Datasheet DS26S10N Datasheet (NSC)

DS26S10
Quad Bus Transceiver

General Description

The DS26S10 is a quad Bus Transceiverconsistingof4high
speed bus drivers with open-collector outputs capable of
sinking 100 mA at 0.8V and 4 high speed bus receivers.
Each driver output is connected internally to the high speed
bus receiver in addition to being connected to the package
pin. The receiver has a Schottky TTL output capable of driv­ing 10 Schottky TTL unit loads.

An active low enable gate controls the 4 drivers so that out­puts of different device drivers can be connected togetherfor
party-line operation.

The bus output high-drive capability in the low state allows
party-line operation with a line impedance as low as 100Ω.
The line can be terminated at both ends, and still give con­siderable noise margin at the receiver. The receiver typical
switching point is 2V.

Logic Diagrams

The DS26S10 features advanced Schottky processing to
minimize propagation delay. The device package also has 2
ground pins to improve ground current handling and allow
close decoupling between V
Both GND 1 and GND 2 should be tied to the ground bus ex­ternal to the device package.

and ground at the package.

CC

Features

n Input to bus is inverting on DS26S10
n Quad high speed open-collector bus transceivers
n Driver outputs can sink 100 mA at 0.8V maximum
n Advanced Schottky processing
n PNP inputs to reduce input loading

DS2610

DS26S10 Quad Bus Transceiver

May 1999

DS005802-1

© 1999 National Semiconductor Corporation DS005802 www.national.com

Absolute Maximum Ratings (Note *NO

TARGET FOR FNXref NS859*)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.

Storage Temperature −65˚C to +150˚C
Temperature (Ambient) Under Bias −55˚C to +125˚C
Supply Voltage to Ground Potential −0.5V to +7V
DC Voltage Applied to Outputs for −0.5V to +V

High Output State
DC Input Voltage −0.5V to +5.5V
Output Current, Into Bus 200 mA
Output Current, Into Outputs

(Except Bus) 30 mA

Max

CC

DC Input Current −30 mA to +5 mA

Maximum Power Dissipation (Note 1) at 25˚C

Molded Package 1362 mW

Operating Conditions

Min Max Units

Supply Voltage (V

DS26S10 4.75 5.25 V

Temperature (T

DS26S10 0 +70 ˚C

Note 1: Derate cavitypackage9.6 mW/˚C above 25˚C; derate molded pack­age 10.9 mW/˚C above 25˚C, derate PLCC package TBD mW/˚C above
25˚C.

)

CC

)

A

Electrical Characteristics

(Unless otherwise noted)

Symbol Parameter Conditions Min Typ Max Units

(Note 2) (Note 3)

V

OH

Output High Voltage V
(Receiver Outputs) V

V

OL

Output Low Voltage V
(Receiver Outputs) V

V

IH

Input High Level Guaranteed Input Logical High for 2.0 V

=

CC

=

V

IN

=

CC

=

V

IN

(Except Bus) All Inputs

V

IL

Input Low Level Guaranteed Input Logical Low for 0.8 V
(Except Bus) All Inputs

V

I

Input Clamp Voltage V

=

CC

(Except Bus)

I

IL

Input Low Current V

=

CC

(Except Bus) Data −0.54 mA

I

IH

Input High Current V

=

CC

(Except Bus) Data 30 µA

I

I

Input High Current V

=

CC

(Except Bus)

I

SC

Output Short-Circuit Current V

=

CC

(Except Bus) Commercial −18 −60 mA

I

CCL

Power Supply Current V

=

CC

(All Bus Outputs Low) DS26S11 80 mA

=

Min, I

IL

Min, I

IL

Min, I

Max, V

Max, V

Max, V

−1 mA, Military 2.5 3.4 V

OH

or V

IH

=

20 mA, 0.5 V

OL

or V

IH

=

−18 mA −1.2 V

IN

=

0.4V Enable −0.36 mA

IN

=

2.7V Enable 20 µA

IN

=

5.5V 100 µA

IN

Commercial 2.7 3.4 V

Max, (Note 4) Military −20 −55 mA

Max, Enable=GND DS26S10 45 70 mA

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Connection Diagram

Dual-In-Line Package

DS005802-3

Top View

Order Number DS26S10N

See NS Package Number N16A

Plastic Chip Carrier

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Bus Input/Output Characteristics

Symbol Parameter Conditions

Min Typ(Note3)Max Units

(Note 2)

V

OL

I

O

I

OFF

V

TH

V

TL

Note 2: For conditions shown as min or max, use the appropriate value specified under Electrical Characteristics for the applicable device type.
Note 3: Typical limits are at V
Note 4: Not more than one output should be shorted at a time. Duration of the short circuit test should not exceed one second.

Output Low Voltage

=

V

Min

CC

Bus Leakage Current

Bus Leakage Currrent (power
OFF)

=

Max

V

CC

=

V

4.5V 100

O

Receiver Input High Threshold Bus enable=2.4V

=

Max

V

CC

Receiver Input Low Threshold Bus enable=2.4V

=

Min

V

CC

=

5V, 25˚C ambient and maximum loading.

CC

=

40 mA 0.33 0.5

I

OL

=

70 mA 0.42 0.05

OL

=

I

100 mA 0.51 0.8

OL

=

V

0.8V −50

O

=

4.5V 100

V

O

2.25 2.0

2.0 1.75

µA

µA

Switching Characteristics

=

(T

25˚C, V

A

Symbol Parameter Conditions Min Typ Max Units

t

PLH

t

PHL

t

PLH

t

PHL

t

PLH

t

PHL

t

r

t

f

Note 5: Includes probe and jig capacitance.

=

5V)

CC

Data Input to Bus R

=

B

Data Input to Bus 10 15 ns
Enable Input to Bus
Enable Input to Bus 13 18 ns
Bus to Receiver Out R
Bus to Receiver Out C
Bus R

=

B

=

L

=

B

=

50Ω,C

50Ω,R

50 pF (Note 5)

B

=

280Ω,C

L

DS26S10

DS26S10

=

50 pF(Note 5) 10 15 ns

B

10 15 ns

14 18 ns

15 pF 10 15 ns

=

50Ω,C

50 pF (Note 5) 4.0 10 ns

B

Bus 2.0 4.0 ns

VI

V

Truth Tables
DS26S10

Inputs Outputs

E

LLHL
LHLH
HXYY

=

H

High voltage level
L=Low voltage level
X=Don’t care
Y=Voltage level of bus (assumes control by another bus transceiver)

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IBZ

Typical Application

AC Test Circuit and Switching Time Waveforms

DS005802-5

Note 1: Includes probe and jig capacitance.

DS005802-6

DS005802-7

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Typical Performance Characteristics

Typical Bus Output Low Volt­age vs Ambient Temperature

Schematic Diagram

DS005802-8

Receiver Threshold Variation
vs Ambient Temperature

DS005802-9

=

V

Pin 16

CC

GND 1=Pin 1
GND 2=Pin 8
Connect for DS26S10
*Remove R1, Q1, D1 for DS26S10

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DS005802-10

Physical Dimensions inches (millimeters) unless otherwise noted

Molded Dual-In-Line Package (N)

Order Number DS26S10N

NS Package Number N16A

DS26S10 Quad Bus Transceiver

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