The DS75361 is a monolithic integrated dual TTL-to-MOS
driver interface circuit. The device accepts standard TTL
input signals and provides high-current and high-voltage
output levels for driving MOS circuits. It is used to drive
address, control, and timing inputs for several types of MOS
RAMs including the 1103 and MM5270 and MM5280.
The DS75361 operates from standard TTL 5V supplies and
the MOS V
been optimized for operation with V
16V to 20V; however, it is designed for use over a much
wider range of V
supply in many applications. The device has
SS
.
CC2
supply voltage from
CC2
Schematic and Connection Diagrams
(1/2 shown)
Features
Y
Capable of driving high-capacitance loads
Y
Compatible with many popular MOS RAMs
Y
V
supply voltage variable over wide range to 24V
CC2
Y
Diode-clamped inputs
Y
TTL compatible
Y
Operates from standard bipolar and MOS supplies
Y
High-speed switching
Y
Transient overdrive minimizes power dissipation
Y
Low standby power dissipation
Dual-In-Line Package
Top View
TL/F/7557– 1
Order Number DS75361N
See NS Package Number N08E
TL/F/7557– 3
C
1995 National Semiconductor CorporationRRD-B30M105/Printed in U. S. A.
TL/F/7557
Page 2
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage Range of V
Supply Voltage Range of V
CC1
CC2
(Note 1)
b
0.5 to 7V
b
0.5V to 25V
Input Voltage5.5V
Inter-Input Voltage (Note 4)5.5V
b
Storage Temperature Range
65§Ctoa150§C
Maximum Power Dissipation* at 25§C
Molded Package1022 mW
Lead Temperature 1/16 inch from Case for
10 Seconds: N or P Package200
*Derate molded package 8.2 mW/§above about 25§C.
Operating Conditions
Supply Voltage (V
Supply Voltage (V
)4.755.25V
CC1
)4.7524V
CC2
Operating Temperature (TA)0
MinMaxUnits
a
70
C
§
C
§
Electrical Characteristics (Notes 2 and 3)
SymbolParameterConditionsMinTypMaxUnits
V
V
V
V
V
V
I
I
I
IH
I
IL
I
CC1(H)
I
CC2(H)
I
CC1(L)
I
CC2(L)
I
CC2(S)
High-Level Input Voltage2V
IH
Low-Level Input Voltage0.8V
IL
Input Clamp VoltageI
I
High-Level Output VoltageV
OH
Low-Level Output VoltageV
OL
Output Clamp VoltageV
O
Input Current at MaximumV
Input Voltage
High-Level Input Current
Low-Level Input Current
Supply Current from V
Outputs High
Supply Current from V
Outputs High
Supply Current from V
Outputs Low
Supply Current from V
Outputs Low
Supply Current from V
Stand-by ConditionAll Inputs at 5V, No Load
Note 1: ‘‘Absolute Maximum Ratings’’ are those values beyond which the safety of the device cannot be guaranteed. Except for ‘‘Operating Temperature Range’’
they are not meant to imply that the devices should be operated at these limits. The table of ‘‘Electrical Characteristics’’ provides conditions for actual device
operation.
Note 2: Unless otherwise specified min/max limits apply across the 0
e
20V.
V
CC2
Note 3: All currents into device pins shown as positive, out of device pins as negative, all voltages referenced to ground unless otherwise noted. All values shown
as max or min on absolute value basis.
Note 4: This rating applies between the A input of either driver and the common E input.
, Both
CC1
, Both
CC2
, Both
CC1
, Both
CC2
,V
CC2
eb
12 mA
I
e
0.8V, I
IL
e
V
0.8V, I
IL
e
2V, I
IH
e
V
CC2
e
I
40 mA
OL
e
0V, I
I
e
5.5V1mA
I
e
V
2.4V
I
e
V
0.4V
I
eb
50 mAV
OH
eb
10 mAV
OH
e
10 mA0.150.3V
OL
15V to 24V, V
e
OH
e
2V,
IH
20 mAV
CC2
CC2
b
1V
b
2.3 V
b
CC2
b
CC2
0.250.5V
A Inputs40mA
E Input80mA
b
A Inputs
E Input
1
b
2
24mA
e
V
5.25V,V
CC1
All Inputs at 0V, No Load
CC2
e
24V,
1624mA
e
V
5.25V,V
CC1
All Inputs at 5V, No Load
e
0V,V
CC1
Ctoa70§C range for the DS75361. All typical values are for T
§
CC2
CC2
e
24V,
711mA
e
24V,
b
1.5V
0.7V
1.8V
a
1.5V
CC2
b
1.6mA
b
3.2mA
0.5mA
0.5mA
e
A
25§C and V
CC1
e
5V and
2
Page 3
Switching Characteristics V
CC1
e
5V, V
CC2
e
20V, T
e
25§C
A
SymbolParameterConditionsMinTypMaxUnits
t
DLH
t
DHL
t
TLH
t
THL
Delay Time, Low-to-High Level Output1120ns
Delay Time, High-to-Low Level Output
Transition Time, Low-to-High Level Output
Transition Time, High-to-Low Level Output
e
C
L
e
R
D
(Figure 1)
390 pF,
10X
1018ns
2540ns
2135ns
tPLHPropagation Delay Time, Low-to-High Level Output103655ns
t
PHL
Propagation Delay Time, High-to-Low Level Output103147ns
AC Test Circuit and Switching Time Waveforms
TL/F/7557– 4
Note 1: The pulse generator has the following characteristics: PRRe1 MHz, Z
Note 2: C
includes probe and jig capacitance.
L
FIGURE 1. Switching Times, Each Driver
3
OUT
TL/F/7557– 5
e
50X.
Page 4
Typical Performance Characteristics
High-Level Output Voltage vs
Output Current
Total Dissipation (Both Drivers)
vs Frequency
Propagation Delay Time,
Low-to-High Level Output
Supply Voltage
vs V
CC2
Low-Level Output Voltage vs
Output Current
Propagation Delay Time,
Low-to-High Level Output
vs Ambient Temperature
Propagation Delay Time,
High-to-Low Level Output
Supply Voltage
vs V
CC2
Voltage Transfer
Characteristics
Propagation Delay Time,
High-to-Low Level Output
vs Ambient Temperature
Propagation Delay Time,
Low-to-High Level Output
vs Load Capacitance
Propagation Delay Time,
High-to-Low Level Output
vs Load Capacitance
4
TL/F/7557– 2
Page 5
Typical Applications
The fast switching speeds of this device may produce undesirable output transient overshoot because of load or wiring
inductance. A small series damping resistor may be used to
reduce or eliminate this output transient overshoot. The
optimum value of the damping resistor to use depends on
the specific load characteristics and switching speed. A typical value would be between 10 X and 30X
(Figure 3)
.
FIGURE 2. Interconnection of DS75361 Devices with 1103 RAM
Thermal Information
POWER DISSIPATION PRECAUTIONS
Significant power may be dissipated in the DS75361 driver
when charging and discharging high-capacitance loads over
a wide voltage range at high frequencies. The total dissipation curve shows the power dissipated in a typical DS75361
as a function of load capacitance and frequency. Average
power dissipated by this driver can be broken into three
components:
e
P
T(AV)
where P
DC(AV)
output high or low, P
or discharging of the load capacitance, and P
power dissipation during switching between the low and
high levels. None of these include energy transferred to the
load and all are averaged over a full cycle.
The power components per driver channel are:
P
DC(AV)
&
P
C(AV)
e
P
S(AV)
where the times are defined in
PL,PH,PLH, and PHLare the respective instantaneous levels of power dissipation and C is load capacitance.
a
P
DC(AV)
is the steady-state power dissipation with the
C(AV)
a
P
LtL
e
T
2
f
CV
C
a
PLHt
LH
T
a
P
PHt
PHLt
P
C(AV)
H
S(AV)
is the power level during charging
HL
Figure 4
.
S(AV)
is the
CC2
2
7mA
2
e
J(
J(
TL/F/7557– 7
20V, and
a
(0.6)
(0.4)
&
J
J
2
D
CC1
a
(20V)
a
(20V)
(2 MHz)
10X to 30X (Optional).
is a negligible portion
S
e
5V, V
0mA
#
#
Note: R
FIGURE 3. Use of Damping
Resistor to Reduce or Eliminate
Output Transient Overshoot in
TL/F/7557– 6
The DS75361 is so designed that P
of P
in most applications. Except at very high frequencies,
T
a
n
t
t
L
dissipation curve for no load demonstrates this point. The
power dissipation contributions from both channels are then
added together to obtain total device power.
The following example illustrates this power calculation
technique. Assume both channels are operating identically
with C
duty cycle
e
V
OH
current from V
On a per-channel basis using data sheet values:
P
DC(AV)
P
DC(AV)
P
C(AV)
P
C(AV)
For the total device dissipation of the two channels:
P
T(AV)
P
T(AV)
a
t
H
LH
e
200 pF, fe2 MHz, V
e
60% outputs high (tH/Te0.6). Also, assume
19.3V, V
CC2
e
(5V)
Ð
(5V)
Ð
e
47 mW per channel
&
(200 pF) (19.2V)
&
148 mW per channel.
&
2 (47
&
390 mW typical for total package.
Certain DS75361 Applications
tHLso that PScan be neglected. The total
e
0.1V, PSis negligible, and that the
OL
is negligible when the output is high.
2mA
2
#
16 mA
2
#
a
148)
FIGURE 4. Output Voltage Waveform
5
TL/F/7557– 8
Page 6
Physical Dimensions inches (millimeters)
DS75361 Dual TTL-to-MOS Driver
Molded Dual-In-Line Package
Order Number DS75361N
See NS Package Number N08E
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or2. A critical component is any component of a life
systems which, (a) are intended for surgical implantsupport device or system whose failure to perform can
into the body, or (b) support or sustain life, and whosebe reasonably expected to cause the failure of the life
failure to perform, when properly used in accordancesupport device or system, or to affect its safety or
with instructions for use provided in the labeling, caneffectiveness.
be reasonably expected to result in a significant injury
to the user.
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