Datasheet DS91M040TSQX, DS91M040 Datasheet (NSC)

Page 1
May 13, 2008
DS91M040 125 MHz Quad M-LVDS Transceiver
General Description
The DS91M040 is a quad M-LVDS transceiver designed for driving / receiving clock or data signals to / from up to four multipoint networks.
M-LVDS (Multipoint LVDS) is a new family of bus interface devices based on LVDS technology specifically designed for multipoint and multidrop cable and backplane applications. It differs from standard LVDS in providing increased drive cur­rent to handle double terminations that are required in multi­point applications. Controlled transition times minimize re­flections that are common in multipoint configurations due to unterminated stubs. M-LVDS devices also have a very large input common mode voltage range for additional noise margin in heavily loaded and noisy backplane environments.
A single DS91M040 channel is a half-duplex transceiver that accepts LVTTL/LVCMOS signals at the driver inputs and con­verts them to differential M-LVDS signal levels. The receiver inputs accept low voltage differential signals (LVDS, BLVDS, M-LVDS, LVPECL and CML) and convert them to 3V LVC­MOS signals. The DS91M040 supports both M-LVDS type 1 and type 2 receiver inputs.
Features
DC - 125 MHz / 250 Mbps low jitter, low skew, low power operation
Wide Input Common Mode Voltage Range allows up to ±2V of GND noise
Conforms to TIA/EIA-899 M-LVDS Standard
Pin selectable M-LVDS receiver type (1 or 2)
Controlled transition times (2.0 ns typ) minimize reflections
8 kV ESD on M-LVDS I/O pins protects adjoining components
Flow-through pinout simplifies PCB layout
Small 5 mm x 5 mm LLP-32 space saving package
Applications
Multidrop / Multipoint clock and data distribution
High-Speed, Low Power, Short-Reach alternative to TIA/ EIA-485/422
Clock distribution in AdvancedTCA (ATCA) and MicroTCA (μTCA) backplanes
Typical Application
30042202
© 2008 National Semiconductor Corporation 300422 www.national.com
DS91M040 125 MHz Quad M-LVDS Transceiver
Page 2
Ordering Information
Order Number Receiver Input Function Package Type
DS91M040TSQ Type 1 or 2 Quad M-LVDS Transciever LLP-32
Connection Diagram
30042201
Logic Diagram
30042203
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DS91M040
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Pin Descriptions
Number Name I/O, Type Description
1, 3, 5, 7 RO O, LVCMOS Receiver output pin.
26, 28, 13, 15 RE I, LVCMOS Receiver enable pin: When RE is high, the receiver is disabled.
When RE is low, the receiver is enabled. There is a 300 k pullup resistor on this pin.
25, 27, 14, 16 DE I, LVCMOS Driver enable pin: When DE is low, the driver is disabled. When
DE is high, the driver is enabled. There is a 300 k pulldown resistor on this pin.
2, 4, 6, 8 DI I, LVCMOS Driver input pin.
31, DAP GND Power Ground pin and pad.
17, 19, 21, 23 A I/O, M-LVDS Non-inverting driver output pin/Non-inverting receiver input pin
18, 20, 22, 24 B I/O, M-LVDS Inverting driver output pin/Inverting receiver input pin
11, 12, 29, 30 V
DD
Power Power supply pin, +3.3V ± 0.3V
32 FSEN1 I, LVCMOS
Failsafe enable pin with a 300 k pullup resistor. This pin enables Type 2 receiver on inputs 0 and 2. FSEN1 = L --> Type 1 receiver inputs FSEN1 = H --> Type 2 receiver inputs
9 FSEN2 I, LVCMOS
Failsafe enable pin with a 300 k pullup resistor. This pin enables Type 2 receiver on inputs 1 and 3. FSEN2 = L --> Type 1 receiver inputs FSEN2 = H --> Type 2 receiver inputs
10 MDE I, LVCMOS Master enable pin. When MDE is H, the device is powered up.
When MDE is L, the device overrides all other control and powers down.
M-LVDS Receiver Types
The EIA/TIA-899 M-LVDS standard specifies two different types of receiver input stages. A type 1 receiver has a con­ventional threshold that is centered at the midpoint of the input amplitude, VID/2. A type 2 receiver has a built in offset that is 100mV greater then VID/2. The type 2 receiver offset acts as a failsafe circuit where open or short circuits at the input will always result in the output stage being driven to a low logic state.
30042240
FIGURE 1. M-LVDS Receiver Input Thresholds
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DS91M040
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Absolute Maximum Ratings (Note 4)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Power Supply Voltage −0.3V to +4V LVCMOS Input Voltage −0.3V to (VDD + 0.3V)
LVCMOS Output Voltage −0.3V to (VDD + 0.3V)
M-LVDS I/O Voltage −5.5V to +5.5V M-LVDS Output Short Circuit
Current Duration Continuous Junction Temperature +140°C Storage Temperature Range −65°C to +150°C Lead Temperature Range Soldering (4 sec.) +260°C Maximum Package Power Dissipation @ +25°C SQ Package 833 mW Derate SQ Package 6.67 mW/°C above +25°C Package Thermal Resistance
 θ
JA
+150°C/W
 θ
JC
+63.8°C/W
ESD Susceptibility HBM (Note 1)
8 kV
MM (Note 2)
250V
CDM (Note 3)
1250V
Note 1: Human Body Model, applicable std. JESD22-A114C
Note 2: Machine Model, applicable std. JESD22-A115-A
Note 3: Field Induced Charge Device Model, applicable std.
JESD22-C101-C
Recommended Operating Conditions
Min Typ Max Units
Supply Voltage, V
DD
3.0 3.3 3.6 V
Voltage at Any Bus Terminal −1.4 +3.8 V
 (Separate or Common-Mode) Differential Input Voltage V
ID
2.4 V
LVTTL Input Voltage High V
IH
2.0 V
DD
V
LVTTL Input Voltage Low V
IL
0 0.8 V
Operating Free Air Temperature T
A
−40 +25 +85 °C
DC Electrical Characteristics (Notes 5, 6, 7, 9)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
M-LVDS Driver
|VAB| Differential output voltage magnitude
RL = 50Ω, CL = 5 pF
480 650 mV
ΔV
AB
Change in differential output voltage magnitude between logic states
Figures 2, 4
−50 0 +50 mV
V
OS(SS)
Steady-state common-mode output voltage
RL = 50Ω, CL = 5 pF
0.3 1.6 2.1 V
V
OS(SS)
|
Change in steady-state common-mode output voltage between logic states
Figures 2, 3
0 +50 mV
V
A(OC)
Maximum steady-state open-circuit output voltage Figure 5 0 2.4 V
V
B(OC)
Maximum steady-state open-circuit output voltage
0 2.4 V
V
P(H)
Voltage overshoot, low-to-high level output (Note 12)
RL = 50Ω, CL = 5pF, CD = 0.5 pF Figures 7, 8
1.2V
SS
V
V
P(L)
Voltage overshoot, high-to-low level output (Note 12)
−0.2V
S
S
V
I
IH
High-level input current (LVTTL inputs) VIH = 2.0V -15 15
μA
I
IL
Low-level input current (LVTTL inputs) VIL = 0.8V -15 15
μA
V
CL
Input Clamp Voltage (LVTTL inputs) IIN = -18 mA -1.5 V
I
OS
Differential short-circuit output current (Note 8) Figure 6 -43 43 mA
M-LVDS Receiver
V
IT+
Positive-going differential input voltage threshold See Function Tables Type 1 16 50 mV
Type 2 100 150 mV
V
IT−
Negative-going differential input voltage threshold See Function Tables Type 1 −50 20 mV
Type 2 50 94 mV
V
OH
High-level output voltage (LVTTL output) IOH = −8mA 2.4 2.7
V
V
OL
Low-level output voltage (LVTTL output) IOL = 8mA 0.28
0.4 V
I
OZ
TRI-STATE output current VO = 0V or 3.6V −10 10
μA
I
OSR
Short-circuit receiver output current (LVTTL output) VO = 0V -50 -90 mA
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Symbol Parameter Conditions Min Typ Max Units
M-LVDS Bus (Input and Output) Pins
I
A
Transceiver input/output current VA = 3.8V, VB = 1.2V 32 µA
VA = 0V or 2.4V, VB = 1.2V −20 +20 µA
VA = −1.4V, VB = 1.2V −32 µA
I
B
Transceiver input/output current VB = 3.8V, VA = 1.2V 32 µA
VB = 0V or 2.4V, VA = 1.2V −20 +20 µA
VB = −1.4V, VA = 1.2V −32 µA
I
AB
Transceiver input/output differential current (IA − IB)
VA = VB, −1.4V V 3.8V
−4 +4 µA
I
A(OFF)
Transceiver input/output power-off current VA = 3.8V, VB = 1.2V,
DE = VCC = 1.5V
32 µA
VA = 0V or 2.4V, VB = 1.2V, DE = VCC = 1.5V
−20 +20 µA
VA = −1.4V, VB = 1.2V, DE = VCC = 1.5V
−32 µA
I
B(OFF)
Transceiver input/output power-off current VB = 3.8V, VA = 1.2V,
DE = VCC = 1.5V
32 µA
VB = 0V or 2.4V, VA = 1.2V, DE = VCC = 1.5V
−20 +20 µA
VB = −1.4V, VA = 1.2V, DE = VCC = 1.5V
−32 µA
I
AB(OFF)
Transceiver input/output power-off differential current (I
A(OFF)
− I
B(OFF)
)
VA = VB, −1.4V V 3.8V, VDD = 1.5V, DE = 1.5V
−4 +4 µA
C
A
Transceiver input/output capacitance VDD = OPEN 7.8 pF
C
B
Transceiver input/output capacitance 7.8 pF
C
AB
Transceiver input/output differential capacitance 3 pF
C
A/B
Transceiver input/output capacitance balance (CA/ CB)
1
SUPPLY CURRENT (VCC)
I
CCD
Driver Supply Current
RL = 50Ω, DE = H, RE = H
67 75 mA
I
CCZ
TRI-STATE Supply Current DE = L, RE = H 22 26 mA
I
CCR
Receiver Supply Current DE = L, RE = L 32 38 mA
I
CCPD
Power Down Supply Current MDE = L 3 5 mA
Note 4: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
Note 5: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 6: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD and ΔVOD.
Note 7: Typical values represent most likely parametric norms for VDD = +3.3V and TA = +25°C, and at the Recommended Operation Conditions at the time of product characterization and are not guaranteed.
Note 8: Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.
Note 9: CL includes fixture capacitance and CD includes probe capacitance.
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DS91M040
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Switching Characteristics (Notes 10, 11, 17)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
DRIVER AC SPECIFICATIONS
t
PLH
Differential Propagation Delay Low to High
RL = 50Ω, CL = 5 pF,
1.5 3.3 5.5 ns
t
PHL
Differential Propagation Delay High to Low
CD = 0.5 pF
1.5 3.3 5.5 ns
t
SKD1
Pulse Skew (Notes 12, 13)
Figures 7, 8
30 125 ps
t
SKD2
Channel-to-Channel Skew (Notes 12, 14)
100 200 ps
t
SKD3
Part-to-Part Skew (Notes 12, 15)
0.8 1.6 ns
t
SKD4
Part-to-Part Skew (Notes 12, 16)
4 ns
t
TLH
Rise Time (Note 12)
1.2 2.0 3.0 ns
t
THL
Fall Time (Note 12) 1.2 2.0 3.0 ns
t
PZH
Enable Time (Z to Active High)
RL = 50Ω, CL = 5 pF,
7.5 11.5 ns
t
PZL
Enable Time (Z to Active Low )
CD = 0.5 pF
8.0 11.5 ns
t
PLZ
Disable Time (Active Low to Z)
Figures 9, 10
7.0 11.5 ns
t
PHZ
Disable Time (Active High to Z)
7.0 11.5 ns
RECEIVER AC SPECIFICATIONS
t
PLH
Propagation Delay Low to High CL = 15 pF 1.5 3.0 4.5 ns
t
PHL
Propagation Delay High to Low
Figures 11, 12, 13
1.5 3.1 4.5 ns
t
SKD1A
Pulse Skew (Receiver Type 1) (Notes 12, 13)
55 325 ps
t
SKD1B
Pulse Skew (Receiver Type 2) (Notes 12, 13)
475 800 ps
t
SKD2
Channel-to-Channel Skew (Notes 12, 14)
60 300 ps
t
SKD3
Part-to-Part Skew (Notes 12, 15)
0.6 1.2 ns
t
SKD4
Part-to-Part Skew (Notes 12, 16)
3 ns
t
TLH
Rise Time (Note 12)
0.3 1.1 1.6 ns
t
THL
Fall Time (Note 12)
0.3 0.65 1.6 ns
t
PZH
Enable Time (Z to Active High)
RL = 500Ω, CL = 15 pF
3 5.5 ns
t
PZL
Enable Time (Z to Active Low)
Figures 14, 15
3 5.5 ns
t
PLZ
Disable Time (Active Low to Z)
3.5 5.5 ns
t
PHZ
Disable Time (Active High to Z)
3.5 5.5 ns
GENERIC AC SPECIFICATIONS
t
WKUP
Wake Up Time (Note 12) (Master Device Enable (MDE) time)
500 ms
f
MAX
Maximum Operating Frequency (Note 12) 125 MHz
Note 10: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 11: Typical values represent most likely parametric norms for VDD = +3.3V and TA = +25°C, and at the Recommended Operation Conditions at the time of product characterization and are not guaranteed.
Note 12: Specification is guaranteed by characterization and is not tested in production.
Note 13: t
SKD1
, |t
PLHD
− t
PHLD
|, Pulse Skew, is the magnitude difference in differential propagation delay time between the positive going edge and the negative
going edge of the same channel.
Note 14: t
SKD2
, Channel-to-Channel Skew, is the difference in propagation delay (t
PLHD
or t
PHLD
) among all output channels.
Note 15: t
SKD3
, Part-to-Part Skew, is defined as the difference between the minimum and maximum differential propagation delays. This specification applies to
devices at the same VDD and within 5°C of each other within the operating temperature range.
Note 16: t
SKD4
, Part-to-Part Skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over
recommended operating temperature and voltage ranges, and across process distribution. t
SKD4
is defined as |Max − Min| differential propagation delay.
Note 17: CL includes fixture capacitance and CD includes probe capacitance.
Note 18: Measured on a clock edge with a histogram and an acummulation of 1500 histogram hits. Input stimulus jitter is subracted geometrically.
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Test Circuits and Waveforms
30042214
FIGURE 2. Differential Driver Test Circuit
30042224
FIGURE 3. Differential Driver Waveforms
30042222
FIGURE 4. Differential Driver Full Load Test Circuit
30042212
FIGURE 5. Differential Driver DC Open Test Circuit
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30042225
FIGURE 6. Differential Driver Short-Circuit Test Circuit
30042216
FIGURE 7. Driver Propagation Delay and Transition Time Test Circuit
30042218
FIGURE 8. Driver Propagation Delays and Transition Time Waveforms
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30042219
FIGURE 9. Driver TRI-STATE Delay Test Circuit
30042221
FIGURE 10. Driver TRI-STATE Delay Waveforms
30042215
FIGURE 11. Receiver Propagation Delay and Transition Time Test Circuit
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30042217
FIGURE 12. Type 1 Receiver Propagation Delay and Transition Time Waveforms
30042223
FIGURE 13. Type 2 Receiver Propagation Delay and Transition Time Waveforms
30042213
FIGURE 14. Receiver TRI-STATE Delay Test Circuit
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30042220
FIGURE 15. Receiver TRI-STATE Delay Waveforms
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DS91M040
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Truth Tables
DS91M040 Transmitting
Inputs Outputs
RE DE DI B A
X H H L H
X H L H L
X L X Z Z
X — Don't care condition Z — High impedance state
DS91M040 as Type 1 Receiving
Inputs Output
FSEN RE DE A − B RO
L L L
+0.05V
H
L L L
−0.05V
L
L L L 0V X
L H L X Z
X — Don't care condition Z — High impedance state
DS91M040 as Type 2 Receiving
Inputs Output
FSEN RE DE A − B R
H L L
+0.15V
H
H L L
+0.05V
L
H L L 0V L
H H L X Z
X — Don't care condition Z — High impedance state
DS91M040 Type 1 Receiver Input Threshold Test Voltages
Applied Voltages Resulting Differential Input
Voltage
Resulting Common-Mode
Input Voltage
Receiver
Output
V
IA
V
IB
V
ID
V
ICM
R
2.400V 0.000V 2.400V 1.200V H
0.000V 2.400V −2.400V 1.200V L
3.800V 3.750V 0.050V 3.775V H
3.750V 3.800V −0.050V 3.775V L
−1.350V −1.400V 0.050V −1.375V H
−1.400V −1.350V −0.050V −1.375V L
H — High Level L — Low Level Output state assumes that the receiver is enabled (RE = L)
DS91M040 Type 2 Receiver Input Threshold Test Voltages
Applied Voltages Resulting Differential Input
Voltage
Resulting Common-Mode
Input Voltage
Receiver
Output
V
IA
V
IB
V
ID
V
IC
R
2.400V 0.000V 2.400V 1.200V H
0.000V 2.400V −2.400V 1.200V L
3.800V 3.650V 0.150V 3.725V H
3.800V 3.750V 0.050V 3.775V L
−1.250V −1.400V 0.150V −1.325V H
−1.350V −1.400V 0.050V −1.375V L
H — High Level L — Low Level Output state assumes that the receiver is enabled (RE
= L)
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Typical Performance
30042250
Driver Rise Time as a Function of Temperature
30042251
Driver Fall Time as a Function of Temperature
30042258
Driver Output Signal Amplitude as a Function of
Resistive Load
30042252
Driver Propagation Delay (tPLHD) as a Function of
Temperature
30042253
Driver Propagation Delay (tPHLD) as a Function of
Temperature
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30042254
Driver Power Supply Current as a Function of Frequency
30042255
Receiver Power Supply Current as a Function of
Frequency
30042256
Receiver Propagation Delay (tPLHD) as a Function of
Input Common Mode Voltage
30042257
Receiver Propagation Delay (tPHLD) as a Function of
Input Common Mode Voltage
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DS91M040
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Physical Dimensions inches (millimeters) unless otherwise noted
Order Number DS91M040TSQ
See NS package Number SQA32A
(See AN-1187 for PCB Design and Assembly Recommendations)
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Notes
DS91M040 125 MHz Quad M-LVDS Transceiver
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