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DS90LV047A
3V LVDS Quad CMOS Differential Line Driver
General Description
The DS90LV047Ais a quad CMOS flow-through differential
line driver designed for applications requiring ultra low power
dissipation and high data rates. The device is designed to
support data rates in excess of 400 Mbps (200 MHz) utilizing
Low Voltage Differential Signaling (LVDS) technology.
The DS90LV047A accepts low voltage TTL/CMOS input levels and translates them to low voltage (350 mV) differential
output signals. In addition, the driver supports a TRI-STATE
®
function that may be used to disable the output stage, disabling the load current, and thus dropping the device to an
ultra low idle power state of 13 mW typical. The
DS90LV047Ahasaflow-through pinout for easy PCB layout.
The EN and EN* inputs are ANDed together and control the
TRI-STATE outputs. The enables are common to all four
drivers. The DS90LV047A and companion line receiver
(DS90LV048A) provide a new alternative to high power
psuedo-ECL devices for high speed point-to-point interface
applications.
Features
n
>
400 Mbps (200 MHz) switching rates
n Flow-through pinout simplifies PCB layout
n 300 ps typical differential skew
n 400 ps maximum differential skew
n 1.7 ns maximum propagation delay
n 3.3V power supply design
n
±
350 mV differential signaling
n Low power dissipation (13mW at 3.3V static)
n Interoperable with existing 5V LVDS receivers
n High impedance on LVDS outputs on power down
n Conforms to TIA/EIA-644 LVDS Standard
n Industrial operating temperature range (−40˚C to +85˚C)
n Available in surface mount (SOIC) and low profile
TSSOP package
Connection Diagram Functional Diagram
Truth Table
ENABLES INPUT OUTPUTS
EN EN
*
D
IN
D
OUT+
D
OUT−
H L or Open L L H
HHL
All other combinations of ENABLE inputs X Z Z
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
Dual-In-Line
DS100887-1
Order Number DS90LV047ATM, DS90LV047ATMTC
See NS Package Number M16A, MTC16
DS100887-2
July 1999
DS90LV047A 3V LVDS Quad CMOS Differential Line Driver
© 1999 National Semiconductor Corporation DS100887 www.national.com
Page 2
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CC
) −0.3V to +4V
Input Voltage (D
IN
) −0.3V to (VCC+ 0.3V)
Enable Input Voltage (EN, EN
*
) −0.3V to (VCC+ 0.3V)
Output Voltage (D
OUT+,DOUT−
) −0.3V to +3.9V
Short Circuit Duration
(D
OUT+,DOUT−
) Continuous
Maximum Package Power Dissipation
@
+25˚C
M Package 1088 mW
MTC Package 866 mW
Derate M Package 8.5 mW/˚C above +25˚C
Derate MTC Package 6.9 mW/˚C above +25˚C
Storage Temperature Range −65˚C to +150˚C
Lead Temperature Range
Soldering (4 sec.) +260˚C
Maximum Junction Temperature +150˚C
ESD Rating (Note 10)
(HBM, 1.5 kΩ, 100 pF) ≥ 10 kV
(EIAJ, 0 Ω, 200 pF) ≥ 1200 V
Recommended Operating
Conditions
Min Typ Max Units
Supply Voltage (V
CC
) +3.0 +3.3 +3.6 V
Operating Free Air
Temperature (T
A
) −40 +25 +85 ˚C
Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified. (Notes 2, 3, 4)
Symbol Parameter Conditions Pin Min Typ Max Units
V
OD1
Differential Output Voltage R
L
=
100Ω (
Figure 1
)D
OUT−
D
OUT+
250 310 450 mV
∆V
OD1
Change in Magnitude of V
OD1
for Complementary Output
States
1 35 |mV|
V
OS
Offset Voltage 1.125 1.17 1.375 V
∆V
OS
Change in Magnitude of VOSfor
Complementary Output States
1 25 |mV|
V
OH
Output High Voltage 1.33 1.6 V
V
OL
Output Low Voltage 0.90 1.02 V
V
IH
Input High Voltage DIN,
EN,
EN*
2.0 V
CC
V
V
IL
Input Low Voltage GND 0.8 V
I
IH
Input High Current V
IN
=
V
CC
or 2.5V −10 2 +10 µA
I
IL
Input Low Current V
IN
=
GND or 0.4V −10 −2 +10 µA
V
CL
Input Clamp Voltage I
CL
=
−18 mA −1.5 −0.8 V
I
OS
Output Short Circuit Current
(Note 11)
ENABLED,
D
IN=VCC,DOUT+
=0Vor
D
IN
= GND, D
OUT−
=0V
D
OUT−
D
OUT+
−4.2 −9.0 mA
I
OSD
Differential Output Short Circuit
Current (Note 11)
ENABLED, VOD= 0V −4.2 −9.0 mA
I
OFF
Power-off Leakage V
OUT
=
0V or 3.6V, V
CC
=
0V
or Open
−20
±
1 +20 µA
I
OZ
Output TRI-STATE Current EN = 0.8V and EN* = 2.0V
V
OUT
=
0V or V
CC
−10
±
1 +10 µA
I
CC
No Load Supply current Drivers
Enabled
DIN=VCCor GND V
CC
4.0 8.0 mA
I
CCL
Loaded Supply Current Drivers
Enabled
RL= 100Ω All Channels, DIN=
V
CC
or GND (all inputs)
20 30 mA
I
CCZ
No Load Supply Current Drivers
Disabled
DIN=VCCor GND, EN =
GND, EN* = V
CC
2.2 6.0 mA
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Switching Characteristics
V
CC
=
+3.3V
±
10%,T
A
=
−40˚C to +85˚C (Notes 3, 9, 12)
Symbol Parameter Conditions Min Typ Max Units
t
PHLD
Differential Propagation Delay High to Low R
L
=
100Ω,C
L
=
15 pF
(
Figure 2
and
Figure 3
)
0.5 0.9 1.7 ns
t
PLHD
Differential Propagation Delay Low to High 0.5 1.2 1.7 ns
t
SKD1
Differential Pulse Skew |t
PHLD−tPLHD
|
(Note 5)
0 0.3 0.4 ns
t
SKD2
Channel-to-Channel Skew (Note 6) 0 0.4 0.5 ns
t
SKD3
Differential Part to Part Skew (Note 7) 0 1.0 ns
t
SKD4
Differential Part to Part Skew (Note 8) 0 1.2 ns
t
TLH
Rise Time 0.5 1.5 ns
t
THL
Fall Time 0.5 1.5 ns
t
PHZ
Disable Time High to Z R
L
=
100Ω,C
L
=
15 pF
(
Figure 4
and
Figure 5
)
25ns
t
PLZ
Disable Time Low to Z 2 5 ns
t
PZH
Enable Time Z to High 3 7 ns
t
PZL
Enable Time Z to Low 3 7 ns
f
MAX
Maximum Operating Frequency (Note 14) 200 250 MHz
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except: V
OD1
and
∆V
OD1
.
Note 3: All typicals are given for: V
CC
=
+3.3V, T
A
=
+25˚C.
Note 4: The DS90LV047Aisa current mode device and only functions within datasheet specifications when a resistive load is applied to the driver outputs typical
range is (90Ω to 110Ω).
Note 5: t
SKD1|tPHLD−tPLHD
| is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the
same channel.
Note 6: t
SKD2
is the Differential Channel-to-Channel Skew of any event on the same device.
Note 7: t
SKD3
, Differential Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This speci-
fication applies to devices at the same V
CC
and within 5˚C of each other within the operating temperature range.
Note 8: t
SKD4
, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over recommended
operating temperature and voltage ranges, and across process distribution. t
SKD4
is defined as |Max − Min| differential propagation delay.
Note 9: Generator waveform for all tests unless otherwise specified: f=1 MHz, Z
O
=
50Ω,t
r
≤1 ns, and tf≤ 1 ns.
Note 10: ESD Ratings:
HBM (1.5 kΩ, 100 pF) ≥ 10 kV
EIAJ (0 Ω, 200 pF) ≥ 1200 V
Note 11: Output short circuit current (I
OS
) is specified as magnitude only, minus sign indicates direction only.
Note 12: C
L
includes probe and jig capacitance.
Note 13: All input voltages are for one channel unless otherwise specified. Other inputs are set to GND.
Note 14: f
MAX
generator input conditions: t
r
=
t
f
<
1ns(0%to 100%), 50%duty cycle, 0V to 3V.OutputCriteria:dutycycle=45%/55%, VOD>250mV,allchannels
switching.
Parameter Measurement Information
DS100887-3
FIGURE 1. Driver VODand VOSTest Circuit
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Parameter Measurement Information (Continued)
DS100887-4
FIGURE 2. Driver Propagation Delay and Transition Time Test Circuit
DS100887-5
FIGURE 3. Driver Propagation Delay and Transition Time Waveforms
DS100887-6
FIGURE 4. Driver TRI-STATE Delay Test Circuit
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Parameter Measurement Information (Continued)
Typical Application
Applications Information
General application guidelines and hints for LVDS drivers
and receivers may be found in the following application
notes: LVDS Owner’s Manual (lit #550062-001), AN808,
AN977, AN971, AN916, AN805, AN903.
LVDSdriversand receivers are intendedto be primarily used
in an uncomplicated point-to-point configuration as is shown
in
Figure 6
. This configuration provides a clean signaling environment for the fast edge rates of the drivers. The receiver
is connected to the driver through a balanced media which
may be a standard twisted pair cable, a parallel pair cable, or
simply PCB traces. Typically, the characteristic differential
impedance of the media is in the range of 100Ω. A termination resistor of 100Ω (selected to match the media), and is located as close to the receiver input pins as possible. The termination resistor converts the driver output current (current
mode) into a voltage that is detected by the receiver. Other
configurations are possible such as a multi-receiver configuration, but the effects of a mid-stream connector(s), cable
stub(s), and other impedance discontinuities as well as
ground shifting, noise margin limits, and total termination
loading must be taken into account.
The DS90LV047A differential line driver is a balanced current source design. A current mode driver, generally speaking has a high output impedance and supplies a constant
current for a range of loads (a voltage mode driver on the
other hand supplies a constant voltage for a range of loads).
Current is switched through the load in one direction to produce a logic state and in the other direction to produce the
other logic state. The output current is typically 3.1 mA, a
minimum of 2.5 mA, and a maximum of 4.5 mA. The current
mode driver requires (as discussed above) that a resistive
termination be employed to terminate the signal and to complete the loop as shown in
Figure 6
.AC or unterminated configurations are not allowed. The 3.1 mA loop current will develop a differential voltage of 310mV across the 100Ω
termination resistor which the receiver detects with a 250mV
minimum differential noise margin, (driven signal minus receiver threshold (250mV – 100mV=150mV)). The signal is
centered around +1.2V (Driver Offset, V
OS
) with respect to
ground as shown in
Figure 7
. Note that the steady-state volt-
age (V
SS
) peak-to-peak swing is twice the differentialvoltage
(V
OD
) and is typically 620mV.
The current mode driver provides substantial benefits over
voltage mode drivers, such as an RS-422 driver. Its quiescent current remains relatively flat versus switching frequency.Whereas the RS-422 voltage mode driver increases
exponentially in most case between 20 MHz–50 MHz. This
is due to the overlap current that flows between the rails of
the device when the internal gates switch. Whereas the current mode driver switches a fixed current between its output
without any substantial overlap current. This is similar to
some ECL and PECL devices, but without the heavy static
I
CC
requirements of the ECL/PECL designs. LVDS requires
>
80%less current than similar PECL devices. AC specifications for the driver are a tenfold improvement over other existing RS-422 drivers.
DS100887-7
FIGURE 5. Driver TRI-STATE Delay Waveform
DS100887-8
FIGURE 6. Point-to-Point Application
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Page 6
Applications Information (Continued)
The TRI-STATE function allows the driver outputs to be disabled, thus obtaining an even lower power state when the
transmission of data is not required.
The DS90LV047A has a flow-through pinout that allows for
easy PCB layout. The LVDS signals on one side of the device easily allows for matching electrical lengths of the differential pair trace lines between the driver and the receiver as
well as allowing the trace lines to be close together to couple
noise as common-mode. Noise isolation is achieved with the
LVDS signals on one side of the device and the TTL signals
on the other side.
Power Decoupling Recommendations:
Bypass capacitors must be used on power pins. Use high
frequency ceramic (surface mount is recommended) 0.1µF
and 0.001µF capacitors in parallel at the power supply pin
with the smallest value capacitor closest to the device supply
pin. Additional scattered capacitors over the printed circuit
board will improve decoupling. Multiple vias should be used
to connect the decoupling capacitors to the power planes. A
10µF (35V) or greater solid tantalum capacitor should be
connected at the power entry point on the printed circuit
board between the supply and ground.
PC Board considerations:
Use at least 4 PCB layers (top to bottom); LVDS signals,
ground, power, TTL signals.
Isolate TTL signals from LVDS signals, otherwise the TTL
may couple onto the LVDS lines. It is best to put TTL and
LVDS signals on different layers which are isolated by a
power/ground plane(s).
Keep drivers and receivers as close to the (LVDS port side)
connectors as possible.
Differential Traces:
Use controlled impedance traces which match the differential impedance of your transmission medium (ie. cable) and
termination resistor. Run the differential pair trace lines as
close together as possible as soon as they leave the IC
(stubs should be
<
10mm long). This will help eliminate reflections and ensure noise is coupled as common-mode. In
fact, we have seen that differential signals which are 1mm
apart radiate far less noise than traces 3mm apart since
magnetic field cancellation is much better with the closer
traces. In addition, noise induced on the differential lines is
much more likely to appear as common-mode which is rejected by the receiver.
Match electrical lengths between traces to reduce skew.
Skew between the signals of a pair means a phase difference between signals which destroys the magnetic field cancellation benefits of differential signals and EMI will result.
(Note the velocity of propagation, v = c/Er where c (the
speed of light) = 0.2997mm/ps or 0.0118 in/ps). Do not rely
solely on the autoroute function for differential traces. Carefully review dimensions to match differential impedance and
provide isolation for the differential lines. Minimize the number or vias and other discontinuities on the line.
Avoid 90˚ turns (these cause impedance discontinuities).
Use arcs or 45˚ bevels.
Within a pair of traces, the distance between the two traces
should be minimized to maintain common-mode rejection of
the receivers. On the printed circuit board, this distance
should remain constant to avoid discontinuities in differential
impedance. Minor violations at connection points are allowable.
Termination:
Use a termination resistor which best matches the differential impedance or your transmission line. The resistor should
be between 90Ω and 130Ω. Remember that the current
mode outputs need the termination resistor to generate the
differential voltage. LVDS will not work without resistor termination. Typically, connecting a single resistor across the pair
at the receiver end will suffice.
Surface mount 1%to 2%resistors are best. PCB stubs,
component lead, and the distance from the termination to the
receiver inputs should be minimized. The distance between
the termination resistor and the receiver should be
<
10mm
(12mm MAX).
Probing LVDS Transmission Lines:
Always use high impedance (
>
100kΩ), low capacitance
(
<
2 pF) scope probes with a wide bandwidth (1 GHz)
scope. Improper probing will give deceiving results.
Cables and Connectors, General Comments:
When choosing cable and connectors for LVDS it is important to remember:
Use controlled impedance media. The cables and connectors you use should have a matched differential impedance
of about 100Ω. They should not introduce major impedance
discontinuities.
Balanced cables (e.g. twisted pair) are usually better than
unbalanced cables (ribbon cable, simple coax.) for noise reduction and signal quality. Balanced cables tend to generate
less EMI due to field canceling effects and also tend to pick
up electromagnetic radiation a common-mode (not differential mode) noise which is rejected by the receiver.
For cable distances
<
0.5M, most cables can be made to
work effectively. For distances 0.5M ≤ d ≤ 10M, CAT 3 (category 3) twisted pair cable works well, is readily available
and relatively inexpensive.
Fail-Safe Feature:
The LVDS receiver is a high gain, high speed device that
amplifies a small differential signal (20mV) to CMOS logic
levels. Due to the high gain and tight threshold of the receiver,care should be taken to prevent noise from appearing
as a valid signal.
The receiver’s internal fail-safe circuitry is designed to
source/sink a small amount of current, providing fail-safe
protection (a stable known state of HIGH output voltage) for
floating, terminated or shorted receiver inputs.
1. Open Input Pins. The DS90LV048A is a quad receiver
device, and if an application requires only 1, 2 or 3 receivers, the unused channel(s) inputs should be left
OPEN. Do not tie unused receiver inputs to ground or
any other voltages. The input is biased by internal high
value pull up and pull down resistors to set the output to
a HIGH state. This internal circuitry will guarantee a
HIGH, stable output state for open inputs.
2. Terminated Input. If the driver is disconnected (cable
unplugged), or if the driver is in a TRI-STATE or poweroff condition, the receiver output will again be in a HIGH
state, even with the end of cable 100Ω termination resistor across the input pins. The unplugged cable can become a floating antenna which can pick up noise. If the
cable picks up more than 10mV of differential noise, the
receiver may see the noise as a valid signal and switch.
To insure that any noise is seen as common-mode and
not differential, a balanced interconnect should be used.
Twisted pair cable will offer better balance than flat ribbon cable.
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Applications Information (Continued)
3. Shorted Inputs. If a fault condition occurs that shorts
the receiver inputs together, thus resulting in a 0V differential input voltage, the receiver output will remain in a
HIGH state. Shorted input fail-safe is not supported
across the common-mode range of the device (GND to
2.4V). It is only supported with inputs shorted and no external common-mode voltage applied.
External lower value pull up and pull down resistors (for a
stronger bias) may be used to boost fail-safe in the presence
of higher noise levels. The pull up and pull down resistors
should be in the 5kΩ to 15kΩ range to minimize loading and
waveform distortion to the driver. The common-mode bias
point should be set to approximately 1.2V (less than 1.75V)
to be compatible with the internal circuitry.
Pin Descriptions
Pin No. Name Description
2, 3, 6, 7 D
IN
Driver input pin, TTL/CMOS
compatible
10, 11, 14,15D
OUT+
Non-inverting driver output pin,
LVDS levels
9, 12, 13,16D
OUT−
Inverting driver output pin, LVDS
levels
1 EN Driver enable pin: When EN is
low, the driver is disabled. When
EN is high and EN
*
is low or
open, the driver is enabled. If
both EN and EN
*
are open
circuit, then the driver is
disabled.
Pin No. Name Description
8EN
*
Driver enable pin: When EN*is
high, the driver is disabled.
When EN
*
is low or open and
EN is high, the driver is enabled.
If both EN and EN
*
are open
circuit, then the driver is
disabled.
4V
CC
Power supply pin, +3.3V±0.3V
5 GND Ground pin
Ordering Information
Operating Package Type/ Order Number
Temperature Number
−40˚C to +85˚C SOP/M16A DS90LV047ATM
−40˚C to +85˚C TSSOP/MTC16 DS90LV047ATMTC
DS100887-9
FIGURE 7. Driver Output Levels
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Typical Performance Curves
Output High Voltage vs
Power Supply Voltage
DS100887-14
Output Low Voltage vs
Power Supply Voltage
DS100887-15
Output Short Circuit Current vs
Power Supply Voltage
DS100887-16
Output TRI-STATE Current vs
Power Supply Voltage
DS100887-17
Differential Output Voltage
vs Power Supply Voltage
DS100887-18
Differential Output Voltage
vs Load Resistor
DS100887-19
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Typical Performance Curves (Continued)
Offset Voltage vs
Power Suppy Voltage
DS100887-20
Power Supply Current
vs Frequency
DS100887-21
Power Supply Current vs
Power Supply Voltage
DS100887-22
Power Supply Current vs
Ambient Temperature
DS100887-23
Differential Propagation Delay vs
Power Supply Voltage
DS100887-24
Differential Propagation Delay vs
Ambient Temperature
DS100887-25
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Page 10
Typical Performance Curves (Continued)
Differential Skew vs
Power Supply Voltage
DS100887-26
Differential Skew vs
Ambient Temperature
DS100887-27
Transition Time vs
Power Supply Voltage
DS100887-28
Transition Time vs
Ambient Temperature
DS100887-29
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Page 11
Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead (0.150" Wide) Molded Small Outline Package, JEDEC
Order Number DS90LV047ATM
NS Package Number M16A
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Page 12
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National Semiconductor
Corporation
Americas
Tel: 1-800-272-9959
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Tel: 81-3-5639-7560
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www.national.com
16-Lead (0.100" Wide) Molded Thin Shrink Small Outline Package, JEDEC
Order Number DS90LV047ATMTC
NS Package Number MTC16
DS90LV047A 3V LVDS Quad CMOS Differential Line Driver
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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