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DS90CR286A/DS90CR216A
+3.3V Rising Edge Data Strobe LVDS Receiver 28-Bit
Channel Link—66 MHz, +3.3V Rising Edge Strobe
LVDS Receiver 21-Bit Channel Link—66 MHz
General Description
The DS90CR286A receiver converts the four LVDS data
streams (Up to 1.848 Gbps throughput or 231 Megabytes/
sec bandwidth) back into parallel 28 bits of CMOS/TTL data.
Also available is the DS90CR216A that converts the three
LVDS data streams (Up to 1.386 Gbps throughput or 173
Megabytes/sec bandwidth) back into parallel 21 bits of
CMOS/TTL data. Both Receivers’ outputs are Rising edge
strobe.
This chipset is an ideal means to solve EMI and cable size
problems associated with wide, high speed TTL interfaces.
Features
n 20 to 66 MHz shift clock support
n 50%duty cycle on receiver output clock
n Best–in–Class Set & Hold Times on RxOUTPUTs
n Rx power consumption
<
270 mW (typ)@66MHz Worst
Case
n Rx Power-down mode
<
200µW (max)
n ESD rating
>
7 kV (HBM),>700V (EIAJ)
n PLL requires no external components
n Compatible with TIA/EIA-644 LVDS standard
n Low profile 56-lead or 48-lead TSSOP package
n Operating Temperature: −40˚C to +85˚C
Block Diagrams
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
DS90CR286A
DS100873-30
Order Number DS90CR286AMTD
See NS Package Number MTD56
DS90CR216A
DS100873-31
Order Number DS90CR216AMTD
See NS Package Number MTD48
June 1999
DS90CR286A/DS90CR216A +3.3V Rising Edge Data Strobe LVDS Receiver 28-Bit Channel
Link— 66 MHz, +3.3V Rising Edge Data Strobe LVDS Receiver 21-Bit Channel Link—66 MHz
© 2000 National Semiconductor Corporation DS100873 www.national.com
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CC
) −0.3V to +4V
CMOS/TTL Output Voltage −0.3V to (V
CC
+ 0.3V)
LVDS Receiver Input Voltage −0.3V to (V
CC
+ 0.3V)
Junction Temperature +150˚C
Storage Temperature −65˚C to +150˚C
Lead Temperature
(Soldering, 4 sec) +260˚C
Maximum Package Power Dissipation Capacity
@
25˚C
MTD56 (TSSOP) Package:
DS90CR286A 1.61 W
MTD48 (TSSOP) Package:
DS90CR216A 1.89 W
Package Derating:
DS90CR286A 12.4 mW/˚C above +25˚C
DS90CR216A 15 mW/˚C above +25˚C
ESD Rating
(HBM, 1.5 kΩ, 100 pF)
>
7kV
(EIAJ, 0Ω, 200 pF)
>
700V
Recommended Operating
Conditions
Min Nom Max Units
Supply Voltage (V
CC
) 3.0 3.3 3.6 V
Operating Free Air
Temperature (T
A
) −40 +25 +85 ˚C
Receiver Input Range 0 2.4 V
Supply Noise Voltage (V
CC
) 100 mV
PP
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
CMOS/TTL DC SPECIFICATIONS
V
OH
High Level Output Voltage IOH= −0.4 mA 2.7 3.3 V
V
OL
Low Level Output Voltage IOL= 2 mA 0.06 0.3 V
I
OS
Output Short Circuit Current V
OUT
= 0V −60 −120 mA
LVDS RECEIVER DC SPECIFICATIONS
V
TH
Differential Input High Threshold VCM= +1.2V +100 mV
V
TL
Differential Input Low Threshold −100 mV
I
IN
Input Current VIN= +2.4V, VCC= 3.6V
±
10 µA
V
IN
= 0V, VCC= 3.6V
±
10 µA
RECEIVER SUPPLY CURRENT
ICCRW Receiver Supply Current Worst Case C
L
= 8 pF, Worst
Case Pattern,
DS90CR286A
(Figures
1,2)
,TA=−10˚C to
+70˚C
f = 33 MHz 49 65 mA
f = 37.5 MHz 53 70 mA
f = 66 MHz 81 105 mA
ICCRW Receiver Supply Current Worst Case C
L
= 8 pF, Worst
Case Pattern,
DS90CR286A
(Figures
1,2)
,TA=−40˚C to
+85˚C
f = 40 MHz 53 70 mA
f = 66 MHz 81 105 mA
ICCRW Receiver Supply Current Worst Case C
L
= 8 pF, Worst
Case Pattern,
DS90CR216A
(Figures
1,2)
,TA=−10˚C to
+70˚C
f = 33 MHz 49 55 mA
f = 37.5 MHz 53 60 mA
f = 66 MHz 78 90 mA
ICCRW Receiver Supply Current Worst Case C
L
= 8 pF, Worst
Case Pattern,
DS90CR216A
(Figures
1,2)
,TA=−40˚C to
+85˚C
f = 40 MHz 53 60 mA
f = 66 MHz 78 90 mA
ICCRZ Receiver Supply Current Power Down = Low
10 55 µA
Power Down Receiver Outputs Stay Low during
Power Down Mode
DS90CR286A/DS90CR216A
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Electrical Characteristics (Continued)
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for V
CC
= 3.3V and TA= +25C.
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise specified (except V
OD
and ∆VOD).
Receiver Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
CLHT CMOS/TTL Low-to-High Transition Time
(Figure 2 )
25ns
CHLT CMOS/TTL High-to-Low Transition Time
(Figure 2 )
1.8 5 ns
RSPos0 Receiver Input Strobe Position for Bit 0
(Figure 9
,
Figure 10)
f = 40 MHz 1.0 1.4 2.15 ns
RSPos1 Receiver Input Strobe Position for Bit 1 4.5 5.0 5.8 ns
RSPos2 Receiver Input Strobe Position for Bit 2 8.1 8.5 9.15 ns
RSPos3 Receiver Input Strobe Position for Bit 3 11.6 11.9 12.6 ns
RSPos4 Receiver Input Strobe Position for Bit 4 15.1 15.6 16.3 ns
RSPos5 Receiver Input Strobe Position for Bit 5 18.8 19.2 19.9 ns
RSPos6 Receiver Input Strobe Position for Bit 6 22.5 22.9 23.6 ns
RSPos0 Receiver Input Strobe Position for Bit 0
(Figure 9
,
Figure 10)
f = 66 MHz 0.7 1.1 1.4 ns
RSPos1 Receiver Input Strobe Position for Bit 1 2.9 3.3 3.6 ns
RSPos2 Receiver Input Strobe Position for Bit 2 5.1 5.5 5.8 ns
RSPos3 Receiver Input Strobe Position for Bit 3 7.3 7.7 8.0 ns
RSPos4 Receiver Input Strobe Position for Bit 4 9.5 9.9 10.2 ns
RSPos5 Receiver Input Strobe Position for Bit 5 11.7 12.1 12.4 ns
RSPos6 Receiver Input Strobe Position for Bit 6 13.9 14.3 14.6 ns
RSKM RxIN Skew Margin (Note 4)
(Figure 11 )
f = 40 MHz 490 ps
f = 66 MHz 400 ps
RCOP RxCLK OUT Period
(Figure 3)
15 T 50 ns
RCOH RxCLK OUT High Time
(Figure 3 )
f = 40 MHz 10.0 12.2 ns
RCOL RxCLK OUT Low Time
(Figure 3)
10.0 11.0 ns
RSRC RxOUT Setup to RxCLK OUT
(Figure 3 )
6.5 11.6 ns
RHRC RxOUT Hold to RxCLK OUT
(Figure 3 )
6.0 11.6 ns
RCOH RxCLK OUT High Time
(Figure 3 )
f = 66 MHz 5.0 7.6 ns
RCOL RxCLK OUT Low Time
(Figure 3)
5.0 6.3 ns
RSRC RxOUT Setup to RxCLK OUT
(Figure 3 )
4.5 7.3 ns
RHRC RxOUT Hold to RxCLK OUT
(Figure 3 )
4.0 6.3 ns
RCCD RxCLK IN to RxCLK OUT Delay 25˚C, V
CC
= 3.3V (Note 5)
(Figure 4 )
3.5 5.0 7.5 ns
RPLLS Receiver Phase Lock Loop Set
(Figure 5 )
10 ms
RPDD Receiver Power Down Delay
(Figure 8 )
1µs
Note 4: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account the transmitter pulse positions (min
and max) and the receiver input setup and hold time (internal data sampling window - RSPos). This margin allows for LVDS interconnect skew, inter-symbol interference (both dependent on type/length of cable), and clock jitter (less than 250 ps).
Note 5: Total latency for the channel link chipset is a function of clock period and gate delays through the transmitter (TCCD) and receiver (RCCD). The total latency
for the 215/285 transmitter and 216A/286A receiver is: (T + TCCD) + (2
*
T + RCCD), where T=Clock period.
DS90CR286A/DS90CR216A
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AC Timing Diagrams
DS100873-2
FIGURE 1. “Worst Case” Test Pattern
DS100873-4
FIGURE 2. DS90CR286A/DS90CR216A (Receiver) CMOS/TTL Output Load and Transition Times
DS100873-5
FIGURE 3. DS90CR286A/DS90CR216A (Receiver) Setup/Hold and High/Low Times
DS100873-6
FIGURE 4. DS90CR286A/DS90CR216A (Receiver) Clock In to Clock Out Delay
DS90CR286A/DS90CR216A
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AC Timing Diagrams (Continued)
DS100873-7
FIGURE 5. DS90CR286A/DS90CR216A (Receiver) Phase Lock Loop Set Time
DS100873-9
FIGURE 6. 28 Parallel TTL Data Inputs Mapped to LVDS Outputs - DS90CR286A
DS100873-10
FIGURE 7. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs - DS90CR216A
DS90CR286A/DS90CR216A
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AC Timing Diagrams (Continued)
DS100873-8
FIGURE 8. DS90CR286A/DS90CR216A (Receiver) Power Down Delay
DS100873-25
FIGURE 9. DS90CR286A (Receiver) LVDS Input Strobe Position
DS90CR286A/DS90CR216A
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AC Timing Diagrams (Continued)
DS100873-26
FIGURE 10. DS90CR216A (Receiver) LVDS Input Strobe Position
DS90CR286A/DS90CR216A
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AC Timing Diagrams (Continued)
DS100873-11
C— Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and max
Tppos— Transmitter output pulse position (min and max)
RSKM = Cable Skew (type, length) + Source Clock Jitter (cycle to cycle) (Note 6) + ISI (Inter-symbol interference) (Note 7)
Cable Skew — typically 10 ps–40 ps per foot, media dependent
Note 6: Cycle-to-cycle jitter is less than TBD ps at 66 MHz.
Note 7: ISI is dependent on interconnect length; may be zero.
FIGURE 11. Receiver LVDS Input Skew Margin
DS90CR286A/DS90CR216A
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DS90CR286A Pin Description—28-Bit Channel Link Receiver
Pin Name I/O No. Description
RxIN+ I 4 Positive LVDS differentiaI data inputs.
RxIN− I 4 Negative LVDS differential data inputs.
RxOUT O 28 TTL level data outputs.
RxCLK IN+ I 1 Positive LVDS differential clock input.
RxCLK IN− I 1 Negative LVDS differential clock input.
RxCLK OUT O 1 TTL Ievel clock output. The rising edge acts as data strobe.
PWR DOWN
I 1 TTL level input. When asserted (low input) the receiver outputs are low.
V
CC
I 4 Power supply pins for TTL outputs.
GND I 5 Ground pins for TTL outputs.
PLL V
CC
I 1 Power supply for PLL.
PLL GND I 2 Ground pin for PLL.
LVDS V
CC
I 1 Power supply pin for LVDS inputs.
LVDS GND I 3 Ground pins for LVDS inputs.
DS90CR216A Pin Description—21-Bit Channel Link Receiver
Pin Name I/O No. Description
RxIN+ I 3 Positive LVDS differentiaI data inputs. (Note 8)
RxIN− I 3 Negative LVDS differential data inputs. (Note 8)
RxOUT O 21 TTL level data outputs.
RxCLK IN+ I 1 Positive LVDS differential clock input.
RxCLK IN− I 1 Negative LVDS differential clock input.
RxCLK OUT O 1 TTL Ievel clock output. The rising edge acts as data strobe.
PWR DOWN
I 1 TTL level input. When asserted (low input) the receiver outputs are low.
V
CC
I 4 Power supply pins for TTL outputs.
GND I 5 Ground pins for TTL outputs.
PLL V
CC
I 1 Power supply for PLL.
PLL GND I 2 Ground pin for PLL.
LVDS V
CC
I 1 Power supply pin for LVDS inputs.
LVDS GND I 3 Ground pins for LVDS inputs.
Note 8: These receivers have input failsafe bias circuitry to guarantee a stable receiver output for floating or terminated receiver inputs. Under these conditions receiver inputs will be in a HIGH state. If a clock signal is present, outputs will all be HIGH; if the clock input is also floating/terminated outputs will remain in the last
valid state. A floating/terminated clock input will result in a LOW clock output.
DS90CR286A/DS90CR216A
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Pin Diagram
DS90CR286A
DS100873-23
DS90CR216A
DS100873-13
DS90CR286A/DS90CR216A
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Physical Dimensions inches (millimeters) unless otherwise noted
56-Lead Molded Thin Shrink Small Outline Package, JEDEC
Order Number DS90CR286AMTD
NS Package Number MTD56
DS90CR286A/DS90CR216A
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
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www.national.com
48-Lead Molded Thin Shrink Small Outline Package, JEDEC
Order Number DS90CR216AMTD
NS Package Number MTD48
DS90CR286A/DS90CR216A +3.3V Rising Edge Data Strobe LVDS Receiver 28-Bit Channel
Link— 66 MHz, +3.3V Rising Edge Data Strobe LVDS Receiver 21-Bit Channel Link—66 MHz
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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