Datasheet DS90LV032A Datasheet (National Semiconductor)

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DS90LV032A 3V LVDS Quad CMOS Differential Line Receiver
DS90LV032A 3V LVDS Quad CMOS Differential Line Receiver
July 1999
General Description
The DS90LV032Ais a quad CMOS differential line receiver designed for applications requiring ultra low power dissipa­tion and high data rates. The device is designed to support data rates in excess of 400 Mbps (200 MHz) utilizing Low Voltage Differential Signaling (LVDS) technology.
The DS90LV032A and companion LVDS line driver (eg. DS90LV031A) provide a new alternative to high power PECL/ECL devices for high speed point-to-point interface applications.
®
function that
Features
>
n
400 Mbps (200 MHz) switching rates
n 0.1 ns channel-to-channel skew (typical) n 0.1 ns differential skew (typical) n 3.3 ns maximum propagation delay n 3.3V power supply design n Power down high impedance on LVDS inputs n Low Power design (40mW 3.3V static) n Interoperable with existing 5V LVDS networks n Accepts small swing (350 mV typical) VID n Supports open, short and terminated input fail-safe n Compatible with ANSI/TIA/EIA-644 n Industrial temp. operating range (-40˚C to +85˚C) n Available in SOIC and TSSOP Packaging
Connection Diagram Functional Diagram
Dual-in-Line
DS100067-1
Order Number DS90LV032ATM
See NS Package Number M16A or MTC16
or DS90LV032ATMTC
DS100067-2
ENABLES INPUTS OUTPUT
EN EN* R
LH X Z All other combinations V of ENABLE inputs V
© 1999 National Semiconductor Corporation DS100067 www.national.com
IN+−RIN−
0.1V H
ID
−0.1V L
ID
Full Fail-safe
OPEN/SHORT H
or Terminated
R
OUT
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Supply Voltage (V Input Voltage (R Enable Input Voltage (EN, EN*) −0.3V to (V Output Voltage (R
Maximum Package Power Dissipation +25˚C
M Package 1025 mW MTC Package 866 mW Derate M Package 8.2 mW/˚C above +25˚C Derate MTC Package 6.9 mW/˚C above +25˚C
Storage Temperature Range −65˚C to +150˚C
) −0.3V to +4V
CC
) −0.3V to +3.9V
IN+,RIN−
) −0.3V to (VCC+ 0.3V)
OUT
CC
+ 0.3V)
(Soldering 4 sec.) +260˚C
Maximum Junction Temperature +150˚C
ESD Rating (Note 10)
(HBM 1.5 k, 100 pF) 4.5 kV (EIAJ 0 , 200 pF) 250 V
Recommended Operating Conditions
Supply Voltage (V
) +3.0 +3.3 +3.6 V
CC
Receiver Input Voltage GND +3.0 V Operating Free Air
Temperature (T
) −40 25 +85 ˚C
A
Min Typ Max Units
Lead Temperature Range
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Note 2)
Symbol Parameter Conditions Pin Min Typ Max Units
V V
Differential Input High Threshold VCM= +1.2V
TH
Differential Input Low Threshold −100 −20 mV
TL
(Note 13)
VCMR Common-Mode Voltage Range VID=200 mV peak to peak (Note 5) 0.1 2.3 V I
V
V I I V V I
V I
Input Current VIN= +2.8V VCC= 3.6V or 0V −10
IN
Output High Voltage IOH= −0.4 mA, VID= +200 mV R
OH
Output Low Voltage IOL= 2 mA, VID= −200 mV 0.1 0.25 V
OL
Output Short Circuit Current Enabled, V
OS
Output TRI-STATE Current Disabled, V
OZ
Input High Voltage EN,
IH
Input Low Voltage GND 0.8 V
IL
Input Current VIN=0VorVCC, Other Input = VCCor
I
Input Clamp Voltage ICL= −18 mA −1.5 −0.8 V
CL
No Load Supply Current EN, EN* = VCCor GND, Inputs Open V
CC
V
= 0V −10
IN
V
= +3.6V VCC= 0V -20 +20 µA
IN
I
= −0.4 mA, Input terminated 2.7 3.0 V
OH
I
= −0.4 mA, Input shorted 2.7 3.0 V
OH
= 0V (Note 11) −15 −48 −120 mA
OUT
=0VorV
OUT
CC
GND
Receivers Enabled EN, EN* = 2.4V or 0.5V, Inputs Open 10 15 mA
I
No Load Supply Current
CCZ
Receivers Disabled
EN = GND, EN* = VCC, Inputs Open 3 5 mA
R
,
IN+
R
IN−
2.7 3.0 V
OUT
−10
2.0 V
EN*
−10
CC
+20 +100 mV
±
1 +10 µA
±
1 +10 µA
±
1 +10 µA
CC
±
1 +10 µA
10 15 mA
V
Switching Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Notes 3, 4, 7, 8)
Symbol Parameter Conditions Min Typ Max Units
t t t t
t t t t
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Differential Propagation Delay High to Low CL= 10 pF 1.8 3.3 ns
PHLD
Differential Propagation Delay Low to High VID= 200 mV 1.8 3.3 ns
PLHD
Differential Pulse Skew |t
SKD1
Differential Channel-to-Channel Skew-same device
SKD2
(Note 7) Differential Part to Part Skew (Note 8) 1.0 ns
SKD3
Differential Part to Part Skew (Note 9) 1.5 ns
SKD4
Rise Time 0.35 1.2 ns
TLH
Fall Time 0.35 1.2 ns
THL
PHLD−tPLHD
| (Note 6) (
Figure 1
and
Figure 2
) 0 0.1 0.35 ns
0 0.1 0.5 ns
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Switching Characteristics (Continued)
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Parameter Measurement Information (Continued)
CLincludes load and test jig capacitance.
for t
, and t
S
1=VCC
= GND for t
S
1
PZL
PZH
and t
measurements.
PLZ
measurements.
PHZ
Typical Application
DS100067-5
FIGURE 3. Receiver TRI-STATE Delay Test Circuit
DS100067-6
FIGURE 4. Receiver TRI-STATE Delay Waveforms
Balanced System
FIGURE 5. Point-to-Point Application
Applications Information
General application guidelines and hints for LVDS drivers and receivers may be found in the following application notes: LVDS Owner’s Manual (lit #550062-001), AN808, AN1035, AN977, AN971, AN916, AN805, AN903.
LVDSdriversand receivers are intended to be primarily used in an uncomplicated point-to-point configuration as is shown in
Figure 5
vironment for the fast edge rates of the drivers . The receiver is connected to the driver through a balanced media which may be a standard twisted pair cable, a parallel pair cable, or simply PCB traces. Typically the characteristic impedance of
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. This configuration provides a clean signaling en-
DS100067-7
the media is in the range of 100. A termination resistor of 100should be selected to match the media, and is located as close to the receiver input pins as possible. The termina­tion resistor converts the driver output (current mode) into a voltage that is detected by the receiver.Other configurations are possible such as a multi-receiver configuration, but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities as well as ground shifting, noise margin limits, and total termination loading must be taken into account.
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Applications Information (Continued)
The DS90LV032Adifferential line receiver is capable of de­tecting signals as low as 100 mV, over a range centered around +1.2V. This is related to the driver off­set voltage which is typically +1.2V.The driven signal is cen­tered around this voltage and may shift ter point. The potential difference between the driver’s ground reference and the receiver’s ground reference, the common-mode ef­fects of coupled noise, or a combination of the two. Both re­ceiver input pins have a recommended operating input volt­age range of 0V to +2.4V (measured from each pin to ground), exceeding these limits may turn on the ESD protec­tion circuitry which will clamp the bus voltages.
Power Decoupling Recommendations:
PC Board considerations:
Use at least 4 PCB layers (top to bottom); LVDS signals, ground, power, TTL signals.
Isolate TTL signals from LVDS signals, otherwise the TTL may couple onto the LVDS lines. It is best to put TTL and
±
1V shifting may be the result of a ground
±
1V common-mode
±
1V around this cen-
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Applications Information (Continued)
3. Shorted Inputs. If a fault condition occurs that shorts the receiver inputs together, thus resulting in a 0V differ­ential input voltage, the receiver output will remain in a HIGH state. Shorted input fail-safe is not supported across the common-mode range of the device (GND to
2.4V). It is only supported with inputs shorted and no ex­ternal common-mode voltage applied.
External lower value pull up and pull down resistors (for a stronger bias) may be used to boost fail-safe in the presence of higher noise levels. The pull up and pull down resistors should be in the 5kto 15krange to minimize loading and waveform distortion to the driver. The common-mode bias point should be set to approximately 1.2V (less than 1.75V) to be compatible with the internal circuitry.
Pin Descriptions
Pin
Name Description
No.
2, 6, R
Non-inverting receiver input pin
IN+
Pin
Name Description
No.
10, 14
1, 7, R
Inverting receiver input pin
IN−
9, 15
3, 5, R
Receiver output pin
OUT
11, 13
4 EN Active high enable pin, OR-ed with
EN* 12 EN* Active low enable pin, OR-ed with EN 16 V
Power supply pin, +3.3V±0.3V
CC
8 GND Ground pin
Ordering Information
Operating Package Type/ Order Number
Temperature Number
−40˚C to +85˚C SOP/M16A DS90LV032ATM
−40˚C to +85˚C TSSOP/MTC16 DS90LV032ATMTC
FIGURE 6. ICC vs Frequency, four channels switching
FIGURE 7. Typical Common-Mode Range variation with respect to amplitude of differential input
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DS100067-8
DS100067-9
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Applications Information (Continued)
FIGURE 8. Typical Pulse Skew variation versus common-mode voltage
DS100067-10
DS100067-11
FIGURE 9. Variation in High to Low Propagation Delay versus VCM
DS100067-12
FIGURE 10. Variation in Low to High Propagation Delay versus VCM
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Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead (0.150" Wide) Molded Small Outline Package, JEDEC
Order Number DS90LV032ATM
NS Package Number M16A
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
DS90LV032A 3V LVDS Quad CMOS Differential Line Receiver
16-Lead (0.100" Wide) Molded Thin Shrink Small Outline Package, JEDEC
Order Number DS90LV032ATMTC
NS Package Number MTC16
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labeling, can be reasonably expected to result in a significant injury to the user.
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