The DS90C363B transmitter converts 21 bits of CMOS/TTL
data into three LVDS (Low Voltage Differential Signaling)
data streams. A phase-locked transmit clock is transmitted in
parallel with the data streams over a fourth LVDS link. Every
cycle of the transmit clock 21 bits of input data are sampled
and transmitted. At a transmit clock frequency of 65 MHz, 18
bits of RGB data and 3 bits of LCD timing and control data
(FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455
Mbps per LVDS data channel. Using a 65 MHz clock, the
data throughput is 170 Mbytes/sec. The DS90C363B transmitter can be programmed for Rising edge strobe or Falling
edge strobe through a dedicated pin. A Rising edge or
Falling edge strobe transmitter will interoperate with a Falling
edge strobe Receiver (DS90CF366) without any translation
logic.
This chipset is an ideal means to solve EMI and cable size
problems associated with wide, high speed TTL interfaces.
Features
n No special start-up sequence required between
clock/data and /PD pins. Input signal (clock and data)
can be applied either before or after the device is
powered.
n Support Spread Spectrum Clocking up to 100kHz
frequency modulation & deviations of
spread or −5% down spread.
n "Input Clock Detection" feature will pull all LVDS pairs to
logic low when input clock is missing and when /PD pin
is logic high.
n 18 to 68 MHz shift clock support
n Best–in–Class Set & Hold Times on TxINPUTs
n Tx power consumption
Grayscale
n 40% Less Power Dissipation than BiCMOS Alternatives
n Tx Power-down mode
n Supports VGA, SVGA, XGA and Dual Pixel SXGA.
n Narrow bus reduces cable size and cost
n Up to 1.3 Gbps throughput
n Up to 170 Megabytes/sec bandwidth
n 345 mV (typ) swing LVDS devices for low EMI
n PLL requires no external components
n Compatible with TIA/EIA-644 LVDS standard
n Low profile 48-lead TSSOP package
n Improved replacement for:
SN75LVDS84, DS90C363A
<
130 mW (typ)@65MHz
<
37µW (typ)
±
2.5% center
Block Diagram
DS90C363B
Order Number DS90C363BMT
See NS Package Number MTD48
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
DS90C363B
Supply Voltage (V
CMOS/TTL Input Voltage−0.3V to (V
LVDS Driver Output Voltage−0.3V to (V
LVDS Output Short Circuit
DurationContinuous
Junction Temperature+150˚C
Storage Temperature−65˚C to +150˚C
Lead Temperature
(Soldering, 4 sec)+260˚C
Maximum Package Power Dissipation Capacity
MTD48 (TSSOP) Package:
DS90C363B1.98 W
)−0.3V to +4V
CC
CC
CC
@
+ 0.3V)
+ 0.3V)
25˚C
Package Derating:
DS90C363B16 mW/˚C above +25˚C
ESD Rating
(HBM, 1.5 kΩ, 100 pF)7 kV
(EIAJ, 0Ω, 200 pF)500V
Recommended Operating
Conditions
MinNomMaxUnits
Supply Voltage (V
Operating Free Air
Temperature (T
Supply Noise Voltage
(VCC)
TxCLKIN frequency1868MHz
)3.03.33.6V
CC
)−10+25+70˚C
A
200mV
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
SymbolParameterConditionsMinTypMaxUnits
CMOS/TTL DC SPECIFICATIONS
V
IH
V
IL
V
CL
I
IN
LVDS DC SPECIFICATIONS
V
OD
∆V
OD
V
OS
∆V
OS
I
OS
I
OZ
TRANSMITTER SUPPLY CURRENT
ICCTWTransmitter Supply Current
High Level Input Voltage2.0V
CC
Low Level Input VoltageGND0.8V
Input Clamp VoltageICL= −18 mA−0.79−1.5V
Input CurrentVIN= 0.4V, 2.5V or V
V
= GND−100µA
IN
CC
+1.8+10µA
Differential Output VoltageRL= 100Ω250345450mV
Change in VODbetween
35mV
complimentary output states
Offset Voltage (Note 4)1.131.251.38V
Change in VOSbetween
35mV
complimentary output states
Output Short Circuit CurrentV
Output TRI-STATE®CurrentPower Down = 0V,
Worst Case
= 0V, RL= 100Ω−3.5−5mA
OUT
±
1
V
=0VorV
OUT
R
L
C
L
= 100Ω,
= 5 pF,
CC
f = 25MHz2940mA
±
10µA
Worst Case Pattern
(Figures 1, 4 ) " Typ "
f = 40 MHz3445mA
values are given for V
CC
= 3.6V and TA=
+25˚C, " Max " values
are given for V
3.6V and T
CC
= −10˚C
A
f = 65 MHz4255mA
=
PP
V
www.national.com2
Page 3
Electrical Characteristics (Continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
SymbolParameterConditionsMinTypMaxUnits
TRANSMITTER SUPPLY CURRENT
ICCTGTransmitter Supply Current
16 Grayscale
R
L
C
L
= 100Ω,
= 5 pF,
16 Grayscale Pattern
(Figures 2, 4 ) " Typ "
values are given for V
CC
= 3.6V and TA=
+25˚C, " Max " values
ICCTZTransmitter Supply Current
Power Down
are given for V
3.6V and T
Power Down = Low
Driver Outputs in TRI-STATE®under
CC
= −10˚C
A
Power Down Mode
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for V
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise
specified (except V
Note 4: V
OS
and ∆VOD).
OD
previously referred as VCM.
= 3.3V and TA= +25˚C unless specified otherwise.
CC
f = 25 MHz2840mA
f = 40 MHz3245mA
f = 65 MHz3950mA
=
11150µA
DS90C363B
Recommended Transmitter Input Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
SymbolParameterMinTypMaxUnits
TCITTxCLK IN Transition Time (Figure 5 )5ns
TCIPTxCLK IN Period (Figure 6 )14.7T50ns
TCIHTxCLK IN High Time (Figure 6 )0.35T0.5T0.65Tns
TCILTxCLK IN Low Time (Figure 6 )0.35T0.5T0.65Tns
TXITTxIN, and Power Down pin transition Time
TXPDMinimum pulse width for Power Down pin signal
1.56.0ns
1us
Transmitter Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
SymbolParameterMinTypMaxUnits
LLHTLVDS Low-to-High Transition Time (Figure 4 )0.751.4ns
LHLTLVDS High-to-Low Transition Time (Figure 4 )0.751.4ns
TPPos0Transmitter Output Pulse Position for Bit 0 (Figure 11 ) (Note 5)f = 65
TPPos1Transmitter Output Pulse Position for Bit 12.002.202.40ns
MHz
TPPos2Transmitter Output Pulse Position for Bit 24.204.404.60ns
TPPos3Transmitter Output Pulse Position for Bit 36.396.596.79ns
TPPos4Transmitter Output Pulse Position for Bit 48.598.798.99ns
TPPos5Transmitter Output Pulse Position for Bit 510.7910.9911.19ns
TPPos6Transmitter Output Pulse Position for Bit 612.9913.1913.39ns
TPPos0Transmitter Output Pulse Position for Bit 0 (Figure 11 ) (Note 5)f = 40
TPPos1Transmitter Output Pulse Position for Bit 13.323.573.82ns
MHz
TPPos2Transmitter Output Pulse Position for Bit 26.897.147.39ns
TPPos3Transmitter Output Pulse Position for Bit 310.4610.7110.96ns
TPPos4Transmitter Output Pulse Position for Bit 414.0414.2914.54ns
TPPos5Transmitter Output Pulse Position for Bit 517.6117.8618.11ns
TPPos6Transmitter Output Pulse Position for Bit 621.1821.4321.68ns
−0.2000.20ns
−0.2500.25ns
www.national.com3
Page 4
Transmitter Switching Characteristics (Continued)
Over recommended operating supply and temperature ranges unless otherwise specified
SymbolParameterMinTypMaxUnits
DS90C363B
TPPos0Transmitter Output Pulse Position for Bit 0 (Figure 11 ) (Note 5)f = 25
TPPos1Transmitter Output Pulse Position for Bit 15.265.716.16ns
MHz
TPPos2Transmitter Output Pulse Position for Bit 210.9811.4311.83ns
TPPos3Transmitter Output Pulse Position for Bit 316.6917.1417.54ns
TPPos4Transmitter Output Pulse Position for Bit 422.4122.8623.26ns
TPPos5Transmitter Output Pulse Position for Bit 528.1228.5728.97ns
TPPos6Transmitter Output Pulse Position for Bit 633.8434.2934.69ns
TSTCTxIN Setup to TxCLK IN (Figure 6 )2.5ns
THTCTxIN Hold to TxCLK IN (Figure 6 )0.5ns
TCCDTxCLK IN to TxCLK OUT Delay (Figure 7 ) 50% duty cycle input
clock is assumed, T
and 25MHz for ” Max ”, V
= −10˚C, and 65MHz for ” Min ”, TA= 70˚C,
A
= 3.6V, R_FB = V
CC
CC
TxCLK IN to TxCLK OUT Delay (Figure 7 ) 50% duty cycle input
clock is assumed, T
and 25MHz for ” Max ”, V
SSCGSpread Spectrum Clock support; Modulation frequency with a
linear profile (Note 6)
= −10˚C, and 65MHz for ” Min ”, TA= 70˚C,
A
= 3.6V, R_FB = GND
CC
f=25
MHz
f=40
MHz
f=65
MHz
TPLLSTransmitter Phase Lock Loop Set (Figure 8 )10ms
TPDDTransmitter Power Down Delay (Figure 10 )100ns
Note 5: The Minimum and Maximum Limits are based on statistical analysis of the device performance over process, voltage, and temperature ranges. This
parameter is functionality tested only on Automatic Test Equipment (ATE).
Note 6: Care must be taken to ensure TSTC and THTC are met so input data are sampling correctly. This SSCG parameter only shows the performance of tracking
Spread Spectrum Clock applied to TxCLK IN pin, and reflects the result on TxCLKOUT+ and TxCLK− pins.
Note 7: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
Note 8: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed
to produce groups of 16 vertical stripes across the display.
Note 9: Figures 1, 2 show a falling edge data strobe (TxCLK IN/RxCLK OUT).
Note 10: Recommended pin to signal mapping. Customer may choose to define differently.
I1TTL level input. Assertion (low input) TRI-STATES the outputs, ensuring low current at power
down. See Applications Information section.
I3Power supply pins for TTL inputs.
I1Power supply pin for PLL.
I1Power supply pin for LVDS outputs.
www.national.com8
Page 9
Applications Information
The DS90C363B are backward compatible with the
DS90C363/DS90CF363, DS90C363A/DS90CF363A and
are a pin-for-pin replacement.
This device may also be used as a replacement for the
DS90CF563 (5V, 65MHz) and DS90CF561 (5V, 40MHz)
FPD-LinkTransmitterswithcertainconsiderations/
modifications:
1. Change 5V power supply to 3.3V. Provide this supply to
, LVDS VCCand PLL VCCof the transmitter.
the V
CC
2. To implement a falling edge device for the DS90C363B,
the R_FB pin (pin 14) may be tied to ground OR left
unconnected (an internal pull-down resistor biases this
pin low). Biasing this pin to Vcc implements a rising edge
device.
TRANSMITTER INPUT PINS
The DS90C363B transmitter input and control inputs accept
3.3V LVTTL/LVCMOS levels. They are not 5V tolerant.
TRANSMITTER INPUT CLOCK/DATA SEQUENCING
The DS90C363B does not require any special requirement
for sequencing of the input clock/data and PD (PowerDown)
signal. The DS90C363B offers a more robust input sequencing feature where the input clock/data can be inserted after
the release of the PD signal. In the case where the clock/
data is stopped and reapplied, such as changing video mode
within Graphics Controller, it is not necessary to cycle the PD
signal. However, there are in certain cases where the PD
may need to be asserted during these mode changes. In
cases where the source (Graphics Source) may be supplying an unstable clock or spurious noisy clock output to the
LVDS transmitter, the LVDS Transmitter may attempt to lock
onto this unstable clock signal but is unable to do so due the
instability or quality of the clock source. The PD signal in
these cases should then be asserted once a stable clock is
applied to the LVDS transmitter. Asserting the PWR DOWN
pin will effectively place the device in reset and disable the
PLL, enabling the LVDS Transmitter into a power saving
standby mode. However, it is still generally a good practice
to assert the PWR DOWN pin or reset the LVDS transmitter
whenever the clock/data is stopped and reapplied but it is
not mandatory for the DS90C363B.
SPREAD SPECTRUM CLOCK SUPPORT
The DS90C363B can support Spread Spectrum Clocking
signal type inputs. The DS90C383B outputs will accurately
track Spread Spectrum Clock/Data inputs with modulation
frequencies of up to 100kHz (max.)with either center spread
±
2.5% or down spread -5% deviations.
of
POWER SOURCES SEQUENCE
In typical applications, it is recommended to have V
and PLL VCCfrom the same power source with three
V
CC
CC
, LVDS
separate de-coupling bypass capacitor groups. There is no
requirement on which VCC entering the device first.
48-Lead Molded Thin Shrink Small Outline Package, JEDEC
Order Number DS90C363BMT
NS Package Number MTD48
www.national.com11
Page 12
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.