Datasheet DS3885VX, DS3885VF, DS3885V Datasheet (NSC)

TL/F/10721

DS3885 BTL Arbitration Transceiver

January 1994

DS3885 BTL Arbitration Transceiver

General Description

The DS3885 is one in a series of transceivers designed spe­cifically for the implementation of high performance Future­bus

a

and proprietary bus interfaces. The DS3885 Arbitra­tion Transceiver is designed to conform to IEEE 1194.1
(Backplane Transceiver LogicÐBTL) as specified in the
IEEE 896.2 Futurebus

a

specification. The Arbitration
Transceiver incorporates the competition logic internally
which simplifies the implementation of a Futurebus

a

appli-

cation by minimizing the on board logic required.

The DS3885 driver output configuration is an NPN open col­lector which allows Wired-OR connection on the bus. Each
driver output incorporates a Schottky diode in series with its
collector to isolate the transistor output capacitance from
the bus thus reducing the bus loading in the inactive state.

The BTL drivers also have high sink current capability to
comply with the bus loading requirements defined within
IEEE 1194.1 BTL specification.

Backplane Transceiver Logic (BTL) is a signaling standard
that was invented and first introduced by National Semicon-

(Continued)

Features

Y

9-bit inverting BTL transceiver

Y

Meets IEEE 1194.1 standard on Backplane Transceiver
Logic (BTL)

Y

Includes on chip competition logic and parity checking

Y

Supports live insertion

Y

Glitch free power-up/down protection

Y

Typically less than 5 pF bus-port capacitance

Y

Low bus-port voltage swing (typically 1V) at 80 mA

Y

Open collector bus-port output allows Wired-OR
connection

Y

Exceeds 2 kV ESD testing (Human Body Model)

Y

Individual bus-port ground pins minimize ground bounce

Y

Controlled rise and fall time to reduce noise coupling to
adjacent lines

Y

TTL compatible driver and control inputs

Y

Built in bandgap reference with separate QVCCand
QGND pins for precise receiver thresholds

Y

Product offered in PLCC and PQFP package styles

Connection Diagrams

TL/F/10721– 2 TL/F/10721– 13

Order Number DS3885V or DS3885VF

See NS Package Number V44A or VF44B

TRI-STATEÉis a registered trademark of National Semiconductor Corporation.

C

1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.

General Description (Continued)

ductor, then developed by the IEEE to enhance the per­formance of backplane buses. BTL compatible transceivers
feature low output capacitance drivers to minimize bus load­ing, a 1V nominal signal swing for reduced power consump­tion and receivers with precision thresholds for maximum
noise immunity. BTL eliminates settling time delays that se­verely limit TTL bus performance, and thus provide signifi­cantly higher bus transfer rates. The backplane bus is in­tended to be operated with termination resistors (selected
to match the bus impedance) connected to 2.1V at both
ends. The low voltage is typically 1V.

Separate ground pins are provided for each BTL output to
minimize induced ground noise during simultaneous switch­ing.

The transceiver’s control and driver inputs are designed
with high impedance PNP input structures and are fully TTL
compatible.

The receiver is a high speed comparator that utilizes a
bandgap reference for precision threshold control allowing
maximum noise immunity to the BTL 1V signaling level.
Separate QV

CC

and QGND pins are provided to minimize
the effects of high current switching noise. The output is
TRI-STATE

É

and fully TTL compatible.

The signals abk7:0ldesignate the arbitration bus number
which this transceiver places on the bus. The signal names
AB

k

7:0ldesignate the open collector Wired-OR signals

on the backplane bus.

The DS3885 implements an odd parity check on the arbitra­tion bus bits AB

k

7:0l, with ABP being the parity bit. The

signal PER

will indicate the parity check result. For a quick
indication of current bus conditions, the bus status block
generates ALL1

(all asserted) status when all bits

(AB

k

7:0l) are asserted by any module. This signal is used
by the DS3875 Arbitration Controller to detect the Arbitra­tion message number (during phase 1) or the powerfail mes­sage number (during phase 2).

To latch the arbitration number into the transceiver, it is
placed onto the CN

k

7:0lport, and the CNÐLE signal is

asserted. When the CMPT

signal is asserted, the arbitration

number is placed on the bus lines AB

k

7:0l. The WIN

Ð

GT
signal serves two purposes during the arbitration cycle. If
the CMPT

signal is not asserted during the arbitration cycle,
the transceiver compares its internally latched number to
the number on the AB

k

7:0lbus lines. If the internal num­ber on the transceiver is greater than or equal to the number
on the AB

k

7:0llines, the WIN

Ð

GT

signal is asserted.

However, if the CMPT

signal is asserted, the transceiver
participates in the competition. If the transceiver wins the
arbitration, the WIN

Ð

GT

signal is asserted to confirm the

winning. The ABÐRE

signal is used to enable the on-chip

receiver outputs.

The DS3885 supports live insertion as defined in IEEE

896.2 through the LI (Live Insertion) pin. To implement live
insertion the LI pin should be connected to the live insertion
power connector. If this function is not supported the LI pin
must be tied to the V

CC

pin. The DS3885 also provides
glitch free power-up/down protection during power se­quencing.

The DS3885 has two types of power connections in addition
to the LI pin. They are the Logic V

CC(VCC

) and the Quiet

V

CC

(QVCC). There are two VCCpins on the DS3885 that
provide the supply voltage for the logic and control circuitry.
Multiple power pins reduce the effects of package induc­tance and thereby minimize switching noise. As these pins
are common to the V

CC

bus internal to the device, a voltage
difference should never exist between these pins and the
voltage difference between V

CC

and QVCCshould never

exceed

g

0.5V because of ESD circuitry.

Additionally, the ESD circuitry between the V

CC

pins and all
other pins except for BTL I/O’s and LI pins requires that any
voltage on these pins should not exceed the voltage on V

CC

a

0.5V

There are three different types of ground pins on the
DS3885. They are the logic ground (GND), BTL grounds
(AB0GND–AB7GND/ABPGND) and the Bandgap refer­ence ground (QGND). All of these reference pins are isolat­ed within the chip to minimize the effects of high current
switching transients. For optimum performance the QGND
should be returned to the connector through a quiet channel
that does not carry transient switching current. The GND
and AB0GND – AB7GND/ABPGND should be connected to
the nearest backplane ground pin with the shortest possible
path.

Since many different grounding schemes could be imple­mented and ESD circuitry exists on the DS3885, it is impor­tant to note that any voltage difference between ground
pins, QGND, GND or AB0GND –AB7GND and ABPGND
should not exceed

g

0.5V including power-up/down se-

quencing.

Three additional transceivers are included in the Future­bus

a

family. They are the DS3883A BTL 9-bit Transceiver.
The DS3884A BTL Handshake Transceiver features select­able Wired-OR glitch filtering. The DS3886A BTL 9-bit
Latching Data Transceiver contains edge triggered latches
in the driver which may be bypassed during a fall-through
mode. In addition, the device contains a transparent latch in
the receiver section.

The DS3875 Arbitration Controller included in the Future­bus

a

family supports all the required and optional modes
for Futurebus

a

arbitration protocol. It is designed to be
used in conjunction with the DS3884A and DS3885 trans­ceivers.

The LOGICAL INTERFACE FUTUREBUS

a

ENGINE (LIFE)

is a high performance Futurebus

a

Protocol Controller de­signed for IEEE 896.1. The LIFE will handle all handshaking
signals between the Futurebus

a

and the local bus inter-

face. The Protocol Controller supports the Futurebus

a

compelled mode data transfer as both master and slave.
The Protocol Controller can be configured to operate in
compliance to IEEE 896.2 Profile B mode. The LIFE incor­porates a DMA controller and 64-bit FIFO’s for fast queuing.

All of the transceivers are offered in 44-pin PLCC and PQFP
high density package styles.

2

Absolute Maximum Ratings (Notes 1 and 2)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.

Supply Voltage 6.5V

Control Input Voltage 6.5V

Driver Input and Receiver Output 5.5V

Receiver Input Current

g

15 mA

Bus Termination Voltage 2.4V

Power Dissipation at 25§C PLCC 2.5W

PQFP 1.3W

Derate PLCC Package 20 mW/

§

C

Derate PQFP Package 11.1 mW/

§

C

Storage Temperature Range

b

65§Ctoa150§C

Lead Temperature (Soldering, 4 sec.) 260§C

Recommended
Operating Conditions

Min Max Units

Supply Voltage, V

CC

4.5 5.5 V

Bus Termination Voltage (VT) 2.06 2.14 V

Operating Free Air Temperature 0 70

§

C

DC Electrical Characteristics (Notes 2 and 3) T

A

e

0§Ctoa70§C, V

CC

e

5Vg10%

Symbol Parameter Conditions Min Typ Max Units

DRIVER AND CONTROL INPUT (CNn CNP, CNÐLE, CMPT, and ABÐRE)

V

IH

Minimum Input High Voltage 2.0 V

V

IL

Maximum Input Low Voltage 0.8 V

I

I

Input Leakage Current V

IN

e

V

CC

e

5.5V 100 mA

I

IH

Input High Current V

IN

e

2.4V 40 mA

I

IL

Input Low Current V

IN

e

0.5V

b

100 mA

V

CL

Input Diode Clamp Voltage I

CLAMP

eb

12 mA

b

1.2 V

DRIVER OUTPUT/RECEIVER INPUT (ABn and ABP)

V

OLB

Output Low Bus Voltage CNneABÐREe2.4V, CNÐLEeCMPTe0.5V

0.75 1.0 1.1 V

(Note 5) I

OL

e

80 mA

I

OLBZ

Output Low Bus Current CMPTeABÐREe2.4V, ABne0.75V

b

100 mA

I

OHBZ

Output High Bus Current CMPTeABÐREe2.4V, ABne2.1V 100 mA

V

TH

Receiver Input Threshold 1.47 1.55 1.62 V

V

CLP

Positive Clamp Voltage V

CC

e

Max or 0V, I

ABn

e

1 mA 2.4 3.4 4.5 V

V

CC

e

Max or 0V, I

ABn

e

10 mA 2.9 3.9 5.0 V

V

CLN

Negative Clamp Voltage I

CLAMP

eb

12 mA

b

1.2 V

RECEIVER OUTPUT (CNn, CNP, ALL1, PER, and WIN

Ð

GT

)

V

OH

Voltage Output High ABne1.1V, ABÐREe0.5V,

2.4 3.2 V

CMPT

e

CNÐLEe2.4V, I

OH

eb

2mA

V

OL

Voltage Output Low ABne2.1V, ABÐREe0.5V,

0.35 0.5 V

CMPT

e

CNÐLEe2.4V, I

OL

e

24 mA

ABne2.1V, ABÐREe0.5V,

0.30 0.4 V

CMPT

e

CNÐLEe2.4V, I

OL

e

8mA

I

OZ

TRI-STATE Leakge Current CNneCNPe2.4V,e2.4V, ABÐREe2.4V 40 mA

CNneCNPe0.5V, ABÐREe2.4V

b

100 mA

I

OS

Output Short Circuit Current ABne1.1V, ABÐREe0.5V

b40b70b

100 mA

CMPT

e

CNÐLEe2.4V (Note 4)

SUPPLY CURRENT

I

CC

Supply Current: Includes VCC, CMPTeCNÐLEe0.5V, All CNneABÐREe2.4V 75 100 mA
QVCCand LI

CMPT

e

CNÐLEeABÐREe2.4V 26 40 mA

I

LI

Live Insertion Current CMPTeABÐREeCNne2.4V, CNÐLEe0.5V 1.5 3 mA

CMPTeCNÐLEe0.5V, All CNneABÐREe2.4 3 5 mA

3

DC Electrical Characteristics (Notes 2 and 3) T

A

e

0§Ctoa70§C, V

CC

e

5Vg10% (Continued)

Note 1: Absolute Maximum Ratings are those beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be
operated at these limits. The tables of ‘‘Electrical Characteristics’’ provide conditions for actual device operation.

Note 2: All input and/or output pins shall not exceed V

CC

a

0.5V and shall not exceed the absolute maximum rating at any time, including power-up and power-

down. This prevents the ESD structure from being damaged due to excessive currents flowing from the input and/or output pins to QV

CC

and VCC. There is a diode

between each input and/or output to V

CC

which is forward biased when incorrect sequencing is applied. LI and Bn pins do not have power sequencing

requirements with respect to V

CC

and QVCC.

Note 3: All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified. All typical values are specified under these conditions: V

CC

e

5V and T

A

e

25§C, unless otherwise stated.

Note 4: Only one output should be shorted at a time, and duration of the short not to exceed one second.

Note 5: Referenced to appropriate signal ground. Do not exceed maximum power dissipation of package.

AC Electrical Characteristics T

A

e

0§Ctoa70§C, V

CC

e

5Vg10% (Note 6)

Symbol Parameter Conditions Min Typ Max Units

DRIVER (

Figures 1

and2)

t

PHL

CNÐLE to AB7 Propagation Delay CMPTe0V, ABÐREe3V 7 13 18 ns

t

PLH

61017 ns

trTransition TimeÐRise/Fall ABÐREe3V, CMPTeCNÐLEe03ns

t

f

20% to 80%

ABÐREe3V, CMPTeCNÐLEe01ns

DRIVER TIMING REQUIREMENTS (

Figures 1

and2)

t

S

CNn to CNÐLE Set-Up Time ABÐREe3V, CMPTe0V 9 ns

t

H

CNÐLE to CNn Hold Time ABÐREe3V, CMPTe0V 0 ns

t

PW

CNÐLE Pulse Width ABÐREe3V, CMPTe0V 15 ns

RECEIVER

t

PHL

ABn to CNn Propagation Delay ABÐREe0V, CMPTeCNÐLEe3V 5 13 22 ns

t

PLH

(

Figures 4

and5)

31523 ns

t

PLZ

ABÐRE to CNn Disable Time CMPTeCNÐLEe3V, ABne2.1V 3 6 11 ns

t

PZL

Enable Time

(

Figures 6

and7)

5 9 13 ns

t

PHZ

Disable Time CMPTeCNÐLEe3V, ABne1.1V 4 7 12 ns

t

PZH

Enable Time

(

Figures 6

and7)

3 6 11 ns

OTHERS

t

PHL

AB0 to ALL1 Propagation Delay ABk7:1

l

e

1.1V 7 16 28 ns

t

PLH

All Asserted Condition (

Figures 4

and8)

71626 ns

t

PHL

AB0 to WIN

Ð

GT

Propagation Delay CMPTeCNÐLEe0V, ABÐREe3V, 6 14 23 ns

t

PLH

Win Condition CNk7:0

l

e

0V

61423 ns

AB

k

7:0

l

e

2.1V (

Figures 4

and9)

t

PHL

AB0 to WIN

Ð

GT

Propagation Delay CMPTeABÐREe3V, CNÐLEe0V, 6 16 27 ns

t

PLH

Greater Than Condition CNk7:1

l

e

0V, CN0e3V

61626 ns

AB

k

7:0

l

e

2.1V (

Figures 4

and9)

t

PHL

ABP to PER Propagation Delay CMPTeCNÐLEeABÐREe3V, 6 13 23 ns

t

PLH

Parity Error Condition ABk7:1

l

e

1.1V, AB0e2.1V
41323 ns

(

Figures 4

and8)

t

PHL

ABn to ABknb1lPropagation Delay CMPTeCNÐLEe0V, ABÐREe3V,

51222 ns

CNne0V, CNknb1

l

e

3V,

t

PLH

CNk7:na1

l

e

0V, ABk7:na1

l

e

2.1V
51323 ns

(

Figures 1

and10)

t

PHL

CMPT to AB7 Propagation Delay CNÐLEe0V, ABÐREeCN7e3V 4 8 14 ns

t

PLH

(

Figures 1

and3)

5 9 16 ns

t

PHL

AB7 to ABP Propagation Delay CMPTeCNÐLEe0V, ABÐREeCNPe3V, 36 60 ns

t

PLH

CNk7:0

l

e

0V (

Figures 1

and10)

36 60 ns

4

AC Electrical Characteristics T

A

e

0§Ctoa70§C, V

CC

e

5Vg10% (Note 6) (Continued)

Symbol Parameter Conditions Min Typ Max Units

PARAMETERS NOT TESTED

C

output

Capacitance at Bn (Note 7) 5 pF

t

NR

Noise Rejection (Note 8) 1 ns

Note 6: All input rise/fall times should be 3 ns.

Note 7: This parameter is tested using TDR techniques described in 1194.0 BTL Backplane Design Guide.

Note 8: This parameter is tested during device characterization. The measurement revealed that the part will typically reject 1 ns pulse width.

Pin Description

Pin Name

Number of Input/

Description

Pins Output

ALL1 1 O TTLÐAll asserted (A logic ‘‘1’’ indicates that all the competition bits

are asserted.)

ABk7:0

l

8 I/O BTLÐFuturebusaWired-OR competition bits

ABP 1 I/O BTLÐFuturebusaWired-OR competition parity bit

ABk7:0land 9 NA Parallel driver grounds reduce ground bounce due to high current

switching of driver outputs (Note 9)

ABP GND

CNk7:0

l

8 I/O TTL TRI-STATEÐModule competition bits

CNP 1 I TTL TRI-STATEÐModule competition parity bit

CMPT 1 I TTLÐCompetition bit (A logic ‘‘0’’ indicates that the module will

compete in the arbitration.)

GND 3 NA Ground for switching circuits. (Note 9)

CNÐLE 1 I TTLÐCNn latch enable (A logic ‘‘0’’ indicates that the CNkn

l

logic states are latched with corresponding parity bit).

LI 1 NA Power supply for live insertion. Boards that require live insertion

should connect LI to the live insertion pin on the connector.
(Note 10)

NC 3 NA No connect

PER 1 O TTLÐABn odd parity (A logic ‘‘0’’ indicates parity error)

ABÐRE 1 I TTLÐReceiver Enable (A logic ‘‘0’’ enables receivers)

QGND 1 NA Ground for receiver input bandgap reference and non-switching

circuits. (Note 9)

QV

CC

1NAV

CC

supply for bandgap reference and non-switching circuits.

(Note 2)

V

CC

2NAV

CC

supply for switching circuits. (Note 10)

WIN

Ð

GT

1 O TTLÐWin signal (active low). During competition, WIN

Ð

GT
indicates that the module has won the competition. For a module
not participating in the competition, WIN

Ð

GT

indicates that the

module has a number which is greater than winner’s number.

Note 9: The multiplicity of parallel ground paths, reduces the effective inductance of bonding wires and leads, which then reduces the noise caused by transients
on the ground path. The various ground pins can be tied together provided that the external ground has low inductance (i.e., ground plane with power pins and
many signal pins connected to the backplane ground). If the external ground floats considerably during transients, precautionary steps should be taken to prevent
QGND from moving with reference to the backplane ground. The receiver threshold should have the same ground reference as the signal coming from the
backplane. A voltage offset between their grounds will degrade the noise margin.

Note 10: The same considerations for ground are used for V

CC

in reducing lead inductance. (See Note 9) QVCCand VCCshould be tied together externally. If live

insertion is not supported, the LI pin can be tied together with QV

CC

and VCC.

5

Package Thermal Characteristics

Linear Feet Per Minute ija(§C/W)

Air Flow

44-Pin PQFP 44-Pin PLCC

(LFPM)

08245

225 68 35

500 60 30

900 53 26

Note: The above values are typical values and are different from the Absolute Maximum
Rating values, which include guardbands.

Typical Application

TL/F/10721– 14

DS3885 Block Diagram

TL/F/10721– 15

6

Function Diagram

Parallel Implementation of Parallel Contention Logic

TL/F/10721– 1

7

Test Circuits and Timing Waveforms

TL/F/10721– 3

FIGURE 1. Driver Propagation Delay Set-up

TL/F/10721– 4

FIGURE 2. Driver: CNÐLE to AB7, tS,tH,t

PW

TL/F/10721– 5

FIGURE 3. Driver: CMPT to AB7

TL/F/10721– 6

Switch Position

t

PLHtPHL

S1 open close

FIGURE 4. Receiver Propagation Delay Set-Up

TL/F/10721– 7

FIGURE 5. Receiver: ABn to CNn

8

Test Circuits and Timing Waveforms (Continued)

TL/F/10721– 8

Switch Position

t

PZLtPZH

t

PLZtPHZ

S1 close open

S2 open close

FIGURE 6. Receiver Enable/Disable Set-Up

TL/F/10721– 9

TL/F/10721– 10

FIGURE 7. Receiver: ABÐRE to CNn FIGURE 8. AB0 to ALL1, AB0 to PER

TL/F/10721– 11

FIGURE 9. AB0 to WIN

Ð

GT

, ABP TO PER

TL/F/10721– 12

FIGURE 10. ABn to ABkn-1l, AB7 to ABP

9

10

Physical Dimensions inches (millimeters)

44-Lead Plastic Chip Carrier

Order Number DS3885V

NS Package Number V44A

11

DS3885 BTL Arbitration Transceiver

Physical Dimensions inches (millimeters) (Continued)

44-Lead Plastic Quad Flatpack

Order Number DS3885VF

NS Package Number VF44B

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.

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