and participation of the DSP. A blank DSM device soldered to a circuit board can be completely programmed in 10 to 25 seconds. The basic JTAG signals; TMS, TCK, TDI, and TDO form the IEEE-1149.1 interface. The DSM device does not implement the IEEE-1149.1 Boundary Scan functions. The DSM uses the JTAG interface for ISP only. However, the DSM device can reside i n a standard JTAG chain with other JTAG devices as it will remain in BYPASS mode while other devices perform Boundary Scan.

ISP programming time can be reduced as much as 30% by using two more signals on Port C, TSTAT and TERR See Table 20. The FlashLINK ming cable available from ST Microelectronics for $59USD and PSDsoft Express software that is available at no charge from that is needed to program a DSM device using the parallel port on any PC or laptop.

By default, the four pins on Port C are enabl ed for the basic JTAG signals TMS, TCK, TDI, and TDO on a blank device (and as shipped from factory)

See Application Note JTAG In-System Programming (ISP).

Standard JTAG Signals. The standard JTAG signals (TMS, TCK, TDI, and TDO) can be enabled by any of three different conditions that are logically ORed.

The following symbolic logic equation specifies the conditions enabling the four basic JTAG signals (TMS, TCK, TDI, and TDO) on their respective Port C pins. For purposes of discussion, the logic label JTAG_ON is used. When JTAG_ON is true, the four pins are enabled for JTAG operation. When JTAG_ON is false, the four pins can be used for general device I/O as specified in PSDsoft Express. JTAG_ON can become true by any of three different ways as shown:

JTAG_ON =

1. PSDsoft Express Pin Configuration -OR-

2. PSDsoft Express PLD equation -OR-

3. DSP writes to register in

Method 1 is most common. This is when the JTAG

pins are selected in PSDsoft Express to be “dedicated” JTAG pins. Th ey can always t ransmit and receive JTAG information because they are “fulltime” JTAG pins.

in addition to TMS, TCK, TDI and TDO.

AN1153

JTAG program-

www.st.com/psm

for more details on

csiop

block

is all

Method 2 is used only when the JTAG pins are multiplexed with general I/O functions. For designs that need every I/O pin, the JTA G pins m ay be used for general I/O when they are not used for ISP. However, when JTAG pins are multiplexed with general I/O functions, the des igner must include a way to get the pins back into JTAG mode when it is time for JTAG operations again. In this case, a single PLD input from Ports B, C, or D must be dedicated to switch the Port C pins from I/ O mode back to ISP mode at any time. It is recom-

mended to physically connect this dedicat ed PLD input pin to the JEN\ output signal from the Flashlink cable when multiplexing JTAG signals.

See Application Note

AN1153

for details.

Method 3 is rarely used to control JTAG pin operation. The DSP can set the port C pins to function as JTAG ISP by setting the JTAG Enable bit in a

csiop

block, but as soon as the DSM chip is reset, the csiop block registers are cleared, which turns off the JTAG-ISP function. Controlling JTAG pins using this method is not recommended.

Table 20. JTAG Port Signals

Port C Pin JTAG Signals Description

PC0 TMS Mode Select PC1 TCK Clock PC3 TSTAT PC4 TERR PC5 TDI Serial Data In PC6 TDO Serial Data Out

JTAG Extensions. TSTAT

Status Error Flag

and TERR are two JTAG extension signals (must be used as a pair) enabled by a command received over the four standard JTAG signals (TMS, TCK, TDI, and TDO) by PSDsoft Express. They are used to speed Program and Erase cycles by indicating status on device pins instead of having to scan the status out serially using t he standa rd J TAG channel. See Application Note

indicates if an error has occurred when

TERR

AN1153

erasing a sector or program ming a byte in F lash memory. This signal goes Low (active) when an Error condition occurs.

TSTAT scribed previously.

behaves the same as Ready/Busy de-

TSTAT is inactive logic 1 when

the device is i n Read mode (Flash memory contents can be read).

TSTAT is logic 0 when Flash

memory Program or Erase cycles are in progress. TSTAT

and TERR can be configured as opendrain type signals with PSDsoft Express. This facilitates a wired-OR connection of T STAT

signals

40/61

Page 41

DSM2190F4

from multiple DSM 2190F4V devices a nd a wiredOR connection of TERR

signals from thos e sam e

devices. This is useful when severa l devices are

“chained” together in a JTAG environment. PSDsoft Express puts TSTAT

and TERR signals to open-drain by default. Click on 'Properties' in the JTAG-ISP window of PSDsoft Express to change to standard CMOS pu sh-pull. It is recommen ded to use 10 kΩ pull-up resistors to V

on all JTAG-

ISP signals on your circuit board.

Initi a l D e live r y St a t e

When delivered from ST, the device has all bits in the memory and PLDs erased to logic 1. The DSM Configuration Register bits are set to 0. The code, configuration, and PLD l ogic are loaded using the programming procedure. The four basic JTAG ISP signals (TCK, TMS, TDI, TDO) are ready for ISP funct ion.

41/61

Page 42

DSM2190F4

AC/DC PARAMETERS

These tables describe the AC and DC parameters of the device:

❏ DC Electrical Specification ❏ AC Timing Specification

■ PLD Timing

– Combinatorial Timing – Synchronous Clock Mode – Asynchronous Clock Mode – Input Macrocell Timing

■ DSP Timing

– Read Timing –Write Timing – Reset Timing

The following are issues concerning the parameters presented:

■ In the DC specification the supply current is

given for different modes of operation. Before calculating the total power consumption, determine the percentage of time that the device is in each mode. Also, the supply power is considerably different if the Turbo bit is 0.

■ The AC power component gives the PLD and

Flash memory a mA/MHz specification. Figure 25 shows the PLD mA/MHz as a function of the number of Product Terms (PT) used.

■ The fitter report of PSDsoft Express indicates

the number of Product Terms (PTs) used for a given design. This number may be used to estimate PLD power consumption using Figure

25.

■ In the PLD timing parameters, add the required

delay when Turbo bit is 0.

Figure 25. PLD I

/Frequency Consumption (3.3 V)

= 3V

– (mA)

010155 20 25

TURBO OFF

HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)

TURBO ON (100%)

TURBO ON (25%)

PT 100% PT 25%

AI03100

42/61

Page 43

DSM2190F4

MAXIMUM RATI N G

Stressing the device ab ove the rating listed in t he Absolute Maximum Ratings table m ay cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions ab ove those i ndicated in t he Operating sections of this specificat ion is not im-

Table 21. Absolute Maximum Ratings

Symbol Parameter Min. Max. Unit

STG

LEAD

ESD

Note: 1. IPC/JEDEC J-STD- 020 A

2. JEDEC Std JESD 22-A114A (C1=100 pF, R1=1500 Ω, R2=500 Ω)

Storage Temperature –65 125 °C

Lead Temperature during Soldering (20 seconds max.) Input and Output Voltage (Q = VOH or Hi-Z)

Supply Voltage –0.6 7.0 V Device Programmer Supply Voltage –0.6 14.0 V

Electrostatic Discharge Voltage (Human Body model)

plied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and ot her relevant quality documents.

–0.6 7.0 V

–2000 2000 V

235 °C

43/61

Page 44

DSM2190F4

DC AND AC PARAMETERS

This section summarizes the operat ing and measurement conditions, and the DC and AC characteristics of the device. The parameters in t he DC and AC Characteristic tables that follow are derived from tests performed under the Measure-

Table 22. Operating Conditions

Symbol Parameter Min. Max. Unit

ment Conditions summarized in the relevant tables. Designers should chec k th at the o perat ing conditions in their circuit matc h the meas urement conditions when relying on the quoted parameters.

Supply Voltage 3.0 3.6 V Ambient Operating Temperature (industrial) –40 85 °C

Table 23. AC Measurement Conditions

Symbol Parameter Min. Max. Unit

Load Capacitance 30 pF Input Rise and Fall Times 5 ns Input Pulse Voltages

1.5

Input and Output Timing Reference Voltages 1.5 V

Note: 1. Output Hi-Z is defined as the point where da ta out is no longe r dri ven.

Figure 26. AC Measurem ent I/O W aveform Figure 27. AC Me as urement Lo ad C ir cui t

2.0 V

0.9V

Test Point 1.5V

Device

Under Test

AI04947

400 Ω

= 30 pF

(Including Scope and Jig Capacitance)

AI04948

Table 24. Capacitance

Symbol Parameter Test Condition

OUT

VPP

Note: 1. Sampled only, not 100% tested.

2. Typical values are for T

44/61

Input Capacitance (for input pins)

Output Capacitance (for input/ output pins)

Capacitance (for CNTL2/VPP)V

= 25°C and nominal supply voltages.

OUT

= 0V

Typ.

Max. Unit

812

18 25

Page 45

Table 25. AC Symbols for PLD Timing

Signal Letters Signal Behavior

A Address Input t Time C CEout Output L Logic Level Low D Input Data H Logic Level High E E Input V Valid N Reset Input or Output X No Longer a Valid Logic Level P Port Signal Output Z Float Q Output Data PW Pulse Width RRD

Input (read)

DSM2190F4

S Chip Select Input, BMS WWR B

Input (write)

Output

STBY

, DMS, IOMS, or FSx

M Output Macrocell

Example: t

– Time from Address Valid to

AVWL

Write input Low.

Figure 28. Switching Waveforms – Key

WAVEFORMS

INPUTS OUTPUTS

STEADY INPUT

MAY CHANGE FROM HI TO LO

MAY CHANGE FROM LO TO HI

DON'T CARE

STEADY OUTPUT

WILL BE CHANGING FROM HI TO LO

WILL BE CHANGING LO TO HI

CHANGING, STATE UNKNOWN

OUTPUTS ONLY

CENTER LINE IS TRI-STATE

AI03102

45/61

Page 46

DSM2190F4

Table 26. DC Characteristics

Symbol Parameter Conditions Min. Typ . Max. Unit

IH1

IL1

HYS

LKO

OH1

IDLE

High Level Input Volta ge Low Level Input Voltage

Reset High Level Input Voltage Reset Low Level Input Voltage Reset Pin Hysteresis 0.3 V

VCC (min) for Flash Erase and Program

Output Low Voltage

Output High Voltage Except

STBY

Output High Voltage V

STBY

Idle Current (VSTBY input) SRAM Data Retention Voltage Stand-by Supply Current

for Power-down Mode Input Leakage Curren t Output Leakage Current

PLD Only

(Note

)

Supply Current

Operating

(DC)

Flash memory

3.0 V < V

(Note (Note

= 20 µA, VCC = 3.0V

= 4 mA, VCC = 3.0 V

= –20 µA, VCC = 3.0 V

= –2 mA, VCC = 3.0 V

On I

OH1

> V

Only on V

>VCC –0.3 V (Notes

CSI V

< VIN < V

0.45 < V PLD_TURBO = Off,

f = 0 MHz (Note PLD_TURBO = On,

f = 0 MHz During Flash memory Write/

Erase Only Read Only, f = 0 MHz 0 0 mA

< 3.6 V 0.7V

< 3.6 V

)

= 1 µA V

STBY

2,3

)

< V

)

VCC +0.5

–0.5 0.8 V

0.8V –0.5

VCC +0.5

0.2V

–0.1

V V

1.5 2.2 V

0.01 0.1 V

0.15 0.45 V

2.9 2.99 V

2.7 2.6 V

STBY

– 0.8

V –0.1 0.1 µA 2V

25 100 µA

–1 ±.1 1 µA –10 ±5 10 µA

0 µA/PT

200 400 µA/PT

10 25 mA

PLD AC Adder

(AC)

(Note

Note: 1. Reset (Reset) ha s hysteresi s. V

Flash memory AC Adder 1.5 2.0

)

is valid at or below 0.2VCC –0.1. V

deselecte d .

2. CSI

3. PLD is in non-Turbo mode, and none of the inputs are switching.

4. Please see Fi gure 25 for th e PLD current calculat i on.

5. I

= 0 mA

OUT

IL1

46/61

(see note

is valid at or abov e 0.8VCC .

IH1

)

mA/

MHz

Page 47

Tabl e 27. CPLD C om binatorial Timing

Symbol Parameter Conditions

-15

Min Max

Aloc

T urbo

Off

DSM2190F4

Slew

Rate

Unit

ARP

ARPW

ARD

Note: 1. Fast Slew Rate output available on PB3-PB0, and PD2-PD0.

CPLD Input Pin/Feedback to CPLD Combinatorial Output

CPLD Input to CPLD Output Enable

CPLD Input to CPLD Output Disable

CPLD Register Clear or Preset Delay

CPLD Register Clear or Preset Pulse Width

CPLD Array Delay Any Macrocell 29 Add 4 ns

45 Add 4 Add 20 Sub 6 ns

45 Add 20 Sub 6 ns

43 Add 20 Sub 6 ns

30 Add 20 ns

47/61

Page 48

DSM2190F4

Table 28. CPLD Macrocell Synchrono us Clock Mode Timing

-15

Symbol Parameter Conditions

Min Max

Aloc

Turbo

Off

Slew

Rate

Unit

Maximum Frequency External Feedback

MAX

Maximum Frequency Internal Feedback (f

CNT

)

Maximum Frequency Pipelined Data

ARD

MIN Minimum Clock Period

Note: 1. Fast Slew Rate output available on PB3-PB0, and PD2-PD0.

Input Setup Time 25 Add 4 Add 20 ns Input Hold Time 0 ns Clock High Time Clock Input 15 ns Clock Low Time Clock Input 15 ns Clock to Output Delay Clock Input 28 Sub 6 ns CPLD Array Delay Any Macrocell 29 Add 4 ns

2. CLKIN (P D1) t

= tCH + tCL .

CLCL

1/(t

tCH+t

S+tCO

CH+tCL

–10)

)

29 ns

Table 29. CPLD Macrocell Asynch ronou s Clock Mod e Timin g

Symbol Parameter Conditions

MAXA

CHA

CLA

COA

ARD

MINA

Maximum Frequency External Feedback

Maximum Frequency Internal Feedback (f

CNTA

Maximum Frequency Pipelined Data

Input Setup Time 12 Add 4 Add 20 ns Input Hold Time 15 ns Clock High Time 22 Add 20 ns Clock Low Time 15 Add 20 ns Clock to Output Delay 40 Add 20 Sub 6 ns CPLD Array Delay Any Macrocell 29 Add 4 ns Minimum Clock Period

1/(t

SA+tCOA

1/(t

SA+tCOA

)

1/(t

CHA+tCLA

1/f

CNTA

)

–10)

)

-15

Min Max

42 ns

18.8 MHz

23.2 MHz

33.3 MHz

Aloc

Turbo

Off

Slew

Rate

Unit

19.2 MHz

23.8 MHz

27 MHz

48/61

Page 49

Figure 29. Input to Output Disable / Enable

INPUT

INPUT TO

OUTPUT

ENABLE/DISABLE

Figure 30. Asynchronous Reset / Preset

RESET/PRESET

INPUT

OUTPUT

DSM2190F4

tER tEA

AI02863

tARPW

tARP

AI02864

Figure 31. Sy nchronous Clo c k Mode Timing – P LD

CLKIN

INPUT

REGISTERED

OUTPUT

Figure 32. Asynchronous Clock Mode Timing (product term clock)

CLOCK

INPUT

REGISTERED

OUTPUT

tCHA

tCLA

tHAtSA

tCOA

AI02859

49/61

Page 50

DSM2190F4

Table 30. Input Macrocell Timing

Symbol Parameter Conditions

INH

INL

INO

Note: 1. Inputs fro m Port B, and C relative to register/latch clock from the PLD.

Input Setup Time Input Hold Time NIB Input High Time NIB Input Low Time NIB Input to Combinatorial Delay

Figure 33. Input Macrocell Timing (product term clock)

INH

PT CLOCK

INPUT

(Note (Note (Note (Note (Note

)

INL

-15

Min Max

Aloc

T urbo

Off

Unit

0ns 25 Add 20 ns 13 ns 13 ns

62 Add 4 Add 20 ns

OUTPUT

AI03101

INO

50/61

Page 51

Table 31. Read Timing

Symbol Parameter Conditions

AVQV

Address Valid to Data Valid

(Note

DSM2190F4

-15

Min Max

)

150 Add 20 ns

T urbo

Off

Unit

SLQV

RLQV

RHQX

RLRH

RHQZ

CS Valid to Data Valid 150 ns RD to Data Valid 8-Bit Bus 35 ns RD Data Hold Time 1 ns RD Pulse Width 40 ns RD to Data High-Z 20 ns

Note: 1. Any input used to select an internal DSM function.

Figure 34. Read Timing

AVQV

ADDRESS

NON-MULTIPLEXED

BUS

DATA

BUS

CSI

SLQV

ADDRESS

VALID

RLQV

RLRH

DATA

VALID

RHQX

tRHQZ

AI04908

51/61

Page 52

DSM2190F4

Table 32. Write Timing

Symbol Parameter Conditions

-15 Unit

Min Max

AVWL

SLWL

DVWH

WHDX

WLWH

WHAX1

WHAX2

WHPV

DVMV

WLMV

Note: 1. Any input used to select an internal PSM function.

Address Valid to Leading Edge of WR

(Notes 1) CS Valid to Leading Edge of WR 0ns WR Data Setup Time 45 ns WR Data Hold Time 2 ns WR Pulse Width 48 ns Trailing Edge of WR to Address Invalid 1.75 ns Trailing Edge of WR to DPLD Address Invalid

(Note

)

Trailing Edge of WR to Port Output Valid Using I/O Port Data Register

Data Valid to Port Output Valid Using Macrocell Register Preset/Clear

WR Valid to Port Output Valid Using Macrocell Register Preset/Clear

2. As suming dat a i s stable before active write signa l .

3. Assuming write is active before data b ecomes valid .

4. TWHAX2 is the address hold time for DPLD inputs that are used to gen erate Sector Select si gnals for internal DSM me m ory.

(Note

)

0ns

Figure 35. Write Timing

AVWL

ADDRESS

NON-MULTIPLEXED

BUS

DATA

BUS

CSI

ADDRESS

SLWL

VALID

WLWH

DVWH

DATA

VALID

WHAX

WHDX

35 ns

70 ns

52/61

AI04909

Page 53

DSM2190F4

Table 33. Flash Memory Program, Wri te and Erase Ti mes

Symbol Parameter Min. T yp. Max. Unit

Flash Bulk Erase

(pre-programmed)

Flash Bulk Erase (not pre-programmed) 5 s

WHQV3

WHQV2

WHQV1

Sector Erase (pre-programmed) 1 30 s Sector Erase (not pre-programmed) 2.2 s Byte Program 14 1200 µs

Program / Erase Cycles (per Sector) 100,000 cycles

WHWLO

Q7VQV

Note: 1. Programmed to all zero before erase.

2. The polling status, DQ7, is valid tQ7VQV time units before the da ta byte, DQ0-DQ7, is valid for reading.

Sector Erase Time-Out 100 µs DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)

Table 34. Reset (Reset) Timing

Symbol Parameter Conditions Min Max Unit

NLNH

NLNH–PO

OPR

Note: 1. Reset (RESET) does not re set Flash memory Prog ram or Erase cyc l es.

2. Warm reset aborts Flash memory Program or Eras e cy cles, and put s the device in Read mode.

RESET Active Low Time

Power On Reset Active Low Time 1 ms RESET High to Operational Device 300 ns

330s

30 ns

300 ns

Figure 36. Reset (RESET) Timing

RESET

VCC(min)

NLNH-PO

Power-On Reset

OPR

NLNH

NLNH-A

Warm Reset

OPR

AI02866b

53/61

Page 54

DSM2190F4

Table 35. ISC Timing

Symbol Parameter Conditions

ISCCF

ISCCH

ISCCL

ISCCFP

ISCCHP

ISCCLP

Clock (TCK, PC1) Frequency (except for PLD) Clock (TCK, PC1) High Time (except for PLD) Clock (TCK, PC1) Low Time (except for PLD) Clock (TCK, PC1) Frequency (PLD only) Clock (TCK, PC1) High Time (PLD only) Clock (TCK, PC1) Low Time (PLD only)

(Note (Note (Note (Note (Note (Note

-15 Unit

Min Max

)

45 ns 45 ns

240 ns 240 ns

10 MHz

2 MHz

ISCPSU

ISCPH

ISCPCO

ISCPZV

ISCPVZ

Note: 1. For no n-PLD Pro gramming, Erase or in ISC by-pass mode.

ISC Port Set Up Time 13 ns ISC Port Hold Up Time 5 ns ISC Port Clock to Output 36 ns ISC Port High-Impedance to Valid Output 36 ns ISC Port Valid Output to

High-Impedance

2. For Program or Erase PLD only.

Figure 37. ISC Timing

ISCCH

TCK

ISCCL

ISCPSU

TDI/TMS

ISCPH

ISCPZV

ISCPCO

36 ns

54/61

ISC OUTPUTS/TDO

ISCPVZ

AI02865

Page 55

PACKAGE MECHANICAL

PLCC52 – 52 lead Plastic Leaded Chip Carrier, rectangular, Pac kage Outline

DSM2190F4

Note: Drawing is not to scale.

PLCC-B

1 N

E1 E

D2/E2

D3/E3

PLCC52 – 52 lead Plastic Leaded Chip Carrier, rectangular, Pac kage Mecha ni cal Data

Symbol

Typ. Min. Max . Typ. Min. Max.

A 4.19 4.57 0.165 0.180 A1 2.54 2.79 0.100 0.110 A2 – 0.9 1 – 0.036

B 0.33 0.53 0.013 0.021 B1 0.66 0.81 0.026 0.032

C 0.246 0.261 0.0097 0.0103

D 19.94 20.19 0.785 0.795 D1 19.05 19.15 0.750 0.754 D2 17.53 18.54 0.690 0.730

E 19.94 20.19 0.785 0.795 E1 19.05 19.15 0.750 0.754 E2 17.53 18.54 0.690 0.730

e 1.27 – – 0.050 – –

R 0.89 – – 0.035 – –

N52 52 Nd 13 13 Ne 13 13

mm inches

55/61

Page 56

DSM2190F4

Table 36. Assignments – PLCC52

Pin No. Pin Assignments Pin No. Pin Assignments

1 GND 27 PA2 2 PB5 28 PA1 3 PB4 29 PA0 4 PB3 30 AD0 5 PB2 31 AD1 6 PB1 32 AD2 7 PB0 33 AD3 8 PD2 34 AD4

9 PD1 35 AD5 10 PD0 36 AD6 11 PC7 37 AD7 12 PC6 38 13 PC5 39 AD8 14 PC4 40 AD9 15 16 GND 42 AD11 17 PC3 43 AD12 18 PC2 (VSTBY) 44 AD13 19 PC1 45 AD14 20 PC0 46 AD15 21 PA7 47 CNTL0 22 PA6 48 RESET 23 PA5 49 CNTL2 24 PA4 50 CNTL1 25 PA3 51 PB7 26 GND 52 PB6

41 AD10

56/61

Page 57

PQFP52 - 52 lead Plastic Quad Flatpack, Package Outline

D D1 D2

DSM2190F4

Note: Drawing is not to scale.

QFP

PQFP52 - 52 lead Plastic Quad Flatpack, Package Mechan ical Data

Symb.

Typ. Min. M ax. Typ. Min. Max.

A 2.35 0.093 A1 0.25 0.010 A2 2.00 1.80 2 .10 0.079 0.077 0.083

b 0 .22 0.38 0.009 0.0 15

c 0.11 0 .23 0.0 04 0.009

D 13.20 12.95 13.45 0.520 0.510 0.530 D1 1 0.00 9.90 10.10 0.394 0.390 0.398 D2 7.80 – – 0.307 – –

E 13.20 12 .95 13.45 0.520 0.510 0.530 E1 10.00 9.90 10 .10 0.394 0.390 0.398 E2 7.80 – – 0.307 – –

e 0 .65 – – 0.026

L 0 .88 0.73 1.03 0.035 0.029 0.041 L1 1 .60 – – 0.063

N52 52 Nd 13 13 Ne 13 13

CP 0.10 0.0 04

mm inches

0° 7° 0° 7°

LA1 α

57/61

Page 58

DSM2190F4

Table 37. Pin Assignments – PQFP52

Pin No. Pin Assignments Pin No. Pin Assignments

1 PD2 27 AD4 2 PD1 28 AD5 3 PD0 29 AD6 4 PC7 30 AD7 5PC6 31 6 PC5 32 AD8 7 PC4 33 AD9 8

9 GND 35 AD11 10 PC3 36 AD12 11 PC2 37 AD13 12 PC1 38 AD14 13 PC0 39 AD15 14 PA7 40 CNTL0 15 PA6 41 RESET 16 PA5 42 CNTL2 17 PA4 43 CNTL1 18 PA3 44 PB7 19 GND 45 PB6 20 PA2 46 GND 21 PA1 47 PB5 22 PA0 48 PB4 23 AD0 49 PB3

34 AD10

58/61

24 AD1 50 PB2 25 AD2 51 PB1 26 AD3 52 PB0

Page 59

PART NUMBERING

Table 38. Ordering Information Scheme

Example: DSM21 90 F4 V - 15 T 6

Device Type

DSM21 = DSP System Memory for ADSP-21XX Family

DSP Applicability

90 = Analog Devices ADSP-219X family

Memory Density

F4 = 2Mbit x 8 (256K Bytes)

Operating Voltage (Vcc)

V = 3.3V ± 10%

Access Time

15 = 150 ns

DSM2190F4

Package

K = 52-pin PLCC T = 52-pin PQFP

Temperature Range

6 = –40 to 85

C (Industrial)

For a list of available options (speed, package, etc.) or for further information on any aspect of this

device, please contact your nearest ST Sales O ffice.

59/61

Page 60

DSM2190F4

REVISION HIST ORY

Table 39. Document Revision History

Date Rev. Description of Revision

27-Aug-2001 1.0 Document written 06-Nov-2001 1.1 Document released 17-Dec-2001 1.2 PQFP52 package mechanical data updated 18-Sep-2002 1.3 JTAG Debug bus separated from JTAG ISP bus

60/61

Page 61

DSM2190F4

Information furnished is believed to be accurate an d rel i able. However, STMicroelectro ni cs assumes no responsibility for the consequen ces of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implic ation or otherwise under any patent or patent ri ghts of STM i croelectr onics. Sp ecifications mentioned in thi s publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics product s are not authorized for use as cri tical comp onents in lif e support devi ces or systems without express written approv al of STMicroel ectronics.

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Datasheet DSM2190F4V Datasheet (SGS Thomson Microelectronics)

Specifications and Main Features

Frequently Asked Questions

User Manual