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DS90CF561/DS90CF562
LVDS 18-Bit Color Flat Panel Display (FPD) Link
General Description
The DS90CF561 transmitter converts 21 bits of CMOS/TTL
data into three LVDS (Low Voltage Differential Signaling)
data streams.Aphase-locked transmit clockis transmitted in
parallel with the data streams over a fourth LVDS link. Every
cycle of the transmit clock 21 bits of input data are sampled
and transmitted. The DS90CF562 receiver converts the
LVDS data streams back into 21 bits of CMOS/TTL data. At
a transmit clock frequency of 40 MHz, 18 bits of RGB data
and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 280 Mbps per
LVDSdata channel. Using a 40 MHz clock, the data throughput is 105 Megabytes per second. These devices are offered
with falling edge data strobes for convenient interface with a
variety of graphics and LCD panel controllers.
This chipset is an ideal means to solve EMI and cable size
problems associated with wide, high speed TTL interfaces.
Features
n Up to 105 Megabyte/sec bandwidth
n Narrow bus reduces cable size and cost
n 290 mV swing LVDS devices for low EMI
n Low power CMOS design
n Power down mode
n PLL requires no external components
n Low profile 48-lead TSSOP package
n Falling edge data strobe
n Compatible with TIA/EIA-644 LVDS standard
Block Diagrams
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
DS90CF561
DS012485-26
Order Number DS90CF561MTD
See NS Package Number MTD48
DS90CF562
DS012485-1
Order Number DS90CF562MTD
See NS Package Number MTD48
July 1997
DS90CF561/DS90CF562 LVDS 18-Bit Color Flat Panel Display (FPD) Link
© 1998 National Semiconductor Corporation DS012485 www.national.com
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Block Diagrams (Continued)
Connection Diagrams
Application
DS012485-2
DS90CF561
DS012485-3
DS90CF562
DS012485-4
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CC
) −0.3V to +6V
CMOS/TTL Input Voltage −0.3V to (V
CC
+ 0.3V)
CMOS/TTL Ouput Voltage −0.3V to (V
CC
+ 0.3V)
LVDS Receiver Input Voltage −0.3V to (V
CC
+ 0.3V)
LVDS Driver Output Voltage −0.3V to (V
CC
+ 0.3V)
LVDS Output
Short Circuit Duration continuous
Junction Temperature +150˚C
Storage Temperature Range −65˚C to +150˚C
Lead Temperature
(Soldering, 4 sec.) +260˚C
Maximum Power Dissipation
@
+25˚C
MTD48 (TSSOP) Package:
DS90CF561 1.98W
DS90CF562 1.89W
Package Derating:
DS90CF561 16 mW/˚C above +25˚C
DS90CF562 15 mW/˚C above +25˚C
This device does not meet 2000V ESD rating (Note 4).
Recommended Operating
Conditions
Min Nom Max Units
Supply Voltage (V
CC
) 4.5 5.0 5.5 V
Operating Free Air
Temperature (T
A
) −10 +25 +70 ˚C
Receiver Input Range 0 2.4 V
Supply Noise Voltage (V
CC
) 100 mV
P-P
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Conditions Min Typ Max Units
CMOS/TTL DC SPECIFICATIONS
V
IH
High Level Input Voltage 2.0 V
CC
V
V
IL
Low Level Input Voltage GND 0.8 V
V
OH
High Level Output Voltage I
OH
=
−0.4 mA 3.8 4.9 V
V
OL
Low Level Output Voltage I
OL
=
2 mA 0.1 0.3 V
V
CL
Input Clamp Voltage I
CL
=
−18 mA −0.79 −1.5 V
I
IN
Input Current V
IN
=
V
CC
, GND, 2.5V or 0.4V
±
5.1
±
10 µA
I
OS
Output Short Circuit Current V
OUT
=
0V −120 mA
LVDS DRIVER DC SPEClFlCATIONS
V
OD
Differential Output Voltage R
L
=
100Ω 250 290 450 mV
∆V
OD
Change in VODbetween 35 mV
Complimentary Output States
V
CM
Common Mode Voltage 1.1 1.25 1.375 V
∆V
CM
Change in VCMbetween 35 mV
Complimentary Output States
V
OH
High Level Output Voltage 1.3 1.6 V
V
OL
Low Level Output Voltage 0.9 1.01 V
I
OS
Output Short Circuit Current V
OUT
=
0V, R
L
=
100Ω −2.9 −5 mA
I
OZ
Output TRI-STATE®Current Power Down=0V, V
OUT
=
0V or V
CC
±
1
±
10 µA
LVDS RECEIVER DC SPECIFlCATIONS
V
TH
Differential Input High Threshold V
CM
=
+1.2V +100 mV
V
TL
Differential Input Low Threshold −100 mV
I
IN
Input Current V
IN
=
+2.4V V
CC
=
5.5V
±
10 µA
V
IN
=
0V
±
10 µA
TRANSMITTER SUPPLY CURRENT
I
CCTW
Transmitter Supply Current,
Worst Case
R
L
=
100Ω,C
L
=
5 pF,
Worst Case Pattern
(
Figure 1,Figure 3
)
f=32.5 MHz 34 51 mA
f=37.5 MHz 36 53 mA
I
CCTG
Transmitter Supply Current,
16 Grayscale
R
L
=
100Ω,C
L
=
5 pF,
Grayscale Pattern
(
Figure 2,Figure 3
)
f=32.5 MHz 27 47 mA
f=37.5 MHz 28 48 mA
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Electrical Characteristics (Continued)
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Conditions Min Typ Max Units
TRANSMITTER SUPPLY CURRENT
I
CCTZ
Transmitter Supply Current,
Power Down
Power Down=Low
125µA
RECEIVER SUPPLY CURRENT
I
CCRW
Receiver Supply Current,
Worst Case
C
L
=
8 pF,
Worst Case Pattern
(
Figure 1,Figure 4
)
f=32.5 MHz 55 75 mA
f=37.5 MHz 60 80 mA
I
CCRG
Receiver Supply Current,
16 Grayscale
C
L
=
8 pF,
16 Grayscale Pattern
(
Figure 2,Figure 4
)
f=32.5 MHz 35 55 mA
f=37.5 MHz 37 58 mA
I
CCRZ
Receiver Supply Current,
Power Down
Power Down=Low
110µA
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for V
CC
=
5.0V and T
A
=
+25˚C.
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise specified (except V
OD
and ∆VOD).
Note 4: ESD Rating:
HBM (1.5 kΩ, 100 pF)
PLL V
CC
≥ 1000V
All other pins ≥ 2000V
EIAJ (0Ω, 200 pF) ≥ 150V
Transmitter Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
LLHT LVDS Low-to-High Transition Time (
Figure 3
) 0.75 1.5 ns
LHLT LVDS High-to-Low Transition Time (
Figure 3
) 0.75 1.5 ns
TCIT TxCLK IN Transition Time (
Figure 5
)8ns
TCCS TxOUT Channel-to-Channel Skew (Note 5) (
Figure 6
) 350 ps
TPPos0 Transmitter Output Pulse Position for Bit 0 (
Figure 17
)f
=
20 MHz −200 150 350 ps
TPPos1 Transmitter Output Pulse Position for Bit 1 6.3 7.2 7.5 ns
TPPos2 Transmitter Output Pulse Position for Bit 2 12.8 13.6 14.6 ns
TPPos3 Transmitter Output Pulse Position for Bit 3 20 20.8 21.5 ns
TPPos4 Transmitter Output Pulse Position for Bit 4 27.2 28 28.5 ns
TPPos5 Transmitter Output Pulse Position for Bit 5 34.5 35.2 35.6 ns
TPPos6 Transmitter Output Pulse Position for Bit 6 42.2 42.6 42.9 ns
TPPos0 Transmitter Output Pulse Position for Bit 0 (
Figure 16
)f
=
40 MHz −100 100 300 ps
TPPos1 Transmitter Output Pulse Position for Bit 1 2.9 3.3 3.9 ns
TPPos2 Transmitter Output Pulse Position for Bit 2 6.1 6.6 7.1 ns
TPPos3 Transmitter Output Pulse Position for Bit 3 9.7 10.2 10.7 ns
TPPos4 Transmitter Output Pulse Position for Bit 4 13 13.5 14.1 ns
TPPos5 Transmitter Output Pulse Position for Bit 5 17 17.4 17.8 ns
TPPos6 Transmitter Output Pulse Position for Bit 6 20.3 20.8 21.4 ns
TCIP TxCLK IN Period (
Figure 7
) 25 T 50 ns
TCIH TxCLK IN High Time (
Figure 7
) 0.35T 0.5T 0.65T ns
TCIL TxCLK IN Low Time (
Figure 7
) 0.35T 0.5T 0.65T ns
TSTC TxIN Setup to TxCLK IN (
Figure 7
)f
=
20 MHz 14 ns
f=40 MHz 8 ns
THTC TxIN Hold to TxCLK IN (
Figure 7
) 2.5 2 ns
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Transmitter Switching Characteristics (Continued)
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
TCCD TxCLK IN to TxCLK OUT Delay
@
25˚C, 5 9.7 ns
V
CC
=
5.0V (
Figure 9
)
TPLLS Transmitter Phase Lock Loop Set (
Figure 11
)10ms
TPDD Transmitter Powerdown Delay (
Figure 15
) 100 ns
Note 5: This limit based on bench characterization.
Receiver Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
CLHT CMOS/TTL Low-to-High Transition Time (
Figure 4
) 3.5 6.5 ns
CHLT CMOS/TTL High-to-Low Transition Time (
Figure 4
) 2.7 6.5 ns
RCOP RxCLK OUT Period (
Figure 8
) 25 T 50 ns
RSKM Receiver Skew Margin (Note 6). V
CC
=
5V, T
A
=
25˚C (
Figure 18
)f
=
20 MHz 1.1 ns
f=40 MHz 700 ps
RCOH RxCLK OUT High Time (
Figure 8
)f
=
20 MHz 21.5 ns
f=40 MHz 10.5 ns
RCOL RxCLK OUT Low Time (
Figure 8
)f
=
20 MHz 19 ns
f=40 MHz 6 ns
RSRC RxOUT Setup to RxCLK OUT (
Figure 8
)f
=
20 MHz 14 ns
f=40 MHz 4.5 ns
RHRC RxOUT Hold to RxCLK OUT (
Figure 8
)f
=
20 MHz 16 ns
f=40 MHz 6.5 ns
RCCD RxCLK IN to RxCLK OUT Delay
@
25˚C, 7.6 11.9 ns
V
CC
=
5.0V (
Figure 10
)
RPLLS Receiver Phase Lock Loop Set (
Figure 12
)10ms
RPDD Receiver Powerdown Delay (
Figure 16
)1µs
Note 6: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account for transmitter output skew(TCCS)
and the setup and hold time (internal data sampling window), allowing LVDS cable skew dependent on type/length and source clock(TxCLK IN) jitter.
RSKM ≥ cable skew (type, length) + source clock jitter (cycle to cycle)
AC Timing Diagrams
DS012485-5
FIGURE 1. “Worst Case” Test Pattern
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AC Timing Diagrams (Continued)
Note 7: The worst case test pattern produces a maximum toggling of device digital circuitry, LVDS I/O and TTL I/O.
Note 8: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed
to produce groups of 16 vertical stripes across the display.
Note 9:
Figure 1
and
Figure 2
show a falling edge data strobe (TxCLK IN/RxCLK OUT).
Note 10: Recommended pin to signal mapping. Customer may choose to define differently.
DS012485-6
FIGURE 2. “16 Grayscale” Test Pattern (Notes 7, 8, 9, 10)
DS012485-8
DS012485-9
FIGURE 3. DS90CF561 (Transmitter) LVDS Output Load and Transition Timing
DS012485-10
DS012485-11
FIGURE 4. DS90CF562 (Receiver) CMOS/TTL Output Load and Transition Timing
DS012485-15
FIGURE 5. DS90CF561 (Transmitter) Input Clock Transition Time
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AC Timing Diagrams (Continued)
DS012485-16
Measurements at Vdiff=0V
TCCS measured between earliest and latest initial LVDS edges.
TxCLK OUT Differential High→Low Edge for DS90CF561
TxCLK OUT Differential Low→High Edge for DS90CR561
FIGURE 6. DS90CF561 (Transmitter) Channel-to-Channel Skew and Pulse Width
DS012485-12
FIGURE 7. DS90CF561 (Transmitter) Setup/Hold and High/Low Times
DS012485-13
FIGURE 8. DS90CF562 (Receiver) Setup/Hold and High/Low Times
DS012485-17
FIGURE 9. DS90CF561 (Transmitter) Clock In to Clock Out Delay
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AC Timing Diagrams (Continued)
DS012485-18
FIGURE 10. DS90CF562 (Receiver) Clock In to Clock Out Delay
DS012485-14
FIGURE 11. DS90CF561 (Transmitter) Phase Lock Loop Set Time
DS012485-19
FIGURE 12. DS90CF562 (Receiver) Phase Lock Loop Set Time
DS012485-20
FIGURE 13. Seven Bits of LVDS in One Clock Cycle
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AC Timing Diagrams (Continued)
DS012485-21
FIGURE 14. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs (DS90CF561)
DS012485-22
FIGURE 15. Transmitter Powerdown Delay
DS012485-23
FIGURE 16. Receiver Powerdown Delay
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AC Timing Diagrams (Continued)
DS012485-24
FIGURE 17. Transmitter LVDS Output Pulse Position Measurement
DS012485-25
SW— Setup and Hold Time (Internal Data Sampling Window)
TCCS— Transmitter Output Skew
RSKM ≥ Cable Skew (Type, Length) + Source Clock Jitter (Cycle to Cycle)
Cable Skew — Typically 10 ps–40 ps per foot
FIGURE 18. Receiver LVDS Input Skew Margin
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DS90CF561 Pin Description—FPD Link Transmitter
Pin Name I/O No. Description
TxIN I 21 TTL level input. This includes: 6 Red, 6 Green, 6 Blue, and 3 control lines (FPLINE, FPFRAME,
DRDY). (Also referred to as HSYNC, VSYNC and DATA ENABLE.)
TxOUT+ O 3 Positive LVDS differential data output
TxOUT− O 3 Negative LVDS differential data output
FPSHIFT IN I 1 TTL level clock input. The falling edge acts as data strobe.
TxCLK OUT+ O 1 Positive LVDS differential clock output
TxCLK OUT− O 1 Negative LVDS differential clock output
PWR DOWN
I 1 TTL level input. Assertion (low input) TRI-STATES the outputs, ensuring low current at power
down.
V
CC
I 4 Power supply pins for TTL inputs
GND I 5 Ground pins for TTL inputs
PLL V
CC
I 1 Power supply pin for PLL
PLL GND I 2 Ground pins for PLL
LVDS V
CC
I 1 Power supply pin for LVDS outputs
LVDS GND I 3 Ground pins for LVDS outputs
DS90CF562 Pin Description—FPD Link Receiver
Pin Name I/O No. Description
RxIN+ I 3 Positive LVDS differential data inputs
RxIN− I 3 Negative LVDS differential data inputs
RxOUT O 21 TTL level data outputs. This includes: 6 Red, 6 Green, 6 Blue, and 3 control lines (FPLINE,
FPFRAME, DRDY). (Also referred to as HSYNC, VSYNC and DATA ENABLE.)
RxCLK IN+ I 1 Positive LVDS differential clock input
RxCLK IN− I 1 Negative LVDS differential clock input
FPSHIFT OUT O 1 TTL level clock output. The falling edge acts as data strobe.
PWR DOWN
I 1 TTL level input. Assertion (low input) maintains the receiver outputs in the previous state
V
CC
I 4 Power supply pins for TTL outputs
GND I 5 Ground pins for TTL outputs
PLL V
CC
I 1 Power supply for PLL
PLL GND I 2 Ground pin for PLL
LVDS V
CC
I 1 Power supply pin for LVDS inputs
LVDS GND I 3 Ground pins for LVDS inputs
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Physical Dimensions inches (millimeters) unless otherwise noted
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
National Semiconductor
Corporation
Americas
Tel: 1-800-272-9959
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Email: support@nsc.com
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Tel: 81-3-5620-6175
Fax: 81-3-5620-6179
48-Lead Molded Thin Shrink Small Outline Package, JEDEC
NS Package Number MTD48
DS90CF561/DS90CF562 LVDS 18-Bit Color Flat Panel Display (FPD) Link
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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