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DS26LV31T
3V Enhanced CMOS Quad Differential Line Driver
General Description
The DS26LV31T is a high-speed quad differential CMOS
driver that meets the requirements of both TIA/EIA-422-B
and ITU-T V.11. The CMOS DS26LV31T features low static
I
CC
of 100 µA MAX which makes it ideal for battery powered
and power conscious applications.
Differential outputs have the same V
OD
guarantee (≥2V) as
the 5V version.
The EN and EN* inputs allow active Low or active High con-
trol of the TRI-STATE
®
outputs. The enables are common to
all four drivers. Protection diodes protect all the driver inputs
against electrostatic discharge. Outputs have enhanced
ESD protection providing greater than 7 kV tolerance. The
driver and enable inputs (DI, EN, EN*) are compatible with
low voltage LVTTL and LVCMOS devices.
Features
n Industrial product meets TIA/EIA-422-B (RS-422) and
ITU-T V.11 recommendation
n Military product conforms to TIA/EIA-422-B (RS-422)
n Interoperable with existing 5V RS-422 networks
n Industrial and Military temperature range
n Guaranteed V
OD
of 2V min over operating conditions
n Balanced output crossover for low EMI (typical within
40 mV of 50%voltage level)
n Low power design (330 µW 3.3V static)
n ESD ≥ 7 kV on cable I/O pins (HBM)
n Guaranteed AC parameter:
— Maximum driver skew: 2 ns
— Maximum transition time: 10 ns
n Pin compatible with DS26C31
n Available in SOIC and Cerpack packaging
n Standard Microcircuit Drawing (SMD) 5962-98584
Connection Diagram Truth Table
Enables Input Outputs
EN EN* DI DO+ DO−
LHXZZ
All other
combinations of
enable inputs
LLH
HHL
L = Low logic state
X = Irrelevant
H = High logic state
Z = TRI-STATE
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
Dual-In-Line Package
DS012642-1
Top View
Order Number DS26LV31TM or DS26LV31W
See NS Package Number M16A or W16A
March 1999
DS26LV31T 3V Enhanced CMOS Quad Differential Line Driver
© 1999 National Semiconductor Corporation DS012642 www.national.com
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CC
) −0.5V to +7V
Enable Input Voltage (EN, EN*) −0.5V to V
CC
+ 0.5V
Driver Input Voltage (DI) −0.5V to V
CC
+ 0.5V
Clamp Diode Current
±
20 mA
DC Output Current, per pin
±
150 mA
Driver Output Voltage
(Power Off: DO+, DO−) −0.5V to +7V
Maximum Package Power Dissipaton +25˚C
M Package 1226 mW
W Package 1119 mW
Derate M Package 9.8 mW/˚C above +25˚C
Derate W Package 7.5 mW/˚C above +25˚C
Storage Temperature Range −65˚C to +150˚C
Lead Temperature Range
Soldering
(4 sec.) +260˚C
ESD Ratings (HBM, 1.5 kΩ, 100
pF)
Driver Outputs ≥7kV
Other Pins ≥2.5 kV
Recommended Operating
Conditions
Min Typ Max Units
Supply Voltage (V
CC
) 3.0 3.3 3.6 V
Operating Free Air Temperature Range (T
A
)
DS26LV31T −40 +25 +85 ˚C
DS26LV31W −55 +25 +125 ˚C
Input Rise and Fall Time 500 ns
Electrical Characteristics(Note 2) (Note 3)
Over supply voltage and operating temperature ranges, unless otherwise specified
Symbol Parameter Conditions Pin Min Typ Max Units
V
OD1
Output Differential Voltage RL=∞(No Load) DO+, 3.3 4 V
V
OD2
Output Differential Voltage RL= 100Ω (
Figure 1
) DO− 2 2.6 V
∆V
OD2
Change in Magnitude of IO≥ 20 mA −400 7 400 mV
Output Differential Voltage
V
OD3
Output Differential Voltage RL= 3900Ω (V.11)
Figure 1
(Note 7)
3.2 3.6 V
V
OC
Common Mode Voltage RL= 100Ω (
Figure 1
) 1.5 2 V
∆V
OC
Change in Magnitude of −400 6 400 mV
Common Mode Voltage
I
OZ
TRI-STATE Leakage V
OUT=VCC
or GND
±
0.5
±
20 µA
Current Drivers Disabled
I
SC
Output Short Circuit Currrent V
OUT
=0V
V
IN=VCC
or
GND (Note 4)
T
A
= -40˚C to
+85˚C
−40 −70 −150 mA
T
A
= -55˚C to
+125˚C (Note
10)
-30 -160 mA
I
OFF
Output Leakage Current VCC= 0V, V
OUT
= 3V or 6V 0.03 100 µA
V
CC
= 0V, V
OUT
= −0.25V
T
A
= -40˚C to
+85˚C
−0.08 −100 µA
T
A
= -55˚C to
+125˚C
-200 µA
V
IH
High Level Input Voltage DI, 2.0 V
CC
V
V
IL
Low Level Input Voltage EN, GND 0.8 V
I
IH
High Level Input Current VIN=V
CC
EN* 10 µA
I
IL
Low Level Input Current VIN= GND −10 µA
V
CL
Input Clamp Voltage IIN= −18 mA −1.5 V
I
CC
Power Supply Current No Load, V
IN
(all) = VCCor
GND
T
A
= -40˚C to
+85˚C
V
CC
100 µA
T
A
= -55˚C to
+125˚C
125 µA
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Switching Characteristics - Industrial (Note 5) (Note 6)
Over supply voltage and -40˚C to +85˚C operating temperature range, unless otherwise specified
Sym Parameter Conditions Min Typ Max Units
t
PHLD
Differential Propagation Delay RL= 100Ω,CL= 50 pF 6 10.5 16 ns
High to Low (
Figures 2, 3
)
t
PLHD
Differential Propagation Delay 6 11 16 ns
Low to High
t
SKD
Differential Skew (same 0.5 2.0 ns
channel) |t
PHLD−tPLHD
|
t
SK1
Skew, Pin to Pin 1.0 2.0 ns
(same device)
t
SK2
Skew, Part to Part (Note 8) 3.0 5.0 ns
t
TLH
Differential Transition Time 4.2 10 ns
Low to High (20%to 80%)
t
THL
Differential Transition Time 4.7 10 ns
High to Low (80%to 20%)
t
PHZ
Disable Time High to Z (
Figures 4, 5
)1220ns
t
PLZ
Disable Time Low to Z 9 20 ns
t
PZH
Enable Time Z to High 22 32 ns
t
PZL
Enable Time Z to Low 22 32 ns
f
max
Maximum Operating 32 MHz
Frequency (Note 9)
Switching Characteristics - Military (Note 5) (Note 6)
Over supply voltage and -55˚C to +125˚C operating temperature range, unless otherwise specified
Sym Parameter Conditions Min Max Units
t
PHLD
Differential Propagation Delay RL= 100Ω,CL=50pF 5 25 ns
High to Low (
Figures 2, 3
)
t
PLHD
Differential Propagation Delay 5 25 ns
Low to High
t
SKD
Differential Skew (same 5.0 ns
channel) |t
PHLD−tPLHD
|
t
SK1
Skew, Pin to Pin 5.0 ns
(same device)
t
PHZ
Disable Time High to Z (
Figures 4, 5
)35ns
t
PLZ
Disable Time Low to Z 35 ns
t
PZH
Enable Time Z to High 40 ns
t
PZL
Enable Time Z to Low 40 ns
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except differential voltages V
OD1,VOD2,VOD3
.
Note 3: All typicals are given for V
CC
= +3.3V, TA= +25˚C.
Note 4: Only one output shorted at a time. The output (true or complement) is configured High.
Note 5: f = 1 MHz, t
r
and tf≤ 6 ns, 10%to 90%.
Note 6: See TIA/EIA-422-B specifications for exact test conditions.
Note 7: This specification limit is for compliance with TIA/EIA-422-B and ITU-T V.11.
Note 8: Devices are at the same V
CC
and within 5˚C within the operating temperature range
Note 9: All channels switching, output duty cycle criteria is 40%/60%measured at 50%. This parameter is guaranteed by design and characterization.
Note 10: This parameter does not meet the TIA/EIA-422-B specification.
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Parameter Measurement Information
Note 11: Generator waveform for all tests unless otherwise specified:f=1MHz, Duty Cycle = 50%Zo=50Ω,tr≤10 ns, tf≤ 10.
Note 12: C
L
includes probe and fixture capacitance.
DS012642-2
FIGURE 1. Differential Driver DC Test Circuit
DS012642-3
FIGURE 2. Differential Driver Propagation Delay and Transition Time Test Circuit
DS012642-4
FIGURE 3. Differential Driver Propagation Delay and Transition Time Waveforms
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Parameter Measurement Information (Continued)
DS012642-5
If EN is the input, then EN* = High
If EN* is the input, then EN = Low
FIGURE 4. Driver Single-Ended TRI-STATE Test Circuit
DS012642-6
FIGURE 5. Driver Single-Ended TRI-STATE Waveforms
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Typical Application Information
General application guidelines and hints for differential drivers and receivers may be found in the following application
notes:
AN-214, AN-457, AN-805, AN-847, AN-903, AN-912, AN-
916.
Power Decoupling Recommendations:
Bypass caps must be used on power pins. High frequency
ceramic (surface mount is recommended) 0.1 µF in parallel
with 0.01 µF at the power supply pin. A 10 µF or greater solid
tantalum or electrolytic should be connected at the power
entry point on the printed circuit board.
DS012642-7
RTis optional although highly recommended to reduce reflection.
DS012642-8
FIGURE 6. Typical Driver Connection
DS012642-9
FIGURE 7. Typical Driver Output Waveforms
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Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead Molded Small Outline Package (M)
Order Number DS26LV31TM
NS Package Number M16A
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
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Corporation
Americas
Tel: 1-800-272-9959
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Fax: 81-3-5639-7507
www.national.com
16-Lead Ceramic Flatpack (W)
Order Number DS26LV31W
NS Package Number W16A
DS26LV31T 3V Enhanced CMOS Quad Differential Line Driver
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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