Datasheet DS90C031BTMX, DS90C031BTM, DS90C031BTWM Datasheet (NSC)

DS90C031B
LVDS Quad CMOS Differential Line Driver

General Description

The DS90C031B is a quad CMOS differential line driver de­signed for applications requiring ultra low power dissipation
and high data rates. The device is designed to support data
rates in excess of 155.5 Mbps(77.7MHz) utilizing Low Volt­age Differential Signaling (LVDS) technology.

The DS90C031B accepts TTL/CMOS input levels and trans­lates them to low voltage (350 mV) differential output sig­nals. In addition the driver supports a TRI-STATE

®

function
that may be used to disable the output stage, disabling the
load current, and thus dropping the device to an ultra low idle
power state of 11 mW typical.

In addition, the DS90C031B provides power-off high imped­ance LVDS outputs. This feature assures minimal loading ef­fect on the LVDS bus lines when V

CC

is not present.

The DS90C031B and companion line receiver (DS90C032B)
provide a new alternative to high power pseudo-ECL devices
for high speed point-to-point interface applications.

Features

n

>

155.5 Mbps (77.7 MHz) switching rates

n High impedance LVDS outputs with power-off

n

±

350 mV differential signaling

n Ultra low power dissipation
n 400 ps maximum differential skew (5V, 25˚C)
n 3.5 ns maximum propagation delay
n Industrial operating temperature range
n Pin compatible with DS26C31, MB571 (PECL) and

41LG (PECL)

n Conforms to ANSI/TIA/EIA-644 LVDS standard
n Offered in narrow and wide body SOIC package
n Fail-safe logic for floating inputs

Connection Diagram Functional Diagram

Driver Truth Table

Enables Input Outputs

EN EN* D

IN

D

OUT+

D

OUT−

LHXZZ
All other combinations L L H
of ENABLE inputs H H L

TRI-STATE®is a registered trademark of National Semiconductor Corporation.

Dual-In-Line

DS100989-1

Order Number

DS90C031BTM,

or DS90C031BTWM

See NS Package Number

M16A or M16B

DS100989-2

March 1999

DS90C031B LVDS Quad CMOS Differential Line Driver

© 1999 National Semiconductor Corporation DS100989 www.national.com

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.

Supply Voltage (V

CC

) −0.3V to +6V

Input Voltage (D

IN

) −0.3V to (VCC+ 0.3V)

Enable Input Voltage (EN, EN*) −0.3V to (V

CC

+ 0.3V)

Output Voltage (D

OUT+,DOUT−

) −0.3V to +5.8V

Short Circuit Duration

(D

OUT+,DOUT−

) Continuous

Maximum Package Power Dissipation

@

+25˚C
M Package 1068 mW
WM Package 1562 mW

Derate M Package 8.5 mW/˚C above +25˚C
Derate WM Package 12.5 mW/˚C above +25˚C
Storage Temperature Range −65˚C to +150˚C

Lead Temperature Range

Soldering (4 sec.) +260˚C

Maximum Junction

Temperature +150˚C

ESD Rating (Note 7)

(HBM, 1.5 kΩ, 100 pF) ≥ 2kV
(EIAJ, 0 Ω, 200 pF) ≥ 250V

Recommended Operating
Conditions

Min Typ Max Units

Supply Voltage (V

CC

) +4.5 +5.0 +5.5 V

Operating Free Air Temperature (T

A

)

DS90C031BT −40 +25 +85 ˚C

Electrical Characteristics

Over supply voltage and operating temperature ranges, unless otherwise specified. (Notes 2, 3)

Symbol Parameter Conditions Pin Min Typ Max Units

V

OD1

Differential Output Voltage RL= 100Ω (

Figure 1

)D

OUT−

,

D

OUT+

250 345 450 mV

∆V

OD1

Change in Magnitude of
V

OD1

for Complementary

Output States

4 35 |mV|

V

OS

Offset Voltage 1.10 1.25 1.35 V

∆V

OS

Change in Magnitude of
V

OS

for Complementary

Output States

5 25 |mV|

V

OH

Output Voltage High RL= 100Ω 1.41 1.60 V

V

OL

Output Voltage Low 0.90 1.07 V

V

IH

Input Voltage High DIN,

EN,
EN*

2.0 V

CC

V

V

IL

Input Voltage Low GND 0.8 V

I

I

Input Current VIN=VCC, GND, 2.5V or 0.4V −10

±

1 +10 µA

V

CL

Input Clamp Voltage ICL= −18 mA −1.5 −0.8 V

I

OS

Output Short Circuit Current V

OUT

= 0V (Note 8) D

OUT−

,

D

OUT+

−3.5 −5.0 mA

I

OZ

Output TRI-STATE Current EN = 0.8V and EN* = 2.0V,

V

OUT

=0VorV

CC

−10

±

1 +10 µA

I

OFF

Power - Off Leakage VO= 0V or 2.4V, VCC= 0V or Open −10

±

1 +10 µA

I

CC

No Load Supply Current
Drivers Enabled

DIN=VCCor GND V

CC

1.7 3.0 mA

D

IN

= 2.5V or 0.4V 4.0 6.5 mA

I

CCL

Loaded Supply Current
Drivers Enabled

RL= 100Ω (all channels)
V

IN=VCC

or GND (all inputs)

15.4 21.0 mA

I

CCZ

No Load Supply Current
Drivers Disabled

DIN=VCCor GND
EN = GND, EN* = V

CC

2.2 4.0 mA

Switching Characteristics

VCC= +5.0V, TA= +25˚C (Notes 3, 6, 9)

Symbol Parameter Conditions Min Typ Max Units

t

PHLD

Differential Propagation Delay High to Low RL= 100Ω,CL=5pF

(

Figure 2

and

Figure 3

)

1.0 2.0 3.0 ns

t

PLHD

Differential Propagation Delay Low to High 1.0 2.1 3.0 ns

t

SKD

Differential Skew |t

PHLD–tPLHD

| 0 80 400 ps

t

SK1

Channel-to-Channel Skew (Note 4) 0 300 600 ps

t

TLH

Rise Time 0.35 1.5 ns

t

THL

Fall Time 0.35 1.5 ns

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Switching Characteristics (Continued)

VCC= +5.0V, TA= +25˚C (Notes 3, 6, 9)

Symbol Parameter Conditions Min Typ Max Units

t

PHZ

Disable Time High to Z RL= 100Ω,CL=5pF

(

Figure 4

and

Figure 5

)

2.5 10 ns

t

PLZ

Disable Time Low to Z 2.5 10 ns

t

PZH

Enable Time Z to High 2.5 10 ns

t

PZL

Enable Time Z to Low 2.5 10 ns

Switching Characteristics

VCC= +5.0V±10%,TA= −40˚C to +85˚C (Notes 3, 6, 9)

Symbol Parameter Conditions Min Typ Max Units

t

PHLD

Differential Propagation Delay High to Low RL= 100Ω,CL=5pF

(

Figure 2

and

Figure 3

)

0.5 2.0 3.5 ns

t

PLHD

Differential Propagation Delay Low to High 0.5 2.1 3.5 ns

t

SKD

Differential Skew |t

PHLD–tPLHD

| 0 80 900 ps

t

SK1

Channel-to-Channel Skew (Note 4) 0 0.3 1.0 ns

t

SK2

Chip to Chip Skew (Note 5) 3.0 ns

t

TLH

Rise Time 0.35 2.0 ns

t

THL

Fall Time 0.35 2.0 ns

t

PHZ

Disable Time High to Z RL= 100Ω,CL=5pF

(

Figure 4

and

Figure 5

)

2.5 15 ns

t

PLZ

Disable Time Low to Z 2.5 15 ns

t

PZH

Enable Time Z to High 2.5 15 ns

t

PZL

Enable Time Z to Low 2.5 15 ns

Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.

Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except: V

OD1

and

∆V

OD1

.

Note 3: All typicals are given for: V

CC

= +5.0V, TA= +25˚C.

Note 4: Channel-to-Channel Skew is defined as the difference between the propagation delay of the channel and the other channels in the same chip with an event
on the inputs.

Note 5: Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays.
Note 6: Generator waveform for all tests unless otherwise specified:f=1MHz, Z

O

=50Ω,tr≤6 ns, and tf≤ 6 ns.

Note 7: ESD Ratings:

HBM (1.5 kΩ, 100 pF) ≥ 2kV
EIAJ (0Ω, 200 pF) ≥ 250V

Note 8: Output short circuit current (I

OS

) is specified as magnitude only, minus sign indicates direction only.

Note 9: C

L

includes probe and jig capacitance.

Parameter Measurement Information

DS100989-3

FIGURE 1. Driver VODand VOSTest Circuit

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Parameter Measurement Information (Continued)

DS100989-4

FIGURE 2. Driver Propagation Delay and Transition Time Test Circuit

DS100989-5

FIGURE 3. Driver Propagation Delay and Transition Time Waveforms

DS100989-6

FIGURE 4. Driver TRI-STATE Delay Test Circuit

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Parameter Measurement Information (Continued)

Typical Application

Applications Information

LVDSdrivers and receivers are intended to be primarily used
in an uncomplicated point-to-point configuration as is shown
in

Figure 6

. This configuration provides a clean signaling en­vironment for the quick edge rates of the drivers. The re­ceiver is connected to the driver through a balanced media
which may be a standard twisted pair cable, a parallel pair
cable, or simply PCB traces. Typically, the characteristic im­pedance of the media is in the range of 100Ω. A termination
resistor of 100Ω should be selected to match the media, and
is located as close to the receiver input pins as possible. The
termination resistor converts the current sourced by the
driver into a voltage that is detected by the receiver. Other
configurations are possible such as a multi-receiver configu­ration, but the effects of a mid-stream connector(s), cable
stub(s), and other impedance discontinuities as well as
ground shifting, noise margin limits, and total termination
loading must be taken into account.

The DS90C031B differential line driver is a balanced current
source design. A current mode driver, generally speaking
has a high output impedance and supplies a constant cur­rent for a range of loads (a voltage mode driver on the other
hand supplies a constant voltage for a range of loads). Cur­rent is switched through the load in one direction to produce
a logic state and in the other direction to produce the other
logic state. The typical output current is a mere 3.4 mA with
a minimum of 2.5 mA, and a maximum of 4.5 mA. The cur­rent mode requires (as discussed above) that a resistive ter-

mination be employed to terminate the signal and to com­plete the loop as shown in

Figure 6

. AC or unterminated
configurations are not allowed. The 3.4 mA loop current will
develop a differential voltage of 340 mV across the 100Ω ter­mination resistor which the receiver detects with a 240 mV
minimum differential noise margin neglecting resistive line
losses (driven signal minus receiver threshold (340 mV –
100 mV = 240 mV). The signal is centered around +1.2V
(Driver Offset, V

OS

) with respect to ground as shown in

Fig-

ure 7

. Note that the steady-state voltage (VSS) peak-to-peak

swing is twice the differential voltage (V

OD

) and is typically

680 mV.
The current mode driver provides substantial benefits over

voltage mode drivers, such as an RS-422 driver. Its quies­cent current remains relatively flat versus switching fre­quency.Whereas the RS-422 voltage mode driver increases
exponentially in most case between 20 MHz–50 MHz. This
is due to the overlap current that flows between the rails of
the device when the internal gates switch. Whereas the cur­rent mode driver switches a fixed current between its output
without any substantial overlap current. This is similar to
some ECL and PECL devices, but without the heavy static
I

CC

requirements of the ECL/PECL designs. LVDS requires
80%less current than similar PECL devices. AC specifica­tions for the driver are a tenfold improvement over other ex­isting RS-422 drivers.

The fail-safe circuitry guarantees that the outputs are en­abled and at a logic ’0’ (the true output is low and the
complement output is high) when the inputs are floating.

DS100989-7

FIGURE 5. Driver TRI-STATE Delay Waveform

DS100989-8

FIGURE 6. Point-to-Point Application

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Applications Information (Continued)

The TRI-STATE function allows the driver outputs to be dis­abled, thus obtaining an even lower power state when the
transmission of data is not required.

The footprint of the DS90C031B is the same as the industry
standard 26LS31 Quad Differential (RS-422) Driver.

The DS90C031B is electrically similar to the DS90C031, but
differs by supporting high impedance LVDS outputs under

power-off condition. This allows for multiple or redundant
drivers to be used in certain applications. The DS90C031B is
offered in a 300 mil. wide SOIC, allowing direct conversion to
Quad PECL drivers to LVDS.It is also offered in a space sav­ing narrow SOIC (150 mil.) package.

For additional LVDS application information, please refer to
National’s LVDS Owner’s Manual available through Nation­al’s website www.national.com/appinfo/lvds.

Pin Descriptions

Pin No. Name Description

1, 7, 9, 15 D

IN

Driver input pin, TTL/CMOS compatible

2, 6, 10, 14 D

OUT+

Non-inverting driver output pin, LVDS levels

3, 5, 11, 13 D

OUT−

Inverting driver output pin, LVDS levels

4 EN Active high enable pin, OR-ed with EN*
12 EN* Active low enable pin, OR-ed with EN
16 V

CC

Power supply pin, +5V±10

%

8 GND Ground pin

Ordering Information

Operating Package Type/ Order Number

Temperature Number

−40˚C to +85˚C SOP/M16A DS90C031BTM

−40˚C to +85˚C SOP/M16B DS90C031BTWM

DS100989-9

FIGURE 7. Driver Output Levels

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Typical Performance Characteristics

Power Supply Current
vs Power Supply Voltage

DS100989-10

Power Supply Current
vs Temperature

DS100989-11

Power Supply Current
vs Power Supply Voltage

DS100989-12

Power Supply Current
vs Temperature

DS100989-13

Output TRI-STATE Current
vs Power Supply Voltage

DS100989-14

Output Short Circuit Current
vs Power Supply Voltage

DS100989-15

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Typical Performance Characteristics (Continued)

Differential Output Voltage
vs Power Supply Voltage

DS100989-16

Differential Output Voltage
vs Ambient Temperature

DS100989-17

Output Voltage High vs
Power Supply Voltage

DS100989-18

Output Voltage High vs
Ambient Temperature

DS100989-19

Output Voltage Low vs
Power Supply Voltage

DS100989-20

Output Voltage Low vs
Ambient Temperature

DS100989-21

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Typical Performance Characteristics (Continued)

Offset Voltage vs
Power Supply Voltage

DS100989-22

Offset Voltage vs
Ambient Temperature

DS100989-23

Power Supply Current
vs Frequency

DS100989-24

Power Supply Current
vs Frequency

DS100989-25

Differential Output Voltage
vs Load Resistor

DS100989-26

Differential Propagation Delay
vs Power Supply Voltage

DS100989-27

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Typical Performance Characteristics (Continued)

Differential Propagation Delay
vs Ambient Temperature

DS100989-28

Differential Skew vs
Power Supply Voltage

DS100989-29

Differential Skew vs
Ambient Temperature

DS100989-30

Differential Transition Time
vs Power Supply Voltage

DS100989-31

Differential Transition Time
vs Ambient Temperature

DS100989-32

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Physical Dimensions inches (millimeters) unless otherwise noted

16-Lead (0.150" Wide) Molded Small Outline Package, JEDEC

Order Number DS90C031BTM

NS Package Number M16A

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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)

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whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.

2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
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www.national.com

16-Lead (0.300" Wide) Molded Small Outline Package, JEDEC

Order Number DS90C031BTWM

NS Package Number M16B

DS90C031B LVDS Quad CMOS Differential Line Driver

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.