Datasheet DS90C032BTMX, DS90C032BTM Datasheet (NSC)

Page 1
DS90C032B LVDS Quad CMOS Differential Line Receiver
General Description
The DS90C032B is a quad CMOS differential line receiver designed for applications requiring ultra low power dissipa­tion and high data rates. The device is designed to support data rates in excess of 155.5 Mbps (77.7 MHz) utilizing Low Voltage Differential Signaling (LVDS) technology.
®
function that may be used to multiplex outputs. The receiver also sup­ports OPEN and terminated (100) input Fail-safe. Receiver output will be HIGH for both Fail-safe conditions.
The DS90C032B provides power-off high impedance LVDS inputs. This feature assures minimal loading effect on the LVDS bus lines when V
CC
is not present.
The DS90C032B and companion line driver (DS90C031B) provide a new alternative to high power pseudo-ECL devices for high speed point-to-point interface applications.
Features
n
>
155.5 Mbps (77.7 MHz) switching rates
n Accepts small swing (350 mV) differential signal levels n High Impedance LVDS inputs with power down n Ultra low power dissipation n 600 ps maximum differential skew (5V, 25˚C) n 6.0 ns maximum propagation delay n Industrial operating temperature range n Available in surface mount packaging (SOIC) n Pin compatible with DS26C32A, MB570 (PECL) and
41LF (PECL)
n Supports OPEN and terminated input fail-safe n Conforms to ANSI/TIA/EIA-644 LVDS standard
Connection Diagram Functional Diagram
Receiver Truth Table
ENABLES INPUTS OUTPUT
EN EN
*
R
IN+−RIN−
R
OUT
LH X Z
All other combinations V
ID
0.1V H
of ENABLE inputs V
ID
−0.1V L
Fail-safe OPEN H
or Terminated
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
Dual-In-Line
DS100990-1
Order Number
DS90C032BTM
See NS Package
Number M16A
DS100990-2
March 1999
DS90C032B LVDS Quad CMOS Differential Line Receiver
© 1999 National Semiconductor Corporation DS100990 www.national.com
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Absolute Maximum Ratings (Note 1)
Supply Voltage (V
CC
) −0.3V to +6V
Input Voltage (R
IN+,RIN−
) −0.3V to +5.8V
Enable Input Voltage
(EN, EN
*
) −0.3V to (VCC+ 0.3V)
Output Voltage (R
OUT
) −0.3V to (VCC+ 0.3V)
Maximum Package Power Dissipation
@
+25˚C M Package 1025 mW Derate M Package 8.2 mW/˚C above +25˚C Storage Temperature Range −65˚C to +150˚C Lead Temperature Range
Soldering (4 sec.) +260˚C
Maximum Junction
Temperature +150˚C
ESD Rating (Note 7)
(HBM, 1.5 k, 100 pF) 2kV (EIAJ, 0 , 200 pF) 250V
Recommended Operating Conditions
Min Typ Max Units
Supply Voltage (V
CC
)
+4.5 +5.0 +5.5 V
Receiver Input Voltage
GND 2.4 V
Operating Free Air Temperature (T
A
)
DS90C032BT −40 +25 +85 ˚C
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Notes 2, 3)
Symbol Parameter Conditions Pin Min Typ Max Units
V
TH
Differential Input High Threshold VCM= +1.2V R
IN+
,
R
IN−
+100 mV
V
TL
Differential Input Low Threshold −100 mV
I
IN
Input Current V
IN
=
+2.4V V
CC
=
5.5V or 0V −10
±
1 +10 µA
V
IN
=
0V −10
±
1 +10 µA
V
OH
Output High Voltage I
OH
=
−0.4 mA, V
ID
=
+200 mV R
OUT
3.8 4.9 V
I
OH
=
−0.4 mA, Input terminated 3.8 4.9 V
V
OL
Output Low Voltage I
OL
=
2 mA, V
ID
=
−200 mV 0.07 0.3 V
I
OS
Output Short Circuit Current Enabled, V
OUT
=
0V (Note 8) −15 −60 −100 mA
I
OZ
Output TRI-STATE Current Disabled, V
OUT
=
0V or V
CC
−10
±
1 +10 µA
V
IH
Input High Voltage EN,
EN
*
2.0 V
V
IL
Input Low Voltage 0.8 V
I
I
Input Current −10
±
1 +10 µA
V
CL
Input Clamp Voltage I
CL
=
−18 mA −1.5 −0.8 V
I
CC
No Load Supply Current EN, EN
*
=
V
CC
or GND, Inputs Open V
CC
3.5 10 mA
Receivers Enabled EN, EN
*
=
2.4 or 0.5, Inputs Open 3.7 11 mA
I
CCZ
No Load Supply Current Receivers Disabled
EN=GND, EN
*
=
V
CC
, Inputs Open 3.5 10 mA
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Switching Characteristics
V
CC
=
+5.0V, T
A
=
+25˚C (Notes 3, 4, 9)
Symbol Parameter Conditions Min Typ Max Units
t
PHLD
Differential Propagation Delay High to Low C
L
=
5 pF 1.5 3.40 5.0 ns
t
PLHD
Differential Propagation Delay Low to High V
ID
=
200 mV 1.5 3.48 5.0 ns
t
SKD
Differential Skew |t
PHLD−tPLHD
|(
Figure 1
and
Figure 2
) 0 80 600 ps
t
SK1
Channel-to-Channel Skew (Note 5) 0 0.6 1.0 ns
t
TLH
Rise Time 0.5 2.0 ns
t
THL
Fall Time 0.5 2.0 ns
t
PHZ
Disable Time High to Z R
L
=
2k 10 15 ns
t
PLZ
Disable Time Low to Z C
L
=
10 pF 10 15 ns
t
PZH
Enable Time Z to High (
Figure 3
and
Figure 4
) 4 10 ns
t
PZL
Enable Time Z to Low 410ns
Switching Characteristics
V
CC
=
+5.0V
±
10%,T
A
=
−40˚C to +85˚C (Notes 3, 4, 9)
Symbol Parameter Conditions Min Typ Max Units
t
PHLD
Differential Propagation Delay High to Low C
L
=
5 pF 1.0 3.40 6.0 ns
t
PLHD
Differential Propagation Delay Low to High V
ID
=
200 mV 1.0 3.48 6.0 ns
t
SKD
Differential Skew |t
PHLD−tPLHD
|(
Figure 1
and
Figure 2
) 0 0.08 1.2 ns
t
SK1
Channel-to-Channel Skew (Note 5) 0 0.6 1.5 ns
t
SK2
Chip to Chip Skew (Note 6) 5.0 ns
t
TLH
Rise Time 0.5 2.5 ns
t
THL
Fall Time 0.5 2.5 ns
t
PHZ
Disable Time High to Z R
L
=
2k 10 20 ns
t
PLZ
Disable Time Low to Z C
L
=
10 pF 10 20 ns
t
PZH
Enable Time Z to High (
Figure 3
and
Figure 4
) 4 15 ns
t
PZL
Enable Time Z to Low 415ns
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Currentinto device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise speci­fied.
Note 3: All typicals are given for: V
CC
=
+5.0V, T
A
=
+25˚C.
Note 4: Generator waveform for all tests unless otherwise specified: f=1 MHz, Z
O
=
50,t
r
and tf(0%–100%) 1 ns for RINand trand tf≤ 6 ns for EN or EN*.
Note 5: Channel-to-Channel Skew is defined as the difference between the propagation delay of one channel and that of the others on the same chip with an event on the inputs.
Note 6: Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays. Note 7: ESD Rating:
HBM (1.5 k, 100 pF) 2kV EIAJ (0, 200 pF) 250V
Note 8: Output short circuit current (I
OS
) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted at a time, do not ex-
ceed maximum junction temperature specification. Note 9: C
L
includes probe and jig capacitance.
Parameter Measurement Information
DS100990-3
FIGURE 1. Receiver Propagation Delay and Transition Time Test Circuit
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Parameter Measurement Information (Continued)
DS100990-4
FIGURE 2. Receiver Propagation Delay and Transition Time Waveforms
DS100990-5
CLincludes load and test jig capacitance. S
1
=
V
CC
for t
PZL
and t
PLZ
measurements.
S
1
=
GND for t
PZH
and t
PHZ
measurements.
FIGURE 3. Receiver TRI-STATE Delay Test Circuit
DS100990-6
FIGURE 4. Receiver TRI-STATE Delay Waveforms
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Typical Application
Applications Information
LVDSdrivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as is shown in
Figure 5.
This configuration provides a clean signaling en­vironment for the quick edge rates of the drivers. The re­ceiver is connected to the driver through a balanced media which may be a standard twisted pair cable, a parallel pair cable, or simply PCB traces. Typically the characteristic im­pedance of the media is in the range of 100. A termination resistor of 100should be selected to match the media, and is located as close to the receiver input pins as possible. The termination resistor converts the current sourced by the driver into a voltage that is detected by the receiver. Other configurations are possible such as a multi-receiver configu­ration, but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities as well as ground shifting, noise margin limits, and total termination loading must be taken into account.
The DS90C032B differential line receiver is capable of de­tecting signals as low as 100 mV,over a
±
1V common-mode range centered around +1.2V.Thisis related to the driver off­set voltage which is typically +1.2V.The driven signal is cen­tered around this voltage and may shift
±
1V around this cen-
ter point. The
±
1V shifting may be the result of a ground potential difference between the driver’s ground reference and the receiver’s ground reference, the common-mode ef­fects of coupled noise, or a combination of the two. Both re­ceiver input pins should honor their specified operating input voltage range of 0V to +2.4V (measured from each pin to ground), exceeding these limits may turn on the ESD protec­tion circuitry which will clamp the bus voltages.
Receiver Fail-Safe:
The LVDS receiver is a high gain, high speed device that amplifies a small differential signal (20mV) to CMOS logic
levels. Due to the high gain and tight threshold of the re­ceiver,care should be taken to prevent noise from appearing as a valid signal.
The receiver’s internal fail-safe circuitry is designed to source/sink a small amount of current, providing fail-safe protection (a stable known state of HIGH output voltage) for floating or terminated receiver inputs.
1. Open Input Pins. The DS90C032B is a quad receiver device, and if an application requires only 1, 2 or 3 re­ceivers, the unused channel(s) inputs should be left OPEN. Do not tie unused receiver inputs to ground or any other voltages. The input is biased by internal high value pull up and pull down resistors to set the output to a HIGH state. This internal circuitry will guarantee a HIGH, stable output state for open inputs.
For additional LVDS application information, please refer to National’s LVDS Owner’s Manual available through Nation­al’s website www.national.com/appinfo/lvds.
DS100990-7
FIGURE 5. Point-to-Point Application
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Pin Descriptions
Pin No.
Name Description
2, 6,
10, 14
R
IN+
Non-inverting receiver input pin
1, 7,
9, 15
R
IN−
Inverting receiver input pin
3, 5,
11, 13
R
OUT
Receiver output pin
4 EN Active high enable pin, OR-ed with
EN
*
Pin No.
Name Description
12 EN
*
Active low enable pin, OR-ed with EN
16 V
CC
Power supply pin, +5V±10
%
8 GND Ground pin
Ordering Information
Operating Package Type/ Order Number
Temperature Number
−40˚C to +85˚C SOP/M16A DS90C032BTM
Typical Performance Characteristics
Output High Voltage vs Power Supply Voltage
DS100990-8
Output High Voltage vs Ambient Temperature
DS100990-9
Output Low Voltage vs Power Supply Voltage
DS100990-10
Output Low Voltage vs Ambient Temperature
DS100990-11
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Typical Performance Characteristics (Continued)
Output Short Circuit Current vs Power Supply Voltage
DS100990-12
Output Short Circuit Current vs Ambient Temperature
DS100990-13
Differential Propagation Delay vs Power Supply Voltage
DS100990-14
Differential Propagation Delay vs Ambient Temperature
DS100990-15
Differential Skew vs Power Supply Voltage
DS100990-16
Differential Skew vs Ambient Temperature
DS100990-17
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Typical Performance Characteristics (Continued)
Transition Time vs Power Supply Voltage
DS100990-18
Transition Time vs Ambient Temperature
DS100990-19
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Physical Dimensions inches (millimeters) unless otherwise noted
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16-Lead (0.150" Wide) Molded Small Outline Package, JEDEC
Order Number DS90C032BTM
NS Package Number M16A
DS90C032B LVDS Quad CMOS Differential Line Receiver
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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