Datasheet FLINK3V6BT-65, DS90C363MTDX, DS90C363MTD Datasheet (NSC)

DS90C363/DS90CF364 +3.3V Programmable LVDS Transmitter 18-Bit Flat Panel Display (FPD) Link—65 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link—65 MHz
General Description
The DS90C363 transmitter converts 21 bits of CMOS/TTL data into three LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fourth LVDS link. Every cycle of the transmit clock 21 bits of input data are sampled and transmitted. The DS90CF364 receiver converts the LVDS data streams back into 21 bits of CMOS/TTL data. At a transmit clock frequency of 65 MHz, 18 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDSdata channel. Using a 65 MHz clock, the data through­puts is 170 Mbytes/sec. The Transmitter is offered with pro­grammable edge data strobes for convenient interface with a variety of graphics controllers. The Transmitter can be pro­grammed for Rising edge strobe or Falling edge strobe through a dedicated pin. A Rising edge Transmitter will inter­operate with a Falling edge Receiver (DS90CF364) without any translation logic.
This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.
Features
n 20 to 65 MHz shift clock support n Programmable Transmitter (DS90C363) strobe select
(Rising or Falling edge strobe)
n Single 3.3V supply n Chipset (Tx + Rx) power consumption
<
250 mW (typ)
n Power-down mode (
<
0.5 mW total)
n Single pixel per clock XGA (1024x768) ready n Supports VGA, SVGA, XGA and higher addressability. n Up to 170 Megabyte/sec bandwidth n Up to 1.3 Gbps throughput n Narrow bus reduces cable size and cost n 290 mV swing LVDS devices for low EMI n PLL requires no external components n Low profile 48-lead TSSOP package n Falling edge data strobe Receiver n Compatible with TIA/EIA-644 LVDS standard n ESD rating
>
7kV
n Operating Temperature: −40˚C to +85˚C
Block Diagrams
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
Application
DS012886-14
September 1999
DS90C363/DS90CF364 +3.3V Programmable LVDS 18-Bit-Color Flat Panel Display (FPD)
Link— 65 MHz
© 1999 National Semiconductor Corporation DS012886 www.national.com
Block Diagrams (Continued)
DS90C363
DS012886-1
Order Number DS90C363MTD
See NS Package Number MTD48
DS90CF364
DS012886-24
Order Number DS90CF364MTD
See NS Package Number MTD48
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Supply Voltage (V
CC
) −0.3V to +4V
CMOS/TTL Input Voltage −0.3V to (V
CC
+ 0.3V)
CMOS/TTL Output Voltage −0.3V to (V
CC
+ 0.3V)
LVDS Receiver Input Voltage −0.3V to (V
CC
+ 0.3V)
LVDS Driver Output Voltage −0.3V to (V
CC
+ 0.3V)
LVDS Output Short Circuit
Duration Continuous Junction Temperature +150˚C Storage Temperature −65˚C to +150˚C Lead Temperature
(Soldering, 4 sec) +260˚C
Maximum Package Power Dissipation Capacity 25˚C
MTD48 (TSSOP) Package:
DS90C363 1.98 W DS90CF364 1.89 W
Package Derating:
DS90C363 16 mW/˚C above +25˚C DS90CF364 15 mW/˚C above +25˚C
ESD Rating
(HBM, 1.5 k, 100 pF)
>
7kV
Recommended Operating Conditions
Min Nom Max Units
Supply Voltage (V
CC
) 3.0 3.3 3.6 V
Operating Free Air
Temperature (T
A
) −40 +25 +85 ˚C Receiver Input Range 0 2.4 V Supply Noise Voltage (V
CC
) 100 mV
PP
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
CMOS/TTL DC SPECIFICATIONS
V
IH
High Level Input Voltage 2.0 V
CC
V
V
IL
Low Level Input Voltage GND 0.8 V
V
OH
High Level Output Voltage IOH= −0.4 mA 2.7 3.3 V
V
OL
Low Level Output Voltage IOL= 2 mA 0.06 0.3 V
V
CL
Input Clamp Voltage ICL= −18 mA −0.79 −1.5 V
I
IN
Input Current VIN=VCC, GND, 2.5V or 0.4V
±
5.1±10 µA
I
OS
Output Short Circuit Current V
OUT
= 0V −60 −120 mA
LVDS DC SPECIFICATIONS
V
OD
Differential Output Voltage RL= 100 250 345 450 mV
V
OD
Change in VODbetween 35 mV complimentary output states
V
OS
Offset Voltage (Note 4) 1.125 1.25 1.375 V
V
OS
Change in VOSbetween 35 mV complimentary output states
I
OS
Output Short Circuit Current V
OUT
= 0V, RL= 100 −3.5 −5 mA
I
OZ
Output TRI-STATE®Current PWR DWN = 0V,
±1±
10 µA
V
OUT
=0VorV
CC
V
TH
Differential Input High Threshold VCM= +1.2V +100 mV
V
TL
Differential Input Low Threshold −100 mV
I
IN
Input Current VIN= +2.4V, VCC= 3.6V
±
10 µA
V
IN
= 0V, VCC= 3.6V
±
10 µA
TRANSMITTER SUPPLY CURRENT
ICCTW Transmitter Supply Current, Worst
Case
R
L
= 100,
C
L
= 5 pF, Worst
Case Pattern
(Figures
1, 3 )
,TA= −40˚C to
+85˚C
f = 32.5 MHz 31 45 mA
f = 37.5 MHz 32 50 mA f = 65 MHz 42 55 mA
ICCTG Transmitter Supply Current, 16
Grayscale
R
L
= 100,
C
L
= 5 pF, 16
Grayscale Pattern
(Figures 2, 3 )
,TA=
−40˚C to +85˚C
f = 32.5 MHz 23 35 mA
f = 37.5 MHz 28 40 mA f = 65 MHz 31 45 mA
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Electrical Characteristics (Continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
TRANSMITTER SUPPLY CURRENT
ICCTZ Transmitter Supply Current PWR DWN = Low
10 55 µA
Power Down Driver Outputs in TRI-STATE
®
under
Power Down Mode
RECEIVER SUPPLY CURRENT
ICCRW Receiver Supply Current, Worst
Case
C
L
= 8 pF, Worst
Case Pattern
(Figures
1,4)
,TA= −40˚C to
+85˚C
f = 32.5 MHz 49 65 mA
f = 37.5 MHz 53 70 mA f = 65 MHz 78 105 mA
ICCRG Receiver Supply Current, 16
Grayscale
C
L
= 8 pF, 16
Grayscale Pattern
(Figures 2, 4 )
,TA=
−40˚C to +85˚C
f = 32.5 MHz 28 45 mA
f = 37.5 MHz 30 47 mA f = 65 MHz 43 60 mA
ICCRZ Receiver Supply Current PWR DWN = Low
10 55 µA
Power Down Receiver Outputs Stay Low during
Power Down Mode
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for V
CC
= 3.3V and TA= +25C.
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise speci­fied (except V
OD
and VOD).
Note 4: V
OS
previously referred as VCM.
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Transmitter Switching Characteristics
Over recommended operating supply and −40˚C to +85˚C ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
LLHT LVDS Low-to-High Transition Time
(Figure 3 )
0.75 1.5 ns
LHLT LVDS High-to-Low Transition Time
(Figure 3 )
0.75 1.5 ns
TCIT TxCLK IN Transition Time
(Figure 5 )
5ns
TCCS TxOUT Channel-to-Channel Skew
(Figure 6 )
250 ps
TPPos0 Transmitter Output Pulse Position for Bit 0
(Figure 17 )
f = 65 MHz −0.4 0 0.3 ns
TPPos1 Transmitter Output Pulse Position for Bit 1 1.8 2.2 2.5 ns TPPos2 Transmitter Output Pulse Position for Bit 2 4.0 4.4 4.7 ns TPPos3 Transmitter Output Pulse Position for Bit 3 6.2 6.6 6.9 ns TPPos4 Transmitter Output Pulse Position for Bit 4 8.4 8.8 9.1 ns TPPos5 Transmitter Output Pulse Position for Bit 5 10.6 11.0 11.3 ns TPPos6 Transmitter Output Pulse Position for Bit 6 12.8 13.2 13.5 ns TCIP TxCLK IN Period
(Figure 7)
15 T 50 ns
TCIH TxCLK IN High Time
(Figure 7)
0.35T 0.5T 0.65T ns
TCIL TxCLK IN Low Time
(Figure 7)
0.35T 0.5T 0.65T ns
TSTC TxIN Setup to TxCLK IN
(Figure 7 )
f = 65 MHz 2.5 ns
THTC TxIN Hold to TxCLK IN
(Figure 7 )
0ns
TCCD TxCLK IN to TxCLK OUT Delay 25˚C, V
CC
= 3.3V
(Figure 9 )
3.0 3.7 5.5 ns
TPLLS Transmitter Phase Lock Loop Set
(Figure 11 )
10 ms
TPDD Transmitter Power Down Delay
(Figure 15 )
100 ns
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Receiver Switching Characteristics
Over recommended operating supply and −40˚C to +85˚C ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
CLHT CMOS/TTL Low-to-High Transition Time
(Figure 4 )
2.2 5.0 ns
CHLT CMOS/TTL High-to-Low Transition Time
(Figure 4 )
2.2 5.0 ns
RSPos0 Receiver Input Strobe Position for Bit 0
(Figure 18 )
f = 65 MHz 0.7 1.1 1.4 ns RSPos1 Receiver Input Strobe Position for Bit 1 2.9 3.3 3.6 ns RSPos2 Receiver Input Strobe Position for Bit 2 5.1 5.5 5.8 ns RSPos3 Receiver Input Strobe Position for Bit 3 7.3 7.7 8.0 ns RSPos4 Receiver Input Strobe Position for Bit 4 9.5 9.9 10.2 ns RSPos5 Receiver Input Strobe Position for Bit 5 11.7 12.1 12.4 ns RSPos6 Receiver Input Strobe Position for Bit 6 13.9 14.3 14.6 ns RSKM RxIN Skew Margin (Note 5)
(Figure 19 )
f = 65 MHz 400 ps RCOP RxCLK OUT Period
(Figure 8)
15 T 50 ns
RCOH RxCLK OUT High Time
(Figure 8 )
f = 65 MHz 7.3 8.6 ns RCOL RxCLK OUT Low Time
(Figure 8)
f = 65 MHz 3.45 4.9 ns RSRC RxOUT Setup to RxCLK OUT
(Figure 8 )
f = 65 MHz 2.5 6.9 ns RHRC RxOUT Hold to RxCLK OUT
(Figure 8 )
f = 65 MHz 2.5 5.7 ns RCCD RxCLK IN to RxCLK OUT Delay 25˚C, V
CC
= 3.3V
(Figure 10 )
5.0 7.1 9.0 ns
RPLLS Receiver Phase Lock Loop Set
(Figure 12 )
10 ms
RPDD Receiver Power Down Delay
(Figure 16 )
s
Note 5: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account the transmitter pulse positions (min and max) and the receiver input setup and hold time (internal data sampling window - RSPos). This margin allows for LVDS interconnect skew, inter-symbol inter­ference (both dependent on type/length of cable), and clock jitter (less than 250 ps).
AC Timing Diagrams
DS012886-2
FIGURE 1. “Worst Case” Test Pattern
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AC Timing Diagrams (Continued)
Note 6: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O. Note 7: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed
to produce groups of 16 vertical stripes across the display.
Note 8:
Figures 1, 2
show a falling edge data strobe (TxCLK IN/RxCLK OUT).
Note 9: Recommended pin to signal mapping. Customer may choose to define differently.
DS012886-3
FIGURE 2. “16 Grayscale” Test Pattern (Notes 6, 7, 8, 9)
DS012886-15
FIGURE 3. DS90C363 (Transmitter) LVDS Output Load and Transition Times
DS012886-4
FIGURE 4. DS90CF364 (Receiver) CMOS/TTL Output Load and Transition Times
DS012886-16
FIGURE 5. DS90C363 (Transmitter) Input Clock Transition Time
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AC Timing Diagrams (Continued)
DS012886-17
Measurements at Vdiff=0V TCCS measured between earliest and latest LVDS edges TxCLK Differential Low→High Edge
FIGURE 6. DS90C363 (Transmitter) Channel-to-Channel Skew
DS012886-18
FIGURE 7. DS90C363 (Transmitter) Setup/Hold and High/Low Times
DS012886-5
FIGURE 8. DS90CF364 (Receiver) Setup/Hold and High/Low Times
DS012886-19
FIGURE 9. DS90C363 (Transmitter) Clock In to Clock Out Delay (Falling Edge Strobe)
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AC Timing Diagrams (Continued)
DS012886-6
FIGURE 10. DS90CF364 (Receiver) Clock In to Clock Out Delay
DS012886-20
FIGURE 11. DS90C363 (Transmitter) Phase Lock Loop Set Time
DS012886-7
FIGURE 12. DS90CF364 (Receiver) Phase Lock Loop Set Time
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AC Timing Diagrams (Continued)
DS012886-9
FIGURE 13. Seven Bits of LVDS in One Clock Cycle
DS012886-10
FIGURE 14. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs
DS012886-21
FIGURE 15. Transmitter Power Down Delay
DS012886-8
FIGURE 16. Receiver Power Down Delay
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AC Timing Diagrams (Continued)
DS012886-22
FIGURE 17. Transmitter LVDS Output Pulse Position Measurement
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AC Timing Diagrams (Continued)
DS012886-25
FIGURE 18. Receiver LVDS Input Strobe Position
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AC Timing Diagrams (Continued)
DS90C363 Pin Description—FPD Link Transmitter
Pin Name I/O No. Description
TxIN I 21 TTL level input. This includes: 6 Red, 6 Green, 6 Blue, and 3 control lines — FPLINE,
FPFRAME and DRDY (also referred to as HSYNC, VSYNC, Data Enable). TxOUT+ O 3 Positive LVDS differentiaI data output. TxOUT− O 3 Negative LVDS differential data output. FPSHIFT IN I 1 TTL Ievel clock input. The falling edge acts as data strobe. Pin name TxCLK IN. R_FB I 1 Programmable strobe select. RTxCLK OUT+ O 1 Positive LVDS differential clock output. TxCLK OUT− O 1 Negative LVDS differential clock output. PWR DWN
I 1 TTL level input. When asserted (low input) TRI-STATES the outputs, ensuring low current at
power down. V
CC
I 3 Power supply pins for TTL inputs. GND I 4 Ground pins for TTL inputs. PLL V
CC
I 1 Power supply pin for PLL. PLL GND I 2 Ground pins for PLL. LVDS V
CC
I 1 Power supply pin for LVDS outputs. LVDS GND I 3 Ground pins for LVDS outputs.
DS012886-11
C—Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and max Tppos—Transmitter output pulse position (min and max) RSKM = Cable Skew (type, length) + Source Clock Jitter (cycle to cycle) (Note 10) + ISI (Inter-symbol interference) (Note 11) Cable Skew — typically 10 ps–40 ps per foot, media dependent
Note 10: Cycle-to-cycle jitter is less than 250 ps at 65 MHz. Note 11: ISI is dependent on interconnect length; may be zero.
FIGURE 19. Receiver LVDS Input Skew Margin
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DS90CF364 Pin Description—FPD Link Receiver
Pin Name I/O No. Description
RxIN+ I 3 Positive LVDS differentiaI data inputs. RxIN− I 3 Negative LVDS differential data inputs. RxOUT O 21 TTL level data outputs. This includes: 6 Red, 6 Green, 6 Blue, and 3 control lines — FPLINE,
FPFRAME, DRDY (also referred to as HSYNC, VSYNC, Data Enable). RxCLK IN+ I 1 Positive LVDS differential clock input. RxCLK IN− I 1 Negative LVDS differential clock input. FPSHIFT OUT O 1 TTL Ievel clock output. The falling edge acts as data strobe. Pin name RxCLK OUT. PWR DWN
I 1 TTL level input. When asserted (low input) the receiver outputs are low.
V
CC
I 4 Power supply pins for TTL outputs. GND I 5 Ground pins for TTL outputs. PLL V
CC
I 1 Power supply for PLL. PLL GND I 2 Ground pin for PLL. LVDS V
CC
I 1 Power supply pin for LVDS inputs. LVDS GND I 3 Ground pins for LVDS inputs.
Applications Information
The DS90C363 and DS90CF364 are backward compatible with the existing 5V FPD Link transmitter/receiver pair (DS90CF563 and DS90CF564). To upgrade from a 5V to a
3.3V system the following must be addressed:
CC
, LVDS VCCand PLL VCCof both the transmitter and receiver devices. This change may enable the re­moval of a 5V supply from the system, and power may be supplied from an existing 3V power source.
2. The DS90C363 (transmitter) incorporates a rise/fall strobe select pin. This select function is on pin 14, for­merly a V
CC
connection on the 5V products. When the
rise/fall strobe select pin is connected to V
CC
, the part is configured with a rising edge strobe. In a system cur­rently using a 5V rising edge strobe transmitter (DS90CR563), no layout changes are required to ac­commodate the new rise/fall select pin on the 3.3V transmitter. The V
CC
signal may remain at pin 14, and
the device will be configured with a rising edge strobe.
When converting from a 5V falling edge transmitter (DS90CF563) to the 3V transmitter a minimal board layout change is necessary. The 3.3V transmitter will
not be configured with a falling edge strobe if V
CC
re-
mains connected to the select pin. To guarantee the
3.3V transmitter functions with a falling edge strobe pin 14 should be connected to ground OR left unconnected. When not connected (left open) and internal pull-down resistor ties pin 14 to ground, thus configuring the trans­mitter with a falling edge strobe.
3. The DS90C363 transmitter input and control inputs ac­cept 3.3V TTL/CMOS levels. They are not 5V tolerant.
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Pin Diagram
TABLE 1. Programmable Transmitter
Pin Condition Strobe Status
R_FB R_FB = V
CC
Rising edge strobe
R_FB R_FB = GND Falling edge strobe
DS90C363
DS012886-23
DS90CF364
DS012886-13
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Physical Dimensions inches (millimeters) unless otherwise noted
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48-Lead Molded Thin Shrink Small Outline Package, JEDEC
Dimensions show in millimeters
Order Number DS90C363MTD and DS90CF364MTD
NS Package Number MTD48
DS90C363/DS90CF364 +3.3V Programmable LVDS 18-Bit-Color Flat Panel Display (FPD)
Link— 65 MHz
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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